JPH06326349A - Photocoupler - Google Patents

Photocoupler

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Publication number
JPH06326349A
JPH06326349A JP11163193A JP11163193A JPH06326349A JP H06326349 A JPH06326349 A JP H06326349A JP 11163193 A JP11163193 A JP 11163193A JP 11163193 A JP11163193 A JP 11163193A JP H06326349 A JPH06326349 A JP H06326349A
Authority
JP
Japan
Prior art keywords
light
passage
light receiving
light emitting
coupling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11163193A
Other languages
Japanese (ja)
Inventor
Yukihisa Oda
幸久 織田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP11163193A priority Critical patent/JPH06326349A/en
Publication of JPH06326349A publication Critical patent/JPH06326349A/en
Pending legal-status Critical Current

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  • Geophysics And Detection Of Objects (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE:To provide a photocoupler which can detect the position of an object to be detected in its longitudinal direction, can be reduced in cost and size, and can be easily changed in object detecting width and detecting pitch for detecting the presence/absence of the object in a passage in a non-contacting state. CONSTITUTION:In the photocoupler which detects the presence/absence of an object to be detected in a passage 21 in a non-contacting state, a light emitting element 24 and a plurality of light receiving elements 25a, 25b, and 25c are arranged in the same plane in the lower section of an enclosure and prism-like reflecting surfaces 26 and 27 are respectively provided above the elements 24 and 25a, 25b, and 25c. In addition, emission-side light transmission bodies 28 and 29 which use the space between the surfaces 26 and 27 as the passage 21 are provided and the bodies 28 and 29 form different optical paths 35a, 35b, and 35c against the elements 25a, 25b, and 25c, respectively.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、通過路上の被検出物体
の有無を無接点で検出する透過型の光結合装置(フォト
インタラプタ)に関し、特にコネクタ付光結合装置に係
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transmission type optical coupling device (photointerrupter) for detecting the presence or absence of an object to be detected on a passage without contact, and more particularly to an optical coupling device with a connector.

【0002】[0002]

【従来の技術】図3は、従来のコネクタ付光結合装置の
構造を示す図であり、同図(a)は縦断面図であり、同
図(b)は上面図である。図4に、その内部結線図を示
す。
2. Description of the Related Art FIGS. 3A and 3B are views showing a structure of a conventional optical coupling device with a connector, wherein FIG. 3A is a vertical sectional view and FIG. 3B is a top view. FIG. 4 shows the internal wiring diagram.

【0003】従来の光結合装置は、発光素子1a,1
b,1cをそれぞれ発光側リードフレーム2,2,2に
搭載し、金線等のボンディングワイヤ3にて電気的接続
をとり、これらをそれぞれ透光性樹脂にてモールドして
発光側透光性樹脂体4a,4b,4cを形成し、同様
に、受光素子5a,5b,5cをそれぞれ受光側リード
フレーム6,6,6に搭載し、ボンディングワイヤー3
にて電気的接続をとり、これらをそれぞれ透光性樹脂に
てモールドして受光側透光性樹脂体7a,7b,7cを
形成し、両透光性樹脂体4a,4b,4c,7a,7
b,7cを通過路8を挟んで対向し、プリント基板9上
に実装し、これらを遮光性樹脂からなる外装ケース10
に収納していた。
The conventional optical coupling device includes the light emitting elements 1a and 1a.
b and 1c are mounted on the light emitting side lead frames 2, 2 and 2, respectively, and are electrically connected by a bonding wire 3 such as a gold wire, and these are respectively molded with a light transmissive resin to transmit light on the light emitting side. The resin bodies 4a, 4b, 4c are formed, and similarly, the light receiving elements 5a, 5b, 5c are mounted on the light receiving side lead frames 6, 6, 6 respectively, and the bonding wire 3
Are electrically connected to each other, and these are respectively molded with a light-transmitting resin to form light-receiving side light-transmitting resin bodies 7a, 7b, 7c, and both light-transmitting resin bodies 4a, 4b, 4c, 7a, 7
b and 7c are opposed to each other with the passage 8 in between, mounted on the printed circuit board 9, and the exterior case 10 made of a light-shielding resin.
Was stored in.

