JPH06349872A - Metal mold for molding electronic parts - Google Patents

Abstract

PURPOSE:To obtain a metal mold of a unique construction promoting the kind changing work of electronic parts by providing a lower mold die set part with a transfer mechanism part and making the lower mold chase part freely attached and detatched respectively. CONSTITUTION:A lower mold die set part 23 is provided side by side with a transfer mechanism part and a lower mold chase part 27 freely attached and detatched. Further, an upper mold chase part 28 is freely attached and detached to an upper mold die set part 24 connected to a press device. For instance, the transfer mechanism part is to be composed of a pot block 35 having a plurality of pots, a plunger 11 for press and transfer of hard-curing molding resin melted inside the pots and a transfer driving mechanism for plunger operation. Thereby, at the time of manufacturing different products, it suffices to change the lower mold chase part 27 when the number of product cavities and/or a product pitch of the object lead frame are coincided with those ones before the change.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electronic part molding die for resin-molding electronic parts.

[0002]

2. Description of the Related Art Next, a conventional electronic part molding die will be described with reference to the drawings. FIG. 5 is a schematic view of an electronic component molding apparatus equipped with a conventional electronic component molding die.

The base bolster 1 and the fixed bolster 2 are connected by a plurality of guide posts 4, and the movable bolster 3 is slidably fitted and mounted on the guide post 4. Between the movable bolster 3 and the fixed bolster 2, an electronic component molding die according to a conventional technique described below,
The lower mold 5 and the upper mold 6 are mounted.

FIG. 6 is a cross-sectional view of a conventional electronic component molding die, and FIG. 8 is an explanatory view of an electronic component lead frame before molding. Electric heater 15,
Lower mold 5, and upper mold 6, which have already been heated to a predetermined temperature by
A plurality of electronic component substrates 34 are arranged at a predetermined position between the lead frame 7 and a thermosetting molding resin tablet 8 obtained by compressing and hardening a thermosetting molding resin powder. After that, the movable bolster 3 on which the lower die 5 is placed is transferred, abutted, and clamped in the direction of the fixed bolster 2 on which the upper die 6 is placed by the movable bolster transfer mechanism 9.

Next, the thermosetting molded resin tablet 8, which is put into the pot 16 for raising the plunger 11 by the transfer driving mechanism 10 and already heated and melted by the electric heater 15, is used as the cull 12, transfer mechanism. Lower mold cavity 1 through the opposite number of runners 13,
4, after being injected and pressurized into the upper mold cavity 19, they are heat-cured after a predetermined heat-curing time.

After a predetermined heat curing time, the movable bolster 3 is lowered to open the upper and lower molds. By the mold opening, the ejector pins 21 and the electronic component package after the thermosetting are released from the lower mold cavity 14 and the upper mold cavity 19, respectively.

FIG. 3 shows an electronic component lead frame taken out from the mold through the above steps. After the cull resin 30 and the runner resin 31 are removed, they are sent to respective processes such as cutting, molding, mark imprinting, and electrical characteristic inspection, which are post-processes. The completed electronic component is shown in FIG.

Next, a conventional electronic part molding die will be described with reference to FIG. 7 which is a structural view and FIG. 6 which is a sectional explanatory view. Since a plurality of types of electronic component packages are resin-molded using the same die set section, units other than the upper and lower die set sections 32 and 33 are replaced. Specifically, the electronic component after the molding and curing is made into the lower mold cavity 14,
A lower mold cavity 14 for molding an electronic component package by communicating with the ejector pin 21 for further releasing the mold, a guide mechanism 22 thereof, and a plunger 11 penetrating to form a cylinder shape, the pot 16, and the runner 13. , Lower chase 17 and lower chase 1
7, a plunger 11 for transferring and pressurizing a thermosetting molding resin that has been heated and melted through the pot portion 16, and a transfer drive mechanism 1 that is a drive source.
0, a plunger holder 18 to be connected to the upper mold cavity, an upper mold cavity 19 for ejecting a molded and hardened electronic component from an upper mold cavity, a guide mechanism 22 for the ejector pin 21, and a runner 1.
The upper chase portion 20 composed of 3, and the above units are exchanged from the upper and lower die set portions 32 and 33, respectively, for each extracted product type.

The upper and lower chase parts 17, 20 are respectively provided with a pressing block 29, and the die set parts 32, 33,
Positioned and fastened. Upper and lower die set parts 32, 3
3, chase parts 17 and 20, plunger holder 18, and transfer drive mechanism 10 are fitted in dovetail grooves.

