JPH0634300U - Electronic component mounting device - Google Patents

Abstract

(57) [Summary] [Purpose] To reduce the number of work steps and to ensure reliable mounting when electronic components are automatically mounted on a wiring board after cutting the lead wires. [Structure] A pair of swing arms 23 of the chuck device 21,
V-shaped opposing cutting edge portions 37, 38, 39, 4 on 24
0 is provided and the lead wire 19 is cut while gripping the electronic component 26 for mounting on the wiring board 27.
The process of automatically mounting the electronic component 26 on the wiring board 27 is simplified. Further, the bending of the lead wire 19 is corrected at the time of cutting, so that the electronic component 26 can be reliably mounted.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component mounting apparatus for mounting an electronic component having a lead wire on a wiring board.

[0002]

[Prior art]

 A typical prior art is shown in simplified form in FIG. As shown in FIG. 12 (1), the lead wires 4 hold the electronic components 2 attached to the electronic component body 3 one by one by the arm of the chuck 1 and move as shown in FIG. 12 (2). Then, as shown in FIG. 12 (3), the lead wire 4 is cut by the cutting means 5 having a pair of blades to obtain the state of FIG. 12 (4), and thus the electronic component 2 in which the lead wire 4 is cut 12 is moved as shown in FIG. 12 (5), and as shown in FIG. 12 (6), the lead wire 4 is inserted into the lead wire insertion hole 7 of the wiring board 6 to mount the electronic component 2 on the wiring board 6. Be touched.

[0003]

[Problems to be solved by the device]

 When the electronic component with lead wire 2 is automatically mounted on the printed circuit board 6, as shown in FIG. 11, a chuck device 1 for holding the electronic component 2 and a lead wire cutting for cutting the lead wire 4 into a predetermined length. Two types of devices, device 5 are required, and the number of parts that make up each device is large, so the manufacturing cost is high, and since a place to install the lead wire cutting device 5 must be secured, the entire device is large. I can't help it.

Further, as shown in FIG. 12, six steps are required from holding the component 2 to mounting it on the printed circuit board 6, and the time required for this work is long.

Further, as another problem, as shown in FIG. 13 showing the side surface of the electronic component 2 and FIG. 14 showing the bottom surface thereof, the pair of lead wires 4 are in the aligned state of FIG. 12 (1). While the lead wire is inserted into the lead wire insertion hole 7 of the wiring board 6 correctly when the lead wire 4 is bent when the electronic component 2 is transported, After cutting by the cutting means 5, as shown in the side view of FIG. 15 and the bottom surface of FIG. 16, the lead wire spacing B is smaller than the prescribed lead wire spacing A shown in FIGS. Is different. After the cutting, when the straight line L1 connecting the cut ends of the lead wires 4 is inclined with respect to the straight line L2 connecting the base ends of the lead wires 4, the lead wires to the lead wire insertion holes 7 of the wiring board 6 are formed. Insertion becomes impossible.

An object of the present invention is to provide an electronic component mounting apparatus capable of cutting lead wires of an electronic component and inserting them into a wiring board with a small number of steps, and performing reliable insertion. That is.

[0007]

[Means for Solving the Problems]

 The present invention provides (a) a chuck having a pair of arms, wherein the pair of arms includes a pair of lead wire cutting edge portions facing each other, and a pair of arm portions that move toward each other from the blade edge portions toward the base end portion. A pair of arms, each of which has a guide portion having a guide surface that is inclined away from the other end, and a support portion that extends from each guide portion toward the base end portion and that supports an electronic component body in which lead wires are connected. A chuck having, (b) a pressing member that is provided to be vertically displaceable relative to each arm and presses the electronic component body, (c) the chuck, and a wiring board into which the lead wire is to be inserted. And (d) the pressing member is moved relative to the pair of arms and the arms are moved away from each other. Open in the direction you want Supporting the child part body by sandwiching it between the support parts, displacing the support parts of each arm in the mutually close direction, cutting the lead wire by the cutting edge part, opening each arm and pressing the electronic part body by the pressing member An electronic component mounting apparatus comprising: a driving unit.

Further, the present invention is characterized in that the cutting edge portion is in the shape of a groove opened upward, and is formed so as to be thin in the direction of mutual proximity.

[0009]

[Action]

 According to the present invention, in a chuck for sandwiching an electronic component and mounting it on a wiring board, a pair of arms includes a pair of lead wire cutting edge portions facing each other and a base end from each blade edge portion. It is provided with a guide portion having guide surfaces that are inclined away from each other as they approach each other, and a support portion that extends from each guide portion toward the base end portion and that supports the electronic component body in which lead wires are connected. Is configured. A pressing member that is vertically displaceable relative to the arm is provided in relation to the arm, and the chuck is moved horizontally and vertically with respect to the wiring board by a moving unit. It These arms, pressing members and moving means are drive-controlled by drive means.

