JPH06320314A - Hole drilling method - Google Patents

Abstract

PURPOSE:To provide a hole drilling method wherein a hole of desired depth is accurately formed relating to a workpiece member further with no troublesome work required. CONSTITUTION:A spindle motor for rotating a drill is supported relating to a housing through magnetic force. Displacement about a shaft of the spindle motor relating to the housing is detected by a displacement sensor. When the housing is lowered down toward a workpiece member (S1), in the point of time cutting the workpiece member is started by the drill, the spindle motor is displaced about the shaft relating to the housing (S2). From the time this displacement is detected, after moving the housing by desired dimension (S3), the housing is lifted to end cutting work (S4). Since a reference position relating to depth of a hole is set to a position of the housing in the point of time cutting is started by the drill, repeatability relating to the hole depth is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hole drilling method for forming a hole having a desired depth in a work by using a cutting tool such as a drill.

[0002]

2. Description of the Related Art Conventionally, drilling using a drilling machine such as a drilling machine or counterboring has been generally used as drilling.
In this type of hole drilling, the work is placed on the table of the hole drilling machine, and the bottom surface of the work is placed as close as possible to the table, and the top surface of the table or the top surface of the work is used as the reference position for drilling The moving distance of the cutting tool of is set.

The hole drilling method using the position of the upper surface of the table as a reference position means that the tip of the cutting tool reaches a position separated from the upper surface of the table by a distance obtained by subtracting a desired hole depth from the thickness of the work. In addition, it is a method of judging that a hole having a desired depth has been formed and stopping the cutting process. By the way, it is common that the thickness of the work varies among different works, and the thickness of one work is not always uniform, and the work is not always in close contact with the upper surface of the table. Since there is no such work, the position of the upper surface of the work is not constant even for the same kind of work. Therefore, there is a problem that even if the tip position of the cutting tool reaches a position separated from the upper surface of the table by a predetermined distance, a hole having a desired depth is not formed in the work. After all, in order to accurately control the depth of the hole to be machined, the method of setting the position of the upper surface of the table as the reference position is inconvenient.

On the other hand, the hole drilling method in which the position of the upper surface of the work is used as a reference position is the time when the position of the upper surface of the work is measured and the tip of the cutting tool moves from that position by a distance corresponding to the depth of the hole. This is a method of stopping the cutting process with. For example, as in the method described in Japanese Patent Application Laid-Open No. 3-60906 shown in FIG. 36, a master bar 41 having a reference length of a cutting tool is attached to a spindle 42 of a rotating device and moved in the axial direction with respect to the spindle 42. A method of calculating a reference position corresponding to the position of the upper surface of the work by providing a free pressure foot 43 has been considered.

In this method, first, the distance A between the lower end of the master bar 41 and the upper surface of the table 44 at the initial position before the spindle 42 is brought close to the work is measured, and then the work is pressed by the pressure foot 43. By further lowering the spindle 42 in this state, the moving distance B of the spindle 42 from the initial position until the positional relationship between the spindle 42 and the pressure foot 43 in the axial direction of the spindle 42 reaches a predetermined relationship is obtained. After that, if the difference (AB) between the two distances is obtained, the distance C between the upper surface of the work and the master bar 41 can be obtained regardless of whether or not the table 44 and the work are in close contact with each other. As a result, it corresponds to obtaining the position of the upper surface of the work. Thus, if the position corresponding to the position of the upper surface of the work is known, the hole H having a desired depth is cut by cutting the hole H with this position as a reference position as shown in FIG. Can be formed. In FIG. 37, a multilayer wiring board is shown as the work 40, and conductive layers 45 and insulating layers 46 are alternately laminated in a plurality of layers. Further, the holes H are formed so as to straddle between the conductive layers 45.

In the above publication, instead of the master bar 41, a master bar 41 when a cutting tool is attached to a spindle 42 is disclosed.
It also describes a method of correcting the difference in the protruding dimension from the spindle 42 between the cutting tool and the cutting tool.

[0007]

However, in the invention disclosed in Japanese Patent Laid-Open No. 3-60906, it is necessary to accurately measure the distance between the table 44 and the master bar 41, as described above. There is a problem that the work for measuring the distance in advance is required and the work before starting the cutting process is troublesome.

An object of the present invention is to solve the above problems, and to provide a hole drilling method for forming a hole having a desired depth with high precision in a work and requiring no troublesome work. To do.

[0009]

According to a first aspect of the present invention, a housing supporting a rotating device for rotating a cutting tool for drilling is moved in a certain direction to reduce a distance from the work, and The time when cutting becomes possible is detected by the change in the reaction force in the rotation direction of the rotating device that acts on the cutting tool, and the position of the housing at the time when the change in the reaction force is detected is set as the reference position. The cutting process is stopped when the housing moves by a distance corresponding to the depth of the hole.

According to a second aspect of the present invention, the housing supporting the rotating device for rotating the cutting tool for drilling is moved in a fixed direction to reduce the distance from the work, and the work can be cut by the cutting tool. Is detected by the change in reaction force in the direction along the moving direction of the housing that acts on the cutting tool, and the housing position at the time when the change in reaction force is detected is set as the reference position, and the desired hole depth is determined from this reference position. When the housing moves by a distance corresponding to, the cutting process is stopped.

According to a third aspect of the present invention, the work is a multilayer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a housing supporting a rotating device for rotating a cutting tool for drilling is used as the work. Move in a fixed direction to reduce the distance between the cutting tool and the cutting of the conductive layer by the cutting tool is detected by the change of the reaction force in the rotation direction of the rotating device acting on the cutting tool, and the cutting is performed based on the number of times the reaction force has changed. The number of the conductive layers is counted, and the cutting process is stopped when the desired number of conductive layers are cut.

According to a fourth aspect of the present invention, the work is a multilayer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a housing supporting a rotating device for rotating a cutting tool for drilling is used as the work. The distance is reduced in a certain direction, and the cutting of the conductive layer by the cutting tool is detected by the change in the reaction force in the direction along the moving direction of the housing acting on the cutting tool, and based on the number of times the reaction force has changed. It is characterized in that the number of conductive layers cut by the above method is counted, and the cutting process is stopped when the desired number of conductive layers are cut.

According to a fifth aspect of the present invention, in the third or fourth aspect of the present invention, the rotating device is supported by a magnetic levitation device which is supported by the magnetic force of an electromagnet so as to be levitated with respect to the housing in at least the moving direction of the housing. To the electromagnet of the magnetic levitation device so as to move the rotating device in the direction to increase the distance from the work immediately after stopping the movement of the housing when the desired number of conductive layers are cut by the housing. It is characterized in that the cutting process is stopped by rapidly changing the energizing current of.

According to a sixth aspect of the present invention, a housing supporting a rotating device for rotating a cutting tool for drilling via a magnetic levitation device is moved in a certain direction to reduce the distance from the work, and at least the housing is In the moving direction, the rotating device is levitated against the housing by the magnetic force of the electromagnet provided in the magnetic levitation device, and the position of the housing is taken as the reference position when the time when the workpiece can be cut by the cutting tool is detected. The movement of the housing is stopped by, and the cutting process is stopped after moving the rotating device by the magnetic levitation device from the reference position by a distance corresponding to the desired depth of the hole.

According to a seventh aspect of the present invention, in the first to fourth aspects of the invention, the approach to the position where the cutting process is stopped is detected by the amount of movement of the housing or the moving time of the housing, and the position where the cutting process is stopped. It is characterized in that the moving speed of the housing is decelerated when an approach to is detected. According to an eighth aspect of the invention, in the fourth or fifth aspect of the invention, the rotating device supports the housing in such a manner that it is levitated by the magnetic force of the electromagnet so as to allow parallel movement and rotational movement in all directions. It is supported by the housing via a levitation device, and the displacement from a predetermined position specified by the current supplied to the electromagnet is used as an index of the reaction force, and when the displacement exceeds a specified threshold, the conductive layer is cut. It is characterized by making a judgment.

According to a ninth aspect of the invention, in the eighth aspect of the invention, an average value of displacements during a period from the movement start position of the housing to the contact of the cutting tool with the workpiece is obtained, and a threshold value is set based on the obtained average value. It is characterized by making a decision.
According to a tenth aspect of the invention, in the eighth or ninth aspect of the invention, the moving distance or time interval of the housing when the displacement exceeds a threshold value is measured, and a specified distance or a specified time period is elapsed after the displacement exceeds the threshold value. When the displacement exceeds the threshold value after passing, the number of cut conductive layers is counted.

According to the invention of claim 11, in the invention of claim 4 or 5, the angular velocity of the rotating device with respect to the housing in the rotating direction of the rotating device and the moving speed of the rotating device in the direction along the moving direction of the housing. It is characterized in that it is judged that the conductive layer is cut when a prescribed change occurs in at least one of them. According to a twelfth aspect of the present invention, a work is a multilayer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a distance between the work and a housing supporting a rotating device that rotates a cutting tool for drilling holes is increased. Move in a fixed direction, and detect the cutting of the conductive layer by the cutting tool by the change of the reaction force in the rotating direction of the rotating device or the moving direction of the housing that acts on the cutting tool. When the cutting tool reaches the specified depth that is smaller than the distance to the position and is larger than the depth of the target conductive layer one layer before, the reaction force starts to be detected and the reaction force changes. It is characterized by stopping the cutting process.

