CN218429697U - Quick detach type electronic component injecting glue mould - Google Patents
Quick detach type electronic component injecting glue mould Download PDFInfo
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- CN218429697U CN218429697U CN202222946322.8U CN202222946322U CN218429697U CN 218429697 U CN218429697 U CN 218429697U CN 202222946322 U CN202222946322 U CN 202222946322U CN 218429697 U CN218429697 U CN 218429697U
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Abstract
The utility model relates to the technical field of electronic component production, in particular to a quick-release type electronic component glue injection mold, which comprises a mold frame and a mold core arranged on the mold frame; the die frame comprises a panel and a bottom plate, die feet are fixedly connected to the lower side of the panel, an upper die mounting plate is fixedly connected to the lower side of the die feet, vertical supporting plates are fixedly connected to two sides of the bottom plate respectively, and lower die mounting plates are fixedly connected to the upper sides of the two supporting plates; a plurality of groups of positioning assemblies are arranged between the upper die mounting plate and the lower die mounting plate; the mold core comprises a tool bottom plate, a lower mold, a tool cover plate and an upper mold which are assembled from bottom to top in sequence. The die carrier and the die core are split type, are convenient to replace, and the die core is divided into a plurality of layers to be assembled in sequence, is convenient to disassemble during demolding, can be rapidly and completely demolded, is not easy to damage products, can be disassembled by the lower die insert, and can be disassembled by the lower die, the tooling and the lower die insert, so that the die is convenient to clean, and the cleaning workload is reduced.
Description
Technical Field
The utility model relates to an electronic component production technical field especially relates to a quick detach type electronic component injecting glue mould.
Background
Electronic components are basic elements in electronic circuits, typically individually packaged, and have two or more leads or metal contacts. The glue injection packaging is needed in the processing process of various electronic components, the manual operation is mainly used in the previous glue injection processing, the operation difficulty is high, and the product rejection rate is high. In recent years, the injection molding is mainly used for injection molding of a mold, a semi-finished product of an electronic element to be injected is placed in the corresponding position of the mold in advance, and the injection mold is used for mold assembly and injection of the encapsulating adhesive to realize one-step molding, so that the processing efficiency and the product quality are greatly improved.
Carry out the drawing of patterns after the injecting glue is accomplished, traditional mould is mostly the integral type, and the drawing of patterns is difficult, destroys the product easily during the drawing of patterns, and changes, the clearance mould is inconvenient, is unfavorable for production efficiency's promotion.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a quick-release type glue injection mould for electronic components.
In order to realize the purpose, the utility model adopts the following technical scheme:
a quick-release type electronic component glue injection mold comprises a mold frame and a mold core arranged on the mold frame; the die frame comprises a panel and a bottom plate, die feet are fixedly connected to the lower side of the panel, an upper die mounting plate is fixedly connected to the lower side of the die feet, vertical support plates are fixedly connected to two sides of the bottom plate respectively, and lower die mounting plates are fixedly connected to the upper sides of the two support plates; a plurality of groups of positioning assemblies are arranged between the upper die mounting plate and the lower die mounting plate; the mold core comprises a tool bottom plate, a lower mold, a tool cover plate and an upper mold which are assembled in sequence from bottom to top; the tooling bottom plate is arranged on the upper side of the lower die mounting plate through a fastener, and the upper die is arranged on the lower side of the upper die mounting plate through a fastener; set up a plurality of income sub-grooves that the 2 xn matrix was arranged on the lower mould, all be equipped with down the mould insert in every income sub-groove, be provided with two on the lower mould and be located two respectively and go into the glue total groove of leading of sub-inslot side, the middle part of frock is equipped with the glue injection groove, and the glue injection groove switches on with leading the glue total groove, the inboard of lower mould insert is equipped with leads glues a groove, leads to glue total groove and leads to glue a groove and switch on.
Preferably, an ejector pin fixing plate is arranged between the lower die mounting plate and the bottom plate, and an ejector pin fixing plate guide column in sliding fit with the lower die mounting plate is fixedly arranged on the ejector pin fixing plate.
Preferably, handles are mounted on the side portions of the tool and the tool cover plate.
Preferably, the lower die mounting plate is fixedly provided with a die assembly guide post, and the upper die mounting plate is movably matched with the die assembly guide post along the length direction of the die assembly guide post.
Preferably, the positioning assembly comprises an upper positioning block and a lower positioning block, the lower positioning block is fixed on the lower die mounting plate, a concave part is arranged at the upper part of the lower positioning block, the upper positioning block is fixed on the upper die mounting plate, and a convex part matched with the corresponding lower positioning block is arranged at the upper part of the upper positioning block.
Preferably, the edge of the tooling bottom plate is provided with a plurality of positioning pins.
The utility model has the advantages that:
1. the die carrier and the die core are split, so that the die carrier and the die core are convenient to replace, the die core is divided into multiple layers to be assembled in sequence, the die carrier is convenient to disassemble during demolding, the demolding can be fast and complete, and the product is not easy to damage.
