JPH0634461B2 - Electronic device mounting structure - Google Patents
Electronic device mounting structureInfo
- Publication number
- JPH0634461B2 JPH0634461B2 JP57154615A JP15461582A JPH0634461B2 JP H0634461 B2 JPH0634461 B2 JP H0634461B2 JP 57154615 A JP57154615 A JP 57154615A JP 15461582 A JP15461582 A JP 15461582A JP H0634461 B2 JPH0634461 B2 JP H0634461B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- connector
- signal
- board
- backboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Connection Or Junction Boxes (AREA)
Description
【発明の詳細な説明】 発明の属する技術分野 本発明は、電子機器の実装構造に関し、特に、複数のプ
リント回路基板をバツクボードに搭載する形式の実装構
造に関する。Description: TECHNICAL FIELD The present invention relates to a mounting structure of an electronic device, and more particularly to a mounting structure of a type in which a plurality of printed circuit boards are mounted on a backboard.
従来技術 従来のこの種実装構造は、第１図に示すように、複数の
プリント回路基板１をそれぞれ接続するためのコネクタ
５を配列したバツクボード基板６を備えて、該バツクボ
ード基板６にプリント回路基板１を搭載する構造であ
る。バツクボード基板６には、プリント回路基板１に電
源，アース等を供給するための電源層，信号接続のため
の信号配線層等があり、電源（およびアース），信号線
等はすべてコネクタ５を介してプリント回路基板１に接
続される構造である。プリント回路基板１は、放熱フイ
ン３を取付けた集積回路パツケージ２を複数個搭載して
いて、その一辺には前記コネクタ５に嵌合接続するため
のコネクタ４が固着されている。該コネクタ４を前記コ
ネクタ５に嵌合接続することによりプリント回路基板１
がバツクボード基板６に搭載される。2. Description of the Related Art As shown in FIG. 1, a conventional mounting structure of the related art includes a backboard board 6 in which connectors 5 for connecting a plurality of printed circuit boards 1 are arranged, and the backboard board 6 is provided with a printed circuit board. It is a structure for mounting 1. The backboard board 6 has a power supply layer for supplying power, ground, etc. to the printed circuit board 1, a signal wiring layer for signal connection, etc., and the power supply (and ground), signal lines, etc. are all connected via the connector 5. Is connected to the printed circuit board 1. The printed circuit board 1 is mounted with a plurality of integrated circuit packages 2 to which heat radiation fins 3 are attached, and a connector 4 for fitting and connecting to the connector 5 is fixed to one side thereof. The printed circuit board 1 is obtained by fitting and connecting the connector 4 to the connector 5.
Are mounted on the backboard board 6.
上述の従来構造は、バツクボード基板６内の電源層の電
流容量が限られており、近年の高集積化高密度実装等に
伴なう単位体積当りの消費電流の増加に対処することが
困難である。すなわち、消費電流の増加に伴なつて電源
層の電流容量を増加させる必要があり、また、電源変
動，発熱量等の増加を押えるためにも、バツクボード基
板に電源層を多層積層した高多層板を必要とし、コスト
上昇を伴なうのみならず、板厚増加に伴なうバツクボー
ド基板製造上の困難がある。In the above-described conventional structure, the current capacity of the power supply layer in the backboard board 6 is limited, and it is difficult to cope with the increase in current consumption per unit volume accompanying the recent high integration and high density mounting. is there. That is, it is necessary to increase the current capacity of the power supply layer as the consumption current increases, and in order to suppress an increase in power supply fluctuations, heat generation, etc., a high multilayer board in which power supply layers are stacked in multiple layers on the backboard board Is required, and not only the cost is increased, but also the back board substrate is difficult to manufacture due to the increase in plate thickness.