【0004】ここで、前記リードフレーム2,6は、前
記プリント基板9に貫通立設され、半田11にて固定さ
れている。また、前記プリント基板9の一端部には外部
装置との接続を容易にするためのコネクタ12のコネク
タ端子13a,13b,13c,13d,13eが半田
11にて固定され、電気的かつ機械的に接続されてい
る。
Here, the lead frames 2 and 6 are erected through the printed circuit board 9 and fixed with solder 11. Further, connector terminals 13a, 13b, 13c, 13d and 13e of a connector 12 for facilitating connection with an external device are fixed to one end of the printed circuit board 9 with solder 11 and electrically and mechanically. It is connected.

【0005】尚、図中、14a,14b,14c,15
a,15b,15cは光の通過窓(スリット)であり、
16,17は集光レンズであり、18a,18b,18
cは光路である。
In the figure, 14a, 14b, 14c, 15
a, 15b, 15c are light passage windows (slits),
Reference numerals 16 and 17 denote condenser lenses, and 18a, 18b and 18
c is an optical path.

【0006】上記光結合装置において、前記各発光素子
1a,1b,1cから射出された光は、各集光レンズ1
6にて集光され、各スリット14a,14b,14c、
通過路8、各スリット15a,15b,15c及び各集
光レンズ17を通過して、各受光素子5a,5b,5c
に入射される。
In the above optical coupling device, the light emitted from each of the light emitting elements 1a, 1b and 1c is collected by each condenser lens 1.
The light is condensed at 6, and each slit 14a, 14b, 14c,
After passing through the passage 8, each slit 15a, 15b, 15c and each condenser lens 17, each light receiving element 5a, 5b, 5c
Is incident on.

【0007】ここで、前記通過路8内を、光路18aか
ら光路18cに向って被検出物が移動した場合には、光
路18a、光路18b、光路18cと順番に光路がさえ
ぎられていく。これにより、受光素子5a,5b,5c
の順番で光の入射が断たれ、受光素子5a,5b,5c
の電流変化が発生する。この電流変化により、被検出物
の横方向の位置検出を3段階で検出することが可能とな
る。
When the object to be detected moves in the passage 8 from the optical path 18a toward the optical path 18c, the optical paths are interrupted in the order of the optical path 18a, the optical path 18b, and the optical path 18c. Thereby, the light receiving elements 5a, 5b, 5c
In this order, the incidence of light is cut off, and the light receiving elements 5a, 5b, 5c
Current change occurs. This change in current makes it possible to detect the lateral position of the object to be detected in three stages.

【0008】[0008]

【発明が解決しようとする課題】図3の如く、従来の光
結合装置では、被検出物体を3段階で位置検出を行うた
めに、3つの発光素子1a,1b,1c及び3つの受光
素子5a,5b,5cを用いており、各受光素子1a,
1b,1c,5a,5b,5cはそれぞれ透光性樹脂に
てモールドされ、発光側透光性樹脂体4a,4b,4
c、受光側透光性樹脂体7a,7b,7cを構成し、樹
脂体単位で並置し、外装ケース10内に収納されている
ため、構造上光結合装置の小型化が困難であった。
As shown in FIG. 3, in the conventional optical coupling device, three light emitting elements 1a, 1b, 1c and three light receiving elements 5a are provided in order to detect the position of the object to be detected in three stages. , 5b, 5c are used, each light receiving element 1a,
1b, 1c, 5a, 5b and 5c are respectively molded with a light-transmitting resin, and the light-emitting side light-transmitting resin bodies 4a, 4b and 4 are formed.
c, the light-receiving side light-transmissive resin bodies 7a, 7b, 7c are arranged, arranged in parallel in resin body units, and housed in the outer case 10. Therefore, it is difficult to downsize the optical coupling device structurally.

【0009】また、前記発光素子1a,1b,1cを搭
載した発光側リードフレーム2,2,2及び前記受光素
子5a,5b,5cを搭載した受光側リードフレーム
6,6,6はそれぞれ、プリント基板9上に貫通立設
し、半田12にて固定する必要があり、製造工程が複雑
となり、コストアップとなった。
Further, the light emitting side lead frames 2, 2, 2 on which the light emitting elements 1a, 1b, 1c are mounted and the light receiving side lead frames 6, 6, 6 on which the light receiving elements 5a, 5b, 5c are mounted are respectively printed. Since it is necessary to stand upright on the substrate 9 and fix it with the solder 12, the manufacturing process is complicated and the cost is increased.

