JPH06324080A - Rf probe head - Google Patents

Abstract

PURPOSE:To make it possible to apply DC voltage for measuring characteristics on a material to be measured without imparting adverse effects on the measurement by providing high-impedance lines having metal needles along grounding lines. CONSTITUTION:In this RF probe head 100, ground monitoring lines 3d and 3e constituted of high-impedance metal films are arranged at the outside of both grounding lines 3a and 3c in parallel with these lines. Metal needles 2d and 2e at one-end side of the lines 3d and 3e are in contact with metal pads 10a and 10c of a material to be measured 10, respectively. Under the state wherein the metal needles 2a-2e are in contact with the corresponding metal pads 10a-10c of the material to be measured 10, the RF signal and the DC voltage are applied on the head 100 from a characteristic measuring instrument and a DC power supply for measurement. Then, the RF signal is supplied into the material to be measured 10 through the lines 3a-3c. At this time, the monitoring lines 3d and 3e do not affect the propagation of the RF signal because the lines have the high impedance. The DC voltage is applied through the line 3b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an RF probe head, and more particularly to a structure of a signal transmission line for supplying a measurement signal to an object to be measured such as a semiconductor integrated circuit.

[0002]

2. Description of the Related Art FIG. 11 is a diagram for explaining an example of a conventional RF probe head, FIG. 11 (a) is a perspective view showing the RF probe head as an object to be measured, and FIG. RF
It is a perspective view which shows the transmission line of a probe head. In the figure, 400 is an RF probe head, 1 is a substrate made of such as ceramics, and a signal line 3b and ground lines 3a, 3c made of a metal film or the like are provided on the back side thereof. Reference numerals 2a, 2b, 2c are metal needles formed on one end side of the respective lines 3a, 3b, 3c, and the metal needles 2a, 2b, 2c are used as the corresponding metal pads 10a, 10b, 10c of the DUT 10. The object to be measured 10 and the RF probe head 400 are electrically connected to each other.

FIG. 12 is a diagram showing a circuit configuration for applying a high frequency signal and a DC voltage to a conventional RF probe head. In the figure, the same reference numerals as those in FIG. 11 indicate the same or corresponding portions, 82 is a bias tee composed of a capacitor 83 and a coil 84, 81 is an RF signal measuring device connected between the bias tee 82 and the ground, 88 Is connected between the bias tee 82 and the ground, and drives D under test.
C power supply, variable DC power supply 87, ammeter 86 and voltmeter 8
Have five. Here, the RF probe head 400
The signal line 3b and the ground lines 3a and 3c are connected to the RF measuring device, the DC power source, and the ground by a coaxial cable (not shown). Note that 90 is the internal resistance of the power supply 88,
Reference numerals 31 and 32 are parasitic resistances such as a resistance component of the cable and a contact resistance of a metal needle.

Next, the operation will be described. When the metal needles 2a, 2b, 2c of the RF probe head are in contact with the metal pads 10a, 10b, 10c of the DUT 10, R
RF signal from F signal measuring instrument 81, D from DC power source 88
The C voltage is applied to the RF probe head 400. Then, the DC voltage and the RF signal drive the transistor or the like of the DUT, and the RF characteristic of the DUT can be measured by the RF signal measuring device 81.

[0005]

However, the conventional RF
The probe head is configured as described above, and the contact or connection between the object to be measured and the RF probe head was visually confirmed when measuring the object to be measured such as a semiconductor integrated circuit. Therefore, there is a problem that the electrical connection between the object to be measured and the RF probe head cannot be reliably recognized.

Further, it is possible to remove the resistance component of the cable connecting the RF measuring device or the DC power source and the RF probe head, and the parasitic resistances 31 and 32 caused by the contact or connection between the DUT and the needle of the RF probe head. However, due to the effect of the voltage drop due to these resistances, there is a problem in that the RF characteristics of the device under test cannot be accurately measured during normal operation.

The present invention has been made in order to solve the above problems, and it is possible to electrically and reliably detect the connection between the object to be measured and the RF probe head, and to adversely affect the RF characteristic measurement. It is an object of the present invention to provide an RF probe head that can apply a DC voltage for characteristic measurement to an object to be measured.

[0008]

In the RF probe head according to the present invention, in addition to a signal line having a metal needle on one end side and a ground line having a metal needle on one end side on both sides of the signal line, the above-mentioned both grounds are provided. A high impedance line having a metal needle that is formed outside the line along each ground line and contacts the same electrode pad as the metal needle of the adjacent ground line is provided.

An RF probe head according to the present invention includes a signal line formed on a substrate and having a metal needle on one end side,
In addition to the ground line formed on both sides of the signal line of the substrate and having a metal needle on one end side, the same as the metal needle of the ground line which is formed so as to face each of the ground lines through the substrate and is opposed to each other. It is provided with a high impedance line having a metal needle that contacts the electrode pad.

In the RF probe head according to the present invention, a measuring instrument connected between the ground line and the signal line via a capacitor to generate an RF signal for characteristic measurement, the signal line and the high impedance line. And a variable DC power supply, an ammeter and a voltmeter, and a measurement DC power supply for generating a DC signal for characteristic measurement.

According to the present invention, in the RF probe head, a variable DC power source and an ammeter are connected between the signal line and the high impedance line, and the contact state between each line and the metal pad is confirmed. Contact confirmation DC
It is equipped with a power supply.

In the RF probe head according to the present invention, a measuring instrument connected between the ground line and the signal line via a capacitor to generate an RF signal for measuring a characteristic, a variable DC power source, an ammeter and a voltage. A DC power supply for measurement, which has a DC meter for generating a DC signal for characteristic measurement, a variable DC power supply and an ammeter, and a DC power supply for contact confirmation for confirming a contact state between each of the lines and the metal pad. And a changeover switch for connecting either the measurement DC power supply or the contact confirmation DC power supply by switching between the signal line and the high impedance line between the two DC power supplies.

The RF probe head according to the present invention has first and second signal lines which are separated by slits and have metal needles at one end which are in contact with the same electrode pad, and are formed on both sides of these signal lines. And a ground line having a metal needle on one end side.

An RF probe head according to the present invention is formed on a substrate and has a first signal line having a metal needle on one end side, and is formed on both sides of the signal line on the substrate, and each has a metal needle on one end side. In addition to a ground line having a signal line, a second signal line having a metal needle that is formed so as to face the signal line through the substrate and is in contact with the same electrode pad as the metal needle of the signal line is provided. Is.

In the RF probe head of the present invention, the RF probe head is connected between the first and second signal lines and the ground line, and RF for characteristic measurement is provided via a capacitor.
A DC generator for measuring characteristics, which is connected between the measuring device for generating a signal and the first signal line and the second signal line via coils, and has a variable DC power supply, an ammeter and a voltmeter.
And a measuring DC power source for generating a signal.

According to the present invention, in the RF probe head, a variable DC power source and an ammeter are connected between the first signal line and the second signal line, and the signal lines and the metal pads are in contact with each other. D for contact confirmation to confirm the state
It is equipped with a C power supply.

According to the present invention, in the above-mentioned RF probe head, a measuring device which is connected between the first and second signal lines and the ground line via a capacitor and which generates an RF signal for characteristic measurement, and a variable DC In order to confirm the contact state between each line and the metal pad, which has a power supply, an ammeter, and a voltmeter, and has a measurement DC power supply that generates a DC signal for characteristic measurement, a variable DC power supply, and an ammeter. Of the contact confirmation DC power supply, and either the measurement DC power supply or the contact confirmation DC power supply is switched between these power supplies, and a coil is provided between the first and second signal lines and the ground line. And a changeover switch connected via the switch.

[0018]

In the present invention, since the transmission line is formed with the central signal line, the high impedance line is formed along each ground line on both sides of the signal line or so as to face each ground line with the substrate interposed therebetween. By connecting a measuring DC power source that generates a DC signal for characteristic measurement, which has a variable DC power source, an ammeter and a voltmeter, between the signal line and the high impedance line, the R of the measuring frequency can be increased.
It is possible to monitor only the voltage applied to the object to be measured, without removing the voltage drop of the parasitic resistance due to the contact between the object to be measured and the RF probe head without affecting the F characteristic. As a result, the applied voltage to the object to be measured can be accurately adjusted to a desired value, and the characteristics of the object to be measured can be accurately measured.

Further, a variable DC power source and an ammeter are provided between the signal line and the high impedance line, and a DC power source for contact confirmation for confirming a contact state between each line and the metal pad is connected. As a result, the connection between the object to be measured and the RF probe head can be reliably detected electrically.

Further, by providing a changeover switch for connecting either the DC power supply for measurement or the DC power supply for contact confirmation by switching between the DC power supply and the high impedance line between the signal line and the high impedance line, The connection between the measurement object and the RF probe head can be reliably detected electrically, and a DC voltage for the characteristic measurement can be applied to the measurement object without adversely affecting the RF characteristic measurement.