The electric heater 15, which is a heat source for heating, melting and curing the thermosetting molding resin, includes upper and lower die set parts 3
It is inserted and installed in 2, 33.

In the above-mentioned conventional method for forming a mold for electronic parts and a method for exchanging products, the number and arrangement pitch of the transfer mechanisms must match those of the lead frame of the electronic parts, and the transfer mechanism is inevitably replaced. . As a result, many units associated with product type change have a problem in that they are heavy, complicated and dangerous.

[0012]

The problem to be solved by the invention is that the conventional electronic parts mold die replacement work is complicated and dangerous because there are many replacement parts and the weight is heavy. .

[0013]

In order to solve the above-mentioned problems, in the present invention, at least a thermosetting molding resin which has been previously charged and melted in a pot heated by a heat source is pressure-transferred by a plunger. The transfer mechanism part, which is composed of two or more transfer mechanisms and is arranged so that it can be fitted into the lower die set part, and the lower chase portion and the transfer mechanism portion are arranged so that they can be fitted together, and is fastened to the press machine body. The lower die set part that communicates with the pot of the transfer mechanism, the thermosetting molding resin that has been pressure-transferred by the plunger flows in, and the lower cavity that molds and cures the electronic component package and the electronic component after molding and curing A lower die chuck that has an ejector pin that separates the package from the lower cavity and a guide mechanism for the ejector pin, and is arranged so that it can be freely fitted to the lower die set part. An upper die chase portion which has a chair portion, an upper cavity, an ejector pin for separating the molded electronic component package from the upper cavity, and a guide mechanism for the ejector pin; An upper die chase portion is arranged so that it can be fitted freely, and an electronic component molding die including an upper die set portion fastened to the press body is used.

[0014]

First Embodiment Next, the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of an electronic component molding apparatus equipped with an electronic component molding die according to the present invention. The base bolster 1 and the fixed bolster 2 are connected by a plurality of guide posts 4, and the movable bolster 3 is slidably fitted and mounted on the guide post 4. Between the movable bolster 3 and the fixed bolster 2, an electronic component molding die according to an embodiment of the present invention described below, a lower die 25, and an upper die 26 are mounted.

FIG. 2 is a sectional view showing an electronic part molding die according to an embodiment of the present invention, and FIG. 8 is an explanatory view of an electronic part lead frame before molding. Electric heater 1
5, a plurality of electronic component boards 34 are provided at predetermined positions between the lower mold 25 and the upper mold 26 which have already been heated to a predetermined temperature by
After the strip-shaped lead frame 7 and the thermosetting molding resin tablets 8 obtained by compressing and hardening the thermosetting molding resin powder are arranged in the pot 16, respectively, the lower mold 25 is placed. The movable bolster 3 mounted on the upper die 26 is transferred, abutted, and clamped in the direction of the fixed bolster 2 mounted on the upper die 26 by the movable bolster transfer mechanism 9.

Next, the transfer drive mechanism 10 raises the plunger 11 of the transfer mechanism portion, and the thermosetting molded resin tablet 8, which has been put into the pot 16 and already heated and melted by the electric heater 15, is upper chase. After the cull 12 and the runner 13 provided in the portion 28 are injected into the lower mold cavity 14 and the upper mold cavity 19 and pressure is applied, they are thermally cured after a predetermined thermal curing time.

After a predetermined heat curing time, the movable bolster 3 is lowered to open the upper and lower molds. Each of the upper and lower molds has an ejector mechanism for releasing the thermosetting molding resin from the mold. FIG. 3 shows an electronic component lead frame taken out from the mold through the above steps. After the cull resin 30 and the runner resin 31 are removed, they are sent to respective processes such as cutting, molding, mark imprinting, and electrical characteristic inspection, which are post-processes. The completed electronic component is shown in FIG.

Next, an electronic part molding die according to the present invention will be described with reference to a structural drawing FIG. 4 and a sectional explanatory drawing FIG.
Basically, since a plurality of types of electronic component packages are resin-molded using the same die set portion, the units other than the die set portions 23 and 24 of the upper and lower molds are replaced.