According to a thirteenth aspect of the present invention, in the twelfth aspect of the present invention, the waste hole is cut at a position different from the processed hole, and the depth of each conductive layer is associated with each conductive layer and registered in the database. It is characterized in that the depth at which the detection of the reaction force is started is determined based on the corresponding depth read from the database by designating the target conductive layer during processing.

According to a fourteenth aspect of the present invention, in the invention of the twelfth aspect, the distance between the first conductive layer and the second conductive layer is detected during drilling, and the depth to the target conductive layer is determined as described above. It is characterized in that it is obtained by multiplying the distance by a predetermined scale factor, and the depth at which the reaction force detection is started is determined based on this depth. According to a fifteenth aspect of the present invention, the work is a multi-layer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a housing supporting a rotating device for rotating a cutting tool for drilling is provided at a distance from the work. One layer of the target conductive layer is sampled by detecting the change of the reaction force in the rotating direction of the rotating device acting on the cutting tool or the moving direction of the housing, which is caused by cutting the conductive layer by moving in a fixed direction. It is characterized in that the subsequent sampling interval is made smaller than the sampling interval until the previous conductive layer is cut, the sampling interval is made smaller, and then the cutting process is stopped when the reaction force changes.

[0020]

According to the method of claim 1, the change in the reaction force in the rotation direction of the rotating device acting on the cutting tool is detected to detect the time when the workpiece can be cut by the cutting tool, and the change in the reaction force is detected. The position of the housing at that time is used as a reference position to form a hole having a predetermined depth. In other words, the position of the housing at the time when the work can be cut by the cutting tool becomes the reference position, so there is no need to measure the dimensions in advance to determine the reference position, and the work by the cutting tool By associating the moving distance of the housing from the time when the cutting becomes possible with the depth of the hole, the depth of the hole is not affected even if the thickness of the work varies.

According to the method of claim 2, the time point at which the cutting tool can cut the work is detected based on the change of the reaction force acting on the cutting tool in the direction along the moving direction of the housing. Since the position of the housing at the time point is used as the reference position, it is not necessary to measure the dimensions in advance in order to determine the reference position, as in the configuration of claim 1, and the variation in the thickness of the work is caused by the depth of the hole. Does not affect

The method of claim 3 is applied when the work is a multi-layer wiring substrate in which a plurality of conductive layers and insulating layers are alternately laminated, and the work in the rotating direction of the rotating device acting on the cutting tool is reversed. By detecting the cutting of the conductive layer by the cutting tool based on the change in force, the number of conductive layers cut is counted, and when the desired number of conductive layers are cut, the cutting process is stopped. Therefore, it is possible to form a hole reaching the intended conductive layer by simply counting the number of cut conductive layers without requiring dimensional control.

The method according to claim 4 is a method applied to the case where a multilayer wiring board is used as a work similarly to the method according to claim 3, wherein the cutting of the conductive layer is performed by a cutting tool in a direction along the moving direction of the housing. The only difference is the point detected by the change in the reaction force acting. Therefore, similar to the method of the third aspect, it is possible to surely form the hole reaching the target conductive layer by not managing the dimension and managing only the number of layers along the conductive layer that is cut.

According to the method of claim 5, immediately after the movement of the housing is stopped at the time when the desired number of conductive layers are cut,
Since the rotating device is rapidly moved in the direction of increasing the distance to the work, it is possible to prevent the rotating device from overshooting due to inertia, and it is possible to improve the accuracy of the depth of the hole. According to the method of claim 6, the housing is stopped at the position where the cutting is started, and thereafter, the magnetic levitation device supporting the rotating device moves the rotating device by the depth of the hole. Therefore, the method is affected by the inertia of the housing. Instead, the processing accuracy of the depth of the hole is increased.

According to the method of claim 7, the moving speed of the housing is decelerated when approaching a target position during cutting, so that it is possible to prevent the rotating device from overshooting due to inertia, and to improve the accuracy of the depth of the hole. Can be increased. The method of claim 8 is a desirable method of detecting a reaction force, and is a method of detecting a displacement of a rotating device supported via a magnetic levitation device from a specified position as a reaction force. If this method is adopted, the reaction force can be easily detected.

According to the method of claim 9, the average value of the displacement in the period from the movement start position of the housing to the contact of the cutting tool with the workpiece is obtained, and the threshold value is determined based on the obtained average value. It is possible to set the threshold value by using the fluctuation amount of the threshold value when the device is operating as an offset value, and to set a good threshold value. The method according to claim 10 measures the moving distance or time interval when the displacement of the rotating device exceeds the threshold value, and determines that the conductive layer is not cut within the range of the specified distance or specified time. The components are less likely to be mistaken for cutting the conductive layer, and the target conductive layer can be reliably reached.

A method according to claim 11 is characterized in that when a prescribed change occurs in at least one of an angular velocity of the rotating device with respect to the housing in a rotating direction of the rotating device and a moving speed of the rotating device in a direction along the moving direction of the housing. It is judged that the conductive layer is cut on
If such a method is adopted, it is not necessary to set the threshold value.

According to a twelfth aspect of the present invention, the cutting tool reaches a specified depth that is smaller than the distance from the specified reference position to the position of the target conductive layer and is larger than the depth one layer before the target conductive layer. The reaction force detection is started from the time when the reaction force is changed, and the cutting process is stopped when the reaction force changes, so the amount of data regarding the reaction force can be limited and the processing of the data is less burdened. Of.

According to a thirteenth aspect of the present invention, the position at which the data regarding the reaction force is started to be determined is determined. The depth at which reaction force detection is started is determined based on the corresponding depth read from the database by registering it in the database in association with the layer and specifying the target conductive layer when drilling holes. It is possible to deal with it easily.

The method of claim 14 is a method of determining a position to start taking in the data on the reaction force, and detecting the distance between the first conductive layer and the second conductive layer during drilling. , The depth to the target conductive layer is obtained by multiplying the above distance by a predetermined magnification, and the depth at which the reaction force is detected is determined based on this depth, so it is possible to process without forming a separate hole. It is possible to determine the depth at which data is captured for each hole to be formed.

According to a fifteenth aspect of the present invention, when the reaction force is sampled and taken in, the sampling interval thereafter is made smaller than the sampling interval until the conductive layer immediately before the target conductive layer is cut, and the sampling is performed. Since the cutting is stopped when the reaction force changes after reducing the interval, it is possible to reduce the amount of data to be taken by increasing the sampling interval for the conductive layer that is not intended, and at the same time for the target conductive layer. Can reduce the sampling interval and detect accurately.

[0032]

Embodiments The hole drilling apparatus used in the following embodiments has a common configuration, and as shown in FIG. The apparatus body 10 is provided with a Z table 13 that moves the housing 12 in a direction orthogonal to the direction.

As shown in FIG. 10, the housing 12 accommodates a spindle motor 2 as a rotating device for rotating a drill 1 which is a cutting tool for drilling. Here, the orthogonal coordinate system is defined by setting the direction in which the housing 12 moves with respect to the apparatus main body 10 (substantially coinciding with the axial direction of the spindle motor 2) as the Z-axis direction and one plane orthogonal to the Z-axis direction as the XY plane. . A disc-shaped support plate 3 a orthogonal to the axial direction of the spindle motor 2 is fixed to the outer peripheral surface of the spindle motor 2 via a motor holder 4. On both sides in the thickness direction of the support plate 3a, electromagnets (3A, 3A, 3A, 3A, 3A, 3A) arranged in a pair along the Z-axis direction are arranged.
Three sets of D), (3B, 3E), and (3C, 3F) are provided apart from each other in the circumferential direction of the spindle motor 2. Each electromagnet 3A, 3B, 3C, 3D, 3E, 3F is a support plate 3a.
The attraction force in the Z-axis direction is applied to the pair of electromagnets (3A, 3D), (3B, 3E), (3C,
The support plate 3a is held at a predetermined position by the antagonistic action during 3F). That is, the electromagnets 3A, 3B, 3C, 3
By adjusting the suction force of D, 3E, 3F, Z of the support plate 3a
The position in the axial direction and the inclination with respect to the Z axis (that is, the amount of rotation around the X axis and the Y axis) can be adjusted. Further, since the spindle motor 2 can be held without coming into contact with other members, the spindle motor 2 can move with almost no frictional force.

