JPH06339854A - Surface polishing method for ceramics - Google Patents

Abstract

PURPOSE:To restain the occurrence of dimensional failure and a flaw and the like caused by the rotational fluctuation of rings by rotating forcibly the rings to hold a material to be worked inside in the inverse direction to the rotating direction of a rotary surface plate. CONSTITUTION:An abrasive grain is supplied onto a rotary surface plate 1 by an abrasive grain supply device. A ring 3 having the rotational center in a position separated by a prescribed dimension from the rotational center of this surface plate 1 is arranged by four pieces at its maximum on this rotary surface plate 1. A material 4 to be worked is held inside of the respective rings 3 by a pressurizing plate 5, and polishing pressure is applied to the material 4 to be worked. A gear 6 is arranged in the rotational center of the rotary surface plate 1, and this gear 6 and these rings 3 are meshed with each other, and these rings 3 are rotated forcibly in the inverse direction to the rotating direction of the rotary surface plate 1, and polishing work is carried out on the material 4 to be worked.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a polishing method for polishing ceramics with high precision.

[0002]

2. Description of the Related Art A method of performing precision polishing using abrasive grains is called lapping and is widely used as a method suitable for manufacturing brittle materials such as ceramics.
Among the lapping methods, an apparatus called a ring type polishing machine used for single-sided polishing is widely used because the operating method is relatively simple. This ring type polishing machine has a center of rotation on a rotating surface plate at a position distant from the center of rotation of the surface plate, and the ring holding the workpiece is rotated in the same direction as the surface plate, thereby rotating the workpiece. There are those that rotate while rotating.

[0003]

In the method using the ring type polishing machine described above, the ring for holding the workpiece is not particularly forcibly powered, and the frictional force with the rotating surface plate is not applied. Was driven by the same direction as the surface plate. Therefore, if it is used as it is for hard ceramics, the machining speed may not be constant, and it may be necessary to check the dimensions during machining, or dimensional defects may occur due to over-machining. Could be a problem. Further, when the rotation of the ring is not uniform, the product often suffers from scratches, which may cause a poor appearance.

It is an object of the present invention to improve the method using the above-mentioned ring type polishing machine, and particularly to provide a ceramic polishing method capable of polishing ceramics with high precision.

[0005]

DISCLOSURE OF THE INVENTION The present inventor has examined the above-mentioned ring-type polishing machine, and for a hard material such as ceramics, rotates it in the opposite direction to the rotation direction of the rotary platen. It has been found that the work can be uniformly polished in a short time by giving it to the ring, and the present invention has been accomplished. That is, the present invention is a method for polishing the surface of a workpiece using abrasive grains placed on a rotary surface plate, in which a ring placed on the rotary surface plate and holding the workpiece inside is rotated. The surface polishing method for ceramics is characterized in that the surface is forcibly rotated in a direction opposite to the rotating direction of the.

[0006]

[Function] Since the rotation of the ring is not driven by the rotation of the surface plate but is forced to rotate in the opposite direction to the surface plate, the rotation speed of the ring can be made constant regardless of the load by the workpiece. Becomes Further, since the platen is rotated in the direction opposite to the rotating direction, the contact speed of the workpiece is increased, which is suitable for polishing ceramics that are harder than metal materials. Therefore, it becomes possible to obtain an accurate part size, and it is possible to reduce the number of man-hours required for size check during the process. Even when a plurality of rings are arranged on the surface plate, there is no dimensional difference between the rings, and it becomes possible to process the same size at the same time by several times.

[0007]

【Example】

(Example 1) The present invention will be described in more detail with reference to the following examples. The alumina plate having a size of 10 × 20 × 3 mm was polished, and the dimension and the state of occurrence of scratches were investigated. 1 and 2 show the configuration of the used apparatus. The apparatus of FIGS. 1 and 2 is an apparatus in which abrasive grains 2 are supplied onto a rotary platen 1 having a radius of 610 mm. Ring 3 with an outer diameter of 260 mm, whose center of rotation is 190 mm from the center of rotation
Up to four can be installed, and the pressurizing plate 5 that holds the workpiece 4 inside the ring 3 and applies a polishing pressure to the workpiece 4 is provided. Further, in the apparatus shown in FIG. 1, a gear 6 is provided at the center of rotation of the rotary platen, and the ring 6 is forcibly rotated in the direction opposite to the rotating direction of the platen by engaging the gear 6 and the ring 3.

Using the apparatus of FIG. 1, 50 pieces were loaded per ring and polishing was performed 10 times for 30 minutes. Other processing conditions are shown in Table 1. Further, as a comparative example, processing was performed under the same conditions even for the case where no gear was used. Then, the same evaluation as in the example of the present invention was performed. The results are shown in Table 2. According to Table 2, an alumina plate polished by the method of the present invention Sample Nos. 1 to 10
In comparison with Comparative Samples Nos. 11 to 20, the dimensional variation is remarkably reduced, and the occurrence of scuff marks caused by uneven rotation can be significantly reduced.

[0009]

[Table 1]

[0010]

[Table 2]

(Embodiment 2) An apparatus similar to that of Embodiment 1 was used to polish an aluminum nitride plate of 20 × 30 × 5 mm. At this time, the number of insertions per ring was 25, and polishing was performed 10 times with a processing time of 45 minutes. Other processing conditions are shown in Table 3. In addition, as a comparative example, processing was performed under the same conditions even for those that did not use gears. Then, the same evaluation as in the example of the present invention was performed. The results are shown in Table 4. According to Table 4, an aluminum nitride plate polished by the method of the present invention Sample No. 2
It can be seen that in 1 to 30, the dimensional variation was remarkably reduced as compared with the comparative sample Nos. 31 to 40, and the occurrence of scratches caused by uneven rotation was also significantly reduced.

[0012]

[Table 3]

[0013]

[Table 4]

[0014]

By using the processing method of the present invention,
Since it is possible to suppress the occurrence of dimensional defects and scratches due to variations in the rotation of the ring, which has been a problem when polishing ceramics with a ring-type polishing machine, it is possible to obtain a highly accurate polished surface. High-precision polishing of ceramics is an essential step for using ceramics for electronic parts, and the present invention is extremely effective.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of an apparatus used for implementing the present invention.

FIG. 2 is a cross-sectional view showing the structure of an apparatus used for implementing the present invention.

[Explanation of symbols]

1 rotating surface plate, 2 abrasive grains, 3 ring, 4 work piece,
5 pressure plates, 6 gears

Claims (1)

[Claims] 1. A method for polishing the surface of a workpiece using abrasive grains placed on a rotating surface plate, comprising rotating a ring placed on the rotating surface plate and holding the object inside. A method for polishing a surface of ceramics, which comprises forcibly rotating the disk in a direction opposite to the rotating direction of the disk.