In mounting the electronic component, the driving means first raises or retracts the pressing member relative to the pair of arms, and moves the arms so that the cutting edge portions are separated from each other. From the open state, the electronic component body is supported by being sandwiched between the supporting portions, and is transported to a predetermined mounting position on the wiring board by the moving means. At this time, the lead wires are cut by displacing the cutting edge portions of the arms in the directions of proximity to each other. After that, each arm is opened on the mounting position, and the electronic component body is pressed by the pressing member to push the lead wire into the insertion hole of the wiring board. Therefore, the lead wire can be cut simply by sandwiching the electronic component with an arm for mounting, the number of steps can be reduced, and the mounting device can be downsized and the cost can be reduced. . Also, even if the lead wire of the electronic component is bent, it will be corrected when it is cut, so it can be mounted reliably.

[0012] Preferably, the cutting edge portion is formed in a groove shape that is recessed upward, and is formed so as to be thin in the direction in which they are close to each other, so that the tip end of the cut lead wire is tapered. Further, the mounting on the wiring board can be performed more reliably.

[0012]

【Example】

 1 is a cross-sectional view of a chuck device 21 and its vicinity according to an embodiment of the present invention, and FIG. 2 is a side view of an electronic component mounting device 22 of the present invention equipped with the chuck device 21. The chuck device 21 has a pair of swing arms 23 and 24, and mounts an electronic component 26 configured by attaching a lead wire 19 to an electronic component body 25 on a horizontally arranged wiring board 27. The chuck device 21 is attached to the moving body 28, and is vertically displaced and driven in the direction of the arrow 30 by the ascending / descending means 29. The movable body 28 can be moved in the X direction 32 by a horizontal rail 31, and the horizontal rail 31 can be moved along the rail 33 in a direction perpendicular to the plane of FIG. Thus, the moving body 28 is movably supported by the XY table 34 in the horizontal plane. The wiring board 27 is mounted on the base 35 of the XY table 34 by the mounting piece 36, and the electronic component 26 is mounted thereon as described above.

As shown in FIG. 3, the swing arms 23 and 24 of the chuck device 21 include a pair of cutting edge portions 37, 38; 39, 40 for cutting the lead wires, which are opposed to each other, and the cutting edge portions 37, 38. 38; 39, 40, and guide portions 43, 44 having guide surfaces 41, 42 that rise as they move away from each other (left-right direction in FIG. 1), and an electronic component body 25 extending upward from the guide portions 43, 44. And supporting portions 45 and 46 for supporting the.

FIG. 4 is a sectional view taken along the section line IV-IV of FIG. 1, FIG. 5 is an enlarged plan view of the vicinity of the cutting edge portions 37, 38; 39, 40, and FIG. 6 is a cutting edge. It is sectional drawing which shows the state which has cut | disconnected a pair of lead wire 19 by the parts 37 and 39. The cutting edge portion 37 has inclined surfaces 48 and 49 that are generally V-groove-shaped and are recessed upward so that they become thinner in the direction in which the cutting edge portions 37 and 39 approach each other, that is, the inclined surfaces 48 and 49. Is inclined so that the cutting edge portions 37, 39 become downward as they approach each other. A recess 51 is formed between the cutting edge portions 37 and 38 of the guide portion 43, a protrusion 52 that fits into the recess 51 is formed in the guide portion 44, and a blade portion 39 is formed in the guide portion 44. Projections 53 and 54 located outside the projections 40 are formed, and the projections 53 and 54 fit into the recesses 55 and 56 of the guide section 43. A guide hole 57 extending upward and downward is formed in the support portion 45 of the swing arm 23, and a horizontal pressing portion 59 of a pressing member 58 is inserted into the guide hole 57. A mounting portion 60 extending upward is connected to the pressing portion 59, and thus the entire pressing member 58 is formed in an L shape. Each swing arm 23, 24 is pivotally supported by a pin 61, 62 fixed to a fixed position (not shown), and links 65, 66 are opposite to the one end side where the cutting edge portions 37 to 40 are formed. Pins 63 and 64 are connected to the other end portion in the vicinity of the other end. Therefore, when the piston rod 68 is retracted in the direction of the arrow 18, the pins 63, 64, and thus the other ends thereof, are angularly displaced in a direction in which they are close to each other, whereby the cutting edge portions facing each other are formed. 37, 38; 39, 40 are angularly displaced in the separating direction, and the arms 23, 24 are in an open state.