【0010】さらに、従来では導光体を用いた縦方向の
位置検出を行なう光結合装置は無かった。
Further, conventionally, there has been no optical coupling device using a light guide to detect a position in the vertical direction.

【0011】本発明は、上記課題に鑑み、被検出物の縦
方向の位置検出を可能とし、低コスト化並びに小型化を
図るとともに、被検出物の検出幅及び検出ピッチを容易
に変更できる光結合装置の提供を目的とするものであ
る。
In view of the above problems, the present invention is capable of detecting the vertical position of an object to be detected, achieving cost reduction and downsizing, and easily changing the detection width and detection pitch of the object. The purpose is to provide a coupling device.

【0012】[0012]

【課題を解決するための手段】本発明の光結合装置は、
通過路上の被検出物の有無を無接点で検出する光結合装
置において、外装ケースの下部に面一に配置された発光
素子及び複数の受光素子と、前記発光素子及び受光素子
の各上方に設けられ、上面にプリズム状の反射面が形成
され、前記反射面間を前記通過路とする発光側導光体及
び受光側導光体とを備え、前記発光側導光体及び受光側
導光体は前記通過路において、前記複数の受光素子のそ
れぞれに対して異なる光路を形成してなることを特徴と
するものである。
The optical coupling device of the present invention comprises:
In an optical coupling device for detecting the presence or absence of an object to be detected on a passage without contact, a light emitting element and a plurality of light receiving elements arranged flush with each other in the lower part of an outer case, and provided above each of the light emitting element and the light receiving element. And a light emitting side light guide and a light receiving side light guide having the passage between the reflection surfaces as the passage, and the light emitting side light guide and the light receiving side light guide. In the above passage, different optical paths are formed for the plurality of light receiving elements, respectively.

【0013】また、請求項1記載の光結合装置におい
て、前記反射面は、前記発光側導光体及び受光側導光体
それぞれにおいて、段差にて複数に分割されてなること
を特徴とするものである。
Further, in the optical coupling device according to claim 1, the reflecting surface is divided into a plurality of steps at each of the light emitting side light guide and the light receiving side light guide. Is.

【0014】[0014]

【作用】上記構成によれば、本発明の光結合装置は、被
検出物の縦方向の位置検出が可能であり、単一の発光素
子から複数の受光素子へ光を導光できるので、前記発光
素子の数を低減でき、また、前記発光素子及び受光素子
は面一に設けているため、製造工程が簡素化され且つ部
品数が少なくなり、さらに前記受光素子をチップサイズ
で並置できるので、低コスト化並びに小型化が図れる。
According to the above construction, the optical coupling device of the present invention can detect the position of the object to be detected in the vertical direction, and can guide light from a single light emitting element to a plurality of light receiving elements. Since the number of light emitting elements can be reduced, and the light emitting elements and the light receiving elements are provided in the same plane, the manufacturing process is simplified and the number of parts is reduced, and further, the light receiving elements can be arranged side by side in a chip size. The cost and size can be reduced.

【0015】加えて、前記反射面に設けられた段差の差
を変更することにより、容易に被検出物の縦方向の検出
幅及び検出ピッチを変更することができる。
In addition, it is possible to easily change the vertical detection width and the detection pitch of the object to be detected by changing the difference in level difference provided on the reflecting surface.

【0016】[0016]

【実施例】図1は本発明の一実施例を示す光結合装置の
縦断面図である。
1 is a vertical sectional view of an optical coupling device showing an embodiment of the present invention.

【0017】図示の如く、本発明のコネクタ付透過型光
結合装置(フォトインタラプタ)は、通過路21の被検
出物の有無を無接点で検出するものであって、外装ケー
ス22内の下部に収納されたプリント基板23上に面一
に並置された発光素子24及び受光素子25a,25
b,25cと、前記発光素子24及び受光素子25a,
25b,25cの各上方に配置され、上面にプリズム状
の反射面26,27が形成され、該反射面26,27間
を前記通過路21とする発光側導光体28及び受光側導
光体29とを備えてなる構成である。
As shown in the figure, the transmission type optical coupling device with a connector (photointerrupter) of the present invention is for detecting the presence or absence of an object to be detected in the passage 21 without contact, and is provided at the bottom of the outer case 22. The light emitting element 24 and the light receiving elements 25a, 25 which are arranged flush with each other on the stored printed circuit board 23.
b, 25c, the light emitting element 24 and the light receiving element 25a,
25b and 25c are arranged above each other, prism-shaped reflecting surfaces 26 and 27 are formed on the upper surface, and the light emitting side light guiding body 28 and the light receiving side light guiding body having the passage 21 between the reflecting surfaces 26 and 27 are formed. And 29.