According to the present invention, a metal needle, which constitutes a transmission line together with the ground lines on both sides and which is in contact with the same electrode pad, which is separated by a slit, is used as a signal line between the ground lines on one end side. Have first, second
Since the above-mentioned signal line is provided, the DC power source for measurement is connected via the coil between the first and second signal lines and the ground line, and in the same manner as described above, the measurement object is connected to the object to be measured. It becomes possible to adjust the applied voltage of
The characteristics of the measured object can be accurately measured.

In the present invention, in addition to the first signal line between the ground lines on both sides, which constitutes the transmission line, the signal line is formed so as to face the signal line through the substrate. Since the second signal line having the metal needle that contacts the same electrode pad as the metal needle of the signal line is provided, the characteristics of the object to be measured can be accurately measured as in the above.

Further, by connecting the DC power source for contact confirmation through a coil between the first and second signal lines and the ground line, the connection between the DUT and the RF probe head is electrically connected. Can be reliably detected.

Further, by providing the changeover switch in addition to the DC power supply for measurement and the DC power supply for contact confirmation, the connection between the object to be measured and the RF probe head can be electrically and reliably detected, and the RF characteristics can be detected. A DC voltage for characteristic measurement can be applied to the DUT without adversely affecting the measurement.

[0025]

【Example】

Example 1. FIG. 1 is a view for explaining an RF probe head according to a first embodiment of the present invention, and FIG. 1 (a) is a perspective view showing the RF probe head together with an object to be measured,
FIG. 1B is a perspective view showing the structure of the transmission line of the RF probe head. In the figure, 100 is R of this embodiment.
It is an F probe head, and the same symbols as those in FIG.
The same thing as the F probe head 400 is shown. In the RF probe head 100 of the present embodiment, a predetermined width, thickness, and length formed of a high-impedance metal film are provided outside the both ground lines 3a and 3c at a predetermined interval and in parallel with them. Ground monitor lines 3d, 3
e are provided respectively. In addition, each of the above lines 3d, 3
Metal needles 2d and 2e are respectively formed at one end of e, and the metal needle 2d together with the metal needle 2a is the object to be measured 1
No. 0 metal pad 10a, the metal needle 2e is the metal needle 2c
At the same time, the metal pad 10c of the object to be measured 10 is brought into contact therewith.

FIG. 2 shows the RF probe head 100 with an R
It is a figure which shows the circuit structure which supplies F signal and DC power supply. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions, and 22 is a bias tee composed of a capacitor 23 and a coil 24, and the connection point between the capacitor and the coil is connected to the signal line 3b. Reference numeral 21 is a characteristic measuring device for applying an RF signal to the RF probe head 100.
One end thereof is connected to ground and the other end is connected to the signal line 3b via the capacitor 23. Further, reference numeral 25 is a measuring DC power source having a variable DC power source 28, an ammeter 26, and a voltmeter 27. The negative side of the variable DC power source 28 is connected to the ground, and the positive side thereof is the ammeter 26 and the internal resistance 3.
It is connected to the coil 24 of the bias tee 22 through 0. The connection point between the ammeter 26 and the internal resistance 30 is connected to the ground monitor lines 3d and 3e via a voltmeter 27 and a coil 29. Here, the RF
A coaxial cable is used to connect the probe head 100 to the measuring DC power supply 25 and the characteristic measuring instrument 21. Further, 31 and 32 are external resistances such as resistance components of cables and contact resistances of metal needles, and the ground lines 3a and 3c of the RF probe head 100 are grounded via these resistances 31 and 32.

Next, the operation will be described. In a state where the metal needles 2a to 2e of the RF probe head are in contact with the corresponding metal pads 10a to 10c of the DUT 10, the RF signal and the DC power source are supplied from the characteristic measuring instrument 21 and the measurement DC power source 25, respectively. Apply to. Then, the RF signal is transmitted to the line 3a of the RF probe head 100.
3c are propagated through an RF transmission line having a predetermined impedance and supplied to the DUT 10. At this time, since the ground monitor lines 3d and 3e have high impedance, they do not affect the propagation of the RF signal.

Further, the DC voltage is applied to the object to be measured through the signal line 3b to drive the transistor etc. of the object to be measured. At this time, the DC current for measuring the characteristic flows through the path composed of the signal line 3b, the DUT 10, and the ground lines 3a and 3c.

At this time, the voltmeter 27 of the measurement DC power supply 25 connected to the ground monitor lines 3d and 3e is provided with a voltage drop in the parasitic resistances 31 and 32 of the ground lines 3a and 3c. The driving voltage of the device under test 10, which is not included, is monitored as it is.

Therefore, by adjusting the voltage of the variable DC power supply 28 so that the display voltage of the voltmeter 27 becomes a predetermined value, the measurement of the RF characteristic when the DUT 10 is driven by the predetermined drive voltage. Is possible.

As described above, in this embodiment, the RF probe head is added to the signal line 3b and the ground lines 3a and 3c arranged on both sides thereof, and in addition to the high impedance in parallel to the outside of the ground lines 3a and 3c. Ground monitor wire 3
Since the structure has d and 3e, only the voltage drop due to the DUT 10 in the state where the DC voltage is applied to the DUT 10 through the signal line 3b and the ground lines 3a and 3c is used. And ground monitor lines 3d, 3
It can be monitored via e.

That is, the voltage applied to the DUT 10 can be accurately monitored without including the voltage drop due to the parasitic resistances 31 and 32 of the circuit for applying the DC voltage to the DUT 10. . As a result, the DC voltage for measuring the characteristic applied to the DUT 10 can be accurately set,
The RF characteristics of the DUT 10 can be measured accurately.

Since the ground monitor lines 3d and 3e are made of a high-impedance metal film, the monitor lines do not adversely affect the propagation of RF signals.

In the above embodiment, the ground monitor lines 3d and 3e are arranged on the surface of the substrate on which the ground lines 3a and 3b are arranged. However, the ground monitor lines are the ground lines of the substrate. It may be arranged on the surface opposite to the surface on which 3a and 3c are arranged.

FIG. 3 shows an RF probe head having such a configuration. In this RF probe head 100a, the ground monitor lines 13d and 13e are located on the side of the substrate 1 opposite to the surface on which the ground lines 3a and 3c are arranged. On the plane of
It is arranged in a portion facing the ground lines 3a and 3c.

Further, the ground monitor lines 13d, 13
The metal needles 12d, 12e on one end side of e are provided so as not to be short-circuited with the metal needles 2a, 2c of the ground lines 3a, 3c at the end of the substrate and to be able to come into contact with the same pad as these metal needles. There is.

The RF probe head 10 having such a configuration
0a has an effect that the area for disposing the ground monitor lines 13d and 13e can be reduced and the probe head can be downsized.

Example 2. FIG. 4 is a view for explaining an RF probe head according to a second embodiment of the present invention,
4A is a perspective view showing the RF probe head together with the object to be measured, and FIG. 4B is a perspective view showing the structure of the transmission line of the RF probe head. In the figure, reference numeral 200 denotes the RF probe head of this embodiment.
In 00, the signal force line 5b and the signal monitor line 5d separated by the slit 6 are provided instead of the signal line 3b in the conventional RF probe head 400, and the other points are the conventional RF probe head 400.
Is the same as In addition, 4b and 4d are metal needles formed on one end side of the signal force wire 5b and the signal monitor wire 5d, respectively, and these metal needles 4b and 4d both contact the metal pad 10b of the DUT 10. Has become.

FIG. 5 is a diagram showing a circuit configuration for supplying an RF signal and a DC power source to the RF probe head 200 of the second embodiment. In the figure, the same reference numerals as those in FIG. 12 indicate the same or corresponding parts, and 52 is a bias tee composed of first and second capacitors 53 and 54 and first and second coils 55 and 56, and a first capacitor. The connection point between 53 and the first coil 55 is connected to the signal force line 5b, the connection point between the second capacitor 54 and the second coil 56 is connected to the signal sense line 5d, and one end is grounded. The other end of the measuring instrument 21 has the above-mentioned first and second capacitors 5
It is connected to 3, 54 connection points. Reference numeral 57 is a measuring DC power supply having a variable DC power supply 59, an ammeter 58, and a voltmeter 60. The minus side of the variable DC power supply 59 is connected to the ground, and the plus side is the ammeter 58 and the internal resistance 6
1 is connected to the first coil 55 of the bias tee 52, and the voltmeter 60 is connected to the second coil and the negative side of the variable DC power supply 59.
Here, the signal force line 5b and the signal monitor line 5d separated by the slit 6 are open for a DC voltage and short-circuited for an RF signal.