また、消費電流の増大に伴なつて、コネクタ４，５の電
源接続用のコネクタピンに流れる電流が増加する。しか
し、コネクタ４，５のコネクタピンは、電源接続用のピ
ンも信号接続用のピンも同一構造であり、信号接続用の
ピンは、集積回路パツケージの機能増大に伴ない多端子
化および微細化が図られることからピン１個当りの接点
容量が減少している。従つて、消費電流が増加した場
合、電源接続用により多数のコネクタピンを使用しなけ
ればならず、信号接続用に使用できるピン数が圧迫され
るという欠点がある。Further, as the current consumption increases, the current flowing through the connector pins for connecting the power sources of the connectors 4 and 5 also increases. However, the connector pins of the connectors 4 and 5 have the same structure for both the power supply connection pin and the signal connection pin, and the signal connection pin has multiple terminals and is miniaturized as the function of the integrated circuit package increases. As a result, the contact capacitance per pin is reduced. Therefore, when the current consumption is increased, it is necessary to use a larger number of connector pins for power supply connection, which has a drawback that the number of pins that can be used for signal connection is limited.
また、第２図は、上記従来構造を示す平面図であるが、
同図から明らかなように、コネクタ５は、プリント回路
基板１，集積回路パツケージ２および放熱フイン３の合
計の厚さに対応する間隔で配列されているから、コネク
タ５相互の間には、空間部Ｂが形成される。すなわち、
バツクボード基板６上に未実装の余分なスペースが生
じ、実装効率が悪い。Further, FIG. 2 is a plan view showing the above conventional structure,
As is clear from the figure, since the connectors 5 are arranged at intervals corresponding to the total thickness of the printed circuit board 1, the integrated circuit package 2 and the heat dissipation fins 3, there is a space between the connectors 5. Part B is formed. That is,
An extra unmounted space is generated on the backboard board 6, resulting in poor mounting efficiency.
発明の目的 本発明の目的は、上述の従来の欠点を解決し、電源供給
容量を増大し、電源電圧変動および発熱量の増加を防止
し、かつコネクタの信号接続用ピン数を圧迫しない電子
機器の実装構造を提供することにある。OBJECT OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional drawbacks, to increase the power supply capacity, to prevent fluctuations in power supply voltage and increase in heat generation, and to avoid pinching the number of signal connecting pins of a connector. To provide the implementation structure of.
発明の構成 本発明の実装構造は、複数のプリント回路基板をそれぞ
れ接続するための複数の信号用コネクタを配列したバツ
クボード基板を備えて、該バツクボード基板に複数のプ
リント回路基板を搭載する電子機器の実装構造におい
て、前記バツクボード基板上に前記コネクタに隣接して
配列された電源バスと、該電源バスに固着され前記プリ
ント回路基板に電源供給するための電源コンタクトとを
備え、前記プリント回路基板は、前記信号用コネクタお
よび上記電源コンタクトにそれぞれ接続される信号ピン
および電源ピンを内蔵したコネクタをその端部に固着し
たことを特徴とする。Configuration of the Invention The mounting structure of the present invention includes a backboard board in which a plurality of signal connectors for connecting a plurality of printed circuit boards are arranged, and an electronic device in which the plurality of printed circuit boards are mounted on the backboard board. In the mounting structure, a power supply bus arranged adjacent to the connector on the backboard board, and a power supply contact fixed to the power supply bus for supplying power to the printed circuit board, the printed circuit board, A connector containing a signal pin and a power supply pin, which are respectively connected to the signal connector and the power supply contact, is fixed to an end portion thereof.
なお、上述の電源バスは、バツクボード基板に配列され
たコネクタ間の余分な空間を利用して取り付けたもので
あり、スペースの有効利用が図られ、かつ、バツクボー
ド基板の機械的補強に対しても有効である。従つて更に
高密度実装が可能となる。In addition, the above-mentioned power supply bus is installed by utilizing the extra space between the connectors arranged on the backboard board, so that the space can be effectively used and the mechanical strength of the backboard board is also improved. It is valid. Therefore, higher density mounting is possible.
発明の実施例 次に、本発明について、図面を参照して詳細に説明す
る。Embodiments of the Invention Next, the present invention will be described in detail with reference to the drawings.