On one surface in the thickness direction of the support plate 3a (the lower surface in FIG. 10), movable coils 5a of linear DC actuators (electromagnets) 5A, 5B, 5C are respectively attached to three circumferentially spaced locations via mounting pieces 5c. Are combined. Each of the actuators 5A, 5B and 5C is a so-called voice coil motor, and as shown in FIGS. 11 and 12, the cross section orthogonal to the rotation axis of the spindle motor 2 has a letter shape and has a stator shape. And a tubular movable coil 5a slidably inserted in the center piece of the yoke 5b. The movable coil 5a is formed by winding a coil winding around a rectangular cylindrical coil bobbin made of synthetic resin or the like, and the yoke 5b is provided at an appropriate position so that the inner side surfaces of both leg pieces and the central piece have different polarities. A permanent magnet (not shown) is arranged. For example, permanent magnets may be provided on the inner side surfaces of both leg pieces. Therefore, when the movable coil 5a is energized, a Lorentz force proportional to the energized current is generated to cause the movable coil 5a to move.
Moves in the direction according to the direction of the current. put it here,
The central piece of the yoke 5b is arranged substantially along the tangential direction of the coupling position with the actuators 5A, 5B, 5C in the spindle motor 2. With respect to the radial direction of the rotary shaft of the spindle motor 2, the width of the inner space of the movable coil 5a is set to be larger than the width of the central piece of the yoke 5b. Also, it can move with respect to the yoke 5b. Therefore, each actuator 5A, 5
The position of the spindle motor 2 is controlled by controlling the currents supplied to the B and 5C coils.
The adjustment can be made in the plane orthogonal to the rotation axis of. That is, by the actuators 5A, 5B, and 5C, the spindle motor 2 is translated in the X and Y directions and moved in the Z direction.
It is possible to perform rotational movement around the axis.

By the way, the amount of displacement of the spindle motor 2 in a plane parallel to the XY plane is relative to the detection pieces 6A, 6B and 6C fixed to the support plate 3a at positions corresponding to the actuators 5A, 5B and 5C. Displacement sensor 7 for detecting distance
It is detected by A, 7B and 7C. That is, the displacement sensors 7A, 7B, and 7C are those that optically measure the distances to the detection pieces 6A, 6B, and 6C, or the displacement sensors 7A, 7B, and 6C that are made of metal. 7C
It is possible to use a device that detects a distance based on the magnitude of eddy current loss by applying a high-frequency electric field. On the other hand, the displacement amount of the spindle motor 2 in the Z-axis direction is detected by displacement sensors 7D, 7E, 7F which detect the relative distances to the three circumferential positions of the support plate 3a. The electromagnets 3A, 3B, 3C, 3D, 3E, 3F, the yoke 5b of the actuators 5A, 5B, 5C, the displacement sensors 7A, 7B, 7C, 7D, 7E, 7F are the housing 1
Fixed to 2.

According to the above construction, the electromagnets 3A, 3B,
By controlling the amount of electricity supplied to the coils of 3C, 3D, 3E, and 3F, parallel movement in the Z-axis direction and rotational movement around the X-axis and the Y-axis are possible, and the actuators 5A, 5B, 5
By controlling the amount of electricity supplied to the movable coil 5a of C, the parallel movement in the XY plane and the rotational movement around the Z axis can be performed. That is, the spindle motor 2 includes the electromagnets 3A, 3B, 3 as described above with respect to the housing 12.
C, 3D, 3E, 3F and actuators (that is, electromagnets) 5A, 5B, 5C, etc. are supported via a magnetic levitation device, and translation and rotation in all directions of the three-dimensional space are performed. It is supported to be forgiven. Such position control is performed by using FIG.
Displacement sensors 7A, 7B, 7C, 7D, 7
In the control circuit 20, the electromagnets 3A, 3B, 3C, 3D, 3E,
It suffices to perform feedback control on the amount of electricity supplied to 3F and the actuators 5A, 5B, 5C. In the control circuit 20,
The outputs of the displacement sensors 7A, 7B, 7C, 7D, 7E, 7F are taken in, and the electromagnets 3A, 3B, 3C, 3D, 3
E, 3F and an interface 20a for outputting control amounts to the actuators 5A, 5B, 5C, electromagnets 3A, 3
B, 3C, 3D, 3E, 3F and actuator 5
Amplifying circuit 20b for amplifying the control amount to A, 5B, 5C,
A calculation control unit 20c that generates a control amount based on the output values of the displacement sensors 7A, 7B, 7C, 7D, 7E, and 7F, an input unit 20d that sets a target value of the control amount, and a power supply 20e that supplies power to each unit. , A feed motor 28 provided in the apparatus main body 10 for moving the housing 12 in the Z-axis direction (controlling the forward / backward movement of the housing 12 and the feed speed)
There is provided a driver circuit 20f or the like for driving the drive circuit according to the control amount. The rotation control of the spindle motor 2 is also performed by the control circuit 20. Here, the electromagnets 3A, 3
B, 3C, 3D, 3E, 3F and actuator 5
Since the control amounts for A, 5B, and 5C need to be set in consideration of mutual influences, multivariable matrix operation is required to obtain the control amount. A microcomputer capable of high-speed calculation is used as the control unit 20c. Further, as described above, the spindle motor 2 includes the electromagnets 3A, 3B, 3C, 3D, 3E,
Since it is supported by 3F in a non-contact manner, a noise component is hardly generated during movement, and the displacement sensor 7
Noise components are not mixed in the outputs of A, 7B, 7C, 7D, 7E, and 7F, which also enables accurate position control.

By the way, the actuators 5A, 5B, 5
The driving force F of the movable coil 5a of C is n, the number of turns of the movable coil 5a is I, the current flowing through the movable coil 5a is I, the magnetic flux density of the permanent magnet is B, and the length of the movable coil 5a in the magnetic field is L.
Then, F = n · I · B · L, and the driving force of the movable coil 5a is proportional to the magnitude of the current flowing through the movable coil 5a. Therefore, the movable coil of each actuator 5A, 5B, 5C is The compliance can be adjusted by adjusting the magnitude of the current supplied to 5a. In addition, since the energizing current to each movable coil 5a is proportional to the generated force, the magnitude of the energizing current when the position is held by the feedback control is proportional to the external force, and the change of the external force corresponds to the change of the energizing current. Can be easily detected as.

On the other hand, each electromagnet 3A, 3B, 3C, 3D,
The attraction force F applied to the support plate 3a by 3E, 3F is I, which is the current supplied to the coils of the electromagnets 3A, 3B, 3C, 3D, 3E, 3F, and 3E, 3C, 3D, 3F.
E, 3F and the distance between the support plate 3a are D, electromagnets 3A, 3
If Q is a constant peculiar to the space between B, 3C, 3D, 3E, 3F and the support plate 3a, then F = QI ² / D ² , and if the distance D is made small, a large suction is obtained. Power is gained. When the spindle motor 2 rotates at high speed,
The Coriolis force is generated and the spindle motor 2 tries to precess, but the electromagnets 3A, 3B, 3C, 3D, 3
Since the spindle motor 2 can be firmly fixed by increasing the attraction force of E and 3F, the precession movement can be considerably reduced. Also, the electromagnets 3A, 3B, 3
Compliance can also be adjusted by C, 3D, 3E, 3F, and further, electromagnets 3A, 3B, 3C,
Also in 3D, 3E, and 3F, since there is a correspondence relationship between the energizing current and the generated force, the magnitude of the energizing current when the position of the spindle motor 2 is held by feedback control corresponds to the external force. The change in the external force can be easily detected as the change in the energizing current.

By the way, when the work is cut by using the above-mentioned device, the drill 1 receives a reaction force against the cutting. Due to this reaction force, the spindle motor 2 tends to be displaced with respect to the housing 12 around the Z axis and in the Z axis direction. As described above, the displacement sensors 7A, 7B, 7C,
Since the energizing currents to the electromagnets 3A, 3B, 3C, 3D, 3E, 3F and the actuators 5A, 5B, 5C are feedback-controlled in a direction to reduce the displacement detected by the 7D, 7E, 7F, around the Z axis and The displacement in the Z-axis direction is generated according to the magnitude relation between the restoring force and the reaction force acting by the feedback control. After all, detecting the displacement is equivalent to detecting the reaction force.

Here, a multilayer substrate is used as a work in the following embodiments. The multilayer wiring board has six conductive layers made of a copper foil or a copper film, and an insulating layer made of a synthetic resin laminated between adjacent conductive layers. That is, four conductive layers are provided inside the multilayer wiring board. In this case, the displacement Δθ around the Z axis and the displacement ΔZ in the Z axis direction change as shown in FIG. In FIG. 14, positions corresponding to the conductive layer are indicated by C1 to C6, and a position considered to be a position where cutting is started is indicated by P1. The lower limit position that the drill 1 can reach is B1.
The arrow shown at the bottom of FIG. 14 indicates the movement process of the tip of the drill 1.

As is apparent from FIG. 14, the point P1 when the lower end of the drill 1 comes into contact with the multilayer wiring board and cutting is started.
The displacements Δθ and ΔZ increase, and the displacements Δθ and ΔZ increase during cutting of the conductive layer more than during cutting of the insulating layer. Such an increase in the displacements Δθ and ΔZ is caused by an increase in the cutting resistance of the drill 1, and means that the reaction force acting on the drill 1 increases.