The drive means 70 for swinging and driving the swing arms 23, 24 has a first cylinder 75 and a second cylinder 76, and has a piston rod 68, a piston 71 to which the piston rod 68 is fixed, and a piston 71. It has a piston rod 72 capable of contacting the piston 71 and a piston 73 to which the piston rod 72 is fixed. The pistons 71 and 73 are housed in the first cylinder 75 and the second cylinder 76, respectively. It is displaced up and down in FIG. 1 by air pressure. A drive means 77 is attached to the holding member 69 to drive the pressing member 58 up and down. The piston rod 78 of the drive means 77 is fixed to the mounting portion 60. The piston rod 78 is fixed to a piston 80 housed in a cylinder 79. The cylinders 75, 76, 77 are controlled by the air pressure control means 81 as follows for mounting electronic parts.

FIG. 7 is a simplified side view for explaining the operation when the electronic component 26 is mounted on the wiring board 27. As shown in FIG. 7 (1), the electronic components 26 are aligned and supplied one by one from a supply place such as a palette. The chuck device 21 is moved to the supply location of the electronic component 26 by the XY table 34, and the swing arms 23 and 24 are opened to approach the component. Next, as shown in FIG. 7 (2), the chuck device 21 closes the swing arms 23 and 24 and cuts the lead wire 19 while holding one electronic component 26 by the support portions 45 and 46. . After cutting the lead wire 19, as shown in FIG. 7C, the electronic parts main body 25 is held by the supporting parts 45 and 46, and the chuck device 21 is horizontally moved to the electronic parts mounting position of the wiring board 27 by the XY table 34. Be moved.

Further, as shown in FIG. 7 (4), the chuck device 21 is moved vertically downward by the XY table 34 to approach the electronic component mounting position of the wiring board 27. As shown in FIG. 7 (5), the chuck device 21 opens the arms 23 and 24 a little by moving the piston rod 68 in the direction shown by the arrow 18 in FIG. At the same time, the pressing member 58 presses the electronic component 26 downward, so that the electronic component 26 moves downward along the guide surfaces 41, 42 of the swing arms 23, 24, and the lead wire 19 of the electronic component 26 moves. It is guided by the cutting edge portions 37 to 40 of the swing arm 24 and extruded downward, and is inserted into the lead wire insertion hole of the wiring board 27. Further, as shown in FIG. 7 (6), the chuck device 21 completely opens the arms 23 and 24, presses the electronic component 26 against the wiring board 27 by the pressing member 58, and mounts the electronic component 26 on the wiring board 27. To complete.

The states of the cylinders 75, 76, 77 in the respective states of FIGS. 7 (1) to 7 (6) are as shown in Table 1.

[0019]

[Table 1]

In Table 1, (upper) represents an ascending position, (lower) represents a descending position, and (middle) represents an intermediate position.

As shown in FIG. 7A, compressed air is supplied to the chambers 88 and 89 of the cylinders 75 and 76 to open the swing arms 23 and 24, and the chambers 90 and 91 are set to the atmospheric pressure. ). At this time, compressed air is still supplied to the chamber 92 of the cylinder 77, and the chamber 93 is opened to the atmospheric pressure. Further, as shown in FIG. 7B, in order to close the swing arms 23 and 24 and cut the lead wire 19, compressed air is supplied to the chamber 90 of the cylinder 75 and the chamber 89 of the second cylinder 76. , 91 and the chamber 88 of the first cylinder 75 are opened to atmospheric pressure. At this time, the state of the cylinders 75 and 76 is such that the pistons 71 and 73 are located below the cylinders 75 and 76, respectively, as shown in FIG. 8 (2). At this time, the compressed air is supplied to the chamber 92 of the cylinder 77, and the chamber 93 is opened to the atmospheric pressure. In FIGS. 7 (3) and 7 (4), the states of the first cylinder 75, the second cylinder 76, and the third cylinder 77 maintain the state of FIG. 8 (2) as shown in Table 1. In FIG. 7 (5), the swing arms 23 and 24 are not completely opened and stopped at an intermediate stage, so that the pressing member 58 presses the electronic component body 25. Compressed air is supplied to the chambers 91 of the two cylinders 76 so that the internal pressure of the chambers 91 of the second cylinder 76 becomes higher than the internal pressure of the chambers 88 of the first cylinder 75. The chamber 90 of the first cylinder 75 and the chamber 89 of the second cylinder 76 are opened to the atmospheric pressure. Further, in order to press the electronic component 26 with the pressing member 58, compressed air is supplied to the chamber 93 of the cylinder 77, and the part 93 is opened to the atmospheric pressure. In this state, as shown in Table 1, the piston 73 of the second cylinder 76 is in the lowered position, and the piston 71 of the first cylinder 75 is stopped in the middle position by the piston rod 72 of the second cylinder 76. Is. The positions of the pistons 71 and 73 in the cylinders 75 and 76 are shown in FIG. 8 (3). Further, as shown in FIG. 7 (6), in the chuck device 21, the swing arms 23 and 24 are completely opened, the electronic component 26 is pressed against the wiring board 27 by the pressing member 58, and the wiring board 27 of the electronic component 26 is pressed. Complete the installation. At this time, compressed air is supplied to the chamber 88 of the first cylinder 75 and the chamber 89 of the second cylinder 76, and at the same time, the chamber 90 of the first cylinder 75 and the chamber 91 of the second cylinder 76 are opened to the atmospheric pressure. The condition of (1) of 8 is assumed. Further, compressed air is supplied to the room 93 of the cylinder 77, and the room 92 is opened to the atmospheric pressure.