第３図は、本発明の一実施例を示す斜視図であり、第４
図はそのＣ部拡大斜視図である。また第５図は第４図の
Ａ−Ａ断面図である。すなわち、第３図に示すように、
バツクボード基板６の上，下両縁に沿つて主電源バス８
を配設し、信号用コネクタ９に隣接して電源バス１０を
配設する。電源バス１０の上，下両端部は、主電源バス
８に接続されている。電源バス１０は、第４図に示され
るように絶縁板１２を挾んで相互に絶縁された１対のバ
スバーからなり、１本のバスバーは例えば主電源バス８
を介して電源に接続され、他の１本のバスバーはアース
に接続される。各バスバーはまたバツクボード基板６内
の電源層とも接続される。そして、絶縁板１２は、電源
バス１０の前面より突出している。従つて、絶縁板１２
と電源バス１０の前面とでＬ字形が形成され、該Ｌ字形
に沿つて１対の電源コンタクト１１が設けられている。
第４図のＡ−Ａ断面図である第５図から理解されるよう
に、信号用コネクタ９は信号接続用のコンタクトピン９
ａを内蔵し、プリント回路基板１に固着されたコネクタ
７から突設した信号ピン１３と接続可能である。また、
電源コンタクト１１には、同様な電源ピン１４が接続さ
れる。ただし、電源ピン１４は、コネクタ７に穿設され
た凹部中に突設されている。FIG. 3 is a perspective view showing an embodiment of the present invention.
The figure is an enlarged perspective view of the C portion. FIG. 5 is a sectional view taken along the line AA of FIG. That is, as shown in FIG.
Main power bus 8 along both upper and lower edges of backboard board 6
And the power supply bus 10 is arranged adjacent to the signal connector 9. Both upper and lower ends of the power supply bus 10 are connected to the main power supply bus 8. As shown in FIG. 4, the power supply bus 10 is composed of a pair of bus bars sandwiched by an insulating plate 12 and insulated from each other. One bus bar is, for example, the main power supply bus 8
To the power supply, and the other one bus bar is connected to the ground. Each bus bar is also connected to a power supply layer in the backboard board 6. The insulating plate 12 projects from the front surface of the power bus 10. Therefore, the insulating plate 12
An L-shape is formed by the front surface of the power supply bus 10 and a pair of power contacts 11 are provided along the L-shape.
As can be understood from FIG. 5 which is a cross-sectional view taken along the line AA of FIG. 4, the signal connector 9 is a contact pin 9 for signal connection.
It has a built-in a and can be connected to the signal pin 13 protruding from the connector 7 fixed to the printed circuit board 1. Also,
A similar power supply pin 14 is connected to the power supply contact 11. However, the power supply pin 14 is provided so as to project into the recessed portion formed in the connector 7.
第６図は、プリント回路基板１の後縁部に固着されたコ
ネクタ７を示す背面図であり、第７図はその側面図であ
る。第６，７図から理解されるように、コネクタ７の裏
面には多数の信号ピン１３が配列して突設され、その隣
接部に穿設された凹部７ａ内には電源ピン１４が穿設さ
れている。該コネクタ７を前記信号用コネクタ９に嵌合
接続したとき前記第５図に示した電源コネクタ１１が凹
部７ａ内に侵入し電源ピン１４と接続される。なお、第
５図に示されるように、信号ピン１３および電源ピン１
４は共にＬ字形に曲折されて、その一方の先端部はプリ
ント回路基板１に植設され、プリント回路基板１に形成
された信号又は電源配線導体を介して集積回路パツケー
ジ２の所要部に接続される。ここで、信号ピン１３は電
源ピン１４より内側に配設してピン長を短くすること
が、信号ラインの誤動作等を防止する上から望ましい。
また、電源ピン１４は、第６図に示すようにコンタクト
部の幅が広く形成されていて大電流を供給することがで
きる。FIG. 6 is a rear view showing the connector 7 fixed to the rear edge of the printed circuit board 1, and FIG. 7 is a side view thereof. As can be seen from FIGS. 6 and 7, a large number of signal pins 13 are arranged in a protruding manner on the back surface of the connector 7, and a power supply pin 14 is formed in a recess 7 a formed in the adjacent portion. Has been done. When the connector 7 is fitted and connected to the signal connector 9, the power supply connector 11 shown in FIG. 5 enters the recess 7a and is connected to the power supply pin 14. As shown in FIG. 5, the signal pin 13 and the power supply pin 1
4 are both bent into an L-shape, and one end portion thereof is implanted in the printed circuit board 1 and is connected to a required portion of the integrated circuit package 2 via a signal or power supply wiring conductor formed on the printed circuit board 1. To be done. Here, it is desirable to dispose the signal pin 13 inside the power supply pin 14 to shorten the pin length in order to prevent malfunction of the signal line and the like.