Next, the operation will be described. The metal needles 2a, 2c, 4d, and 4e of the RF probe head are attached to the DUT 10.
While in contact with the corresponding metal pads 10a to 10c, the RF signal and the DC power source are applied to the RF probe head 200 from the characteristic measuring instrument 21 and the measuring DC power source 57, respectively. Then, the RF signal is transmitted to the RF probe head 20.
0 through the RF transmission line having a predetermined impedance composed of the lines 3a, 3c, 5b and 5d
Supplied to zero. In the propagation of the RF signal, the signal force line 5b and the signal monitor line 5d have exactly the same functions as one signal line.

The DC voltage is the signal force line 5b.
After that, the voltage is applied to the DUT 10 to drive the transistor or the like of the DUT. At this time, the DC current for the characteristic measurement is the signal force line 5b, the DUT 10, and the ground line 3.
It flows through the route consisting of a and 3b.

At this time, the voltmeter 60 of the measuring DC power source 57 connected to the signal sense line 5d does not include the voltage drop in the parasitic resistances 31 and 32 of the ground lines 3a and 3c. The drive voltage of the DUT 10 is directly monitored.

Therefore, by adjusting the voltage of the variable DC power supply 59 so that the monitored voltage becomes a predetermined value, it is possible to measure the RF characteristic when the device under test 10 is driven by the predetermined driving voltage. Becomes

As described above, in this embodiment, since the RF probe head has the structure having the signal force line 5b and the signal monitor line 5d separated by the slit 6 as the signal line, the signal force line 5b and the ground line are provided. Only the voltage drop due to the DUT 10 in the state where the DC voltage is applied to the DUT 10 via 3a and 3c can be monitored via the signal force line 5b and the signal monitor line 5d.

That is, the voltage applied to the DUT 10 can be accurately monitored without including the voltage drop due to the parasitic resistances 31 and 32 of the circuit for applying the DC voltage to the DUT 10. . As a result, the DC voltage for measuring the characteristic applied to the DUT 10 can be accurately set,
The RF characteristics of the DUT 10 can be measured accurately.

For the RF signal, the signal monitor line 5d and the signal force line 5b act as one signal line, so that the signal monitor line 5d does not adversely affect the propagation of the RF signal.

In the second embodiment, the signal force line 5b and the signal monitor line 5 are used as the signal line.
Although d is separated by a slit and arranged on the same surface of the substrate of the RF probe head, the signal monitor line 5d is arranged on the surface of the substrate opposite to the surface on which the ground lines 3a and 3c are arranged. Good.

FIG. 6 shows an RF probe head having such a configuration. In this RF probe head 200a, the signal force line 5b is arranged at a position equidistant from the ground lines 3a and 3c, and The signal monitor line 15e is on the surface of the substrate 1 opposite to the surface on which the ground lines 3a and 3c are arranged, and the signal force line 5 is provided.
It is arranged in a portion facing b.

The needle tip 14 on one end side of the signal monitor wire 15 is an end portion of the substrate 1 and the signal force wire 5b.
The metal needle 4b is not short-circuited, and the metal needle 4b and the pad 10b can be brought into contact with each other.

The RF probe head 20 having such a configuration
0a has an effect that the area for disposing the signal monitor line 15e can be reduced and the probe head can be made smaller.

Example 3. FIG. 7 shows an RF probe head according to a third embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC power to the RF probe head. In the figure, the same reference numerals as those in FIG. A contact confirmation DC power supply including a power supply 74 and an ammeter 73. The negative side of the variable DC power supply 74 is connected to ground and the positive side is connected to the ground monitor lines 3d and 3e via the ammeter 73.
The other end of the characteristic measuring instrument 21 whose one end is grounded is connected to the signal line 3b. Here, the contact confirmation DC power source is connected between the ground line and the monitor line as described above because the signal line 3b and the ground monitor lines 3d and 3e are the same as in the first and second embodiments. If a DC power supply for contact confirmation is connected between them, a confirmation current will flow through the element for which characteristic measurement is performed, and this current value will vary depending on the performance of the element, so an appropriate determination cannot be made. For example, when measuring a transistor, a certain amount of current flows between the drain and source even if the metal needle is in half contact, so depending on the element, it may be determined that the metal needle and pad are in complete contact. In addition, since almost no current flows between the gate and the source, it is difficult to confirm whether there is contact or contact failure.

Next, the function and effect will be described. The probe head 100 is applied to the object to be measured while a DC voltage is applied from the contact confirmation DC power source 72 to the ground monitor lines 3d and 3e. Then, the ground monitor lines 3d and 3e
And the metal needles 2d, 2e and 2a of the ground lines 3a, 3c,
When 2c surely contacts the corresponding metal pad 10a of the object to be measured, the ammeter 73 of the power supply device 72 shows a predetermined current value, and the contact between the metal needle and the metal pad is unsuccessful. When it is perfect, the current value indicated by the ammeter 73 does not reach a predetermined value. As a result, the contact between the ground lines 3a and 3c and the corresponding metal pads 10a and 10c can be electrically confirmed without visual inspection, and the electrical connection between the probe head and the object to be measured can be ensured.
The F characteristic measurement can be accurately performed.

Example 4. FIG. 8 shows an RF probe head according to a fourth embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head. The peripheral circuit of the RF probe head of this example has the same circuit configuration as that shown in FIG. Instead of the measurement DC power source 57, a contact confirmation DC power source 72 including an ammeter 73 and a variable DC power source 74 shown in FIG. 7 is provided.

That is, the minus side of the variable DC power supply 74 is connected to the ground and is also connected to the signal monitor line 5d through the coil 56, and the plus side is connected to the signal force line 5b through the ammeter 73 and the coil 55. It is connected.

As described above, in this embodiment, since the DC power source 72 for contact confirmation is connected to the RF probe head 200,
The contact between the metal needle 4b of the signal force wire 5b and the needle portion 4d of the signal monitor wire 5d and the pad 10b of the DUT 10 can be electrically confirmed without visual inspection, and like the third embodiment, There is an effect that the electrical connection between the probe head and the object to be measured can be ensured and the RF characteristic can be accurately measured.

Example 5. FIG. 9 shows an RF probe head according to a fifth embodiment of the present invention and an RF signal and DC
A circuit configuration for supplying a voltage is shown. In the circuit configuration of this embodiment, in addition to the circuit configuration of the first embodiment, the contact confirmation DC power source 72 of the third embodiment and the measurement DC power source 25 are provided.
A switch 95 for switching between and is provided. Here, the voltmeter 27 of the measurement DC power supply 25 and the contact confirmation D
The ammeter 73 of the C power source 72 has a changeover switch 9
It is connected to the ground monitor lines 3d and 3e via 5.

Next, the function and effect will be described. First, the switch 95 is switched so that the contact confirmation DC power supply 72 and the ground monitor lines 3d and 3e are connected to each other, and the contact confirmation DC power supply 72 is connected.
The probe head 100 is applied to the object to be measured while a DC voltage is applied from the power source 72 to the ground monitor lines 3d and 3e. At this time, the ammeter 73 of the contact confirmation DC power source 72
Depending on the current value shown by, the metal needle 2 of the ground lines 3a, 3c
a, 2c and the pads 10a, 10c of the object to be measured 10 can be electrically confirmed, and if this contact is incomplete, the probe head 100 is operated to operate the metal needle and the pad. Correct the contact state of.

After that, the switch 95 is switched so that the ground monitor lines 3d and 3e are connected to the measuring DC power source 25, and the characteristic is measured.

As described above, in this embodiment, the DC power source connected to the ground monitor lines 3d and 3e of the RF probe head is connected to the contact confirmation DC power source 72 by the electric switch 95.
And the DC power supply 25 for characteristic measurement are switched, so that the metal needle of the RF probe head and the metal pad of the object to be measured can be reliably contacted, and the characteristic applied to the object to be measured. The DC voltage for measurement can be set accurately, and the RF characteristics of the DUT 10 can be measured accurately.

Example 6. FIG. 10 shows an RF probe head according to a sixth embodiment of the present invention and an RF signal and D
A circuit configuration for supplying a C voltage is shown. The circuit configuration of this embodiment is similar to the circuit configuration of the second embodiment shown in FIG.
Contact confirmation DC power source 72 of the embodiment, and DC for measurement and this
First and second switches 9 for switching between the power supply device 57
It is equipped with 6,97. Here, the ammeter 58 of the measurement DC power supply 57 and the ammeter 73 of the contact confirmation DC power supply 72 are connected to the signal force line 5b via the second changeover switch 97, respectively, and the voltage of the measurement DC power supply 57 is increased. The minus side of the variable DC power source of the total 60 and the contact confirmation DC power source 72 are connected to the signal monitor line 5d via the first changeover switch 96, respectively.