【0018】前記発光素子24は、例えば赤外線発光ダ
イオードが用いられ、前記受光素子25a,25b,2
5cは、例えばアナログ出力用のフォトトランジスタが
用いられ、これらは、前記プリント基板23の上面に直
接銀ペースト等により面一にダイボンドされる。尚、前
記発光素子24は、金線等のボーディングワイヤ35に
て電気的接続を行ない、その周囲は前記発光素子24を
保護するために、シリコン樹脂33にて被覆されてい
る。また、前記受光素子25a,25b,25cは、そ
れぞれ間隔をあけて配置されており、それぞれボーディ
ングワイヤ36にて電気的接続を行った後、これらはシ
リコン樹脂33にて被覆されている。
As the light emitting element 24, for example, an infrared light emitting diode is used, and the light receiving elements 25a, 25b, 2
For 5c, for example, a phototransistor for analog output is used, and these are die-bonded flush with the upper surface of the printed circuit board 23 directly by silver paste or the like. The light emitting element 24 is electrically connected by a boarding wire 35 such as a gold wire, and the periphery thereof is covered with a silicon resin 33 to protect the light emitting element 24. Further, the light receiving elements 25a, 25b, 25c are arranged at intervals, and after electrically connecting with the boarding wires 36, they are covered with the silicon resin 33.

【0019】前記プリント基板23は、一端部に外部装
置との接続を容易にするためのコネクタ34のコネクタ
端子34′が半田付けされ、前記外装ケース22内の下
部に収納される。
A connector terminal 34 'of a connector 34 for facilitating connection with an external device is soldered to one end of the printed circuit board 23, and is housed in the lower part of the outer case 22.

【0020】前記発光側導光体28は、例えば透光性樹
脂等を用いて略直方体に形成され、前記発光素子24の
上方に配置される。前記発光側導光体28の下面は、発
光素子24からの上方への照射光を平行光とするレンズ
30が形成されており、また、上面には前記レンズ30
にて平行光となった光を受光側に反射されるよう、45
°に傾斜されたプリズム効果を有する反射面が形成され
ている。
The light emitting side light guide 28 is formed in a substantially rectangular parallelepiped shape using, for example, a transparent resin, and is arranged above the light emitting element 24. A lens 30 is formed on the lower surface of the light-emitting-side light guide 28 to collimate upward light emitted from the light-emitting element 24, and the lens 30 is formed on the upper surface.
45 so that the light that has become parallel light is reflected on the receiving side
A reflecting surface having a prism effect tilted at a degree is formed.

【0021】前記受光側導光体29は、同じく透光性樹
脂等を用いて略直方体に形成され、前記受光素子25
a,25b,25cの上方に配置される。前記受光側導
光体29の上面は、前記発光側導光体28の反射面26
にて反射された光を、前記受光素子25a,25b,2
5cに入射させるよう、45°に傾斜されたプリズム効
果を有する反射面27が形成されており、前記受光素子
25a,25b,25cと相対向する位置に配置されて
いる。尚、前記受光側導光体29の下面に形成されたV
溝37は各受光素子25a,25b,25cに入射され
る光を確実に分離するためのものである。
The light-receiving-side light guide body 29 is also formed in a substantially rectangular parallelepiped shape using a light-transmitting resin or the like.
It is arranged above a, 25b and 25c. The upper surface of the light-receiving-side light guide body 29 has a reflection surface 26 of the light-emitting-side light guide body 28.
The light reflected by the light receiving elements 25a, 25b, 2
A reflecting surface 27 having a prism effect inclined at 45 ° is formed so as to be incident on 5c, and is disposed at a position facing the light receiving elements 25a, 25b, 25c. In addition, V formed on the lower surface of the light receiving side light guide 29
The groove 37 is for surely separating the light incident on each of the light receiving elements 25a, 25b, 25c.

