JPH06342138A - Adsorption panel of spacer material dispersing device for liquid crystal display element and production of panel - Google Patents

Abstract

PURPOSE:To provide a spacer material dispersing device capable of scattering a spacer material on the surface of a substrate in dispersed state, to improve the performance of a liquid crystal display element and the yield in mass- production, to facilitate the control of the scattering quantity of the spacer material and to improve the utilization efficiency of the spacer material. CONSTITUTION:An adsorption panel mounted to block the opening face of a suction and exhaust chamber and arranged to face the substrate is constituted by mutually joining a porous plate member 10 having a laminated structure composed of a polyimide film 18 and a metal plated layer 22 and having many spacer material adsorption pores uniformly formed on the whole surface smaller in the opening diameter of the under surface of the polyimide film than the diameter of the spacer material with a rigid honeycomb body 14 formed with many air permeating holes 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in a cell assembling process in a series of processes for manufacturing a liquid crystal display device.
The present invention relates to a spacer adsorbing plate which is a component of a spacer material dispersing device used to disperse a spacer material onto a lower substrate surface before laminating two substrates, and a method for manufacturing the adsorbing plate.

[0002]

2. Description of the Related Art In a liquid crystal display device, in order to make the cell gap into which liquid crystal is injected uniform over the entire surface, a spacer material made of a spherical plastic material or a cylindrical glass fiber material is provided between the upper and lower substrates. I am trying to insert it. This spacer material is sprinkled on the lower substrate surface before the upper and lower two substrates are bonded together in the cell assembling process. However, in order to obtain a uniform cell thickness, the spacer material should be uniformly dispersed. It is necessary to spray on the surface.

There are two methods of spraying the spacer material on the surface of the substrate: wet spraying and dry spraying. Among them, in wet spraying, first, a spacer material is mixed and dispersed in a volatile solvent such as CFC or ethanol, and a glass substrate is placed below a spray nozzle of a spacer material spraying device to mix the spacer material. The dispersed liquid is sprayed from the spray nozzle together with an inert gas such as nitrogen gas toward the glass substrate in a mist state. On this occasion,
The chamber in which the liquid in which the spacer material is dispersed is blown is heated so that the solvent of the liquid jetted from the spray nozzle is quickly evaporated. Then, the spacer material after the solvent is evaporated is dispersed and dropped onto the glass substrate surface.

Further, the dry spraying is a system in which a spacer material is dispersed only by a gas such as nitrogen gas without using a solvent and sprayed on the glass substrate surface. In this dry type spraying, unlike the wet type spraying, the spacer material is not previously dispersed in the solvent, and therefore, a device for dispersing the spacer material is required. As a method for this, conventionally, an electric field is applied to the spacer material so that the spacer material is electrically repulsed to disperse the spacer material, or a compressed gas such as nitrogen gas is used together with the spacer material. It is possible to install obstacles such as spheres and meshes in front of the jet outlet of the nozzle that blows out, and to collide the spacer material blown from the jet outlet of the nozzle with the compressed gas to disperse by colliding with the obstacle. ing. Further, in Japanese Patent Laid-Open No. 63-155026, one end of the pipe is arranged at a place where a negative pressure is generated in the vicinity of the ejection port of a nozzle from which compressed gas is ejected at high speed, and the other end of the pipe is arranged in the vicinity of a spacer material tray. The spacer material is conveyed by utilizing the negative pressure generated in the pipe, and the spacer material is collided with the compressed gas at the pipe outlet and sheared, and the spacer material is blown out from the jet outlet of the nozzle in a separated state. Discloses a method of dispersing a spacer material on a substrate.

[0005]

In the above-mentioned wet spraying method, chlorofluorocarbon has been mainly used as the volatile solvent, but there is a reality that the fluorocarbon cannot be used because of environmental problems. As an alternative solvent for CFCs, no satisfactory one has been found in terms of flammability and toxicity. Further, it is difficult to prepare a liquid in which the spacer material is mixed with the volatile solvent so that the concentration of the spacer material is always constant because of the difference in specific gravity between the spacer material and the solvent. For this reason, when the spacer material is scattered on the glass substrate surface, the density of the spacer material on the substrate surface changes, which causes a decrease in contrast of the liquid crystal display element.