Also in the RF probe head and its peripheral circuit having such a configuration, the DC power sources connected to the signal force line 5b and the signal monitor line 5d are connected to the first and second circuits as in the fifth embodiment. Changeover switch 96, 97
The contact confirmation DC power source 72 and the measurement DC power source 57 are switched to each other, so that the metal needle of the RF probe head and the metal pad of the object to be measured can be reliably contacted and the object to be measured can be measured. DC for characteristic measurement applied to objects
The voltage can be set accurately and the RF of the DUT 10 can be set.
The characteristic measurement can be made accurate.

In the fifth and sixth embodiments, different DC power supplies are provided for contact confirmation and characteristic measurement, respectively, and a circuit configuration in which switching is possible by switches is shown. One DC power supply may be used as the contact confirmation and measurement DC power supplies.

[0063]

As described above, according to the RF probe head of the present invention, the transmission line is formed together with the central signal line, the ground lines on both sides of the signal line are provided, or the ground line and the substrate are provided. Since a high impedance is formed so as to face each other with a pinch between them, a variable DC power supply, an ammeter, and a voltmeter are provided between the signal line and the high impedance line, and a DC signal for characteristic measurement is generated. R of measurement frequency by connecting DC power supply for
It is possible to monitor only the applied voltage to the DUT without removing the parasitic resistance voltage drop caused by the contact between the DUT and the RF probe head without affecting the F characteristic. It is possible to adjust the applied voltage to the device to a desired value accurately, and it is possible to accurately measure the characteristics of the object to be measured.

A variable DC power source and an ammeter are provided between the signal line and the high impedance line, and a DC power source for contact confirmation for confirming the contact state between each line and the metal pad is connected. As a result, there is an effect that the connection between the object to be measured and the RF probe head can be electrically and reliably detected.

Further, by providing a changeover switch for connecting either the measurement DC power supply or the contact confirmation DC power supply between the signal line and the high impedance line by switching between the both DC power supplies, There is also an effect that the connection between the object to be measured and the RF probe head can be reliably detected electrically, and a DC voltage for measuring the characteristic can be applied to the object to be measured without adversely affecting the RF characteristic measurement. .

According to the RF probe head of the present invention, the transmission lines are formed together with the ground lines on both sides, and the signal lines between the ground lines are in contact with the same electrode pads separated by the slits. Since the first and second signal lines having the metal needle on one end side are provided, the DC power source for measurement should be connected via the coil between the first and second signal lines and the ground line. Thus, similarly to the above, the voltage applied to the object to be measured can be appropriately adjusted to a desired value and the characteristics of the object to be measured can be accurately measured.

According to the RF probe head of the present invention, in addition to the first signal line between the two ground lines, which constitutes a transmission line together with the ground lines on both sides, the signal line is opposed to this signal line via the substrate. And a metal needle that contacts the same electrode pad as the metal needle of the signal line.
Since the signal line of 1 is provided, there is an effect that the characteristics of the object to be measured can be accurately measured, as in the above.

Further, by connecting the DC power supply for contact confirmation through the coil between the first and second signal lines and the ground line, the connection between the DUT and the RF probe head is electrically connected. There is also an effect that can be reliably detected.

Furthermore, by providing the changeover switch in addition to the DC power supply for measurement and the DC power supply for contact confirmation, the connection between the object to be measured and the RF probe head can be electrically and reliably detected and the RF characteristics can be improved. There is also an effect that a DC voltage for characteristic measurement can be applied to the object to be measured without adversely affecting the measurement.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of an RF probe head according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

FIG. 3 is a perspective view showing a modification of the RF probe head of the first embodiment.

FIG. 4 is a perspective view showing a configuration of an RF probe head according to a second embodiment of the present invention.

FIG. 5 is a diagram showing a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head according to the second embodiment.

FIG. 6 is a perspective view showing a modification of the RF probe head according to the second embodiment.

FIG. 7 is a circuit diagram showing an RF probe head according to a third embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

FIG. 8 is a circuit diagram showing an RF probe head according to a fourth embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

FIG. 9 is a circuit diagram showing an RF probe head according to a fifth embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

FIG. 10 is a circuit diagram showing an RF probe head and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head according to a sixth embodiment of the present invention.

FIG. 11 is a perspective view showing a configuration of a conventional RF probe head.

FIG. 12 is a circuit diagram showing a conventional RF probe head and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

[Explanation of symbols]

1 probe head substrate 2a-2e, 4d, 4e metal needle 3a, 3c ground line 3b signal line 3d, 3e ground monitor line 5b signal force line 5d signal monitor line 10 object to be measured 10a-10c metal pad 14 metal needle 15 signal monitor Line 21,81 RF signal measuring device 22,52,82 Bias tee 23,53,54,83 Capacitor 24,29,55,56,84 Coil 25,57,88 DC power supply for measurement 26,58,73,86 Current Total 27,60,85 Voltmeter 28,59,74,87 Variable DC power supply 30,61,90 Internal resistance 31,32 External resistance 72 DC power for contact confirmation 95-97 Changeover switch 100,100a, 200,200a, 400 Probe head

[Procedure amendment]

[Submission date] August 5, 1994

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction content]

[Document name] Statement

Title of the invention RF probe head

[Claims]

7. The RF probe head according to claim 6 Symbol mounting, it is connected via a capacitor between the first and second signal lines and the ground line, the measurement for generating an RF signal for characteristics measurement And a variable DC power supply, an ammeter, and a voltmeter, which are respectively connected between the first signal line and the second signal line via coils, and have a DC signal for characteristic measurement. DC
An RF probe head having a power supply.

8. The RF probe head according to claim 6 Symbol mounting, is connected between the first signal line and second signal line,
An RF probe head comprising a variable DC power supply and an ammeter, and a contact confirmation DC power supply for confirming a contact state between each signal line and a metal pad.

9. The RF probe head according to claim 6 Symbol mounting, it is connected via a capacitor between the first and second signal lines and the ground line, measuring device for generating an RF signal for characteristics measurement And a variable DC power supply, an ammeter, and a voltmeter, and a measurement DC power supply that generates a DC signal for characteristic measurement, and a variable DC power supply and an ammeter, and the contact state between each line and the metal pad. The DC power supply for contact confirmation for confirming the above, and either the DC power supply for measurement or the DC power supply for contact confirmation, through the coil between the first and second signal lines and the ground line. An RF probe head, comprising: a changeover switch for connecting and switching between DC power supplies.

Formed to 10. on a substrate, a signal line that Yusuke <br/> metal needle at one end, are formed on both sides of the signal line on the substrate, grounding the respective one end with a metal needle An RF probe head for connecting the object to be measured to the characteristic measuring device by bringing the metal needles of the signal line and the ground line into contact with the corresponding electrode pads of the object to be measured, the signal line and the substrate An RF probe head, comprising: a high impedance metal line having metal needles that are formed to face each other with a metal needle that contacts the same electrode pad as the metal needle of the signal line.

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an RF probe head, and more particularly to a structure of a signal transmission line for supplying a measurement signal to an object to be measured such as a semiconductor integrated circuit.

[0002]

2. Description of the Related Art FIG. 11 is a diagram for explaining an example of a conventional RF probe head, FIG. 11 (a) is a perspective view showing the RF probe head as an object to be measured, and FIG. RF
It is a perspective view which shows the transmission line of a probe head. In the figure, 400 is an RF probe head, 1 is a substrate made of such as ceramics, and a signal line 3b and ground lines 3a, 3c made of a metal film or the like are provided on the back side thereof. Reference numerals 2a, 2b, 2c are metal needles formed on one end side of the respective lines 3a, 3b, 3c, and the metal needles 2a, 2b, 2c are used as the corresponding metal pads 10a, 10b, 10c of the DUT 10. The object to be measured 10 and the RF probe head 400 are electrically connected to each other.

FIG. 12 is a diagram showing a circuit configuration for applying a high frequency signal and a DC voltage to a conventional RF probe head. In the figure, the same reference numerals as those in FIG. 11 indicate the same or corresponding portions, 82 is a bias tee composed of a capacitor 83 and a coil 84, 81 is an RF signal measuring device connected between the bias tee 82 and the ground, 88 Is connected between the bias tee 82 and the ground, and drives D under test.
C power supply, variable DC power supply 87, ammeter 86 and voltmeter 8
Have five. Here, the RF probe head 400
The signal line 3b and the ground lines 3a and 3c are connected to the RF measuring device, the DC power source, and the ground by a coaxial cable (not shown). Note that 90 is the internal resistance of the power supply 88,
Reference numerals 31 and 32 are parasitic resistances such as a resistance component of the cable and a contact resistance of a metal needle.