Further, the power supply pin 14 has a wide contact portion as shown in FIG. 6 and can supply a large current.
本実施例においては、プリント回路基板１をバツクボー
ド基板６に搭載したとき、電源は、主電源バス８からバ
ツクボード基板６の電源層および電源バス１０に供給さ
れ、電源コンタクト１１→電源ピン１４→プリント回路
基板１の電源層→集積回路パツケージ２の径路で供給さ
れる。アースについても同様である。また、バツクボー
ド基板６とプリント回路基板１間の信号伝達は、信号用
コネクタ９と信号ピン１３によつて行なわれる。本実施
例では、信号用コネクタ９は、電源接続用には使用され
ないから、微弱な信号を流すのみであり、微細、小容量
の接点とすることができる。従つて多端子化に有利であ
る。また、電源供給は、主として主電源バス８，電源バ
ス１０から行なわれるため電流容量を十分大きくするこ
とが可能となり、電流増大による発熱および電源電圧変
動を減少できる効果がある。また、電源接続用に信号用
コネクタ９を使用しないから、信号接続用に使用できる
ピン数を圧迫することがない。また、バツクボード基板
６の電源配線層を多層化する必要がないから、バツクボ
ード基板を薄く形成することができ、安価に提供可能で
ある。さらに、電源バス８，１０等によつて、バツクボ
ード基板６の機械的強度が補強される利点もある。従つ
て、高密度実装による重量の増大に耐えることができ
る。なお、上記電源バス１０は、信号用コネクタ９に隣
接するベースに配設するものであるから、バツクボード
基板６のスペースが有効に活用され、全体面積を増加さ
せることなく上述の諸効果および諸利点を生じる。In this embodiment, when the printed circuit board 1 is mounted on the backboard board 6, power is supplied from the main power supply bus 8 to the power supply layer of the backboard board 6 and the power supply bus 10, and the power supply contact 11 → power supply pin 14 → printing. Power is supplied from the power supply layer of the circuit board 1 to the integrated circuit package 2. The same applies to earth. Signal transmission between the backboard board 6 and the printed circuit board 1 is performed by the signal connector 9 and the signal pin 13. In this embodiment, since the signal connector 9 is not used for power supply connection, it only allows a weak signal to flow, and can be a fine, small-capacity contact. Therefore, it is advantageous for increasing the number of terminals. Further, since power is supplied mainly from the main power supply bus 8 and the power supply bus 10, it is possible to sufficiently increase the current capacity, and it is possible to reduce heat generation and power supply voltage fluctuation due to the increase in current. Further, since the signal connector 9 is not used for power supply connection, the number of pins that can be used for signal connection is not restricted. Further, since it is not necessary to make the power supply wiring layers of the backboard substrate 6 multi-layered, the backboard substrate can be formed thin and can be provided at low cost. Further, there is an advantage that the mechanical strength of the backboard board 6 is reinforced by the power supply buses 8 and 10. Therefore, it is possible to withstand the increase in weight due to the high-density mounting. Since the power supply bus 10 is arranged on the base adjacent to the signal connector 9, the space of the backboard board 6 is effectively utilized, and the above-mentioned effects and advantages are obtained without increasing the overall area. Cause
以上のように、本発明においては、複数のプリント回路
基板を搭載するためのバツクボード基板に配列された信
号接続用コネクタに隣接して電源バスを配設し、該電源
バスに給電用の電源コンタクトを固着し、前記プリント
回路基板後縁には、上記信号接続用コネクタ嵌合接続す
る信号ピンと上記電源コンタクトに嵌合接続する電源ピ
ンとを内蔵したコネクタを固着した構成としたから、各
プリント回路基板をバツクボード基板に搭載したとき、
電源およびアースは、上記電源バス，電源コンタクトお
よび電源ピンを介して接続され、信号は信号接続用コネ
クタおよび信号ピンによつて接続される。従つて、信号
接続用のピンは電源接続に使用されず、小型化多端子化
が可能となる。また、電源供給は主として電源バスによ
つて行なわれるから、バツクボード基板の電源層を多層
化しないで、電流容量を増大させることが可能であり、
かつ、電源電圧の変動、発熱量の増大を防止できる効果
がある。以上総合して高密度実装，多端子化等が容易