2. The lower mold insert can be detached, and the glue injection channel can be detached through detaching the lower mold, the tool and the lower mold insert, so that the mold is convenient to clean, and the cleaning workload is reduced.
Drawings
Fig. 1 is a schematic structural view of a quick release type glue injection mold for electronic components according to the present invention;
fig. 2 is a schematic view of a mold frame structure of a quick-release type electronic component glue injection mold provided by the present invention;
fig. 3 is a schematic view of a mold core structure of a quick-release type electronic component glue injection mold provided by the present invention;
fig. 4 is a schematic view of an upper mold structure of a quick release type glue injection mold for electronic components according to the present invention;
fig. 5 is a schematic view of the mold core structure of the quick release type electronic component glue injection mold of the present invention with the upper mold removed;
fig. 6 is a schematic lower mold structure diagram of a quick release type electronic component glue injection mold provided by the present invention;
fig. 7 is a schematic view of a tooling structure of a quick-release type glue injection mold for electronic components according to the present invention;
fig. 8 is a schematic view of a tooling cover plate structure of a quick-release type electronic component glue injection mold according to the present invention;
fig. 9 is a schematic view of a tooling bottom plate assembly structure of a quick-release type electronic component glue injection mold according to the present invention;
fig. 10 is a schematic view of a lower mold insert structure of a quick-release electronic component glue injection mold according to the present invention;
fig. 11 is a schematic view of a product structure of a quick release type electronic component glue injection mold provided by the present invention.
In the figure: 1. a mold frame; 11. a panel; 12. a mould leg; 13. an upper die mounting plate; 14. a positioning assembly; 141. an upper positioning block; 142. a lower positioning block; 15. a lower die mounting plate; 16. a support plate; 17. a base plate; 18. a thimble fixing plate; 2. a mold core; 21. a tooling bottom plate; 22. a lower die; 23. tooling; 24. a tooling cover plate; 25. a lower mold insert; 26. a positioning pin; 27. an upper die; 28. a handle; 3. injecting glue groove; 4. a glue guiding main groove; 5. a rubber guide supporting groove; 6. and (5) producing the product.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1, the quick-release type electronic component glue injection mold comprises a mold frame 1 and a mold core 2 installed on the mold frame 1;
referring to fig. 2, the die carrier 1 comprises a panel 11 and a bottom plate 17, die feet 12 are fixedly connected to the lower side of the panel 11, a slotted opening is formed in the panel 11, a die is convenient to support, the middle of each die foot 12 is hollow, the weight of the die is reduced, and taking and placing are convenient. Mould 12 downside fixedly connected with of mould foot goes up mould mounting panel 13, and upward mould mounting panel 13 downside is equipped with the mold core mounting groove for installation mold core 2 still is equipped with the injecting glue hole on going up mould mounting panel 13, is used for the injecting glue, and is equipped with the mould heating hole on going up mould mounting panel 13, is used for the heating of mould. The both sides of bottom plate 17 are the vertical backup pad 16 of fixedly connected with respectively, 17 fluting type mouths on bottom plate, the frame mould of being convenient for, two 16 upside fixedly connected with lower mould mounting panels 15 of backup pad, 15 upsides of lower mould mounting panel are equipped with the mold core mounting groove, be used for installing mold core 2, still be equipped with the injecting glue hole on the lower mould mounting panel 15, be used for the injecting glue, and be equipped with mould heating hole on the lower mould mounting panel 15, fixed mounting has the compound die guide post on the lower mould mounting panel 15, go up the length direction of mould mounting panel 13 along the compound die guide post rather than clearance fit.
Three groups of positioning assemblies 14 are arranged between the upper die mounting plate 13 and the lower die mounting plate 15, each positioning assembly 14 comprises an upper positioning block 141 and a lower positioning block 142, each lower positioning block 142 is fixed on the corresponding lower die mounting plate 15, a concave part is arranged at the upper part of each lower positioning block, each upper positioning block 141 is fixed on the upper die mounting plate 13, a convex part matched with the corresponding lower positioning block 142 is arranged at the upper part of each upper positioning block, and when the upper die and the lower die are assembled, the upper positioning blocks 141 and the lower positioning blocks 142 are abutted for accurate positioning of the upper die and the lower die.
An ejector pin fixing plate 18 is arranged between the lower die mounting plate 15 and the bottom plate 17, an ejector pin fixing plate guide post in sliding fit with the lower die mounting plate 15 is fixedly arranged on the ejector pin fixing plate 18, the ejector pin fixing plate 18 is used for ejector pin assembly, and the supporting plate 16 limits the stroke of an ejector pin.
Referring to fig. 3-10, the mold core 2 comprises a tooling bottom plate 21, a lower mold 22, a tooling 23, a tooling cover plate 24 and an upper mold 27 which are assembled in sequence from bottom to top; the tooling bottom plate 21 is mounted on the upper side of the lower die mounting plate 15 through a fastener, and the upper die 27 is mounted on the lower side of the upper die mounting plate 13 through a fastener.