Next, the operation will be described. When the metal needles 2a, 2b, 2c of the RF probe head are in contact with the metal pads 10a, 10b, 10c of the DUT 10, R
RF signal from F signal measuring instrument 81, D from DC power source 88
The C voltage is applied to the RF probe head 400. Then, the DC voltage and the RF signal drive the transistor or the like of the DUT, and the RF characteristic of the DUT can be measured by the RF signal measuring device 81.

[0005]

However, the conventional RF
The probe head is configured as described above, and the contact or connection between the object to be measured and the RF probe head was visually confirmed when measuring the object to be measured such as a semiconductor integrated circuit. Therefore, there is a problem that the electrical connection between the object to be measured and the RF probe head cannot be reliably recognized.

Further, it is possible to remove the resistance component of the cable connecting the RF measuring device or the DC power source and the RF probe head, and the parasitic resistances 31 and 32 caused by the contact or connection between the DUT and the needle of the RF probe head. However, due to the effect of the voltage drop due to these resistances, there is a problem in that the RF characteristics of the device under test cannot be accurately measured during normal operation.

The present invention has been made in order to solve the above problems, and it is possible to electrically and reliably detect the connection between the object to be measured and the RF probe head, and to adversely affect the RF characteristic measurement. It is an object of the present invention to provide an RF probe head that can apply a DC voltage for characteristic measurement to an object to be measured.

[0008]

In the RF probe head according to the present invention, in addition to a signal line having a metal needle on one end side and a ground line having a metal needle on one end side on both sides of the signal line, the above-mentioned both grounds are provided. A high impedance line having a metal needle that is formed outside the line along each ground line and contacts the same electrode pad as the metal needle of the adjacent ground line is provided.

An RF probe head according to the present invention includes a signal line formed on a substrate and having a metal needle on one end side,
In addition to the ground line formed on both sides of the signal line of the substrate and having a metal needle on one end side, the same as the metal needle of the ground line which is formed so as to face each of the ground lines through the substrate and is opposed to each other. It is provided with a high impedance line having a metal needle that contacts the electrode pad.

In the RF probe head according to the present invention, a measuring instrument connected between the ground line and the signal line via a capacitor to generate an RF signal for characteristic measurement, the signal line and the high impedance line. And a variable DC power supply, an ammeter and a voltmeter, and a measurement DC power supply for generating a DC signal for characteristic measurement.

According to the present invention, in the RF probe head, a variable DC power source and an ammeter are connected between the signal line and the high impedance line, and the contact state between each line and the metal pad is confirmed. Contact confirmation DC
It is equipped with a power supply.

In the RF probe head according to the present invention, a measuring instrument connected between the ground line and the signal line via a capacitor to generate an RF signal for measuring a characteristic, a variable DC power source, an ammeter and a voltage. A DC power supply for measurement, which has a DC meter for generating a DC signal for characteristic measurement, a variable DC power supply and an ammeter, and a DC power supply for contact confirmation for confirming a contact state between each of the lines and the metal pad. And a changeover switch for connecting either the measurement DC power supply or the contact confirmation DC power supply by switching between the signal line and the high impedance line between the two DC power supplies.

The RF probe head according to the present invention has first and second signal lines which are separated by slits and have metal needles at one end which are in contact with the same electrode pad, and are formed on both sides of these signal lines. And a ground line having a metal needle on one end side.

In the RF probe head according to the present invention, the RF probe head is connected between the first and second signal lines and the ground line, and RF for characteristic measurement is provided via a capacitor.
A DC generator for measuring characteristics, which is connected between the measuring device for generating a signal and the first signal line and the second signal line via coils, and has a variable DC power supply, an ammeter and a voltmeter.
And a measuring DC power source for generating a signal.

According to the present invention, in the RF probe head, a variable DC power source and an ammeter are connected between the first signal line and the second signal line, and the signal lines and the metal pads are in contact with each other. D for contact confirmation to confirm the state
It is equipped with a C power supply.

According to the present invention, in the above-mentioned RF probe head, a measuring device that is connected between the first and second signal lines and the ground line via a capacitor and generates an RF signal for characteristic measurement, and a variable DC In order to confirm the contact state between each line and the metal pad, which has a power supply, an ammeter, and a voltmeter, and has a measurement DC power supply that generates a DC signal for characteristic measurement, a variable DC power supply, and an ammeter. Of the contact confirmation DC power supply, and either the measurement DC power supply or the contact confirmation DC power supply is switched between these power supplies, and a coil is provided between the first and second signal lines and the ground line. And a changeover switch connected via the switch.

The RF probe head according to the present invention is formed on a substrate, a signal line that have a metal needle at one end,
In addition to a ground line formed on both sides of the signal line on the board and having a metal needle on one end side, respectively, the signal line is formed to face the signal line through the board, and is the same as the metal needle of the signal line. A high edge with a metal needle that contacts the electrode pad.
It is equipped with an impedance metal track .

The present invention relates to the above RF probe head.
Connected between the signal line and the ground line,
RF signal for characteristic measurement is generated through the capacitor
Measuring instrument, above signal line and high impedance metal line
Variable DC power
Power source, ammeter and voltmeter, and DC signal for characteristic measurement
It is provided with a DC power supply for measurement that is generated.

The present invention relates to the above RF probe head.
Between the signal line and high impedance metal line
Connected, with variable DC power supply and ammeter, above signal line
Between high-impedance metal lines and metal pads with metal lines
Equipped with a DC power supply for contact confirmation to confirm the state
Is.

The present invention provides the above RF probe head.
Through a capacitor between the signal line and the ground line.
Measuring instrument that is connected to the circuit and generates an RF signal for characteristic measurement
With a variable DC power supply, ammeter and voltmeter, and characteristic measurement
DC power supply for measurement, which generates DC signal for
It has a source and an ammeter, and contacts each of the above lines with the metal pad.
DC power for contact confirmation to confirm the state and the above measurement
DC power supply for contact and DC power for contact confirmation
Switch between these power supplies to connect the signal line and high impedance
Connect a coil between the metal line and the ground line.
And a changeover switch for switching.

[0021]

In the present invention, since the transmission line is formed with the central signal line, the high impedance line is formed along each ground line on both sides of the signal line or so as to face each ground line with the substrate interposed therebetween. By connecting a measuring DC power source that generates a DC signal for characteristic measurement, which has a variable DC power source, an ammeter and a voltmeter, between the signal line and the high impedance line, the R of the measuring frequency can be increased.
It is possible to monitor only the voltage applied to the object to be measured, without removing the voltage drop of the parasitic resistance due to the contact between the object to be measured and the RF probe head without affecting the F characteristic. As a result, the applied voltage to the object to be measured can be accurately adjusted to a desired value, and the characteristics of the object to be measured can be accurately measured.

Further, a variable DC power source and an ammeter are provided between the signal line and the high impedance line, and a DC power source for contact confirmation for confirming a contact state between each line and the metal pad is connected. As a result, the connection between the object to be measured and the RF probe head can be reliably detected electrically.

Further, by providing a changeover switch for connecting either the measurement DC power supply or the contact confirmation DC power supply between the signal line and the high impedance line by switching between the both DC power supplies, The connection between the measurement object and the RF probe head can be reliably detected electrically, and a DC voltage for the characteristic measurement can be applied to the measurement object without adversely affecting the RF characteristic measurement.

According to the present invention, the transmission line is constructed with the ground lines on both sides. As the signal line between the two ground lines, the metal needles, which are separated by the slits and are in contact with the same electrode pad, are provided on one end side. Have first, second
Since the above-mentioned signal line is provided, the DC power source for measurement is connected via the coil between the first and second signal lines and the ground line, and in the same manner as described above, the measurement object is connected to the object to be measured. It becomes possible to adjust the applied voltage of
The characteristics of the measured object can be accurately measured.

Further, by connecting the DC power supply for contact confirmation through a coil between the first and second signal lines and the ground line, the connection between the DUT and the RF probe head is electrically connected. Can be reliably detected.

[0026] In the present invention, constitutes a transmission line with both sides of the ground line, in addition to the signal line between the both ground lines, is formed so as to face each other via the signal line and the substrate, the signal line Since the high-impedance signal line having the metal needle that is in contact with the same electrode pad as the above-mentioned metal needle is provided, the characteristics of the object to be measured can be accurately measured as in the above.

The signal line and high impedance gold
The above contact confirmation is made through a coil between the main line and the ground line.
By connecting a DC power supply for approval, the DUT and RF
The connection with the lobe head can be reliably detected electrically.

Further, by providing the changeover switch in addition to the measurement DC power supply and the contact confirmation DC power supply, the connection between the object to be measured and the RF probe head can be electrically and reliably detected, and the RF characteristics can be detected. A DC voltage for characteristic measurement can be applied to the DUT without adversely affecting the measurement.