【0022】前記外装ケース22は、遮光性樹脂を用い
て予め金型成形されたもので、前記発光側導光体28を
収納する発光側収納部38と、前記受光側導光体29を
収納する受光側収納部39とを有する側面視略コ字形に
形成されており、前記通過路21は、前記発光側収納部
38と受光側収納部39とに挟まれた空間が利用され
る。また、両収納部38、39の前記通過路21を挟ん
で対向する対向壁には、両導光体28,29の間で光指
向光を有せしめて光授受を行なう通過窓(スリット)3
1,32が形成されている。
The outer case 22 is molded in advance using a light-shielding resin, and contains a light-emission-side storage section 38 for accommodating the light-emission-side light guide 28 and the light-reception-side light guide 29. The light receiving side storage portion 39 is formed in a substantially U shape in side view, and the passage 21 uses a space sandwiched between the light emitting side storage portion 38 and the light receiving side storage portion 39. In addition, a passage window (slit) 3 for transmitting and receiving light by allowing light-directing light to be provided between the light guides 28 and 29 on the opposing walls of the storage portions 38 and 39 that face each other across the passage 21.
1, 32 are formed.

【0023】このように、両素子24,25a,25
b,25cをプリント基板23に面一にダイボンドして
いるため、同一工程でかつ自動的にワイヤボンディング
等を行えるため製造工程の簡素化および自動化による製
造コストの低減を図り得る。また、単一の発光素子24
から複数の受光素子25a,25b,25cへ光を導光
でき、図3に示したリードフレーム2,6等が不要とな
り、部品点数を削減でき、製造コストを低減できる。さ
らに、発光素子24及び受光素子25a,25b,25
cをチップサイズでプリント基板23上に配置できるた
め、小型化が可能である。
In this way, both elements 24, 25a, 25
Since b and 25c are die-bonded to the printed circuit board 23 so as to be flush with each other, wire bonding and the like can be automatically performed in the same process, so that the manufacturing process can be simplified and the manufacturing cost can be reduced by automation. In addition, a single light emitting element 24
Light can be guided to a plurality of light receiving elements 25a, 25b, 25c, the lead frames 2, 6 and the like shown in FIG. 3 are not required, the number of parts can be reduced, and the manufacturing cost can be reduced. Further, the light emitting element 24 and the light receiving elements 25a, 25b, 25
Since c can be arranged in the chip size on the printed circuit board 23, the size can be reduced.

【0024】次に、上記光結合装置の動作を説明する。
発光素子24から上方へ発する照射光は、発光側導光体
28の下面のレンズ30にて平行光とされ、そして、上
面の反射面26で側方に全反射され、スリット31より
通過路20に放出される。尚、35a,35b,35c
は光路である。
Next, the operation of the optical coupling device will be described.
Illumination light emitted upward from the light emitting element 24 is collimated by the lens 30 on the lower surface of the light emitting side light guide 28, and is totally reflected laterally by the reflecting surface 26 on the upper surface, and passes through the passage 31 from the slit 31. Is released to. Incidentally, 35a, 35b, 35c
Is the optical path.

【0025】ここで、物体の通過路21上に被検出物が
なかった場合には、通過路21内の光はスリット32よ
り受光側導光体29に入射し、反射面27にて下方へ全
反射され、それぞれの受光素子25a,25b,25c
へ導光される。
Here, when there is no object to be detected on the passage 21 of the object, the light in the passage 21 enters the light guide 29 on the light receiving side through the slit 32, and is reflected downward by the reflecting surface 27. Totally reflected and the respective light receiving elements 25a, 25b, 25c
Is guided to.

【0026】一方、物体の通過路21上に被検出物があ
った場合、例えば被検出物が通過路21の上方より下方
に移動した場合には、まず光路35aがさえぎられ、受
光素子25aへの光入射がなくなり、前記受光素子25
aの電流変化が発生する。さらに、被検出物が下方に移
動すれば、光路35b、光路35cの順に光路がさえぎ
られ、受光素子25b、25cの順で電流変化が発生
し、被検出物の縦方向の位置検出を3段階において検出
可能とすることができる。
On the other hand, when there is an object to be detected on the passage 21 of the object, for example, when the object to be detected moves downward from above the passage 21, the optical path 35a is interrupted first and the light receiving element 25a is reached. Of the light receiving element 25
A current change of a occurs. Further, when the object to be detected moves downward, the optical path is blocked in the order of the optical path 35b and the optical path 35c, a current change occurs in the order of the light receiving elements 25b and 25c, and the vertical position detection of the object to be detected is performed in three steps. Can be detected at.

