JPH0635048A - Compact camera device - Google Patents

Abstract

PURPOSE:To provide a compact camera device incorporating a drive processing circuit, and simultaneously, having high density packaging and excellent manufacturability. CONSTITUTION:A CCD element 1 whose circumference has the formation of a bonding pad 3 for external connection 3, is attached to a ceramic substrate 41, and a connecting land 6 fixed on the ceramic substrate 41, is electrically connected with a wiring conductor 22 having the attachment of electric parts comprising the drive processing circuit driving the CCD element 1, on the rear surface 41a of the ceramic substrate 41, by a through hole 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact camera device using a CCD element, which is more compact than a compact camera device.

[0002]

2. Description of the Related Art In recent years, miniaturization of cameras using an image pickup device, particularly a CCD, has been progressing, and they are also used for medical applications such as endoscopes.
It has come to be used in a wide range of applications such as crime prevention and visual inspection of printed circuit boards. This small camera is a CCD
And a peripheral circuit thereof, the development of a camera cable is being developed by incorporating a CCD drive processing circuit in the camera to improve the commercial property. For example, by incorporating the horizontal drive processing circuit and its peripheral circuits in the camera body, it is possible to extend the conventional cable length of about 10 m to about 30 m, which has the advantage of expanding the range of applications. To be

FIG. 4 shows a mounting structure of a small camera incorporating a conventional CCD drive processing circuit. Figure 4
(A) is a CCD element, in which a plastic filter 2 is attached on the CCD element 1, and a plurality of bonding pads 3 for external connection are formed around the CCD element 1 to take out the output. Although FIG. 4B shows a structure in which the CCD element 1 is unitized, generally, the concave portion 4a of the ceramic substrate 4 having the concave portion 4a is formed.
Die-bond the CCD element 1 to the center of the
Thus, the connection land 6 and the bonding pad 3 are connected by wire bonding.

The CCD substrate 1 is mounted on the ceramic substrate 4.
In order to take out the output of the above, it is drawn out from the connection land 6 through the through hole 7 to the lower surface of the ceramic substrate 4 and connected to the external connection land 8. The external connection land 8 has a structure in which a connection pin 10 is brazed with a silver solder 9. A glass plate 11 for protecting the CCD element 1 is fixed on the ceramic substrate 4 with an adhesive 12.

As shown in FIG. 5, the CCD package 13 in a ceramic package as shown in FIG. 4 is a flexible substrate such as polyimide on which electronic components for drive processing circuits such as chip components 14a and 14b are soldered. 15
The CCD unit 13 is connected to the upper part by soldering via the connection pin 10.

A driving IC is mounted on the flexible substrate 15.
16a and 16b are connected by wire bonding or soldering such as a flat package. In this way, the chip parts 14a, 14b and the driving ICs 16a, 1
The flexible substrate 15 on which electronic components for a drive processing circuit such as 6b are mounted is stored in the camera housing 17 by bending, rolling, or the like. Further, the camera cable 18 is connected by connecting pins 19 and connectors 20 soldered to the flexible substrate 15. If a horizontal drive processing circuit and its peripheral circuits are incorporated in the camera housing 17 as a drive processing circuit for the CCD device 1, the electronic components that need to be mounted on the flexible substrate 15 are, for example, horizontal drive processing circuits. Logic circuit IC
It is necessary to mount two, nine resistors, nine capacitors, and two transistors.

However, in the above-mentioned conventional mounting structure, there is a limit to the mounting technique as the size of the camera is further reduced. That is, the diameter of the camera corresponding to the dimension A in FIG.
From the degree, it is expected to be even smaller than 10 mm. Regarding the built-in drive processing circuit, the size of the mounting part corresponding to the dimension B in FIG. 5 is reduced, the mounting part of the electronic component is further narrowed, and there is a limit in high-density mounting as an extension of the current mounting method. Causes a significant obstacle to the miniaturization of. Therefore, a new mounting method has been desired which enables a high-density mounting with a simpler manufacturing method.

[0008]

The small camera device incorporating the above-mentioned conventional drive processing circuit has a problem that it is not only small in size but also inferior in manufacturability.