On the other hand, in the dry spraying method, if the spacer material is strongly aggregated, the spacer material may not be sufficiently dispersed.
Thus, there is a problem that unevenness in the cell gap occurs due to the difference in the degree of dispersion of the spacer material, the contrast of the liquid crystal display element decreases, and the yield in mass production decreases. In addition, in dry spraying, it is necessary to measure a very small amount of spacer material, which makes it difficult to control the spraying amount of spacer material as compared with wet spraying, and the utilization efficiency of spacer material is extremely low. is there.

As a proposal for solving various problems in the above wet spraying and conventional dry spraying,
A spacer material dispersion method as shown in the schematic diagram in Fig. 10 is conceivable. That is, to the intake / exhaust chamber 2 that is switchably connected to an intake device and an exhaust device (not shown) through the pipe 1,
Adsorption plate 3 in which a large number of spacer material adsorption holes 4 having an opening diameter smaller than the diameter of the spacer material 5 are formed uniformly over the entire surface.
Using a spacer material dispersing device that is airtightly attached so as to close the opening surface of the intake / exhaust chamber 2, first connect the intake / exhaust chamber 2 to the intake device as shown in FIG. 10 (a). Then, the air in the intake / exhaust chamber 2 is sucked to bring the inside of the intake / exhaust chamber 2 into a negative pressure state, so that the spacer materials 5 are adsorbed and held at the open ends of the large number of spacer material adsorption holes 4, respectively. When the spacer material 5 is adsorbed and held in all the spacer adsorbing holes 4, as shown in FIG. 10B, the substrate 6 is arranged below the adsorbing plate 3 so as to face the adsorbing plate 3, and then the intake / exhaust chamber is placed. 2 is connected in communication with the exhaust device. Then, by exhausting air from the intake / exhaust chamber 2 through the large number of spacer material adsorption holes 4, the large number of spacer materials 5 adsorbed and held at the open ends of the spacer material adsorption holes 4 are sprayed toward the substrate 6. As a result, as shown by the chain double-dashed line in FIG. 10B, a large number of spacer materials 5 are dispersed on the surface of the substrate 6 in a state of being dispersed according to the arrangement of the large number of spacer material adsorption holes 4 of the adsorption plate 3. Will be.

According to the spacer material dispersing method as described above, the above-mentioned various problems as in the conventional spraying method can be solved at once. By the way, the diameter of the spacer material 5 is usually about 4 to 7 μm. Therefore, in order to carry out the above-described spacer material dispersion method, the spacer material adsorption holes whose opening diameter is less than about 4 μm are required. The suction plate 3 in which a large number of 4 are uniformly formed is required.
Moreover, when inhaling and exhausting the intake / exhaust chamber 2, it is 1 kg / cm.
^Since a pressure of about ² is applied to the suction plate 3 and the size of the suction plate 3 needs to be about several hundreds of mm square, it must have sufficient rigidity.

Therefore, the present invention has been made as a technical subject to provide an adsorption plate satisfying the above-mentioned conditions and to provide a method for producing such an adsorption plate. Therefore, the purpose is to enable implementation of the spacer material dispersion method as shown in FIG.

[0010]

According to the present invention, in a spacer material dispersion device for a liquid crystal display element as shown in FIG. 10, the spacers are airtightly attached so as to close the opening surface of the intake and exhaust chambers. A suction plate arranged to face the substrate on which the material is to be dispersed, a porous plate member having a large number of spacer material suction holes uniformly formed over the entire surface, and a porous reinforcement member having a constant thickness and having rigidity. Are bonded to each other. The porous plate member has a laminated structure in which a metal plating layer having a uniform thickness is closely formed on the upper surface of a synthetic resin film, and the numerous spacer material adsorption holes in the laminated structure are the synthetic resin film and It is formed such that it penetrates the metal plating layers and the opening diameter on the lower surface side of the synthetic resin film is smaller than the diameter of the spacer material. And the porous reinforcement member,
The porous plate member is bonded to the metal plating layer side. This porous reinforcing member can be formed of, for example, a honeycomb body having a large number of ventilation holes penetrating linearly in the thickness direction.