(Example 1) Multilayer wiring board 3 as a work
As shown in FIG. 2, 0 is formed by alternately laminating a conductive layer 31 having a conductive pattern formed of a copper foil or a copper film and an insulating layer 32 formed of a synthetic resin in a plurality of layers. When electrically connecting different conductive layers 31 in this type of multilayer wiring board 30, holes are formed through the conductive layers 31 that are electrically connected to each other, and plating is performed on the inner peripheral surface of the holes. Well-known techniques such as application will be used. Therefore, in the multilayer wiring board 30, it is required to form a hole having a specified depth at a specified position.

In this embodiment, the position of the upper surface of the multilayer wiring board 30 is set as a reference position, and the housing 12 from this reference position is set.
When the amount of movement of the hole reaches a distance corresponding to the depth of the desired hole, it is determined that the hole having the desired depth is formed. That is, when the drilling is started, the multilayer wiring board 30 is placed on the XY table 11, and the XY table 11 is moved so that the center line of the drill 1 is made to correspond to the prescribed position of the multilayer wiring board 30. . Next, FIG.
As shown in (a), the Z table 13 is driven to bring the housing 12 close to the multilayer wiring board 30 (S1 in FIG. 1).

When the lower end of the drill 1 contacts the upper surface of the multi-layer wiring board 30, a frictional force is generated between the drill 1 and the multi-layer wiring board 30, and when the cutting is further started, the cutting resistance increases. The reaction force around the Z-axis due to the force and cutting resistance acts on the drill 1. That is, when such an external force acts, the spindle motor 2 produces a displacement Δθ that rotates about the Z axis with respect to the housing 12 as shown in FIG. 2B, and this displacement Δθ is caused by the displacement sensors 7A, 7B,
7C, the actuator 5A, which returns the spindle motor 2 to the original position through the control circuit 20.
The load currents of 5B and 5C are feedback-controlled. Therefore, as shown in FIG. 3, when the displacement Δθ (or load current) reaches a predetermined threshold value T, whether the lower end of the drill 1 contacts the upper surface of the multilayer wiring board 30 as shown in FIG.
Alternatively, it is determined that cutting has started. In this way, when the lower end of the drill 1 comes into contact with the upper surface of the multilayer wiring board 30 or cutting is started (S2 in FIG. 1), the arithmetic control unit 20
In c, using that position as a reference position, as shown in FIG. 2C, the distance d corresponding to the desired depth of the hole in the housing 12 is d.
Drive the Z table 13 until it descends (S in FIG. 1)
3). When the housing 12 moves from the reference position by the distance d by this operation, the depth of the formed hole is also considered to be d, and as shown in FIG. 2D, the drill 1 is lifted to stop the cutting process. Then, the housing 12 is returned to the position before the start of processing (S4 in FIG. 1).

As described above, the time point when the cutting start (or contact) of the multilayer wiring board 30 is detected is set as the reference position, and the moving distance of the housing 12 from this reference position is set as the depth of the hole. The measurement work is unnecessary, and if the threshold value T is appropriately set, the multilayer wiring board 30 is pressed against the XY table 11 and the multilayer wiring board 30 is moved to the X direction.
It is possible to perform cutting in a state of being in close contact with the upper surface of the Y table 11.

(Embodiment 2) This embodiment shows that the lower end of the drill 1 comes into contact with the upper surface of the multilayer wiring board 30 or the cutting of the multilayer wiring board 30 by the drill 1 is started. As described above, the point detected by the increase in the displacement ΔZ of the spindle motor 2 with respect to the housing 12 in the Z-axis direction (or the change in the load current in the Z-axis direction) is described in the first embodiment.
Is different from. That is, the outputs of the displacement sensors 7D, 7E, 7F or the electromagnets 3A, 3B, 3C, 3D, 3E, 3
Based on the load current of F, it is determined that the lower end of the drill 1 has reached the reference position. Since the other points are the same as those of the first embodiment, the description thereof will be omitted.

(Embodiment 3) This embodiment is a multi-layer wiring board 3
At 0, it is detected that a hole having a depth reaching the desired conductive layer 31 is formed by utilizing the change in cutting resistance caused by the difference in material between the conductive layer 31 and the insulating layer 32. That is, when the multilayer wiring board 30 is cut by the drill 1, the cutting resistance of the conductive layer 31 made of metal becomes larger than that of the insulating layer 32 made of synthetic resin or the like. Therefore, as shown in FIG. The displacement Δθ is also larger when the conductive layer 31 is cut than when the insulating layer 32 is cut.
Here, the displacement Δθ (or cutting resistance) exceeds a predetermined threshold value T because the number of conductive layers 31 that pass through when forming a hole having a desired depth is determined at each position of the multilayer wiring board 30. If the number of times is counted, the conductive layer 3 cut by the drill 1
The number of layers of 1 can be known. Therefore, FIG.
As shown in (a), the Z table 13 is operated to lower the housing 12 (S1 in FIG. 5), and as shown in FIG. 6 (b), the cutting of the multilayer wiring board 30 by the drill 1 is started. At this time, when the displacement Δθ (or cutting resistance) once exceeds the threshold T and then crosses the threshold T (indicated by a black circle in FIG. 7), it can be determined that the conductive layer 31 has been cut (S2 in FIG. 5). ), The number of cut layers of the conductive layer 31 is counted, and P of FIG.
When it is determined that the target conductive layer 31 has been reached as shown in FIG. 6C at the time point 2 (S3 in FIG. 5), the housing 12 is lifted as shown in FIG. 6D to complete the cutting process. (S4 in FIG. 5). Here, the time when the displacement Δθ exceeds the threshold value T may be the position of the conductive layer 31.

As described above, the conductive layer 3 actually cut
Since the number of layers of 1 is counted and the cutting process is terminated when the desired conductive layer 31 is reached, dimensional control regarding the depth of the hole is not necessary, and a hole reaching the desired conductive layer 31 is formed. It is possible to surely achieve the purpose. The other configurations are similar to those of the first embodiment, and thus the description thereof is omitted.

(Embodiment 4) Like Embodiment 3, this embodiment is a method of forming a hole reaching the target conductive layer 31 by counting the number of cut conductive layers 31. The cutting of the conductive layer 31 is detected based on the increase of the displacement ΔZ in the Z-axis direction (or the change of the load current in the Z-axis direction) as shown in FIG. Different from 3. That is, similarly to the second embodiment, the outputs of the displacement sensors 7D, 7E, 7F or the electromagnets 3A, 3F are generated.
Based on the load currents of B, 3C, 3D, 3E and 3F, it is determined whether the conductive layer 31 or the insulating layer 32 is cut. Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

(Fifth Embodiment) By the way, in the third and fourth embodiments, as a procedure for stopping the cutting process, the Z table 13 is lifted when the tip of the drill 1 cuts the desired number of conductive layers 31. I am trying to raise the drill 1. In this case, the Z table 13 stops without decelerating, and then rises, so that the spindle motor 2 supported by the magnetic levitation device with respect to the housing 12 does not rotate.
Even if stops, it will continue to move downward due to inertia.
Further, since the Z table 13 also has inertia, it will move downward after the stop. Ie drill 1
The hole cut by is often deeper than the depth when the Z table 13 is stopped, and the machining depth may vary.

In this embodiment, in order to prevent the machining depth from being excessive due to the inertia of the spindle motor 2 and the Z table 13 and prevent the machining depth from varying, the current supplied to the magnetic levitation device is controlled. The force component in the Z-axis direction for supporting the spindle motor 2 is adjusted. That is, in FIG.
As shown in FIG. 3, when the tip of the drill 1 reaches the target conductive layer 31 by the processing of the Z table 13, the processing of the Z table 13 is stopped, and then the electromagnets 3A, 3B, 3C of the magnetic levitation device, A magnetic force is applied so that the spindle motor 2 is rapidly raised by controlling the currents supplied to the 3D, 3E, and 3F. Specifically, electromagnets 3A, 3B, 3C
The suction power of is rapidly increased. At this time, the spindle motor 2 that moves downward due to inertia receives the upward force due to the magnetic force of the electromagnets 3A, 3B, 3C, 3D, 3E, and 3F, and as shown in FIG. It can be cut to the depth of. Here, the stop line LX shown in FIG. 17 is the electromagnets 3A, 3B, 3
This is the position of the spindle motor 2 when the energizing currents to C, 3D, 3E and 3F are not controlled.

The above operation is summarized as shown in FIG. 15. First, as shown in FIG.
Is lowered (S1), and when it is detected that the tip of the drill 1 has reached the target conductive layer 31 (S2), the Z table 13 is stopped without decelerating (S3), and the spindle motor 2 is driven by the magnetic levitation device. Is rapidly increased (S4). In this way, after the Z table 13 is stopped and the spindle motor (floating part) 2 is rapidly raised, the Z table 13
Is raised to return to the original position (S5). By such a procedure, it is possible to prevent the hole from becoming unnecessarily deep, and it is possible to perform accurate hole processing.