FIG. 9 shows the side surface of the electronic component 26 whose lead wire 19 has been cut by the cutting edge portions 37, 38; 39, 40 of the chuck device 21 of the present embodiment, and FIG. 10 shows the bottom surface thereof. As shown in the figure, the cut portion of the lead wire 19 is in the shape of a quadrangular pyramid whose bottom surface is a circle, and the lead wire 19 is inclined at the cutting edge portions 37, 38; 39, 40 when the lead wire is cut. The tip end is held by the frictional force between the inclined surface and the cut surface of the lead wire 19, so that the bend of the lead wire 19 after cutting can be prevented.

As described above, according to the present embodiment, the electronic component mounting device 22 includes the pair of lead wire cutting edge portions 37, 38 which face the pair of swing arms 23, 24 of the chuck device 21. Guide parts 43 and 44 having guide surfaces 41 and 42 having 39 and 40 and inclined and separated from each other toward the base end from the respective cutting edge parts 37 and 38; 39 and 40, and the guide parts. Supporting portions 45 and 46 that extend upward from 43 and 44 and that support the electronic component body 25 that is continuous with the lead wire 19 are formed, and the XY table 34 that is the moving means 28 is a chuck device. 21 and the wiring board 27 on which the electronic component 26 is to be mounted are relatively moved in the horizontal direction, and the elevating means 29 is moved in the vertical direction. Further, the drive means 77 raises the pressing member 58 relative to the pair of swing arms 23 and 24, and the drive means 70 moves the arms 23 and 24 into the cutting edge portions 37, 38; 39, 40. Open in a direction in which they separate from each other to support the electronic component main body 25 by sandwiching it between the support portions 45 and 46, and angularly displace the support portions 45 and 46 of each arm 23 and 24 in a mutually approaching direction. The lead wire 19 is cut by the portions 37, 38; 39, 40, the drive means 70 opens the arms 23, 24, and the drive means 77 presses the electronic component body 25 by the pressing member 58, so that the electronic component 26 Is supplied and the electronic component 26 is gripped by the chuck device 21 and before the electronic component 26 is mounted on the wiring board 27, the lead wire 19 of the electronic component 26 can be cut by the chuck device 21. There is no need to install a wire cutting machine, and in the process of automatically mounting electronic parts on the wiring board of the conventional electronic component mounting device, the process of moving the electronic parts to the lead wire cutting machine and the lead wire cutting machine lead The step of inserting the wire and the step of cutting the lead wire can be omitted. Therefore, it is not necessary to secure a place to install the lead wire cutting machine, and the cost can be reduced.

In addition, in the electronic component mounting apparatus 22 of the present embodiment, the cutting edge portions 37, 38; 39, 40 of the chucking device 21 are groove-shaped recessed upward and are thin in the direction of mutual proximity. Since the lead wire 19 is cut into a quadrangular pyramid shape after being cut, it is easy to insert into the lead wire insertion hole of the wiring board 27, and after cutting the lead wire, Since the tip ends of the lead wires 19 are held by the cutting edge portions 37, 38; 39, 40, when the lead wires 19 are inserted into the lead wire insertion holes of the wiring board 27 after cutting the lead wires, the lead wires 19 are moved by the arm 23, 24 are guided to the recesses where the cutting edge portions 37, 38; 39, 40 of the arm 24 and the cutting edge portions 39, 40 of the arm 24 are formed, and are inserted into the lead wire insertion holes of the wiring board 27. Therefore, after cutting the lead wire, it is possible to prevent external force from being applied to the lead wire 19 of the electronic component 26 gripped by the chuck device 21, and the electronic component can be accurately mounted on the wiring board 27.