Also, a step of depositing a metal thin film layer on one surface of the synthetic resin film by vacuum vapor deposition or sputtering, a step of depositing a metal plating film layer on the surface of the metal thin film layer by electroplating, A step of closely adhering a metal plating layer having a large number of through holes uniformly formed on the surface of the metal plating film layer by photoelectroforming, and a plurality of through holes of the metal plating layer from the metal plating layer side. Irradiating excimer laser light through a mask in which a large number of beam passing portions corresponding to the above are formed, and the metal plating film layer, the metal thin film layer and the synthetic resin film penetrate the metal thin film layer of the synthetic resin film. A large number of through-holes whose opening diameter on the side opposite to the attachment surface side is smaller than the diameter of the spacer material are connected so as to communicate with the above-mentioned many through-holes. A step of forming, on the surface of the metal plating layer, by going through a step of bonding the porous reinforcing member having rigidity is formed at a constant thickness, so as to produce a suction plate of the structure.

As another method for manufacturing the adsorption plate having the above-mentioned structure, a thin plate-shaped metal plating body having a large number of through holes uniformly formed on the entire surface by photoelectroforming is formed on one surface of the metal thin plate. And the process of
A step of peeling the metal thin plate from the thin plate metal plated body, a step of joining a synthetic resin film to the surface of the thin plate metal plated body from which the metal thin plate is peeled off, from the thin plate metal plated body side, The thin plate metal of the synthetic resin film is irradiated with excimer laser light through a mask in which a large number of beam passage portions corresponding to the large number of through holes of the thin plate metal plated body are radiated, and penetrates through the synthetic resin film. A step of forming a large number of through holes having an opening diameter smaller than the diameter of the spacer material on the surface side opposite to the joint surface side with the plated body so as to respectively communicate with the plurality of through holes; And a step of joining a porous reinforcement member having a certain thickness and having rigidity to the surface of the.

[0013]

In the suction plate according to the present invention configured as described above, a large number of spacer material suction holes for sucking and holding the spacer material are formed in the porous plate member having a structure in which the synthetic resin film and the metal plating layer are laminated. Since the spacer material is configured to adsorb and hold the spacer material on the lower surface side of the synthetic resin film of the porous plate member, the opening diameter of the spacer material adsorption hole on the lower surface side of the synthetic resin film is smaller than the diameter of the spacer material. The spacer material suction holes need not be formed by a very difficult technique. Then, in the spacer material dispersion device in which the adsorption plate is attached so as to close the opening surface of the intake / exhaust chamber, when the intake / exhaust chamber is inhaled, the spacer material is not sucked into the intake / exhaust chamber and is synthesized. It is held at the open end of the spacer material suction hole on the lower surface side of the resin film. Further, since the porous plate member is reinforced by being joined to the porous reinforcing member having rigidity, even if a certain pressure is applied to the suction plate during intake and exhaust of the intake and exhaust chambers, the adsorption plate Will not be deformed.