【0027】図2は、他の実施例を示す縦断面図であ
る。本実施例について、上記実施例と相違する点のみ説
明する。
FIG. 2 is a vertical sectional view showing another embodiment. Only the points of this embodiment different from the above embodiments will be described.

【0028】図2の如く、本実施例の光結合装置は、各
導光体28,29の上面に形成されたプリズム効果を有
する反射面26、27が、段差にて分割された複数の反
射面26a,26b,26c、27a,27b,27c
からなる構成である。
As shown in FIG. 2, in the optical coupling device of this embodiment, the reflecting surfaces 26 and 27 having the prism effect formed on the upper surfaces of the light guides 28 and 29 are divided into a plurality of reflecting portions. Faces 26a, 26b, 26c, 27a, 27b, 27c
It is composed of.

【0029】前記反射面26a,26b,26cは、レ
ンズ30にて平行光とした光を受光側に全反射させるよ
う、45°に傾斜されており、また光を3つの光に分割
するものである。
The reflecting surfaces 26a, 26b and 26c are inclined at 45 ° so as to totally reflect the light collimated by the lens 30 to the light receiving side, and divide the light into three lights. is there.

【0030】前記反射面27a,27b,27cは、そ
れぞれ受光素子25a,25b,25cと一対するよう
相対向する位置に配置されており、前記反射面26a,
26b,26cにて反射された光をそれぞれ受光素子2
5a,25b,25cへ全反射させるよう、45°に傾
斜されたものである。
The reflecting surfaces 27a, 27b and 27c are arranged at positions facing each other so as to be paired with the light receiving elements 25a, 25b and 25c, respectively.
The light reflected by 26b and 26c receives light from the light receiving element 2 respectively.
It is tilted at 45 ° so as to totally reflect light to 5a, 25b and 25c.

【0031】このように、前記反射面26,27を段差
にて分割したことにより、段差の差を変えることで、通
過路21における被検出物の縦方向の検出幅及び検出ピ
ッチを容易に変更することができる。例えば、反射面2
6a,26b間及び反射面27a,27b間の段差を大
きくする、すなわち、両導光体28,29の反射面26
a,27aの部分を突出するよう縦方向に延ばすことに
より、光路35aが高い位置に設定され、検出幅が広が
る。また、前記光路35a,35b,35c間の各ピッ
チを段差にて変更することにより所望のピッチを得るこ
とができる。さらに、受光素子及び反射面を増やすこと
により、光路を増加させることも可能である。
By thus dividing the reflecting surfaces 26 and 27 by the steps, the difference between the steps can be changed to easily change the vertical detection width and the detection pitch of the object to be detected in the passage 21. can do. For example, reflective surface 2
6a, 26b and the reflecting surfaces 27a, 27b are made larger in level, that is, the reflecting surfaces 26 of both light guides 28, 29.
By extending the portions a and 27a in the vertical direction so as to project, the optical path 35a is set at a high position and the detection width is widened. Further, a desired pitch can be obtained by changing each pitch between the optical paths 35a, 35b and 35c by a step. Further, it is possible to increase the optical path by increasing the number of light receiving elements and reflecting surfaces.

【0032】尚、ここで、段差の差の変更により、スリ
ット31,32及び外装ケース22の大きさも所望の値
と変更することは勿論である。
Here, it goes without saying that the sizes of the slits 31 and 32 and the exterior case 22 can be changed to desired values by changing the difference in step.

【0033】また、上記構成によれば、発光側導光体2
8の反射面26が延びる方向の厚みを薄くすることが可
能である。
Further, according to the above configuration, the light emitting side light guide 2
It is possible to reduce the thickness in the direction in which the reflecting surface 26 of No. 8 extends.

【0034】[0034]

【発明の効果】以上のように本発明の光結合装置によれ
ば、被検出物の縦方向の位置検出が可能であり、低コス
ト化及び小型化が図れる。
As described above, according to the optical coupling device of the present invention, the position of the object to be detected can be detected in the vertical direction, and the cost and size can be reduced.