[0029]

EXAMPLES Example 1. FIG. 1 is a view for explaining an RF probe head according to a first embodiment of the present invention, and FIG. 1 (a) is a perspective view showing the RF probe head together with an object to be measured,
FIG. 1B is a perspective view showing the structure of the transmission line of the RF probe head. In the figure, 100 is R of this embodiment.
It is an F probe head, and the same symbols as those in FIG.
The same thing as the F probe head 400 is shown. In the RF probe head 100 of the present embodiment, a predetermined width, thickness, and length formed of a high-impedance metal film are provided outside the both ground lines 3a and 3c at a predetermined interval and in parallel with them. Ground monitor lines 3d, 3
e are provided respectively. In addition, each of the above lines 3d, 3
Metal needles 2d and 2e are respectively formed at one end of e, and the metal needle 2d together with the metal needle 2a is the object to be measured 1
No. 0 metal pad 10a, the metal needle 2e is the metal needle 2c
At the same time, the metal pad 10c of the object to be measured 10 is brought into contact therewith.

FIG. 2 shows the RF probe head 100 with an R
It is a figure which shows the circuit structure which supplies F signal and DC power supply. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions, and 22 is a bias tee composed of a capacitor 23 and a coil 24, and the connection point between the capacitor and the coil is connected to the signal line 3b. Reference numeral 21 is a characteristic measuring device for applying an RF signal to the RF probe head 100.
One end thereof is connected to ground and the other end is connected to the signal line 3b via the capacitor 23. Further, reference numeral 25 is a measuring DC power source having a variable DC power source 28, an ammeter 26, and a voltmeter 27. The minus side of the variable DC power source 28 is connected to the ground, and the plus side of the variable DC power source 28 is the ammeter 26 and the internal resistance 3.
It is connected to the coil 24 of the bias tee 22 through 0. The connection point between the ammeter 26 and the internal resistance 30 is connected to the ground monitor lines 3d and 3e via a voltmeter 27 and a coil 29. Here, the RF
A coaxial cable is used to connect the probe head 100 to the measuring DC power supply 25 and the characteristic measuring instrument 21. Further, 31 and 32 are external resistances such as resistance components of cables and contact resistances of metal needles, and the ground lines 3a and 3c of the RF probe head 100 are grounded via these resistances 31 and 32.

Next, the operation will be described. In a state where the metal needles 2a to 2e of the RF probe head are in contact with the corresponding metal pads 10a to 10c of the DUT 10, the RF signal and the DC power source are supplied from the characteristic measuring instrument 21 and the measurement DC power source 25, respectively. Apply to. Then, the RF signal is transmitted to the line 3a of the RF probe head 100.
3c are propagated through an RF transmission line having a predetermined impedance and supplied to the DUT 10. At this time, since the ground monitor lines 3d and 3e have high impedance, they do not affect the propagation of the RF signal.

Further, the DC voltage is applied to the object to be measured through the signal line 3b to drive the transistor etc. of the object to be measured. At this time, the DC current for measuring the characteristic flows through the path composed of the signal line 3b, the DUT 10, and the ground lines 3a and 3c.

At this time, the voltmeter 27 of the measurement DC power supply 25 connected to the ground monitor lines 3d and 3e is provided with a voltage drop in the parasitic resistances 31 and 32 of the ground lines 3a and 3c. The driving voltage of the device under test 10, which is not included, is monitored as it is.

Therefore, by adjusting the voltage of the variable DC power supply 28 so that the display voltage of the voltmeter 27 becomes a predetermined value, the RF characteristic is measured when the DUT 10 is driven at the predetermined drive voltage. Is possible.

As described above, in this embodiment, the RF probe head is added to the signal line 3b and the ground lines 3a and 3c arranged on both sides thereof, and in addition to the high impedance in parallel to the outside of the ground lines 3a and 3c. Ground monitor wire 3
Since the structure has d and 3e, only the voltage drop due to the DUT 10 in the state where the DC voltage is applied to the DUT 10 through the signal line 3b and the ground lines 3a and 3c is used. And ground monitor lines 3d, 3
It can be monitored via e.

That is, the voltage applied to the DUT 10 can be accurately monitored without including the voltage drop due to the parasitic resistances 31 and 32 of the circuit for applying the DC voltage to the DUT 10. . As a result, the DC voltage for measuring the characteristic applied to the DUT 10 can be accurately set,
The RF characteristics of the DUT 10 can be measured accurately.

Since the ground monitor lines 3d and 3e are made of a high impedance metal film, the monitor lines do not adversely affect the propagation of RF signals.

In the above embodiment, the ground monitor lines 3d and 3e are arranged on the surface of the substrate on which the ground lines 3a and 3b are arranged. However, the ground monitor lines are the ground lines of the substrate. It may be arranged on the surface opposite to the surface on which 3a and 3c are arranged.

FIG. 3 shows an RF probe head having such a configuration. In this RF probe head 100a, the ground monitor lines 13d and 13e are on the side of the substrate 1 opposite to the surface on which the ground lines 3a and 3c are arranged. On the plane of
It is arranged in a portion facing the ground lines 3a and 3c.

Further, the ground monitor lines 13d, 13
The metal needles 12d, 12e on one end side of e are provided so as not to be short-circuited with the metal needles 2a, 2c of the ground lines 3a, 3c at the end of the substrate and to be able to come into contact with the same pad as these metal needles. There is.

The RF probe head 10 having such a configuration
0a has an effect that the area for disposing the ground monitor lines 13d and 13e can be reduced and the probe head can be downsized.

Example 2. FIG. 4 is a view for explaining an RF probe head according to a second embodiment of the present invention,
4A is a perspective view showing the RF probe head together with the object to be measured, and FIG. 4B is a perspective view showing the structure of the transmission line of the RF probe head. In the figure, reference numeral 200 denotes the RF probe head of this embodiment.
In 00, the signal force line 5b and the signal monitor line 5d separated by the slit 6 are provided instead of the signal line 3b in the conventional RF probe head 400, and the other points are the conventional RF probe head 400.
Is the same as In addition, 4b and 4d are metal needles formed on one end side of the signal force wire 5b and the signal monitor wire 5d, respectively, and these metal needles 4b and 4d both contact the metal pad 10b of the DUT 10. Has become.

FIG. 5 is a diagram showing a circuit configuration for supplying an RF signal and a DC power source to the RF probe head 200 of the second embodiment. In the figure, the same reference numerals as those in FIG. 12 indicate the same or corresponding parts, and 52 is a bias tee composed of first and second capacitors 53 and 54 and first and second coils 55 and 56, and a first capacitor. The connection point between 53 and the first coil 55 is connected to the signal force line 5b, the connection point between the second capacitor 54 and the second coil 56 is connected to the signal sense line 5d, and one end is grounded. The other end of the measuring instrument 21 has the above-mentioned first and second capacitors 5
It is connected to 3, 54 connection points. Reference numeral 57 is a measuring DC power supply having a variable DC power supply 59, an ammeter 58, and a voltmeter 60. The minus side of the variable DC power supply 59 is connected to the ground, and the plus side is the ammeter 58 and the internal resistance 6
1 is connected to the first coil 55 of the bias tee 52, and the voltmeter 60 is connected to the second coil and the negative side of the variable DC power supply 59.
Here, the signal force line 5b and the signal monitor line 5d separated by the slit 6 are open for a DC voltage and short-circuited for an RF signal.

Next, the operation will be described. The metal needles 2a, 2c, 4d, and 4e of the RF probe head are attached to the DUT 10.
While in contact with the corresponding metal pads 10a to 10c, the RF signal and the DC power source are applied to the RF probe head 200 from the characteristic measuring instrument 21 and the measuring DC power source 57, respectively. Then, the RF signal is transmitted to the RF probe head 20.
0 through the RF transmission line having a predetermined impedance composed of the lines 3a, 3c, 5b and 5d
Supplied to zero. In the propagation of the RF signal, the signal force line 5b and the signal monitor line 5d have exactly the same functions as one signal line.

The DC voltage is the signal force line 5b.
After that, the voltage is applied to the DUT 10 to drive the transistor or the like of the DUT. At this time, the DC current for the characteristic measurement is the signal force line 5b, the DUT 10, and the ground line 3.
It flows through the route consisting of a and 3b.

At this time, the voltmeter 60 of the measurement DC power source 57 connected to the signal sense line 5d does not include the voltage drop in the parasitic resistances 31 and 32 of the ground lines 3a and 3c. The drive voltage of the DUT 10 is directly monitored.