When the suction plate is manufactured by each of the above methods, a large number of spacer material suction holes whose opening diameter at the opening end is smaller than the diameter of the spacer material are evenly distributed over the entire surface of the suction plate. A suction plate that can be formed relatively easily and that has sufficient rigidity is obtained.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, in which a suction plate of a spacer material dispersing device used for spraying a spacer material onto a substrate surface in a manufacturing process of a liquid crystal display element is shown in a broken state. It is an expansion perspective view. This adsorption plate joins together a porous plate member 10 in which a large number of spacer material adsorption holes 12 are uniformly formed over the entire surface and a honeycomb body 14 having a large number of ventilation holes 16 penetrating linearly in the thickness direction. It is composed of

In the porous plate member 10, a metal thin film layer 20 is adhered and formed on an upper surface of a synthetic resin film, for example, a polyimide film 18, and a metal plating layer 22 having a uniform thickness is closely formed on the upper surface of the metal thin film layer 20. It has a laminated structure, and the polyimide film 18, the metal thin film layer 20 and the metal plating layer 22.
Spacer material suction holes 12 are formed so as to penetrate through the laminated structure made of. The spacing between the spacer material suction holes 12 is, for example, about 100 μm. The polyimide film 18 has a thickness of, for example, about 25 μm, and the opening diameter of the spacer material adsorption holes 12 on the lower surface side thereof is smaller than the diameter of the spacer material, that is, 4 to 7 μm, for example, less than about 4 μm. The spacer material suction holes 12 are sucked and held at the lower open end positions. Since the spacer material suction hole 12 has an inverted trapezoidal cross section, the gas flow velocity at the lower opening end of the spacer material suction hole 12 increases when air is taken in and exhausted through the spacer material suction hole 12. . The metal thin film layer 20 is formed by depositing a metal such as nickel or aluminum on the upper surface of the polyimide film 18 by vacuum vapor deposition or sputtering. The metal thin film layer 20 formed by vacuum deposition has a thickness of about 0.3 to 0.4 μm, and the metal thin film layer 20 is formed when the metal plated layer 22 is formed by electroplating.
If the thickness is insufficient by itself, a metal plating film layer of nickel or the like having a thickness of 1 to 2 μm is formed on the surface of the metal thin film layer 20 by electroplating. The metal plating layer 22 having a large number of holes is formed by using a photoelectroforming technique. Then, the perforated plate member 10 has a required thickness such that it can be easily handled, for example, 80
In order to obtain the metal plating layer 22 having a thickness of μm, the unit process of photoelectroforming is repeated a plurality of times, for example, three times. The honeycomb body 14 has rigidity and is formed to have a constant thickness. And perforated plate member
When the entire size of the adsorption plate is set to about several hundreds of mm square so that it can fully function as a reinforcing member of 10 and can withstand a pressure of about 1 kg / cm ² , the honeycomb body 14 may have, for example, several tens of millimeters.
The thickness is about mm.

Next, an example of a method of manufacturing the suction plate having the structure shown in FIG. 1 will be described with reference to FIGS.

First, one side (upper surface) of a polyimide film 24 having a thickness of about 25 μm as shown in FIG. 2 (a) is subjected to electric discharge machining to roughen the surface, and then polyimide as shown in FIG. 2 (b). 0.3 to 0.3 by vacuum deposition on the top surface of film 24
A nickel thin film layer 26 having a thickness of about 0.4 μm is adhered and formed to give conductivity to the surface of the polyimide film 24.
Next, as shown in FIG. 2C, a nickel plating film layer 28 having a thickness of about 1 to 2 μm is deposited on the upper surface of the nickel thin film layer 26 by electroplating.
Apply photoresist solution to the upper surface of 28 and dry it.
As shown in (d), a photoresist layer 30 having a thickness of about 2 to 3 μm is deposited. Next, as shown in FIG. 2 (e), the surface of the photoresist layer 30 is irradiated with a light beam 32 from a mercury lamp through an exposure mask plate 34 to expose the photoresist layer 30, and then a normal light is applied. After the development, washing with water and drying according to the method, as shown in FIG.
A resist film 36 is formed on the surface of the nickel plating film layer 28 at intervals of about μm. Then, as shown in FIG. 3G, a first-stage nickel plating layer 38 is formed on the exposed portion of the nickel plating film layer 28 that is not covered with the resist film 36 by electroplating, and then washed with water. . Then, FIG.
As shown in (h), the concave portion of the nickel plating layer 38 of the first stage is coated and filled with a photoresist liquid to form a resist film.
The first layer with the same thickness as the first-stage nickel plating layer 38 on 36
A stepped photoresist layer 40 is formed. Then, the surface of the nickel plating layer 38 of the first step and the photoresist layer 40 of the first step are polished to make the surface of the nickel plating layer 38 of the first step sufficiently exposed, and then electroplating is performed again. Then, as shown in FIG. 3 (i), a second-stage nickel plating layer 42 is formed on the first-stage nickel plating layer 38, and then washed with water. Then, the same process is repeated, and FIG.
As shown in (j), a second-step photoresist layer 44 having the same thickness as the second-step nickel plating layer 42 is formed on the first-step photoresist layer 40, and the second-step nickel plating layer is formed.
A nickel plating layer 46 of a third stage is formed on 42. Then, using a caustic soda aqueous solution, the resist film 36, the first
Step photoresist layer 40 and second step photoresist layer
The entire 44 is peeled off from the nickel-plated film layer 28, and then washed with water, and as shown in FIG.
A nickel-plated layer 48 having a thickness of about 4 is obtained.