Further, in the present embodiment, the arms 23 and 24 of the chuck device 21 are oscillated and driven by the links 65 and 66 which are pin-coupled to the arms 23 and 24, but by the driving means arranged in the horizontal direction. The arms 23 and 24 may be driven toward and away from each other.

[0026]

[Effect of device]

 As described above, according to the present invention, the electronic component mounting device forms the lead wire cutting edge portions on the pair of arms of the chuck, and cuts the electronic component during transportation to the mounting position by sandwiching the electronic component. The number can be reduced, and the mounting device can be downsized and the cost can be reduced. Further, even if the lead wire of the electronic component is bent, it is corrected when it is cut, so that it can be reliably mounted.

[0027] Preferably, the cutting edge portion of the chuck has a groove shape that is recessed upward and is formed so as to be thin in the direction of mutual proximity, so that the cutting portion after cutting the lead wire is cut. Has a tapered shape, which facilitates insertion into the lead wire insertion hole of the wiring board, and allows electronic components to be mounted more reliably.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a chuck device 21 and its vicinity according to an embodiment of the present invention.

FIG. 2 is a side view of an electronic component mounting device 22 according to the present embodiment, which is provided with a chuck device 21.

FIG. 3 is a perspective view of one swing arm 23 and a pressing member 58.

FIG. 4 is a sectional view taken along the section line IV-IV in FIG.

FIG. 5 is an enlarged plan view of the cutting edge portions 37, 38; 39, 40.

FIG. 6 shows a pair of lead wires 1 by means of cutting edge portions 37, 39.
It is sectional drawing which shows the state which has cut | disconnected 9.

FIG. 7 is a simplified side view for explaining the operation of the chuck device 21 when mounting the electronic component 26 on the wiring board 27.

FIG. 8 is a simplified cross-sectional view showing the operation of the driving means 70.

FIG. 9 is a side view of the electronic component 26 in which the lead wire 19 is cut by the chuck device 21 of the present embodiment.

10 is a bottom view of the electronic component 26 shown in FIG.

FIG. 11: Lead wire 4 of electronic component 2 with lead wire cutting machine 5
It is a figure which shows a mode that is cut | disconnected.

FIG. 12 is a simplified side view showing the operation of the conventional electronic component mounting apparatus.

FIG. 13 is a side view of the conventional electronic component 2 after the lead wire is cut according to the regulations.

14 is a bottom view of the electronic component 2 shown in FIG.

FIG. 15: Lead wire 4 by conventional lead wire cutting machine 5
It is a side view of the electronic component 2 which was cut.

16 is a bottom view of the electronic component shown in FIG.

[Explanation of symbols]

 19 Lead Wire 21 Chuck Device 22 Electronic Component Mounting Device 23, 24 Swing Arm 25 Electronic Component Main Body 26 Electronic Component 27 Wiring Board 29 Elevating Means 34 XY Table 37, 38, 39, 40 Blade Edge 41, 42 Guide Surface 43 , 44 Guide part 45, 46 Support part 48, 49 Inclined surface 58 Pressing member 69 Holding member 70, 77 Driving means

Claims (2)

[Scope of utility model registration request] 1. (a) A chuck having a pair of arms, wherein the pair of arms includes a pair of cutting edge portions for cutting a lead wire facing each other, and a portion closer to a base end portion from each of the cutting edge portions. A pair of such arms, each of which is formed with a guide portion having guide surfaces that are inclined away from each other, and a support portion that extends from each guide portion toward the base end portion and that supports an electronic component body in which lead wires are continuous. (B) is provided so as to be vertically displaceable relative to each arm,
A pressing member for pressing the electronic component body; (c) moving means for relatively moving the chuck and the wiring board into which the lead wire is to be inserted in horizontal and vertical directions; and (d) a pressing member. , Raising relative to the pair of arms, and opening each arm in a direction in which the cutting edge portions are separated from each other to support the electronic component body by sandwiching the electronic component body between the support portions. An electronic component mounting apparatus comprising: driving means for displacing each other in the proximity direction to cut a lead wire by a cutting edge portion, opening each arm, and pressing an electronic component body by a pressing member. 2. The electronic component mounting apparatus according to claim 1, wherein the cutting edge portion is in the shape of a groove that is open upward and is formed so as to become thinner in the direction of mutual proximity.