Specifically, if the number of lead frames and product pitches of the electronic parts subject to product type exchange match the number of electronic component lead frames before product type exchange and the product pitch, the electronic parts after molding and curing Lower chase portion 27 including a lower mold cavity 14, an ejector pin 21 for releasing the mold from the lower mold cavity, and a guide mechanism 22, a pot 16, and a lower mold cavity 14 communicating with the runner 13 for molding an electronic component package. , The ejector pin 2 for separating the molded and cured electronic component from the upper mold cavity 19 and the mold
1 and its guide mechanism 22, an upper chase portion 28 including the runner 13, and the above two units are replaced from the upper and lower die set portions 23 and 24, respectively, for each extracted product type. Therefore, it is not necessary to replace the transfer mechanism portion such as the pot block 35, the plunger 11, the plunger holder 18, and the like.

Further, when the number of electronic component lead frames subject to product type exchange and the product pitch do not match the number of electronic component lead frames before product type exchange, the product pitch, and the need for thermosetting molding resin for electronic component packages If the amounts are significantly different, the plunger holder 18, the plunger 11, and the pot block 35 of the transfer mechanism are replaced in addition to the upper and lower chase portions 27, 28 described above. The upper and lower chase parts 27, 28 are respectively holding blocks 29,
It is positioned and fastened to each of the die set parts 23, 24. The upper and lower die set portions 23 and 24, the chase portions 27 and 28, the plunger holder 18, and the transfer driving mechanism 10 are fitted with dovetail grooves.

The electric heater 15, which is a heat source for heating, melting, and curing the thermosetting molding resin, includes upper and lower die set portions 2.
3, 24, or upper and lower die set parts 23, 2
4 and upper and lower chase parts 27, 28, respectively.

[0022]

The use of the electronic part mold according to the present invention reduces the number of units of the mold that need to be replaced at the time of replacing the product type, which is complicated as compared with the conventional electronic part mold product replacement work. Size and risk are reduced and work time is shortened.

[Brief description of drawings]

FIG. 1 is a schematic view of an electronic component molding apparatus equipped with an electronic component molding die according to the present invention.

FIG. 2 is an explanatory sectional view of an electronic component molding die according to the present invention.

FIG. 3 is an explanatory diagram of an electronic component lead frame after molding.

FIG. 4 is a configuration diagram of an electronic component molding die according to the present invention.

FIG. 5 is a schematic view of an electronic component molding apparatus equipped with a conventional electronic component molding die.

FIG. 6 is an explanatory cross-sectional view of an electronic component molding die according to a conventional technique.

FIG. 7 is a block diagram of an electronic component molding die according to a conventional technique.

FIG. 8 is an explanatory diagram of an electronic component lead frame before molding.

[Figure 9] Completed electronic component

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base bolster 2 Fixed bolster 3 Movable bolster 4 Guide post 5 Lower mold for electronic parts according to conventional technology 6 Upper mold for electronic parts according to conventional technology 7 Lead frame 8 Thermosetting molding resin tablet 9 Movable bolster transfer mechanism 10 Transfer mechanism 11 Plunger 12 Cull 13 Runner 14 Lower Mold Cavity 15 Electric Heater 16 Pot 17 Lower Chase Part According to Conventional Technology 18 Plunger Holder 19 Upper Mold Cavity 20 Upper Chase Part according to Conventional Technology 21 Ejector Pin 22 Ejector Pin Guide Mechanism 23 Lower Mold According to the Present Invention Die set part 24 Upper mold die set part according to the present invention 25 Electronic component mold lower mold according to the present invention 26 Electronic component mold upper mold according to the present invention 27 Lower chase part according to the present invention 28 Upper chase according to the present invention Part 29 Presser Block 30 Cull Resin 31 Runner Resin 32 Lower Die Set Part by Conventional Technology 33 Upper Die Set Part by Conventional Technology 34 Electronic Component Substrate 35 Pot Block

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[Procedure amendment]

[Submission date] November 29, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction content]

[Document name] Statement

[Title of Invention] Electronic component mold

[Claims]

Detailed Description of the Invention

[0001]

SUMMARY OF THE INVENTION The present invention relates to a mold used for resin molding of electronic parts, and is intended to provide an electronic part mold having a novel structure which is useful in the work of exchanging the kind of electronic parts. is there.

[0002]

2. Description of the Related Art FIGS. 7 to 11 are schematic views of an electronic component molding apparatus equipped with a conventional electronic component molding die. The electronic component molding die according to this conventional technique will be described below with reference to the drawings. That is, the base bolster 1 and the fixed bolster 2
The plurality of guide posts 4, 4, ... Are connected to each other, and the movable bolster 3 is slidably fitted and mounted on these guide posts 4. Movable bolster 3 and fixed bolster 2
A lower die 5 and an upper die 6 of a conventional electronic component molding die, which will be described below, are mounted between them.