Therefore, by adjusting the voltage of the variable DC power supply 59 so that the monitored voltage becomes a predetermined value, it is possible to measure the RF characteristic when the device under test 10 is driven by the predetermined driving voltage. Becomes

As described above, in this embodiment, the RF probe head has a structure having the signal force line 5b and the signal monitor line 5d separated by the slit 6 as the signal line, and therefore the signal force line 5b and the ground line are provided. Only the voltage drop due to the DUT 10 in the state where the DC voltage is applied to the DUT 10 via 3a and 3c can be monitored via the signal force line 5b and the signal monitor line 5d.

That is, the voltage applied to the DUT 10 can be accurately monitored without including the voltage drop due to the parasitic resistances 31 and 32 of the circuit for applying the DC voltage to the DUT 10. . As a result, the DC voltage for measuring the characteristic applied to the DUT 10 can be accurately set,
The RF characteristics of the DUT 10 can be measured accurately.

For the RF signal, the signal monitor line 5d and the signal force line 5b act as one signal line, so that the signal monitor line 5d does not adversely affect the propagation of the RF signal.

In the second embodiment described above, the signal force line 5b and the signal monitor line 5 are used as the signal lines.
Although d is separated by a slit and arranged on the same surface of the substrate of the RF probe head, the signal monitor line 5d is arranged on the surface of the substrate opposite to the surface on which the ground lines 3a and 3c are arranged. Good.

FIG. 6 shows an RF probe head having such a configuration. In this RF probe head 200a, the signal force line 5b is arranged at a position equidistant from the ground lines 3a and 3c, and The signal monitor line 15 is on the surface of the substrate 1 opposite to the surface on which the ground lines 3a and 3c are arranged, and the signal force line 5b.
It is located in the part facing.

The needle tip 14 on one end side of the signal monitor wire 15 is at the end of the substrate 1 and the signal force wire 5b.
The metal needle 4b is not short-circuited, and the metal needle 4b and the pad 10b can be brought into contact with each other. here,
The signal monitor line 15 adversely affects the RF signal measurement.
Do not use a high impedance metal film to prevent
I will Furthermore, in this RF probe head 200a
The circuit to be connected is the signal in the circuit shown in FIG.
To prevent RF signal from flowing through the monitor line 15,
Circuit in which Nita wire 15 and RF signal measuring instrument are not connected
The configuration.

The RF probe head 20 having such a configuration
In 0a, it can reduce the area for disposing the signal monitor line 1 5, there is a small as possible the effect of the probe head.

Example 3. FIG. 7 shows an RF probe head according to a third embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC power to the RF probe head. In the figure, the same reference numerals as those in FIG. A contact confirmation DC power supply including a power supply 74 and an ammeter 73. The negative side of the variable DC power supply 74 is connected to ground and the positive side is connected to the ground monitor lines 3d and 3e via the ammeter 73.
The other end of the characteristic measuring instrument 21 whose one end is grounded is connected to the signal line 3b. Here, the contact confirmation DC power source is connected between the ground line and the monitor line as described above because the signal line 3b and the ground monitor lines 3d and 3e are the same as in the first and second embodiments. If a DC power supply for contact confirmation is connected between them, a confirmation current will flow through the element for which characteristic measurement is performed, and this current value will vary depending on the performance of the element, so an appropriate determination cannot be made. For example, when measuring a transistor, a certain amount of current flows between the drain and source even if the metal needle is in half contact, so depending on the element, it may be determined that the metal needle and pad are in complete contact. In addition, since almost no current flows between the gate and the source, it is difficult to confirm whether there is contact or contact failure.

Next, the function and effect will be described. The probe head 100 is applied to the object to be measured while a DC voltage is applied from the contact confirmation DC power source 72 to the ground monitor lines 3d and 3e. Then, the ground monitor lines 3d and 3e
And the metal needles 2d, 2e and 2a of the ground lines 3a, 3c,
When 2c surely contacts the corresponding metal pad 10a of the object to be measured, the ammeter 73 of the power supply device 72 shows a predetermined current value, and the contact between the metal needle and the metal pad is unsuccessful. When it is perfect, the current value indicated by the ammeter 73 does not reach a predetermined value. As a result, the contact between the ground lines 3a and 3c and the corresponding metal pads 10a and 10c can be electrically confirmed without visual inspection, and the electrical connection between the probe head and the object to be measured can be ensured.
The F characteristic measurement can be accurately performed.

Example 4. FIG. 8 shows an RF probe head according to a fourth embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head. The peripheral circuit of the RF probe head of this example has the same circuit configuration as that shown in FIG. Instead of the measurement DC power source 57, a contact confirmation DC power source 72 including an ammeter 73 and a variable DC power source 74 shown in FIG. 7 is provided.

That is, the negative side of the variable DC power supply 74 is connected to the ground and is connected to the signal monitor line 5d via the coil 56, and the positive side is connected to the signal force line 5b via the ammeter 73 and the coil 55. It is connected.

As described above, in this embodiment, since the DC power source 72 for contact confirmation is connected to the RF probe head 200,
The contact between the metal needle 4b of the signal force wire 5b and the needle portion 4d of the signal monitor wire 5d and the pad 10b of the DUT 10 can be electrically confirmed without visual inspection, and like the third embodiment, There is an effect that the electrical connection between the probe head and the object to be measured can be ensured and the RF characteristic can be accurately measured.

Example 5. FIG. 9 shows an RF probe head according to a fifth embodiment of the present invention and an RF signal and DC
A circuit configuration for supplying a voltage is shown. In the circuit configuration of this embodiment, in addition to the circuit configuration of the first embodiment, the contact confirmation DC power source 72 of the third embodiment and the measurement DC power source 25 are provided.
A switch 95 for switching between and is provided. Here, the voltmeter 27 of the measurement DC power supply 25 and the contact confirmation D
The ammeter 73 of the C power source 72 has a changeover switch 9
It is connected to the ground monitor lines 3d and 3e via 5.

Next, the function and effect will be described. First, the switch 95 is switched so that the contact confirmation DC power supply 72 and the ground monitor lines 3d and 3e are connected to each other, and the contact confirmation DC power supply 72 is connected.
The probe head 100 is applied to the object to be measured while a DC voltage is applied from the power source 72 to the ground monitor lines 3d and 3e. At this time, the ammeter 73 of the contact confirmation DC power source 72
Depending on the current value shown by, the metal needle 2 of the ground lines 3a, 3c
a, 2c and the pads 10a, 10c of the object to be measured 10 can be electrically confirmed, and if this contact is incomplete, the probe head 100 is operated to operate the metal needle and the pad. Correct the contact state of.

Thereafter, the switch 95 is switched so that the ground monitor lines 3d and 3e are connected to the measuring DC power source 25, and the characteristic is measured.

As described above, in this embodiment, the DC power source connected to the ground monitor lines 3d and 3e of the RF probe head is connected to the contact confirmation DC power source 72 by the electric switch 95.
And the DC power supply 25 for characteristic measurement are switched, so that the metal needle of the RF probe head and the metal pad of the object to be measured can be reliably contacted, and the characteristic applied to the object to be measured. The DC voltage for measurement can be set accurately, and the RF characteristics of the DUT 10 can be measured accurately.

Example 6. FIG. 10 shows an RF probe head according to a sixth embodiment of the present invention and an RF signal and D
A circuit configuration for supplying a C voltage is shown. The circuit configuration of this embodiment is similar to the circuit configuration of the second embodiment shown in FIG.
Contact confirmation DC power source 72 of the embodiment, and DC for measurement and this
First and second switches 9 for switching between the power supply device 57
It is equipped with 6,97. Here, the ammeter 58 of the measurement DC power supply 57 and the ammeter 73 of the contact confirmation DC power supply 72 are connected to the signal force line 5b via the second changeover switch 97, respectively, and the voltage of the measurement DC power supply 57 is increased. The minus side of the variable DC power source of the total 60 and the contact confirmation DC power source 72 are connected to the signal monitor line 5d via the first changeover switch 96, respectively.

Also in the RF probe head and its peripheral circuit having such a configuration, DC power sources connected to the signal force line 5b and the signal monitor line 5d are connected to the first and second circuits as in the fifth embodiment. Changeover switch 96, 97
The contact confirmation DC power source 72 and the measurement DC power source 57 are switched to each other, so that the metal needle of the RF probe head and the metal pad of the object to be measured can be reliably contacted and the object to be measured can be measured. DC for characteristic measurement applied to objects
The voltage can be set accurately and the RF of the DUT 10 can be set.
The characteristic measurement can be made accurate.

In the fifth and sixth embodiments, different DC power supplies are provided for contact confirmation and characteristic measurement, and a circuit configuration in which the switches can be switched is shown. One DC power supply may be used as the contact confirmation and measurement DC power supplies.