(Embodiment 6) This embodiment, like Embodiment 5, is a method for controlling the hole depth with high accuracy, and by removing the influence of the inertia of the Z table 13, a hole with high accuracy can be obtained. It is something that is going to be processed. That is, Example 1,
As shown in FIG. 2, when it is detected that the tip of the drill 1 has reached the surface of the multilayer wiring board 30 due to the increase in the displacement Δθ around the Z axis and the displacement ΔZ in the Z axis direction, FIG.
As shown in, the Z table 13 is stopped at that time,
After that, as shown in FIG. 19B, the spindle motor 2 is moved down by using the attraction force of the electromagnets 3A, 3B, 3C, 3D, 3E, and 3F of the magnetic levitation device (indicated by a dashed line Z in the figure). The position of the spindle motor 2 at the stop position of the table 13 is shown). Actually, the electromagnets 3D, 3E,
The energizing current is controlled so that the attraction force of 3F becomes large.

The above operation is summarized as shown in FIG.
First, the Z table 13 is operated to lower the housing 12 (S1), and when it is detected that the tip of the drill 1 reaches the surface of the multilayer wiring board 30 (S2), the Z table 13 is stopped without decelerating. (S3), the spindle motor 2 is lowered by the magnetic levitation device (S4). Then, when it is detected that the tip portion of the drill 1 has reached the target conductive layer 31, the cutting process is stopped (S5). By such a procedure, it is possible to remove the influence of the inertia of the Z table 13 and prevent the holes from becoming unnecessarily deep, and it is possible to perform accurate hole processing.

(Embodiment 7) In this embodiment, in order to achieve the purpose of precisely controlling the hole depth as in Embodiment 5, the descending speed of the housing 12 is decelerated before the cutting process is stopped. The Z table 13 is controlled as described above.
That is, as shown in FIG. 20, after setting the required time or depth (movement amount of the Z table 13) to a predetermined position immediately before the position where the cutting process is stopped in advance (S
1), the processing is started (S2), and the fact that the tip of the drill 1 reaches the surface of the multilayer wiring substrate 30 means that the displacement Δθ or the displacement ΔZ exceeds the threshold value as in the first or second embodiment. It is detected (S3), and this position is set as the reference position (S4). After that, when the tip of the drill 1 reaches the specified position set by the required time or depth from the reference position (S5), the Z table 13 is controlled so that the descending speed of the housing 12 is reduced (S6), When the target conductive layer 31 is cut, the cutting process is stopped (S
7). Thus, before the cutting process is stopped, the Z table 13
Since the descending speed of is reduced, it is possible to suppress the excessive penetration of the hole depth due to inertia.

(Embodiment 8) In the present embodiment, the number of cut conductive layers 31 is counted in the same manner as in Embodiments 3 and 4, and an error in counting conductive layers 31 is prevented. It is an object. In the method of the third embodiment, the displacement Δθ around the Z axis is
Is judged to have cut the conductive layer 31, and when the displacement ΔZ in the Z-axis direction exceeds the threshold T, it is judged that the conductive layer 31 has been cut. As described above, the displacement Δθ is detected by the output of the displacement sensors 7A, 7B, 7C or the load current of the actuators 5A, 5B, 5C, and the displacement ΔZ is detected by the displacement sensors 7D, 7E,
Output of 7F or electromagnets 3A, 3B, 3C, 3D, 3
It can be detected by the load currents of E and 3F. These displacements Δθ and ΔZ are sampled at fixed time intervals, and if the sampled value becomes larger than the threshold value T, it is judged that the cutting of the conductive layer 31 has started. Therefore, the past process is not taken into consideration, and the conductive layer 31
May be erroneously detected even when the tool is not cut.

Therefore, in the present embodiment, the displacement Δ detected in time series by sampling as shown in FIG. 22 (b).
For Z (may be Δθ), displacement ΔZ exceeding threshold T
_{When N} is detected, as shown in FIG. 21, it is determined whether or not the immediately preceding displacement ΔZ _N−1 in the time series is smaller than the threshold value T. If the displacement ΔZ _N is equal to or greater than the threshold value T, the displacement ΔZ _N is determined. Only when _N-1 is equal to or less than the threshold value T, it is determined that the conductive layer 31 is cut. In short, as shown in FIG. 22A, it is determined that the conductive layer 31 is cut only when the adjacent displacements ΔZ _N−1 and ΔZ _N in the time series sandwich the threshold value T. . By doing so, it is possible to prevent erroneous detection of the conductive layer 31 by appropriately setting the threshold value T.

(Embodiment 9) The threshold value T for the displacements Δθ and ΔZ described in each of the above embodiments is set with the stationary position where the spindle motor 2 is levitated by the magnetic levitation device as the reference position. May be deviated from the stationary position while moving the to lower the spindle motor 2. That is, since the reference position of the spindle motor 2 changes due to the acceleration / deceleration of the Z table 13,
Even if the threshold value T set at the stationary position is used, the hole depth may vary depending on the processing speed.

Therefore, as shown in FIG. 23, the average value V ₁ regarding the displacement ΔZ (or Δθ) is obtained in a predetermined section E from the start of the descent of the Z table 13 to the start of the cutting of the multilayer circuit board 30, This average value V ₁ is used as the reference position. In general, this average value V ₁ is displaced with respect to the stationary position V ₀ , and further reflects the moving state of the Z table 13, so by setting the threshold value T using this average value V ₁ as an offset value. , A good threshold T can be determined.

Now, assuming that the threshold value from the reference position for the displacement ΔZ (Δθ) is TH, the threshold value T becomes V ₁ + TH by adopting the method of this embodiment, and the conventional threshold value T = V
Compared with ₀ + TH, the threshold value T can be corrected by (V ₁ −V ₀ ), and a more appropriate threshold value T can be set. FIG. 24 shows a processing procedure using the threshold value T obtained in the above procedure. That is, first, the Z table 13 starts to descend (S1), and then the displacement ΔZ (or Δ) occurs in a predetermined section before the tip of the drill 1 reaches the multilayer wiring board 30.
The average value of θ) is obtained, and the threshold value T is determined based on this average value (S2). Next, the cutting start position and the target position of the conductive layer 31 are obtained (S3), and the cutting process is performed (S4).

(Embodiment 10) In the above embodiment, when the number of cut conductive layers 31 is counted, the cutting state of the conductive layers 31 changes as shown in FIG. The detection is based on the magnitude of the displacement Δθz about the Z axis. That is, the displacement ΔZ (or Δθz)
Was detected in the vicinity of the maximum value (the broken line in the figure indicates the position where the cutting of the conductive layer 31 is started).

On the other hand, the change over time of the displacement ΔZ (or Δθz) (that is, the velocity ΔVz or the angular velocity ΔVθz) is shown in FIG.
As shown in FIG. 5 (b), when the displacement ΔZ (or Δθz) takes the maximum value, the transition from positive to negative occurs, so that the velocity ΔVz
Similarly to the displacement ΔZ (or Δθz), the number of conductive layers 31 cut by the drill 1 can be known by counting the number of times the angular velocity ΔVθz transits from positive to negative.

However, in the third and fourth embodiments, the threshold value T is set to the displacement ΔZ (or Δθz) to obtain the number of cut conductive layers 31, whereas in the present embodiment, the above number is used. Based on the knowledge, the number of cut conductive layers 31 is counted by detecting a person whose velocity ΔVz in the Z-axis direction or angular velocity ΔVθz around the Z-axis changes from positive to negative. Other procedures are the same as those in the third and fourth embodiments. If the cutting of the conductive layer 31 is detected by using the sign changes of the velocity ΔVz and the angular velocity ΔVθz as in the present embodiment, there is an advantage that the threshold T need not be set.

(Embodiment 11) When counting the number of conductive layers 31 cut by using the method of Embodiments 3, 4, 10, etc., the conductive layers 31 may not be cut. However, due to some noise component, the displacement ΔZ (or Δθ
z) exceeds the threshold value T, the velocity ΔVz or the angular velocity ΔVθz
The sign of may change from positive to negative. If such a noise component exists, the cutting process will stop before reaching the target conductive layer 31. For example,
In the method of Example 3 and Example 4, C shown in FIG.
It is assumed that the positions of 1, C3, C4 and C5 correspond to the conductive layer 31, and the displacement ΔZ (or Δθz) exceeds the threshold T even at the position of C2 due to some noise component.
In this case, the target conductive layer 31 is at the position of C5, and the cutting process should be terminated assuming that the conductive layer 31 at the position of C5 is reached when the four conductive layers 31 are counted. When the conductive layer 31 at the position of C4 is counted due to the noise component at the position of C2, it is determined that the conductive layer 31 is the fourth layer and the cutting process is stopped. That is, there arises a problem that the conductive layer 31 cannot be cut by the intended number of layers.