The present invention incorporates a drive processing circuit,
It is intended to provide a small-sized camera device with high-density mounting and good manufacturability.

[0010]

According to another aspect of the present invention, there is provided a compact camera device in which an image pickup device having pads for external connection formed on the periphery thereof, an insulating substrate having the image pickup device attached thereto, and the insulating substrate are fixed together, The land electrically connected to the pad, and the land and the back surface of the insulating substrate were formed at desired positions of a wiring conductor to which an electronic component forming a part of a drive processing circuit for driving the image pickup device was attached. It comprises a means for connecting to the land and a flexible substrate which is connected to the wiring conductor and forms the remaining portion of the drive processing circuit.

[0011]

According to the above means, the drive processing circuit for driving the image pickup device is formed on the back surface of the insulating substrate on which the image pickup device is mounted, so that a dramatic high-density mounting is possible, and the drive processing circuit is small in size. Camera can be realized.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 illustrates an embodiment of the present invention. In the figure, the same parts as those in FIG. A plastic filter 2 is attached on the CCD element 1, and a bonding pad 3 for external connection is formed around the plastic filter 2. The CCD device 1 has a concave portion 4 of a ceramic substrate 41 having a concave portion 41a.
The CCD element 1 is die-bonded in the center of 1a by silver paste or the like, and the connection land 6 formed on the ceramic substrate 41 by the gold wire 5 and the bonding pad 3 are connected by wire bonding. This ceramic substrate 41
In order to take out the output of the CCD element 1 to the outside, the package using is drawn from the connection land 6 to the lower surface 41b of the ceramic substrate 41 through the through hole 7.

On the lower surface 41b of the ceramic substrate 41, a C
A ruthenium oxide-based resistor 21, a copper wiring conductor 22, and the like, which form a part of the drive processing circuit of the CD element 1, are formed of a thick film. The through hole 7 is connected to the connection land 6 and the pad 22 a formed on a part of the wiring conductor 22. After that, the CCD unit 13 ′ is electrically inspected, and the glass substrate 11 is fixed to the adhesive 12 in order to protect the upper portion of the CCD unit 13 ′ facing the CCD element 1.

Next, a drive IC for CCD drive processing
23 is mounted on the wiring conductor 22. At this time, since it is necessary to mount at a temperature lower than the heat resistant temperature (almost 150 ° C.) of the already mounted CCD element 1, for example, a low temperature connection of indium or the like is possible by using an electrode structure with gold bumps in the IC 23. The flip method is suitable. Further, although the mounting area is somewhat increased, a method such as wire bonding using an aluminum wire is also possible.

Other electronic components such as the chip capacitor 24, which constitute the drive processing circuit of the CCD, are soldered to a flexible substrate 25 such as polyimide to connect a predetermined pad of the wiring conductor 22 to the flexible substrate 25. Further, an external connection pin 26 is attached to the flexible substrate 25 and is connected to a connector 28 of an extension cable 27 to take out the output of the CCD element 1 to the outside.

The CCD unit 13 'in which a part of the drive processing circuit of the CCD element 1 is formed and the flexible substrate 25 in which the other part of the drive processing circuit of the CCD element 1 is formed are housed in the camera housing 29. Thus, a CCD camera can be realized. The drive processing circuit of the CCD element 1 here has the same circuit configuration as the conventional one.

In this embodiment, since the thick film circuit having the electronic components mounted thereon is formed on the back surface of the CCD unit 13 ', the area of the connecting substrate such as the flexible substrate 25 can be reduced. Small CC
A D camera can be realized.

FIG. 2 shows another embodiment of the present invention. In this embodiment, the CC constructed on a flexible substrate is used.
A part of the drive processing circuit of the D element 1 is also built in the ceramic substrate 42.

That is, reference numeral 42 denotes a ceramic substrate based on, for example, glass ceramics, which can be fired at a low temperature of 1000 ° C. or lower, and is a substrate containing a large number of thick film resistors R and capacitors C in a multi-layer substrate and a passive element built-in substrate. is there. The ceramic substrate 42 has substantially the same size as a conventional ceramic package and has a recess 42a formed therein. Further, the connection pin 29 for external connection is previously attached to the back surface 42b of the ceramic substrate 42 by silver brazing.
It is glued and fixed to.