Next, as shown in FIG. 4 (i), a large number of beam passing portions corresponding to the large number of through holes 50 of the nickel plating layer 48 are patterned by excimer laser light 52 from the nickel plating layer 48 side. Irradiate through the mask plate 54. As a result, as shown in FIG. 4 (m), the nickel plated film layer 28, the nickel thin film layer 26, and the polyimide film 24 are penetrated so that the diameter of the upper opening end is 20 to 30 μm and the diameter of the lower opening end is 1 to 4 μm. Thus, the perforated plate member 58 having the inverted trapezoidal through-hole 56 and the spacer material adsorption hole 60 formed by the through-hole 50 and the through-hole 56 communicating with each other is obtained. And
As shown in FIG. 5 (n), a roll coater 66 is used, and a number 1 having a large number of ventilation holes 64 penetrating linearly in the thickness direction is used.
An adhesive is applied to one side of the honeycomb body 62 having a uniform thickness of about 0 mm.
Apply 68 evenly and thinly. Finally, as shown in FIG. 5 (o), the nickel plating layer 48 side of the porous plate member 58 and the side of the honeycomb body 62 on which the adhesive 68 is applied are opposed to each other, and the honeycomb body 62 and the porous plate member 58. The suction plate is completed by joining and by pressure bonding. At this time, since the adhesive 68 is uniformly and thinly applied to the honeycomb body 62 by the roll coater 66, the nickel plating layer 48 is formed by the lump of the adhesive 68.
There is no concern that the through hole 50 of will be blocked.

Another method of manufacturing the suction plate having the same structure as that shown in FIG. 1 will be described below with reference to FIGS. 6 to 9.

First, one surface (upper surface) of a metal thin plate 70 such as stainless steel having good adhesion and peeling property as shown in FIG. 6 (A).
Then, as shown in FIG. 6B, a photoresist solution is applied and dried to deposit a photoresist layer 72 having a thickness of about 2 to 3 μm. Next, as shown in FIG.
The surface of the photoresist layer 72 is irradiated with a light beam 74 from a mercury lamp through an exposure mask plate 76, and the photoresist layer 72 is exposed to light. As shown in (D), a resist film 78 is deposited on the surface of the metal thin plate 70 at intervals of about 100 μm. Then, as shown in FIG. 6 (E), a first-stage nickel plating layer 80 is formed on the exposed portion of the metal thin plate 70 which is not covered with the resist film 78 by electroplating, followed by washing with water. Then, as shown in FIG.
A photoresist solution is applied and filled in the concave portions of the nickel plating layer 80 of the step, and a first-step photoresist layer 82 having the same thickness as the nickel plating layer 80 of the first step is formed on the resist film 78. . Then, the surface of the first-stage nickel plating layer 80 and the first-stage photoresist layer 82 is polished to form a first layer.
After the surface of the nickel plating layer 80 of the step is sufficiently exposed, electroplating is performed again, and as shown in FIG. 7G, the nickel of the second step is plated on the nickel plating layer 80 of the first step. The plated layer 84 is formed and then washed with water. Subsequently, the same steps are repeated, and as shown in FIG. 7H, a second-step photoresist layer 86 having the same thickness as the second-step nickel plating layer 84 is formed on the first-step photoresist layer 82. Then, the nickel plating layer 88 of the third step is formed on the nickel plating layer 84 of the second step. Then, as shown in FIG. 7 (I), the thin metal plate 70 is peeled off from the lower surfaces of the nickel plating layer 80 and the resist film 78 of the first step, and then the resist film 78 and the first step of the caustic soda solution are used. Of the first photoresist layer 82 and the second photoresist layer 86 are removed from the nickel plating layers 80, 84 and 88 of the first, second and third stages, followed by rinsing with water, as shown in FIG. As shown in J), about 80μ with a large number of through holes 92 with a diameter of about 30μm in the smallest detail.
A thin plate nickel-plated body 90 having a thickness of about m is obtained.