Therefore, in this embodiment, the time interval at which the displacement ΔZ (or Δθz) exceeds the threshold value T or the moving distance of the drill 1 is measured, and if this time interval or moving distance does not exceed the specified threshold value, noise is measured. Do not count as a component. Assuming that a threshold value is set for the moving distance, the moving distance of the drill 1 is obtained from the moving distance of the Z table 13 and the displacement of the spindle motor 2 with respect to the housing 12, and the conductive layer 31 is cut after cutting. When the moving distance is less than the threshold value set according to the distance between the conductive layers 31, the displacement ΔZ (or Δ
Even if θz) exceeds the threshold value T, it is invalidated so that counting is not performed. By such processing, the noise component can be removed and the conductive layer 31 can be counted, and the occurrence of a problem due to erroneous counting can be prevented.

The above procedure is summarized in FIG. That is, first, a value (α) slightly smaller than the interval between the adjacent conductive layers 31 is set (S1), and the processing is started (S2). Next, when the displacement ΔZ (or Δθz) exceeds the threshold T (S3), the machining depth from the time when the displacement ΔZ (or Δθz) exceeds the threshold T by cutting the conductive layer 31 one layer before. Is compared with a threshold value set for the interval (S4), and if the processing depth does not exceed the threshold value, it is determined that the conductive layer 31 is not present and counting is not performed (S4).
5), the conductive layer 3 only when the processing depth exceeds the threshold value
1 is counted as cut (S6). When the target number of layers is counted by such counting (S7), the cutting process is completed.

Here, an example in which a threshold value is set for the movement distance is shown, but it may be a time interval and the displacement ΔZ (or Δθ).
The number of conductive layers 31 may be counted using velocity ΔVz or angular velocity ΔVθz instead of z). (Embodiment 12) In this embodiment, whether or not the target conductive layer 31 is cut is determined without counting the number of layers of the conductive layer 31, and the surface of the multilayer wiring board 30 is determined. Taking advantage of the fact that the depth from the position to the target conductive layer 31 is known, the surface position of the multilayer wiring board 30 is used as a reference position, and the tip of the drill 1 reaches near the depth of the target conductive layer 31. Therefore, the displacement ΔZ (or Δθz) is compared with the threshold value T.

That is, this embodiment is the third or fourth embodiment.
Similarly to the above, the displacement ΔZ or the displacement Δθz is compared with the threshold value T to judge whether or not the conductive layer 31 is in the cutting state.
After the time point at which the cutting process is started due to contact with is detected, the process of comparing the displacement ΔZ (or Δθz) with the threshold value T is not performed up to near the depth of the target conductive layer 31. Is different. The method for detecting that the tip of the drill 1 has reached the surface of the multilayer wiring board 30 is the first embodiment.
Similarly to the second embodiment, the position where the displacement ΔZ (or Δθz) sampled at constant time intervals first exceeds the threshold T is set as the reference position C1. After that, the reference position C1
The movement distance of the drill 1 or the movement time is calculated, and the displacement ΔZ (or Δθz to the calculation control unit 20c is reached until this depth reaches a depth Dp which is smaller than the depth of the target conductive layer 31 by a predetermined dimension. ) Is interrupted.
When the depth of the tip of the drill 1 reaches a preset depth (that is, a depth smaller by a predetermined dimension than the depth of the target conductive layer 31) Dp, the capture of the displacement ΔZ (or Δθz) is restarted, and When the displacement ΔZ (or Δθz) exceeds the threshold value T, it is determined that the target conductive layer 31 (Cn) has been reached.

The white circles in FIG. 28 represent the data of the displacement ΔZ (or Δθz) fetched by the arithmetic control unit 20c,
After the displacement ΔZ (or Δθz) is captured at the reference position C1 described above, the displacement ΔZ is reached until the specified depth Dp is reached.
(Or Δθz) data is not captured, and the data capture is restarted to determine that the position Cn at which the displacement ΔZ (or Δθz) exceeds the threshold value T is the target conductive layer 31 position. There is. This procedure is summarized in Figure 2.
As shown in FIG. 9, first, the depth Dp is defined based on the position of the conductive layer 31 (S1), and then the cutting process is started (S).
2). Then, the displacement ΔZ (or Δθz) is first determined by the threshold value T.
(S3), the position is set as the reference position (S3).
4) Stop taking in the displacement ΔZ (or Δθz) (S5). After that, when the drill 1 reaches the set depth Dp from the reference position (S6), the displacement ΔZ (or Δθz)
Data acquisition is restarted (S7), and when the displacement ΔZ (or Δθz) exceeds the threshold value T after the data acquisition is restarted (S8), it is determined that the target conductive layer 31 has been reached and the cutting process is stopped. Of.

When the target conductive layer 31 is detected by the above procedure, the displacement ΔZ (or Δ) with respect to the other conductive layers 31 is detected.
θz) does not need to be detected, and as a result, the arithmetic control unit 20c
It is possible to reduce the number of data to be input to and reduce the load on the arithmetic control unit 20c. (Embodiment 13) This embodiment is similar to Embodiment 12 in depth D.
When defining and cutting p, it is possible to deal with a plurality of types of multilayer wiring boards 30, and the depth and number of layers of each conductive layer 31 of the multilayer wiring board 30 to be cut are set. Build a database that registers relationships,
The depth Dp used during cutting is defined based on the data registered in this database. Registration of data in the database is automated, and the procedure is as follows. First, a waste hole is formed in the unnecessary position of the multilayer wiring board 30 to be processed by the above apparatus. When forming this waste hole, the time when the displacement ΔZ (or Δθz) exceeds the threshold value T is detected and judged as the position of the conductive layer 31, and the relationship between the number of layers of the conductive layer 31 and the depth at that time is paired. That is, that is, information that the x-th conductive layer 31 as shown in FIG. 30 has a depth of ymm from the surface of the multilayer wiring board 30 is registered in the database in the form of a pair (x-th layer, ymm). . If such a database is constructed, thereafter, the depth of the conductive layer 31 is obtained from the target conductive layer 31 based on the data of this database, and the depth at which sampling is restarted according to the obtained depth. It is possible to determine Dp.

That is, since the process of creating the database is performed for each member to be processed, as shown in FIG. 31, the member to be processed is first exchanged (S1) and an appropriate threshold value T is set.
Is input (S2). Next, the above-mentioned waste hole is formed (S3), and the number of layers and the depth from the surface of the multilayer wiring board 30 when the displacement ΔZ or the displacement Δθz exceeds the threshold T are output and registered in the database. It ’s good (S
4).

(Embodiment 14) This embodiment is an example of a procedure for determining the depth Dp at which sampling is restarted similarly to the embodiment 13, and in the embodiment 13, the depth Dp for each multilayer wiring board 30 is determined. However, in this embodiment, the depth Dp is set for each hole. That is, sampling is performed as indicated by white circles in FIG. 32, and the first layer C1 of the conductive layer 31 is sampled.
And the second layer C2, the distance to the target conductive layer 31 is calculated based on the number of layers up to the target conductive layer 31, assuming that the conductive layers 31 are provided at equal intervals,
The depth Dp is determined from this distance. For example,
When the fourth layer C4 is the target conductive layer 31, the target conductive layer 31 has a depth of the first layer C1 and the second layer C2.
It is estimated that the distance is 3 times the distance between the first layer C1 and the second layer C2, and the depth D
It is defined as p.

This process is summarized as shown in FIG. That is, first, an appropriate threshold value T is input (S1),
When the machining is started (S2) and the displacement ΔZ or the displacement Δθz exceeds the threshold T (S3), the position is set as the reference position (S4). Next, when the displacement ΔZ (or Δθz) exceeds the threshold value T (S5), the depth from the reference position is obtained (S5).
6) Stop capturing the displacement ΔZ (or Δθz) (S7). In the meantime, the depth Dp corresponding to the intended depth of the conductive layer 31 is set to the depth from the reference position (S8), and when the tip of the drill 1 reaches this depth Dp, data acquisition is restarted ( S9). After that, the displacement ΔZ (or Δθ
When z) exceeds the threshold value T, it is determined that the target conductive layer 31 has been reached (S10), and the cutting process is ended.

(Embodiment 15) This embodiment, like Embodiments 3 and 4, counts the conductive layer 31 cut based on the displacement ΔZ (or Δθz). By changing the sampling interval at which the data of the displacement ΔZ (or Δθz) is taken in, it is possible to accurately detect the position of the target conductive layer 31 while the number of data taken into the arithmetic control unit 20c is relatively small. To do.

That is, as shown in FIG. 34, the displacement ΔZ
When counting the number of conductive layers 31 by (or Δθz), the sampling interval is relatively long until reaching one layer before the target conductive layer 31 (however, the displacement necessary to detect the conductive layer 31 is It is set so that a change in ΔZ (or Δθz) can be detected (white circles represent sampled data), and the position Cn-1 of the conductive layer 31 one layer before the position Cn of the target conductive layer 31 is detected. Then, the sampling interval is reduced. In this way, the displacement ΔZ
The position where (or Δθz) exceeds the threshold value can be accurately determined. Further, as compared with the case where the sampling interval is always reduced, the amount of data taken in can be reduced without lowering the measurement accuracy, and as a result, the load on the arithmetic control unit 20c can be reduced.