【0035】また、反射面の段差の差を変更することに
より、被検出物の検出幅及び検出ピッチを所望の値とす
ることが可能となる。
By changing the difference in level difference between the reflecting surfaces, it becomes possible to set the detection width and detection pitch of the object to be detected to desired values.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す光結合装置の縦断面図
である。
FIG. 1 is a vertical sectional view of an optical coupling device showing an embodiment of the present invention.

【図2】本発明の他の実施例を示す光結合装置の縦断面
図である。
FIG. 2 is a vertical sectional view of an optical coupling device showing another embodiment of the present invention.

【図3】従来例を示す図であり、図(a)は縦断面図で
あり、図(b)は平面図である。
3A and 3B are views showing a conventional example, FIG. 3A is a vertical sectional view, and FIG. 3B is a plan view.

【図4】図3に示す光結合装置の内部結線図である。FIG. 4 is an internal wiring diagram of the optical coupling device shown in FIG.

【符号の説明】[Explanation of symbols]

21 通過路 22 外装ケース 24 発光素子 25a,25b,25c 受光素子 26,26a,26b,26c,27a,27b,27
c 反射面 28 発光側導光体 29 受光側導光体 35a,35b,35c 光路
21 Passage Path 22 Exterior Case 24 Light-Emitting Element 25a, 25b, 25c Light-Receiving Element 26, 26a, 26b, 26c, 27a, 27b, 27
c reflective surface 28 light emitting side light guide 29 light receiving side light guide 35a, 35b, 35c optical path

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 通過路上の被検出物の有無を無接点で検
出する光結合装置において、外装ケースの下部に面一に
配置された発光素子及び複数の受光素子と、前記発光素
子及び受光素子の各上方に設けられ、上面にプリズム状
の反射面が形成され、前記反射面間を前記通過路とする
発光側導光体及び受光側導光体とを備え、前記発光側導
光体及び受光側導光体は前記通過路において、前記複数
の受光素子のそれぞれに対して異なる光路を形成してな
ることを特徴とする光結合装置。
1. An optical coupling device for contactlessly detecting the presence or absence of an object to be detected on a passage, a light emitting element and a plurality of light receiving elements arranged flush with each other in a lower portion of an outer case, the light emitting element and the light receiving element. A light emitting side light guide body and a light receiving side light guide body having a prism-shaped reflection surface formed on the upper surface thereof and having the passage between the reflection surfaces as the passage path. An optical coupling device, wherein the light-receiving side light guide forms a different optical path for each of the plurality of light-receiving elements in the passage.
【請求項2】 前記反射面は、前記発光側導光体及び受
光側導光体それぞれにおいて、段差にて複数に分割され
てなることを特徴とする請求項1記載の光結合装置。
2. The optical coupling device according to claim 1, wherein the reflecting surface is divided into a plurality of steps at each of the light emitting side light guide and the light receiving side light guide.
JP11163193A 1993-05-13 1993-05-13 Photocoupler Pending JPH06326349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11163193A JPH06326349A (en) 1993-05-13 1993-05-13 Photocoupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11163193A JPH06326349A (en) 1993-05-13 1993-05-13 Photocoupler

Publications (1)

Publication Number Publication Date
JPH06326349A true JPH06326349A (en) 1994-11-25

Family

ID=14566216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11163193A Pending JPH06326349A (en) 1993-05-13 1993-05-13 Photocoupler

Country Status (1)

Country Link
JP (1) JPH06326349A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008032728A (en) * 2006-07-31 2008-02-14 Ivoclar Vivadent Ag Light measuring device
JP2013210263A (en) * 2012-03-30 2013-10-10 Azbil Corp Sensor device
CN113359250A (en) * 2021-06-07 2021-09-07 通号(北京)轨道工业集团有限公司轨道交通技术研究院 Optical coupling structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008032728A (en) * 2006-07-31 2008-02-14 Ivoclar Vivadent Ag Light measuring device
JP2013210263A (en) * 2012-03-30 2013-10-10 Azbil Corp Sensor device
CN113359250A (en) * 2021-06-07 2021-09-07 通号(北京)轨道工业集团有限公司轨道交通技术研究院 Optical coupling structure

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