Next, as shown in FIG. 8K, a thin plate-shaped nickel-plated body 90 and a polyimide film 94 having a thickness of about 25 μm and having an adhesive layer 96 applied and formed on one surface are heat-pressurized roller 98. 8 (L) by crimping using
As shown in, the thin plate nickel-plated body 90, metal thin plate
A polyimide film 94 is bonded to the surface from which the 70 is peeled off via an adhesive layer 96. Then, by going through the same steps as those described above with reference to FIGS. 4 (l) to 5 (n),
As shown in FIG. 9M, an inverted trapezoidal through hole that penetrates the adhesive layer 96 and the polyimide film 94 and has an upper opening end diameter of 20 to 30 μm and a lower opening end diameter of 1 to 4 μm. A perforated plate member 102 having a spacer material adsorption hole 104 formed by communicating 100 and a through hole 92, and a plurality of ventilation holes 108 linearly penetrating in the thickness direction and having a uniform thickness of about several tens mm. An adsorption plate obtained by joining the honeycomb body 106 with the adhesive 110 is obtained.

[0024]

Since the present invention is constructed and operates as described above, according to the present invention, various problems as in the wet spraying and the conventional dry spraying can be solved, as shown in FIG. It is possible to implement such a spacer material dispersion method. That is, in the intake / exhaust chamber that is switchably connected to the intake device and the exhaust device through the pipe, a suction plate having a large number of spacer material suction holes formed uniformly over the entire surface is formed so as to close the opening face of the intake / exhaust chamber. It is possible to configure an airtightly attached spacer material dispersion device and to disperse a large number of spacer materials on the substrate surface in a dispersed state according to the arrangement of a large number of spacer material adsorption holes of the adsorption plate. The present invention can greatly contribute to the improvement of the performance of the liquid crystal display device, the improvement of the yield in mass production, the easy control of the spray amount of the spacer material, and the improvement of the utilization efficiency of the spacer material.

[Brief description of drawings]

FIG. 1 is a partially enlarged perspective view showing a suction plate of a spacer material dispersion device for a liquid crystal display element in a broken state according to an embodiment of the present invention.

FIG. 2 is a first method of manufacturing the suction plate having the configuration shown in FIG.
It is a partial expanded longitudinal cross-sectional view for explaining an example.

FIG. 3 is a partially enlarged vertical sectional view of the same.

FIG. 4 is a partially enlarged vertical sectional view of the same.

FIG. 5 is a partially enlarged vertical sectional view of the same.

FIG. 6 is a partially enlarged vertical cross-sectional view for explaining another method of manufacturing the suction plate having the same configuration as that shown in FIG.

FIG. 7 is a partially enlarged vertical sectional view of the same.

FIG. 8 is a partially enlarged vertical sectional view of the same.

FIG. 9 is a partially enlarged vertical sectional view of the same.