[0067]

As described above, according to the RF probe head of the present invention, the transmission line is formed together with the central signal line, the ground lines on both sides of the signal line are provided, or the ground line and the substrate are provided. Since a high impedance is formed so as to face each other with a pinch between them, a variable DC power supply, an ammeter, and a voltmeter are provided between the signal line and the high impedance line, and a DC signal for characteristic measurement is generated. R of measurement frequency by connecting DC power supply for
It is possible to monitor only the applied voltage to the DUT without removing the parasitic resistance voltage drop caused by the contact between the DUT and the RF probe head without affecting the F characteristic. It is possible to adjust the applied voltage to the device to a desired value accurately, and it is possible to accurately measure the characteristics of the object to be measured.

Further, a variable DC power source and an ammeter are provided between the signal line and the high impedance line, and a DC power source for contact confirmation for confirming a contact state between each line and the metal pad is connected. As a result, there is an effect that the connection between the object to be measured and the RF probe head can be electrically and reliably detected.

Further, by providing a changeover switch for connecting either the measurement DC power supply or the contact confirmation DC power supply between the signal line and the high impedance line by switching between the two DC power supplies, There is also an effect that the connection between the object to be measured and the RF probe head can be reliably detected electrically, and a DC voltage for measuring the characteristic can be applied to the object to be measured without adversely affecting the RF characteristic measurement. .

According to the RF probe head of the present invention, a transmission line is constructed with the ground lines on both sides, and the signal lines between the two ground lines come into contact with the same electrode pad separated by the slit. Since the first and second signal lines having the metal needle on one end side are provided, the DC power source for measurement should be connected via the coil between the first and second signal lines and the ground line. Thus, similarly to the above, the voltage applied to the object to be measured can be appropriately adjusted to a desired value and the characteristics of the object to be measured can be accurately measured.

By connecting the DC power supply for contact confirmation through a coil between the first and second signal lines and the ground line, the connection between the DUT and the RF probe head is electrically connected. There is also an effect that can be reliably detected.

[0072] According to RF probe head according to the present invention, it constitutes a transmission line with both sides of the ground line, in addition to the signal line between the both ground lines, so as to face each other via the signal line and the substrate High impedance having a metal needle formed and in contact with the same electrode pad as the metal needle of the signal line
Since the dance metal line is provided, there is an effect that the characteristics of the object to be measured can be accurately measured as described above.

Further , the signal line and high impedance gold
The above contact confirmation is made through a coil between the main line and the ground line.
By connecting a DC power supply for approval, the DUT and RF
The effect of electrically and reliably detecting the connection with the lobe head
There is also.

Further, by providing the changeover switch in addition to the measurement DC power supply and the contact confirmation DC power supply, the connection between the object to be measured and the RF probe head can be electrically and reliably detected and the RF characteristics can be improved. There is also an effect that a DC voltage for characteristic measurement can be applied to the object to be measured without adversely affecting the measurement.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of an RF probe head according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

FIG. 3 is a perspective view showing a modification of the RF probe head of the first embodiment.

FIG. 4 is a perspective view showing a configuration of an RF probe head according to a second embodiment of the present invention.

FIG. 5 is a diagram showing a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head according to the second embodiment.

FIG. 6 is a perspective view showing a modification of the RF probe head according to the second embodiment.

FIG. 7 is a circuit diagram showing an RF probe head according to a third embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

FIG. 8 is a circuit diagram showing an RF probe head according to a fourth embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

FIG. 9 is a circuit diagram showing an RF probe head according to a fifth embodiment of the present invention and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

FIG. 10 is a circuit diagram showing an RF probe head and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head according to a sixth embodiment of the present invention.

FIG. 11 is a perspective view showing a configuration of a conventional RF probe head.

FIG. 12 is a circuit diagram showing a conventional RF probe head and a circuit configuration for supplying an RF signal and a DC voltage to the RF probe head.

[Description of Reference Signs] 1 probe head substrate 2a to 2e, 4d, 4e metal needle 3a, 3c ground line 3b signal line 3d, 3e ground monitor line 5b signal force line 5d signal monitor line 10 device under test 10a to 10c metal pad 14 Metal needle 15 Signal monitor wire 21,81 RF signal measuring instrument 22, 52, 82 Bias tee 23, 53, 54, 83 Capacitor 24, 29, 55, 56, 84 Coil 25, 57, 88 Measurement DC power supply 26, 58 , 73, 86 Ammeter 27, 60, 85 Voltmeter 28, 59, 74, 87 Variable DC power supply 30, 61, 90 Internal resistance 31, 32 External resistance 72 DC power supply for contact confirmation 95-97 Changeover switch 100, 100a, 200,200a, 400 probe head

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 5

[Correction method] Change

[Correction content]

[Figure 5]

Claims (10)

[Claims] 1. A signal line formed on a substrate and having a metal needle on one end side, and ground lines formed on both sides of the signal line on the substrate, each having a metal needle on one end side, the signal line comprising: An RF probe head for connecting a metal needle of a line and a ground line to a corresponding electrode pad of an object to be measured so as to connect the object to be measured to its characteristic measuring device. An RF probe head comprising a high impedance line having a metal needle formed along the line and contacting the same electrode pad as the metal needle of an adjacent ground line. 2. A signal line that is formed on a substrate and has a metal needle on one end side, and ground lines that are formed on both sides of the signal line on the substrate and that has a metal needle on each one end side. In an RF probe head for connecting a metal needle of a line and a ground line to a corresponding electrode pad of an object to be measured to connect the object to be measured to the characteristic measuring device, the RF probe head is opposed to each of the ground lines through a substrate. Formed,
An RF probe head comprising a high impedance line having a metal needle that contacts the same electrode pad as a metal needle of a ground line that faces each other. 3. The RF probe head according to claim 1, further comprising: a measuring device connected between the ground line and the signal line via a capacitor to generate an RF signal for characteristic measurement; and the signal line. And a high-impedance line, a variable DC power supply, an ammeter and a voltmeter, and a measurement DC power supply for generating a DC signal for characteristic measurement. 4. The RF probe head according to claim 1, wherein the RF probe head is connected between the signal line and the high-impedance line, has a variable DC power source and an ammeter, and connects each line with a metal pad. An RF probe head comprising a contact confirmation DC power supply for confirming a contact state. 5. The RF probe head according to claim 1, further comprising a measuring device connected between the ground line and the signal line via a capacitor to generate an RF signal for characteristic measurement, and a variable DC power supply. , Having a ammeter and a voltmeter, and having a measuring DC power source for generating a DC signal for characteristic measurement, a variable DC power source and an ammeter, for confirming the contact state between each line and the metal pad A DC power supply for contact confirmation, and a changeover switch for switching and connecting either the DC power supply for measurement or the DC power supply for contact confirmation between the signal line and the high impedance line between the DC power sources. An RF probe head characterized in that 6. A signal line formed on a substrate and having a metal needle on one end side, and ground lines formed on both sides of the signal line on the substrate, each having a metal needle on one end side, the signal line comprising: In an RF probe head for connecting a metal needle of a line and a ground line to a corresponding electrode pad of an object to be measured to connect the object to be measured to its characteristic measuring device, the signal lines are separated by a slit and are the same. An RF probe head comprising a first signal line and a second signal line having a metal needle that contacts the electrode pad of FIG. 7. A first signal line formed on a substrate and having a metal needle on one end side, and a ground line formed on both sides of the signal line on the substrate and having a metal needle on each one end side. In an RF probe head for connecting the metal needles of the signal line and the ground line to corresponding electrode pads of the object to be measured and connecting the object to be measured to the characteristic measuring instrument, the signal line and the RF probe head are opposed to each other via a substrate. And a second signal line having a metal needle that contacts the same electrode pad as the metal needle of the signal line.
Probe head. 8. The RF probe head according to claim 6 or 7, wherein the first and second signal lines and the ground line are respectively connected via capacitors to generate an RF signal for characteristic measurement. A measurement device, which is connected between the first signal line and the second signal line via a coil, has a variable DC power supply, an ammeter, and a voltmeter, and generates a DC signal for characteristic measurement. DC for
An RF probe head having a power supply. 9. The RF probe head according to claim 6 or 7, wherein the RF probe head is connected between the first signal line and the second signal line,
An RF probe head comprising a variable DC power supply and an ammeter, and a contact confirmation DC power supply for confirming a contact state between each signal line and a metal pad. 10. The RF probe head according to claim 6, wherein the first and second signal lines and the ground line are connected via a capacitor to generate an RF signal for characteristic measurement. And a variable DC power supply, an ammeter and a voltmeter, and a measuring DC power supply that generates a DC signal for characteristic measurement, and a variable DC power supply and an ammeter. The contact confirmation DC power supply for confirming the state, and any one of the measurement DC power supply and the contact confirmation DC power supply are placed between the first and second signal lines and the ground line via a coil. An RF probe head, comprising: a changeover switch for switching and connecting between both DC power supplies.