This procedure is summarized as shown in FIG. That is, when the processing is started (S1) and the displacement ΔZ (or Δθz) exceeds the threshold value T (S2), the counting of the conductive layer 31 is started as the cutting is started (S3).
When the number of the counted conductive layers 31 becomes one less than the target number of layers (S4), the sampling interval is shortened and the data is captured densely (S5). After that, when the displacement Z (or Δθz) exceeds the threshold T (S6), it is determined that the target conductive layer 31 has been reached, and the cutting process is stopped.

[0077]

According to the first and second aspects of the present invention, the time when the workpiece can be cut by the cutting tool is detected, and the housing position at this time is used as the reference position. The cutting process is stopped when the housing moves by a distance corresponding to, and as a method for detecting the time when the workpiece can be cut, in the invention of claim 1, in the rotating direction of the rotating device acting on the cutting tool. The change of the reaction force is detected, and in the invention of claim 2, the change is detected based on the change of the reaction force in the direction along the moving direction of the housing acting on the cutting tool. As a result, it is not necessary to measure the dimensions in advance in order to determine the reference position, and the movement distance of the housing from the time when the work can be cut by the cutting tool is associated with the depth of the hole. This has an advantage that the depth of the hole is not affected even if the work thickness varies.

The inventions of claims 3 and 4 are applied when the work is a multilayer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated. The number of layers is counted, and when the desired number of conductive layers are cut, the cutting process is stopped. In the invention of claim 3, the cutting of the conductive layer is detected by the change of the reaction force in the rotating direction of the rotating device acting on the cutting tool, and in the invention of claim 4, the reaction acting on the cutting tool in the direction along the moving direction of the housing. It is detected by the change in force. As a result, it is possible to form a hole reaching the target conductive layer by counting the number of conductive layers that are simply cut without requiring dimensional control.

According to the fifth aspect of the invention, immediately after the movement of the housing is stopped at the time when the desired number of conductive layers are cut,
Since the rotating device is rapidly moved in the direction of increasing the distance to the work, it is possible to prevent the rotating device from overshooting due to inertia, and it is possible to improve the accuracy of the depth of the hole. In the invention of claim 6, the housing is stopped at the position where the cutting is started, and thereafter the magnetic levitation device for supporting the rotating device moves the rotating device by the depth of the hole, so that it may be affected by the inertia of the housing. There is an effect that the processing accuracy of the depth of the hole is increased.

According to the seventh aspect of the present invention, since the moving speed of the housing is reduced when approaching the target position during cutting, it is possible to prevent the rotating device from overshooting due to inertia, and to improve the accuracy of the depth of the hole. The effect is that it can be increased. The method of claim 8 is a desirable method of detecting a reaction force, and is a method of detecting a displacement of a rotating device supported via a magnetic levitation device from a specified position as a reaction force. If this method is adopted, the reaction force can be easily detected.

According to the ninth aspect of the present invention, the average value of the displacement in the period from the movement start position of the housing to the contact of the cutting tool with the workpiece is obtained, and the threshold value is determined based on the obtained average value. There is an advantage that the threshold value can be set by using the fluctuation amount of the threshold value when the device is operating as an offset value, and a good threshold value can be set.

According to the tenth aspect of the present invention, the moving distance or time interval when the displacement of the rotating device exceeds the threshold value is measured, and it is determined that the conductive layer is not cut within the range of the specified distance or the specified time. Therefore, the noise component is less likely to be mistaken for the cutting of the conductive layer, and it is possible to reliably reach the target conductive layer. Claim 11
The invention of claim 1 cuts the conductive layer when a prescribed change occurs in at least one of the angular velocity of the rotating device with respect to the housing in the rotating direction of the rotating device and the moving speed of the rotating device in the direction along the moving direction of the housing. If such a method is adopted, there is an advantage that the setting of the threshold value becomes unnecessary.

According to the twelfth aspect of the invention, the cutting tool reaches a specified depth that is smaller than the distance from the specified reference position to the position of the target conductive layer and is larger than the depth one layer before the target conductive layer. The reaction force detection is started from the time when the reaction force is changed, and the cutting process is stopped when the reaction force changes, so the amount of data related to the reaction force can be limited and the data processing load is low. There is an effect.

According to a thirteenth aspect of the present invention, there is provided a method for determining a position at which data regarding reaction force is to be taken in. A waste hole is cut at a position different from a machined hole so that the depth of each conductive layer is adjusted to each conductive layer. Corresponding to a layer, it is registered in the database, and when the hole is drilled, the target conductive layer is specified to determine the depth at which reaction force detection is started based on the corresponding depth read from the database. It has an advantage that it can be easily dealt with.

According to a fourteenth aspect of the present invention, there is provided a method for determining a position at which data regarding reaction force is to be taken in. The distance between the first conductive layer and the second conductive layer is detected during drilling. , The depth to the target conductive layer is obtained by multiplying the above distance by a predetermined magnification, and the depth at which the reaction force is detected is determined based on this depth, so it is possible to process without forming a separate hole. This has the effect of determining the depth at which data is taken in for each hole.

According to the fifteenth aspect of the invention, when the reaction force is sampled and taken in, the sampling interval thereafter is made smaller than the sampling interval until the conductive layer immediately before the target conductive layer is cut, and the sampling is performed. Since the cutting is stopped when the reaction force changes after reducing the interval, it is possible to reduce the amount of data to be taken by increasing the sampling interval for the conductive layer that is not intended, and at the same time for the target conductive layer. Has the advantage that the sampling interval can be reduced and detection can be performed accurately.

[Brief description of drawings]

FIG. 1 is an operation explanatory diagram illustrating Embodiments 1 and 2.

2A to 2C are process drawings showing a process of forming a hole in Example 1. FIG.

FIG. 3 is an operation explanatory view showing a change with time of displacement in the first embodiment.

FIG. 4 is a process diagram showing a process of forming a hole according to the second embodiment.

FIG. 5 is an operation explanatory view showing Examples 3 and 4.

FIG. 6 is a process diagram showing a process of forming a hole in Example 3;

FIG. 7 is an operation explanatory view showing a change with time of displacement in the third embodiment.

FIG. 8 is a process drawing showing the process of forming holes in Example 4;

FIG. 9 is a perspective view of the overall configuration showing an embodiment.

FIG. 10 is a partially cutaway perspective view showing an example.

FIG. 11 is a plan view of an actuator used in the example.

FIG. 12 is a cross-sectional view of an actuator used in an example.

FIG. 13 is a block diagram of a control circuit showing an embodiment.

FIG. 14 is an operation explanatory diagram of the embodiment.

FIG. 15 is an operation explanatory view showing the fifth embodiment.

16A and 16B show Example 5; FIG. 16A is a diagram showing a cutting process, and FIG. 16B is an enlarged sectional view of a main part.

17A and 17B show Example 5, in which FIG. 17A is a diagram showing a cutting process, and FIG. 17B is an enlarged sectional view of an essential part.

FIG. 18 is an operation explanatory view showing the sixth embodiment.

FIG. 19 is a diagram showing a cutting process of Example 6;

FIG. 20 is an operation explanatory view showing the seventh embodiment.

FIG. 21 is a diagram for explaining the operation of the main parts of the eighth embodiment.

22A and 22B show an eighth embodiment, FIG. 22A is an operation explanatory diagram showing a displacement time change, and FIG. 22B is a detailed operation explanatory diagram showing a displacement time change.

FIG. 23 is a conceptual explanatory view of the ninth embodiment.

FIG. 24 is an operation explanatory view showing the ninth embodiment.

FIG. 25 is a conceptual explanatory diagram showing Example 10.

FIG. 26 is a conceptual explanatory view showing Example 11.

FIG. 27 is an operation explanatory view showing the eleventh embodiment.

FIG. 28 is a conceptual explanatory diagram showing Example 12;

FIG. 29 is an operation explanatory view showing the twelfth embodiment.

FIG. 30 is a conceptual explanatory diagram showing Example 13;

FIG. 31 is an operation explanatory view showing the thirteenth embodiment.

FIG. 32 is a conceptual explanatory diagram showing Example 14;

FIG. 33 is an operation explanatory view showing the fourteenth embodiment.

FIG. 34 is a conceptual explanatory diagram showing Example 15.

FIG. 35 is an operation explanatory view showing the fifteenth embodiment.

FIG. 36 is a schematic configuration diagram showing a conventional example.

FIG. 37 is a perspective view showing an example of forming holes in a conventional example.