Next, the CCD element 1 is die-bonded to the surface of the central portion of the recess 42a of the ceramic substrate 42 with silver paste or the like. Using the gold wire 5, C
Bonding pad 3 of CD element 1 and ceramic substrate 4
The connection land 6 on 2 is wire-bonded. After that, an electrical inspection of the CCD unit 13 'is performed, and the upper part of the CCD unit 13' is adhesively sealed with the glass plate 11.

Next, a driver IC for CCD driving processing
23 is mounted on the back surface of the ceramic substrate 42. On this occasion,
Since it is necessary to mount the already mounted CCD element 1 at a heat resistant temperature of 150 ° C. or lower, for example, a flip method that allows low temperature connection of indium or the like is suitable for the IC 23 by using a structure of electrodes with gold bumps. . Moreover, although the mounting area is somewhat increased, a method such as wire bonding using an aluminum wire is also possible. Also, except IC
The rest of the electronic components that cannot be embedded in the board, that is, electrolytic capacitors and transistors, are mounted with a conductive adhesive such as silver paste.

FIG. 3 shows a ceramic substrate 42 with a built-in circuit element.
FIG. The inner layer of the ceramic substrate 42 is divided into a resistor forming layer 43a and a capacitor forming layer 44a, and the conductor layers of the forming layers 43a and 44a and interlayer connection are connected to each other through through holes 45.

The external connection pin 29 projecting from the rear surface of the CCD unit 13 'incorporating the drive processing circuit for the CCD element 1 is directly fitted to the connector 28 of the extension cable 27, so that it can be used in the above embodiment. In comparison, not only a connecting board such as a flexible board is unnecessary, but also the size B of the mounting space in the housing 29 'of the small camera can be reduced. The CCD element and the peripheral drive circuit are C
It can be mounted in almost the same size as a ceramic substrate with a built-in element that also serves as a CD unit.

[0024]

As described above, according to the small-sized camera device of the present invention, it is possible to realize a package having a high packaging density including the CCD drive processing circuit with a simple packaging structure.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining an embodiment of the present invention.

FIG. 2 is a sectional view for explaining another embodiment of the present invention.

FIG. 3 is an enlarged cross-sectional view of a main part of FIG.

FIG. 4 is a sectional view of a conventional CCD unit.

FIG. 5 is a sectional view of a conventional small camera.

[Explanation of symbols]

1 ... CCD element 3 ... Bonding pad 41 ... Ceramic substrate 6 ... Connection land 7 ... Through hole 22 ... Wiring substrate 25 ... Flexible substrate

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masayuki Arakawa 3-3-9 Shimbashi, Minato-ku, Tokyo Inside Toshiba Abu E., Ltd.

Claims (4)

[Claims] 1. An image pickup device having a pad for external connection formed around it, an insulating substrate having the image pickup device attached thereto, a land fixed to the insulating substrate and electrically connected to the pad, Means for connecting the land and the back surface of the insulating substrate to a land formed at a desired location of a wiring conductor to which an electronic component forming a part of a drive processing circuit for driving the image pickup device is connected; A compact camera device comprising a flexible substrate which is connected to the drive processing circuit and which forms the remaining portion of the drive processing circuit. 2. An image pickup device having pads for external connection formed on the periphery thereof, an insulating substrate having the image pickup device attached thereto, a connection land fixedly attached to the insulating substrate, and the image pickup provided on a back surface of the insulating substrate. A small camera device comprising: a wiring conductor to which an electronic component forming a drive processing circuit for driving an element is attached; and means for electrically connecting the wiring conductor and the land. 3. The insulating substrate is made of ceramic, and the electronic component attached to the wiring conductor formed on the back surface of the image pickup device is
3. The miniature camera device according to claim 1, wherein the miniature camera device is mounted at a temperature equal to or lower than a heat resistant temperature of the image pickup element. 4. The miniature camera device according to claim 1, wherein the pad and the land are connected by a through hole.