で、大電流を供給可能な実装構造を提供できる効果があ
る。また、上記電源バスは、信号接続用コネクタ間のス
ペースを有効に利用して配設するものであるから、バツ
クボード基板の面積を増大させることはなく、さらに、
バツクボード基板の機械的強度が補強される利点もあ
る。As described above, in the present invention, the power supply bus is disposed adjacent to the signal connection connector arranged on the backboard board for mounting a plurality of printed circuit boards, and the power supply contact for supplying power to the power supply bus. The printed circuit board has a structure in which a signal pin for fitting and connecting the signal connecting connector and a power supply pin for fitting and connecting to the power contact are fixed to the rear edge of the printed circuit board. When mounted on the backboard board,
The power supply and the ground are connected via the power supply bus, the power supply contact and the power supply pin, and the signals are connected by the signal connection connector and the signal pin. Therefore, the pin for signal connection is not used for power supply connection, and it is possible to reduce the size and increase the number of terminals. Further, since the power supply is mainly performed by the power supply bus, it is possible to increase the current capacity without making the power supply layers of the backboard board multilayer.
Moreover, there is an effect that the fluctuation of the power supply voltage and the increase of the heat generation amount can be prevented. Overall, there is an effect that it is possible to provide a mounting structure capable of supplying a large current, which facilitates high-density mounting and multi-terminal mounting. Further, since the power bus is arranged by effectively utilizing the space between the signal connecting connectors, it does not increase the area of the backboard board, and further,
There is also an advantage that the mechanical strength of the backboard substrate is reinforced.
第１図は従来の電子機器の実装構造の一例を示す斜視
図、第２図はその平面図、第３図は本発明の一実施例を
示す斜視図、第４図はそのｃ部拡大斜視図、第５図は第
４図のＡ−Ａ断面図、第６図はプリント回路基板に固着
されたコネクタを示す背面図、第７図はその側面図であ
る。 図において、１……プリント回路基板、２……集積回路
パツケージ、３……放熱フイン、４，５……コネクタ、
６……バツクボード基板、７……プリント回路基板１の
後縁に固着され信号ピンおよび電源ピンを内蔵したコネ
クタ、８……主電源バス、９……信号用コネクタ、１０
……電源バス、１１……電源コンタクト、１２……絶縁
板、１３……信号ピン、１４……電源ピン、７ａ……コ
ネクタ７に穿設された凹部、９ａ……信号接続用のコン
タクトピン。FIG. 1 is a perspective view showing an example of a mounting structure of a conventional electronic device, FIG. 2 is a plan view thereof, FIG. 3 is a perspective view showing an embodiment of the present invention, and FIG. 5 and 5 are sectional views taken along the line AA in FIG. 4, FIG. 6 is a rear view showing a connector fixed to a printed circuit board, and FIG. 7 is a side view thereof. In the figure, 1 ... Printed circuit board, 2 ... Integrated circuit package, 3 ... Heat dissipation fin, 4, 5 ... Connector,
6 ... Backboard board, 7 ... Connector fixed to the rear edge of the printed circuit board 1 and incorporating signal and power pins, 8 ... Main power bus, 9 ... Signal connector, 10
...... Power supply bus, 11 ...... Power supply contact, 12 ...... Insulation plate, 13 ...... Signal pin, 14 ...... Power supply pin, 7a ...... Recessed hole formed in the connector 7, 9a ...... Contact pin for signal connection .
