CN101022099A - Thick film circuit, pin frame, circuit board and assembly thereof - Google Patents
Thick film circuit, pin frame, circuit board and assembly thereof Download PDFInfo
- Publication number
- CN101022099A CN101022099A CN 200710073585 CN200710073585A CN101022099A CN 101022099 A CN101022099 A CN 101022099A CN 200710073585 CN200710073585 CN 200710073585 CN 200710073585 A CN200710073585 A CN 200710073585A CN 101022099 A CN101022099 A CN 101022099A
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- thick film
- pad
- circuit
- circuit board
- welding assembly
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Abstract
This invention discloses a kind of thick film circuit, a CB and their combination, in which, a staggered distribution mode is applied to the pins of the thick film circuit, when multiple thick film circuits are installed on the circuit in parallel, the adjacent pins of two thick film circuits are plugged into the vacancies formed by staggered distribution of the opposite pins so as to reduce the distance of the two thick film circuits and increase the density of the circuit.
Description
Technical field
The present invention relates to a kind of electronic circuit, particularly a kind of thick film circuit and use the circuit board combination of this thick film circuit.
Background technology
Thick film circuit is used very extensive as the element circuit carrier in electronic product fields such as communication, household electrical appliances.
As Fig. 1, a kind of thick film circuit of prior art has thick film matrix and pin, and this pin is fixed on this thick film matrix by draw-in groove, and to thick film matrix both sides separately, plane of common formation, all pin bottoms.This thick film circuit is a mode of utilizing silk-screen to be shaped, go up (also can add components and parts such as electric capacity, diode in case of necessity) such as printed circuit conductor, thick-film resistors at substrate (as ceramic wafer) earlier, make pad at an end of thick film then, and finish behind the pin that is shaped in advance of assembling, welding.Compare individual resistors, the electric capacity made with thin-film technique, thick-film technique has makes simple, good reliability, and helps the advantage of circuit heat radiation.
But the both wings of this thick film circuit pin are connected as a single entity, and are symmetrically distributed, and leadframe structure as shown in Figure 2 before its assembling.Play the many of I/O connection and supporting role the intercell connector 4 of pin 3 by two ends connected, the both wings of pair of pins are connected as a single entity, and have assembled the connection that the back pair of pins provides an I/O mouth.
Along with the development of electronic product microminiaturization, the use of thick film circuit on printed circuit board (PCB) can get more and more, and therefore when needing a plurality of thick film circuit board on the printed circuit board (PCB), situation as shown in Figure 3 will appear in the pin arrangements of these a plurality of thick film circuits.Therefore the parallel Surface Mount of a plurality of monocrepid thick film circuits is arranged and need be taken a large amount of veneer layout/wiring space, is unfavorable for the raising of circuit board density and the microminiaturization of product.
Summary of the invention
Take circuit-board laying-out/wiring space when a plurality of thick film circuits of prior art are parallel to be arranged on the circuit board for overcoming, the shortcoming of the raising of restricting circuits plate density and the miniaturization of products, the embodiment of the invention provides a kind of thick film circuit, nead frame, circuit board and combination thereof that can effectively improve circuit board density.
For reaching above-mentioned first purpose, the technical scheme that the embodiment of the invention adopts is: a kind of thick film circuit is provided, and it comprises a thick film matrix and is located at a plurality of pins of this thick film matrix bottom that these a plurality of pins are staggered in these thick film matrix both sides.
For reaching above-mentioned second purpose, the technical scheme that the embodiment of the invention adopts is: a kind of nead frame is provided, this nead frame and the assembling of thick film matrix form thick film circuit, it comprises a junction, this connecting portion comprises one first cantilever and is located at a plurality of pins on this first cantilever that the pad of corresponding thick film matrix reserves the vacant locations of the pin of the staggered thick film matrix opposite side of installing with it between these a plurality of pins.
For reaching above-mentioned the 3rd purpose, the technical scheme that the embodiment of the invention adopts is: a kind of circuit board is provided, this circuit board is provided with one first pad, this first pad comprises one first row welding assembly and secondary series welding assembly, this first row welding assembly and secondary series welding assembly are equipped with a plurality of solder joints, and these a plurality of pads are staggered and corresponding with the pin of thick film circuit thick film matrix both sides.
For reaching above-mentioned the 4th purpose, the technical scheme that the embodiment of the invention adopts is: a kind of circuit board combination with thick film circuit is provided, it comprises that a circuit board and is located at the thick film circuit on this circuit board, this thick film circuit is provided with a plurality of pins, and these a plurality of pins are staggered and be welded on this circuit board in these thick film matrix both sides.