FIG. 10 is a cross-sectional view of a conventional electronic component molding die, and FIG. 12 is a perspective view of an electronic component lead frame before molding. Electric heater 1
5, the lower mold 5 and the upper mold 6 already heated to a predetermined temperature.
After a plurality of electronic component boards 34 are placed at predetermined positions between the lead frame 7 and a thermosetting molding resin tablet 8 obtained by compression-curing thermosetting molding resin powder The movable bolster 3 on which the lower die 5 is placed is moved, abutted, and clamped by the movable bolster transfer mechanism 9 in the direction of the fixed bolster 2 on which the upper die 6 is placed.

Then, the plunger 11 is raised by the transfer driving mechanism 10 to be put into the pot 16 and the thermosetting molded resin tablet 8 which has been already heated and melted by the electric heater 15 is opposed to the cull 12 and the transfer mechanism. After being injected and pressurized into the lower mold cavity 14 and the upper mold cavity 19 through the required number of runners 13, they are heat-cured after a predetermined heat-curing time.

After a predetermined heat curing time, the movable bolster 3 is lowered to open the upper and lower molds. With this mold opening,
The ejector pins 21 separate the thermosetting electronic component package from the lower mold cavity 14 and the upper mold cavity 19, respectively.

FIG. 3 shows an electronic component lead frame taken out from the mold through the above steps.
After removing the electronic component lead frame cull resin 30 and the runner resin 31, the subsequent steps of cutting, molding,
It will be sent to each process such as marking and electrical characteristics inspection. The electronic component thus completed is shown in FIG.

Next, a conventional electronic part molding die will be described with reference to the exploded perspective view of FIG. 11 and the sectional view of FIG. If a plurality of types of electronic component packages are to be resin-molded by using the same die set section, the units other than the upper and lower die set sections 32 and 33 must be replaced.

Specifically, the ejector pin 21 for releasing the molded and cured electronic component from the lower mold cavity 14,
And a guide mechanism 22 thereof, a lower chase portion 17 and a lower chase, each of which includes a pot 16 through which a plunger 11 penetrates to form a cylinder shape, a pot 16 ... And a lower die cavity 14 which communicates with a runner 13 to mold an electronic component package. A plunger 11 for penetrating the pot part 16 of the part 17 to transfer and press the thermosetting molding resin that has been heated and melted, and a plunger holder 1 for connecting the plurality of plungers 11, 11, ... With a transfer drive mechanism 10 as a drive source.
8, an ejector pin 21 for releasing the molded and cured electronic component from the upper die cavity 19, a guide mechanism 22 for the ejector pin 21, an upper chase portion 20 including a runner 13, and the above units, the upper and lower die set portions 32, It must be removed from 33 and replaced for each product type.

The upper and lower chase parts 17 and 20 are positioned and fastened to the die set parts 32 and 33 by the pressing block 29. The upper and lower die set parts 32 and 33, the chase parts 17 and 20, and the plunger holder 18
The transfer driving mechanism 10 and the transfer driving mechanism 10 are fitted in a dovetail groove. The electric heater 15, which is a heat source for heating, melting and curing the thermosetting molding resin, includes the upper and lower die set parts 3
It is inserted and installed in 2, 33.

The structure of the electronic component molding die and the method for exchanging the product type according to the prior art have been described above. However, the number of transfer mechanisms and the arrangement pitch must match those of the electronic component lead frame. With the mold, the transfer mechanism is inevitably replaced. As a result, many units associated with product type replacement have a problem in that not only the replacement work is complicated, but also the work is dangerous because the weight is heavy. Therefore,
In the present invention, as a result of intensive research and development in view of the above situation, an electronic component molding die having a novel structure as described in detail below has been completed.

[0011]

The present invention basically has the following structure. That is, a transfer mechanism section and a lower die chase portion are arranged and fitted in the lower die set portion side by side so as to be detachable, while the upper die chase portion is connected to a press device. An electronic component molding die, which is detachably fitted to an upper die set portion.

In further detail, the lower die set portion has a pot block having a plurality of pots, a plunger for pressure transfer of thermosetting molding resin melted in the pots, and a plan. The transfer mechanism part composed of a transfer drive mechanism for jar operation, the lower cavity, the ejector pin for releasing the electronic parts package in the lower cavity, and the lower chase part incorporating the guide mechanism are respectively attached and detached. Install and fit side by side as desired.