FIG. 10 is a schematic diagram for explaining a spacer material dispersion method for solving various problems in wet spraying and conventional dry spraying.

[Explanation of symbols]

 10, 58, 102 Perforated plate member 12, 60, 104 Spacer material adsorption holes 14, 62, 106 Honeycomb body 16, 64, 108 Honeycomb body ventilation holes 18, 24, 94 Polyimide film 20 Metal thin film layer 22 Metal plating layer 26 Nickel thin film layer 28 Nickel plated film layer 36, 78 Resist film 38, 80 First stage nickel plated layer 40, 82 First stage photoresist layer 42, 84 Second stage nickel plated layer 44, 86 Second stage Photoresist layer 46, 88 Third-stage nickel plating layer 48 Nickel plating layer 50 Nickel plating layer through hole 52 Excimer laser light 54 Mask plate 56, 100 Through hole 68, 110 Adhesive 70 Metal thin plate 90 Thin plate nickel plating 92 Thin plate nickel plated through hole 96 Adhesive layer

Claims (4)

[Claims] 1. A laminated structure in which a metal plating layer having a uniform thickness is adhered and formed on an upper surface of a synthetic resin film, the synthetic resin film and the metal plating layer are respectively penetrated, and the lower surface of the synthetic resin film is formed. Has a certain thickness on the metal plating layer side of the perforated plate member having a large number of spacer material adsorption holes formed uniformly over the entire surface such that the opening diameter on the side is smaller than the diameter of the spacer material and has rigidity. A spacer material dispersion device for liquid crystal display elements, which is formed by joining porous reinforcement members, is airtightly attached so as to close the opening surface of the intake / exhaust chamber, and is arranged facing the substrate on which the spacer material is to be dispersed. Adsorption plate. 2. The honeycomb body, wherein the porous reinforcing member has a large number of ventilation holes penetrating linearly in the thickness direction.
A suction plate for a spacer material dispersion device for a liquid crystal display element as described above. 3. A step of depositing a metal thin film layer on one surface of a synthetic resin film by vacuum vapor deposition or sputtering; a step of depositing a metal plating film layer on the surface of the metal thin film layer by electroplating; A step of closely adhering a metal plating layer having a large number of through holes uniformly formed on the surface of the metal plating film layer by photoelectroforming, and a plurality of through holes of the metal plating layer from the metal plating layer side. Irradiating excimer laser light through a mask in which a large number of beam passing portions corresponding to the above are formed, and the metal plating film layer, the metal thin film layer and the synthetic resin film penetrate the metal thin film layer of the synthetic resin film. A large number of through-holes having an opening diameter on the side opposite to the attachment surface side smaller than the diameter of the spacer material are formed so as to respectively communicate with the above-mentioned multiple through-holes. And a step of joining a porous reinforcing member having a certain thickness and having rigidity to the surface of the metal plating layer, the manufacturing method of the adsorption plate of the spacer material dispersion device for a liquid crystal display element. 4. A step of forming a thin plate-shaped metal plating body having a large number of through-holes uniformly formed on one surface of the thin metal plate by photoelectroforming, and a step of forming the thin metal plate from the thin plate-shaped metal plating body. A step of peeling, a step of joining a synthetic resin film to the surface of the thin plate-shaped metal plated body from which the thin metal plate has been peeled, and a number of through holes of the thin plate-shaped metal plated body from the side of the thin plate-shaped metal plated body. Is irradiated with excimer laser light through a mask in which a large number of beam passing portions corresponding to are pierced, and the synthetic resin film penetrating the synthetic resin film is opposite to the joint surface side with the thin plate metal plating body. Forming a large number of through-holes having an opening diameter on the surface side smaller than the diameter of the spacer material so as to communicate with the plurality of through-holes, respectively; On the surface of the body, and a step of bonding the porous reinforcing member having rigidity is formed at a constant thickness, the manufacturing method of the suction plate of the liquid crystal display device spacer material distribution apparatus.