As seen from the above technical solution, the pin of embodiment of the invention thick film circuit adopts staggered mode, as a plurality of thick film circuits are parallel when being installed on the circuit, the pin that two thick film circuits are adjacent inserts the other side's pin successively because of the staggered vacancy that forms, shortened the distance between two thick film circuits, strengthened the density of the thick film circuit on the circuit board, helped circuit board simultaneously and develop to microminiaturization.
Description of drawings
Fig. 1 is the schematic diagram of prior art thick film circuit.
Fig. 2 is a prior art thick film circuit nead frame schematic diagram.
Fig. 3 is a plurality of thick film circuits of prior art parallel schematic diagram of arranging on circuit board.
Fig. 4 is an embodiments of the invention thick film circuit perspective view.
Fig. 5 is the schematic diagram of the preceding preferable implementation column of pin configuration of thick film circuit assembling of the present invention.
Fig. 6 is the schematic diagram of preceding another embodiment of pin configuration of thick film circuit assembling of the present invention.
The pad schematic diagram of the circuit board that Fig. 7 can be used with thick film circuit board for the present invention.
Fig. 8 is the schematic diagram of a plurality of thick film circuits of the present invention parallel first embodiment that arranges on circuit board.
Fig. 9 is the schematic diagram of a plurality of thick film circuits of the present invention parallel second embodiment that arranges on circuit board.
Figure 10 is the schematic diagram of a plurality of thick film circuits of the present invention parallel the 3rd embodiment that arranges on circuit board.
Embodiment
Following with reference to the accompanying drawing preferred embodiment that develops simultaneously, the present invention is described in further detail.
The circuit board combination with thick film circuit that preferred embodiment of the present invention is described comprises a circuit board and is located at thick film circuit on this circuit board.
See also Fig. 4, thick film circuit 10 comprises a thick film matrix 11 and a plurality of pin 13.These thick film matrix 11 inside are provided with circuit, and its top is provided with user's paste card cap 12, and the bottom is provided with a plurality of pads 14 that link to each other with the I/O interface.This user's paste card cap 12 is used to make things convenient for the subscriber set paster.These a plurality of pins 13 are welded on the pad 14, and staggered in these thick film matrix 11 both sides, therefore the just corresponding I/O interface of pin 13.Saidly in the embodiment of the invention staggeredly be meant that when a side had pin to draw on the pad 14 of thick film matrix 11, the corresponding position of its opposite side just can be vacated, and the like.Below only be the better embodiment of pin 13 arrangement modes, it is interlaced that the staggered rule of the pin of thick film circuit is not limited to single pin, also can be that a plurality of pins are interlaced.As shown in Figure 5, be a plurality of thick film circuits parallel second embodiment that arranges on circuit board: the staggered mode of the pin of thick film circuit is for staggered in twos.And for example shown in Figure 6, be a plurality of thick film circuits parallel the 3rd embodiment that arrange on circuit board: to be that single pin is staggered, two pins of three pin alternation sums are staggered be arranged in order the pin arrangement mode of thick film circuit.As seen but the staggered mode of the pin of thick film circuit is very flexible random variation.
See also Fig. 7, staggered for realizing thick film circuit 10 pins 13, be used for comprising a junction 20 and a plurality of pin 13 with the nead frame of thick film matrix 11 assemblings.This connecting portion 20 comprises one first cantilever 21 and one second cantilever 23, be connected by intercell connector 22 between this first cantilever 21 and second cantilever 23, and its junction is equipped with cut groove (indicating).These a plurality of pin 13 staggered being arranged on this first cantilever 21 and second cantilever 23, the one end is unsettled, and the other end links to each other with first cantilever 21 or second cantilever 23.For the ease of separating with this connecting portion 20 by a plurality of pins 13, the junction of this connecting portion 20 and these a plurality of pins 13 can be provided with cut groove (as the V-type groove etc.), perhaps will these a plurality of pins 13 with this connecting portion between be arranged to be connected (a kind of syndeton of similar stamp hole), perhaps other separated structures of being convenient to well known in the prior art.。Distance between these a plurality of pins that are crisscross arranged 13 is corresponding with the pad 14 of thick film matrix 11.A unsettled end of this pin 13 is provided with two columns 130, and the spacing of this two column 130 is corresponding with the thickness of thick film matrix 11.The column 130 of the free end of these a plurality of pins 13 is arranged and is formed a draw-in groove, cooperates with thick film matrix 11.