The edge of the tooling bottom plate 21 is provided with a plurality of positioning pins 26 for positioning the mold cores 2. Set up a plurality of sub-grooves of going into that the 2N matrix was arranged on lower mould 22, every goes into all to be equipped with down the mould and goes into sub-25 in the sub-groove, be provided with two on the lower mould 22 and be located two respectively and go into the gluey master tank 4 of leading of sub-inslot side, the middle part of frock 23 is equipped with glue injection groove 3, when glue injection groove 3 and lower mould 22 assembly, glue injection groove 3 switches on with leading gluey master tank 4, the inboard of sub-25 of going into is equipped with leads gluey a groove 5 down, when lower mould goes into sub-25 and lower mould 22 assembly, lead gluey master tank 4 and lead gluey a groove 5 and switch on. Handles 28 are mounted on the side portions of the tooling 23 and the tooling cover plate 24.
During glue injection, the tool bottom plate 21, the lower die 22, the tool 23 and the tool cover plate 24 are sequentially assembled from bottom to top, the lower die insert 25 is assembled in the lower die 22, the upper die 27 and the lower die 22 are assembled, the packaging glue is injected through the glue injection hole and sequentially guided into a die cavity through the glue injection groove 3, the glue guide main groove 4 and the glue guide branch grooves 5, the lower die 22 is lifted after the packaging glue is cooled and solidified, the tool cover plate 24 and the tool 23 are sequentially disassembled, and then the product 6 can be obtained (as shown in figure 11).
The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.
Claims (6)
1. A quick-release type electronic component glue injection mold is characterized by comprising a mold frame (1) and a mold core (2) installed on the mold frame (1);
the die set (1) comprises a panel (11) and a bottom plate (17), die feet (12) are fixedly connected to the lower side of the panel (11), an upper die mounting plate (13) is fixedly connected to the lower side of the die feet (12), vertical supporting plates (16) are fixedly connected to two sides of the bottom plate (17) respectively, and lower die mounting plates (15) are fixedly connected to the upper sides of the two supporting plates (16);
a plurality of groups of positioning assemblies (14) are arranged between the upper die mounting plate (13) and the lower die mounting plate (15);
the mold core (2) comprises a tool bottom plate (21), a lower mold (22), a tool (23), a tool cover plate (24) and an upper mold (27) which are assembled in sequence from bottom to top; the tooling bottom plate (21) is mounted on the upper side of the lower die mounting plate (15) through a fastener, and the upper die (27) is mounted on the lower side of the upper die mounting plate (13) through a fastener;
set up a plurality of income sub-grooves that 2 x n matrix was arranged on lower mould (22), all be equipped with down mould income sub- (25) in every income sub-groove, be provided with two on lower mould (22) and be located two respectively and go into leading of sub-inslot side and glue total groove (4), the middle part of frock (23) is equipped with injecting glue groove (3), and injecting glue groove (3) with lead and glue total groove (4) and switch on, the inboard of lower mould income sub- (25) is equipped with leads glues a groove (5), leads to glue total groove (4) and leads to glue a groove (5) and switch on.
2. The glue injection mold for the fast-dismounting electronic components according to claim 1, wherein an ejector pin fixing plate (18) is disposed between the lower mold mounting plate (15) and the bottom plate (17), and an ejector pin fixing plate guide post slidably engaged with the lower mold mounting plate (15) is fixedly disposed on the ejector pin fixing plate (18).
3. The quick-release type injection mold for electronic components as claimed in claim 1, wherein a handle (28) is mounted on each of the side portions of the tooling (23) and the tooling cover plate (24).
4. The quick-release type electronic component glue injection mold according to claim 1, wherein the lower mold mounting plate (15) is fixedly provided with mold clamping guide posts, and the upper mold mounting plate (13) is movably matched with the mold clamping guide posts along the length direction of the mold clamping guide posts.
5. The mold for injecting glue to quick-release electronic components of claim 1, wherein said positioning assembly (14) comprises an upper positioning block (141) and a lower positioning block (142), said lower positioning block (142) is fixed on said lower mold mounting plate (15), and a concave portion is disposed on the upper portion of said lower positioning block, said upper positioning block (141) is fixed on said upper mold mounting plate (13), and a convex portion matched with the corresponding lower positioning block (142) is disposed on the upper portion of said upper positioning block.
6. The mold for injecting glue to an electronic component of a quick release type as claimed in claim 1, wherein a plurality of positioning pins (26) are disposed on an edge of the tooling bottom plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222946322.8U CN218429697U (en) | 2022-11-07 | 2022-11-07 | Quick detach type electronic component injecting glue mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222946322.8U CN218429697U (en) | 2022-11-07 | 2022-11-07 | Quick detach type electronic component injecting glue mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218429697U true CN218429697U (en) | 2023-02-03 |
Family
ID=85074022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222946322.8U Active CN218429697U (en) | 2022-11-07 | 2022-11-07 | Quick detach type electronic component injecting glue mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218429697U (en) |
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2022
- 2022-11-07 CN CN202222946322.8U patent/CN218429697U/en active Active
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