On the other hand, in the upper die set portion connected to the pressing device, the upper cavity communicating with the pot in the transfer mechanism section by the cull and the runner, the upper cavity and the cull, and the electronic part package separation in the runner. An electronic component mold characterized in that an upper die chase portion including a die ejector pin and a guide mechanism for the die is detachably fitted, and the lower die set portion is combined with the upper die chase portion. It is a mold. Examples of an electronic component molding die embodied based on this basic configuration are shown in FIGS. 1 to 4 and 6.

[0014]

Embodiment 1 A plan view of FIG. 1, a sectional view of FIG. 2 and a side view of FIG. 3 show an outline of an electronic component molding apparatus equipped with an electronic component molding die according to the present invention. The base bolster 1 and the fixed bolster 2 are connected by a plurality of guide posts 4, and the movable bolster 3 is slidably fitted and mounted on the guide post 4. Between the movable bolster 3 and the fixed bolster 2, an electronic component molding die according to an embodiment of the present invention described below, a lower die 25, and an upper die 26 are mounted.

FIG. 4 is a sectional view of an electronic component molding die according to an embodiment of the present invention, and FIG. 8 is a perspective view of an electronic component lead frame before molding. Electric heater 1
Lower mold 25 and upper mold 2 which have already been heated to a predetermined temperature by 5
6, a strip-shaped lead frame 7 in which a plurality of electronic component substrates 34 are arranged with a space therebetween, and a thermosetting molding resin tablet 8 obtained by compression-curing thermosetting molding resin powder. After arranging in pots 16 respectively, lower mold 2
The movable bolster 3 having the number 5 mounted thereon is moved, abutted, and clamped in the direction of the fixed bolster 2 having the upper die 26 mounted thereon by the movable bolster transfer mechanism 9.

Next, the upper chase portion 28 is provided with the thermosetting molded resin tablet 8 which has been lifted by the transfer driving mechanism 10 to raise the plunger 11 of the transfer mechanism portion and put into the pot 16 and which has already been heated and melted by the electric heater 15. Through the cull 12 and the runner 13 into the lower mold cavity 14 and the upper mold cavity 19, and after pressurization,
After a predetermined heat setting time, heat setting is performed.

After a predetermined heat curing time, the movable bolster 3 is lowered to open the mold up and down. Each of the upper and lower molds has an ejector mechanism for releasing the thermosetting molding resin from the mold. FIG. 3 shows an electronic component lead frame taken out from the mold through the above steps.
After the cull resin 30 and the runner resin 31 are removed, they are sent to each step such as cutting, molding, marking, and electrical characteristic inspection, which are post steps. The electronic component thus completed is shown in the perspective view of FIG.

Next, the electronic component molding die according to the present invention will be described with reference to the exploded perspective view of FIG. 6 and the sectional view of FIG. Basically, since a plurality of types of electronic component packages are resin-molded using the same die set portion, units other than the upper and lower die set portions 23 and 24 are replaced.

Specifically, when the number of electronic component lead frames and product pitches for the product type replacement match the number of electronic component lead frames and product pitches before the product type replacement, after molding and curing. Lower mold cavity 14 for electronic parts
The ejector pin 21 for further releasing the mold, the guide mechanism 22 thereof, the lower mold cavity 14, 1 for communicating with the pot 16 and the runner 13 to mold the electronic component package.
Lower chase part 27 composed of 4, ..., Ejector pin 21 for releasing the electronic component after molding and curing from upper mold cavity 19, guide mechanism 22 thereof, upper chase part 28 composed of runner 13, and the above two units From the upper and lower die set parts 23 and 24 and replaced for each product type. Therefore, the pot block 35 and the plunger 1
1. The transfer mechanism portion such as the plunger holder 18 does not need to be replaced.

In addition, when the number of electronic component lead frames and product pitches for the product type exchange do not match the number of electronic component lead frames and product pitches before the product type exchange, or when thermosetting molding of the electronic component package is performed. If there is a large difference in the amount of resin required, the upper and lower chase parts 27,
28 and transfer mechanism blocker holder 1
8. Replace the plunger 11 and pot block 35.