When the thick film matrix 11 of thick film circuit 10 is assembled with nead frame, only need thick film matrix 11 is put into draw-in groove, make each column 130 of pad 14 and pin 13 corresponding and weld together, then intercell connector 22, first cantilever 21 and second cantilever 23 are removed along cut groove, just can be finished the assembling of thick film matrix 11 and pin 13.
Please continue to consult Fig. 8, nead frame also can only comprise one first cantilever 21, and promptly first cantilever 21 and second cantilever 23 are independent structure.The pad 14 of corresponding thick film matrix 11 reserves the vacant locations of the pin 13 of staggered thick film matrix 11 opposite sides of installing with it between the pin 13 on this first cantilever 21 at this moment.During assembling, only need 21 staggered the cooperating with thick film matrix 11 of two first cantilevers just can.
The present invention also provides a kind of circuit board that uses above-mentioned thick film circuit.
In order to use thick film circuit 10 provided by the invention, reach the purpose of effective raising thick film circuit board circuit 10 density, the present invention also provides a kind of circuit board that can be used with this thick film circuit 10, and this circuit board can be a printed circuit board (PCB), also can be the circuit board of other types.
See also Fig. 9, be the local pad schematic diagram of circuit board.This circuit board 20 is provided with a plurality of parallel first pad 21 and second pads 22 of arranging, this first pad 21 comprises the first row welding assembly 210 and secondary series welding assembly 211, every row welding assembly has a plurality of pads 212, and the pad of this first row welding assembly 210 and secondary series welding assembly 211 212 is staggered and corresponding with the pin 13 of thick film matrix 11 both sides of thick film circuit 10.These second pad, 22 structures are identical with this first pad 21, also comprise the first row welding assembly 220 and secondary series welding assembly 221, the secondary series welding assembly 211 of its first row welding assembly 220 and first pad 21 is adjacent, pad 222 on it is inserted into the vacancy of secondary series welding assembly 211 pads 212 of first pad 21 successively, forms the layout that interleave is arranged with it.
See also Figure 10, be a plurality of thick film circuits parallel first embodiment that arranges on circuit board.After the welding of thick film circuit and circuit board, thick film circuit 10 is gone up parallel arranging at circuit board (figure does not show), and adjacent thick film circuit 10,10 ' sides adjacent pin 13,13 ' interleave are arranged on the circuit board.The pin 13 of thick film circuit 10 is inserted into the vacancy between thick film circuit 10 ' the sides adjacent pin 13 ' successively, thereby the spacing between the thick film matrix 11 of thick film circuit 10 ' and thick film circuit 10 ' is dwindled, and has saved wiring space.
By preferred embodiment of the present invention as can be seen, the pin of thick film circuit of the present invention adopts staggered mode, as a plurality of thick film circuits are parallel when being installed on the circuit, the pin that two thick film circuits are adjacent inserts the other side's pin successively because of the staggered vacancy that forms, shortened the distance between two thick film circuits, strengthened the density of the thick film circuit on the circuit board, helped circuit board simultaneously and develop to microminiaturization.
The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention.All any modifications of being done within the spirit and principles in the present invention, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (15)
1, a kind of thick film circuit, it comprises a thick film matrix and is located at a plurality of pins of this thick film matrix bottom that it is characterized in that: these a plurality of pins are staggered in these thick film matrix both sides.
2, thick film circuit as claimed in claim 1 is characterized in that: the corresponding I/O interface of each pin.
3, the described thick film circuit of claim 2 is characterized in that: this thick film matrix bottom is provided with a plurality of pads, and this pad is corresponding with the I/O interface, these a plurality of pins and this pad corresponding matching.
4, a kind of nead frame, this nead frame and thick film matrix are assembled into thick film circuit, it comprises a junction, this connecting portion comprises one first cantilever and is located at a plurality of pins on this first cantilever, it is characterized in that: the pad of corresponding thick film matrix reserves the vacant locations of the pin of the staggered thick film matrix opposite side of installing with it between these a plurality of pins.
5, the nead frame shown in claim 4 is characterized in that: this connecting portion also comprises one second cantilever and an intercell connector, is connected by described intercell connector between this first cantilever and second cantilever.
6, the nead frame shown in claim 5 is characterized in that: what these a plurality of pins were staggered is arranged on this first cantilever and second cantilever, and the one end is unsettled, and the other end links to each other with first cantilever or second cantilever.