Claims (1)
基板上に設けられて複数のプリント回路基板が接続され
るバックボード基板を備え、 上記信号用コネクタと上記電源バスとが上記プリント回
路基板端部のコネクタと接続されて上記バックボード基
板に上記プリント回路基板を搭載する電子機器の実装構
造において、 上記電源バスは上記信号用コネクタに隣接して並列に配
列され、 上記プリント回路基板のコネクタは、上記バックボード
基板の信号用コネクタに接続される信号ピン列と、該信
号ピン列に隣接して平行に配列され、上記電源バス上の
電源コンタクトに嵌合する電源ピンとを有する ことを特徴とする電子機器の実装構造。1. A backboard board having a plurality of signal connectors and a power supply bus provided on the board to which a plurality of printed circuit boards are connected, wherein the signal connector and the power supply bus are the printed circuits. In a mounting structure of an electronic device which is connected to a connector at an end of a board and mounts the printed circuit board on the backboard board, the power supply bus is arranged in parallel adjacent to the signal connector, The connector has a signal pin row connected to the signal connector of the backboard board and a power pin arranged adjacent to the signal pin row in parallel and fitted to a power contact on the power bus. The characteristic electronic device mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57154615A JPH0634461B2 (en) | 1982-09-07 | 1982-09-07 | Electronic device mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57154615A JPH0634461B2 (en) | 1982-09-07 | 1982-09-07 | Electronic device mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5944910A JPS5944910A (en) | 1984-03-13 |
| JPH0634461B2 true JPH0634461B2 (en) | 1994-05-02 |
Family
ID=15588052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57154615A Expired - Lifetime JPH0634461B2 (en) | 1982-09-07 | 1982-09-07 | Electronic device mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0634461B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4937136A (en) * | 1972-08-11 | 1974-04-06 | ||
| JPS5436316A (en) * | 1978-07-11 | 1979-03-17 | Nippon Electric Glass Co | Sealing composition capable of melting at low temperature |
| JPS5528134A (en) * | 1978-08-15 | 1980-02-28 | Nec Corp | Construction of power supply |
| JPS567320A (en) * | 1979-06-29 | 1981-01-26 | Matsushita Electric Works Ltd | Delay switch |
-
1982
- 1982-09-07 JP JP57154615A patent/JPH0634461B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5944910A (en) | 1984-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0129966B1 (en) | High cooling efficiency circuit module | |
| EP1264347B1 (en) | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages | |
| JPH0552079B2 (en) | ||
| JPH0574532A (en) | Electric connector | |
| US3927925A (en) | Connector assembly | |
| US4764122A (en) | Data bus connector | |
| JPH0453195A (en) | Electronic circuit module | |
| US20040264148A1 (en) | Method and system for fan fold packaging | |
| US4603927A (en) | Surface mounted bussing device | |
| US6181571B1 (en) | Printed-wiring board and electronic device having the same wiring board | |
| JP2002198108A (en) | Multi-line grid connector | |
| JPH0634461B2 (en) | Electronic device mounting structure | |
| JPH0519316B2 (en) | ||
| US7183644B2 (en) | Integrated circuit package with improved power signal connection | |
| CN101022099A (en) | Thick film circuit, pin frame, circuit board and assembly thereof | |
| JPH10214928A (en) | Printed wiring board | |
| JP2976605B2 (en) | Memory module | |
| JP3521115B2 (en) | Electronic unit wiring structure | |
| TWI793506B (en) | battery connection module | |
| JPS62527B2 (en) | ||
| CN101965100A (en) | Thick film circuit, pin frame, circuit board and combination thereof | |
| JPS5855767Y2 (en) | Printed board mounting structure on back panel | |
| JPS62208691A (en) | Double-sided mounting hybrid integrated circuit | |
| WO1996031100A1 (en) | Package of electronic device | |
| JP2000195586A (en) | Circuit board for card connector |