The upper and lower chase parts 27, 28 are positioned and fastened to the die set parts 23, 24 by a pressing block 29. The upper and lower die set portions 23 and 24, the chase portions 27 and 28, the plunger holder 18 and the transfer drive mechanism 10 are fitted in dovetail grooves, respectively. The electric heater 15 as a heat source for heating and melting and curing the thermosetting molding resin is fitted into only the upper and lower die set portions 23 and 24, or into the upper and lower die set portions 23 and 24 and the upper and lower chase portions 27 and 28, Is installed.

[0022]

The electronic component molding die according to the present invention has a structure in which the transfer mechanism portion and the lower die chase portion are arranged side by side in the lower die set portion so as to be detachable. , The number of lead frame products to be replaced and //
Alternatively, when manufacturing different products whose product pitches are the same as those before product type replacement, it is sufficient to replace only the lower chase part, and when manufacturing different products. Therefore, the number of product and / or product pitch of the target lead frame does not match those before the product type exchange, or the required amount of thermosetting molding resin of the electronic component package is before and after the product type exchange. Only in the case where it is drastically different, it is possible to cope by replacing the transfer mechanism part with the lower chase part.

As described above, since the electronic component molding die of the present invention is capable of manufacturing different kinds of products with the minimum necessary replacement unit, it can be compared with the conventional type electronic component molding die replacement work. As a result, the complexity and risk of the work can be reduced to a considerable extent and the work time can be shortened, and also in terms of economic cost, resin molding of many types of electronic components can be performed while minimizing the capital investment. It has the excellent feature of being able to implement.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component molding apparatus equipped with an electronic component molding die according to the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is a side view of the same.

FIG. 4 is a cross-sectional view of an electronic component molding die according to the present invention.

FIG. 5 is a perspective view of an electronic component lead frame after molding.

FIG. 6 is an exploded perspective view of an electronic component molding die according to the present invention.

FIG. 7 is a plan view of an electronic component molding apparatus in which a conventional electronic component molding die is mounted.

FIG. 8 is a sectional view of the same.

FIG. 9 is a side view of the same.

FIG. 10 is a cross-sectional view of a conventional electronic component molding die.

FIG. 11 is an exploded perspective view of a conventional electronic component molding die.

FIG. 12 is a perspective view of an electronic component lead frame before being molded.

FIG. 13 is a perspective view of a completed electronic component.

[Explanation of reference numerals] 1 base bolster 2 fixed bolster 3 movable bolster 4 guide post 5 electronic component mold lower mold according to conventional technology 6 electronic component mold upper mold according to conventional technology 7 lead frame 8 thermosetting molded resin tablet 9 movable bolster transfer mechanism 10 Transfer Mechanism 11 Plunger 12 Cull 13 Runner 14 Lower Cavity 15 Electric Heater 16 Pot 17 Lower Chase Part by Conventional Technology 18 Plunger Holder 19 Upper Mold Cavity 20 Upper Chase Part by Conventional Technology 21 Ejector Pin 22 Ejector Pin Guide Mechanism 23 Lower die set section according to the present invention 24 Upper die set section according to the present invention 25 Electronic component mold lower die according to the present invention 26 Electronic component mold upper die according to the present invention 27 Lower chase portion according to the present invention 28 Present invention According upper chase unit 29 holding block 30 Cal resin 31 runner resin 32 upper mold die set unit 34 the electronic component substrate 35 pot block by the lower die set 33 prior art according to the prior art

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 5]

[Figure 7]

[Fig. 12]

[Fig. 13]

[Figure 4]

[Figure 6]

[Figure 8]

[Figure 9]

[Figure 10]

FIG. 11

Claims (1)

[Claims] 1. A at least two transfer mechanism for pressing and transferring a thermosetting molding resin, which has been charged and melted into a pot previously heated by a heat source, by a plunger, and is arranged so as to be fittable to a lower die set part. The transfer mechanism part to be installed, the lower mold chase part and the transfer mechanism part are arranged so that they can be fitted freely, and the lower die set part that is fastened to the press machine body and the pot of the transfer mechanism part are communicated with each other. A lower die that has a lower cavity that performs thermosetting molding resin that has been transferred under pressure to mold and cure the electronic component package, and an ejector pin that separates the electronic component package after molding and curing from the lower cavity and its guide mechanism. Set the lower die chase part that can be fitted in the set part freely, the upper cavity and the electronic component package after molding. The upper die chase portion, which has an ejector pin that can be separated from the cavity and a guide mechanism for the ejector pin, is provided so as to be fittable in the upper die set portion, and the upper die chase portion is provided so as to be fittable, and a press device is also provided. Mold for electronic parts consisting of upper die set part fastened to the body