7, the nead frame shown in claim 6 is characterized in that: the distance between these a plurality of pins that are crisscross arranged is corresponding with the solder pad space length of thick film matrix.
8, the nead frame shown in claim 6 is characterized in that: a unsettled end of this pin is provided with two columns, and the spacing of this column is corresponding with the thickness of described thick film matrix.
9, the nead frame shown in claim 8 is characterized in that: the column of the free end of these a plurality of pins is arranged and is formed a draw-in groove, cooperates with the thick film matrix.
10, a kind of circuit board, this circuit board is provided with one first pad, this first pad comprises one first row welding assembly and secondary series welding assembly, this first row welding assembly and secondary series welding assembly are equipped with a plurality of solder joints, it is characterized in that: these a plurality of pads are staggered and corresponding with the pin of thick film circuit thick film matrix both sides.
11, circuit board as claimed in claim 10, it is characterized in that: this circuit board is provided with and parallel second pad of arranging of first pad, comprise one first row welding assembly and secondary series welding assembly, and staggered pad, the secondary series welding assembly of its first row welding assembly and first pad is adjacent, pad on it is inserted between the first pad secondary series welding assembly pad successively, form the layout that interleave is arranged with it, and corresponding with the pin of thick film circuit thick film matrix both sides.
12, a kind of circuit board combination with thick film circuit, it comprises that a circuit board and is located at the thick film circuit on this circuit board, it is characterized in that this thick film circuit is provided with a plurality of pins, these a plurality of pins are staggered and be welded on this circuit board in these thick film matrix both sides.
13, the circuit board combination with thick film circuit as claimed in claim 12, it is characterized in that: this circuit board is provided with one first pad, this first pad comprises one first row welding assembly and secondary series welding assembly, this first row welding assembly and secondary series welding assembly are equipped with a plurality of solder joints, it is characterized in that: these a plurality of pads are staggered and corresponding with the pin of thick film circuit thick film matrix both sides.
14, the circuit board combination with thick film circuit as claimed in claim 13, it is characterized in that: this circuit board is provided with and parallel second pad of arranging of first pad, comprise one first row welding assembly and secondary series welding assembly, and staggered pad, the secondary series welding assembly of its first row welding assembly and first pad is adjacent, pad on it is inserted into the vacancy of the first pad secondary series welding assembly pad successively, forms the layout that interleave is arranged with it.
15, the circuit board combination with thick film circuit as claimed in claim 14, it is characterized in that: this has, and corresponding second pad is provided with a thick film circuit, the pin cross arrangement of the sides adjacent of the thick film circuit on this thick film circuit and first pad on the circuit board of thick film circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710073585 CN101022099A (en) | 2007-03-16 | 2007-03-16 | Thick film circuit, pin frame, circuit board and assembly thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710073585 CN101022099A (en) | 2007-03-16 | 2007-03-16 | Thick film circuit, pin frame, circuit board and assembly thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102559360A Division CN101965100B (en) | 2007-03-16 | 2007-03-16 | Thick film circuit, pin frame, circuit board and combination thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101022099A true CN101022099A (en) | 2007-08-22 |
Family
ID=38709808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710073585 Pending CN101022099A (en) | 2007-03-16 | 2007-03-16 | Thick film circuit, pin frame, circuit board and assembly thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101022099A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997185B (en) * | 2009-08-12 | 2012-10-17 | 华为技术有限公司 | Vertical surface-mounted module and combined surface-mounted module |
| CN102843862A (en) * | 2012-09-04 | 2012-12-26 | 西安永电电气有限责任公司 | Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module |
| CN105093728A (en) * | 2015-07-10 | 2015-11-25 | 武汉华星光电技术有限公司 | Drive circuit and liquid-crystal display panel |
-
2007
- 2007-03-16 CN CN 200710073585 patent/CN101022099A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997185B (en) * | 2009-08-12 | 2012-10-17 | 华为技术有限公司 | Vertical surface-mounted module and combined surface-mounted module |
| CN102843862A (en) * | 2012-09-04 | 2012-12-26 | 西安永电电气有限责任公司 | Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module |
| CN102843862B (en) * | 2012-09-04 | 2015-03-25 | 西安永电电气有限责任公司 | Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module |
| CN105093728A (en) * | 2015-07-10 | 2015-11-25 | 武汉华星光电技术有限公司 | Drive circuit and liquid-crystal display panel |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20070822 |