[Explanation of symbols]

 1 Drill 2 Spindle Motor 3A-3F Electromagnet 5A-5C Actuator 7A-7F Displacement Sensor 20 Control Circuit

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[Procedure amendment]

[Submission date] June 13, 1994

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 6

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 8

[Correction method] Change

[Correction content]

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 11

[Correction method] Change

[Correction content]

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction content]

[0014] The invention of claim 6, moves the housing supporting the rotary device for rotating the cutting tool for drilling through the magnetic levitation equipment in a predetermined direction to reduce the distance between the workpiece, at least the housing In the moving direction, the rotating device is levitated against the housing by the magnetic force of the electromagnet provided in the magnetic levitation device, and the position of the housing is taken as the reference position when the time when the workpiece can be cut by the cutting tool is detected. The movement of the housing is stopped by, and after the rotating device is moved by the magnetic levitation device from the reference position by a distance corresponding to the desired depth of the hole, the cutting process is stopped.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Name of item to be corrected] 0015

[Correction method] Change

[Correction content]

According to a seventh aspect of the present invention, in the first to fourth aspects of the invention, the approach to the position where the cutting process is stopped is detected by the amount of movement of the housing or the moving time of the housing, and the position where the cutting process is stopped. It is characterized in that the moving speed of the housing is decelerated when an approach to is detected. According to an eighth aspect of the present invention, in the third or fourth aspect of the present invention, the rotating device supports the housing in such a manner that it is levitated by the magnetic force of the electromagnet so as to allow parallel movement and rotational movement in all directions. It is supported by the housing via a levitation device, and the displacement from a predetermined position specified by the current supplied to the electromagnet is used as an index of the reaction force, and when the displacement exceeds a specified threshold, the conductive layer is cut. It is characterized by making a judgment.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction content]

According to an eleventh aspect of the present invention, in the third or fourth aspect of the invention, the angular velocity of the rotating device with respect to the housing in the rotating direction of the rotating device and the moving speed of the rotating device in the direction along the moving direction of the housing. It is characterized in that it is judged that the conductive layer is cut when a prescribed change occurs in at least one of them. According to a twelfth aspect of the present invention, a work is a multilayer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a distance between the work and a housing supporting a rotating device that rotates a cutting tool for drilling holes is increased. Move in a fixed direction, and detect the cutting of the conductive layer by the cutting tool by the change of the reaction force in the rotating direction of the rotating device or the moving direction of the housing that acts on the cutting tool. When the cutting tool reaches the specified depth that is smaller than the distance to the position and is larger than the depth of the target conductive layer one layer before, the reaction force starts to be detected and the reaction force changes. It is characterized by stopping the cutting process.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0052

[Correction method] Change

[Correction content]

The above operation is summarized as shown in FIG. 15. First, as shown in FIG.
Lowering the (S1), when the leading end of the drill 1 detects that it has reached the conductive layer 31 of interest (S2), were locked down the Z table 13 (S3), to jump the spindle motor 2 by a magnetic levitation device (S4). Thus, Z
Spindle motor (floating part) by stopping the table 13
After abruptly raising 2, Z table 13 is raised and returned to the original position (S5). By such a procedure, it is possible to prevent the hole from becoming unnecessarily deep, and it is possible to perform accurate hole processing.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0054

[Correction method] Change

[Correction content]

The above operation is summarized as shown in FIG.
First, by operating the Z table 13 is lowered to the housing 12 (S1), when the leading end of the drill 1 detects that it has reached the surface of the multilayer wiring board 30 (S2), were locked down the Z table 13 (S3) The spindle motor 2 is lowered by the magnetic levitation device (S4). Then, when it is detected that the tip portion of the drill 1 has reached the target conductive layer 31, the cutting process is stopped (S5). By such a procedure, it is possible to remove the influence of the inertia of the Z table 13 and prevent the holes from becoming unnecessarily deep, and it is possible to perform accurate hole processing.

[Procedure Amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0055

[Correction method] Change

[Correction content]

(Embodiment 7) In this embodiment , in order to achieve the purpose of precisely controlling the hole depth as in Embodiment 5, the descending speed of the housing 12 is decelerated before the cutting process is stopped. The Z table 13 is controlled as described above.
That is, as shown in FIG. 20, after setting the required time or depth (movement amount of the Z table 13) to a predetermined position immediately before the position where the cutting process is stopped in advance (S
1), the processing is started (S2), and the fact that the tip of the drill 1 reaches the surface of the multilayer wiring substrate 30 means that the displacement Δθ or the displacement ΔZ exceeds the threshold value as in the first or second embodiment. It is detected (S3), and this position is set as the reference position (S4). After that, when the tip of the drill 1 reaches the specified position set by the required time or depth from the reference position (S5), the Z table 13 is controlled so that the descending speed of the housing 12 is reduced (S6), When the target conductive layer 31 is cut, the cutting process is stopped (S
7). Thus, before the cutting process is stopped, the Z table 13
Since the descending speed of is reduced, it is possible to suppress the excessive penetration of the hole depth due to inertia.

[Procedure Amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0061

[Correction method] Change

[Correction content]

(Embodiment 10) In the above embodiment, when the number of cut conductive layers 31 is counted, the cutting state of the conductive layers 31 changes as shown in FIG. The detection is based on the magnitude of the displacement Δθ about the Z axis. That is, it was to detect the vicinity of the maximum value of the displacement ΔZ (or Δθ ) (the broken line in the figure indicates the conductive layer 3).
The cutting start position of No. 1 is shown).

[Procedure Amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0062

[Correction method] Change

[Correction content]

On the other hand, the time change of the displacement ΔZ (or Δθ ) (that is, the velocity ΔVz or the angular velocity ΔVθ ) is shown in FIG.
As shown in (b), when the displacement ΔZ (or Δθ ) has a maximum value, the transition is from positive to negative. Therefore , even if the number of times the velocity ΔVz or the angular velocity ΔVθ transits from positive to negative is counted, the displacement ΔZ ( Alternatively, the number of conductive layers 31 cut by the drill 1 can be known as in the case of Δθ ).

[Procedure Amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0063

[Correction method] Change

[Correction content]

However, in the third and fourth embodiments, the threshold number T is set to the displacement ΔZ (or Δθ ) to find the number of cut conductive layers 31, whereas in the present embodiment, Based on the knowledge, the point at which the velocity ΔVz in the Z-axis direction or the angular velocity ΔVθ around the Z-axis transits from positive to negative
The number of the cut conductive layers 31 is counted by detecting the temperature. Other procedures are the same as those in the third and fourth embodiments. If the cutting of the conductive layer 31 is detected by using the sign changes of the velocity ΔVz and the angular velocity ΔVθ as in the present embodiment, the threshold value T is obtained.
There is an advantage that the setting of is unnecessary.

[Procedure Amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0064

[Correction method] Change

[Correction content]

(Embodiment 11) When counting the number of conductive layers 31 cut by the methods of Embodiment 3, Embodiment 4, Embodiment 10, etc., the conductive layers 31 may not be cut. The displacement ΔZ (or Δ
θ ) may exceed the threshold value T, or the signs of the velocity ΔVz and the angular velocity ΔVθ may change from positive to negative. If such a noise component exists, the cutting process will stop before reaching the target conductive layer 31. For example, in the methods of the third and fourth embodiments, C1, shown in FIG.
It is assumed that the positions of C3, C4, and C5 correspond to the conductive layer 31, and the displacement ΔZ (or Δθ 2 ) exceeds the threshold T even at the position of C2 due to some noise component. In this case, the target conductive layer 31 is at the C5 position, and when the four conductive layers 31 are counted, the conductive layer 31 at the C5 position is counted.
The cutting process should be terminated as if the
Due to the noise component at the position of C2, the conductive layer 3 at the position of C4
When 1 is counted, it is judged that it is the fourth layer and the cutting process is stopped. That is, there arises a problem that the conductive layer 31 cannot be cut by the intended number of layers.

[Procedure Amendment 14]

[Document name to be amended] Statement

[Correction target item name] 0065

[Correction method] Change

[Correction content]

Therefore, in this embodiment, the displacement ΔZ (or
The time interval at which Δθ ) exceeds the threshold value T or the moving distance of the drill 1 is measured, and if this time interval or moving distance does not exceed the specified threshold value, it is not counted as a noise component. Now, assuming that a threshold is set for the movement distance, the movement distance of the drill 1 is set to Z
When the moving distance obtained after cutting the conductive layer 31 from the moving distance of the table 13 and the displacement of the spindle motor 2 with respect to the housing 12 is less than the threshold value set according to the distance between the conductive layers 31, , Displacement ΔZ (or Δ
Even if θ 2 ) exceeds the threshold value T, it is invalidated and counting is not performed. By such processing, the noise component can be removed and the conductive layer 31 can be counted, and the occurrence of a problem due to erroneous counting can be prevented.

[Procedure Amendment 15]

[Document name to be amended] Statement

[Correction target item name] 0066

[Correction method] Change

[Correction content]

The above procedure is summarized in FIG. That is, first, a numerical value obtained by subtracting a slightly smaller value (α) from the interval between the adjacent conductive layers 31 is set (S1), and processing is started (S2). However, (caused by noise
Value) <α <(thickness of one conductive layer). Next, when the displacement ΔZ (or Δθ 2 ) exceeds the threshold value T (S3),
Displacement ΔZ by cutting the conductive layer 31 one layer before
The machining depth from the time point (or Δθ ) exceeds the threshold value T is compared with the threshold value set for the interval (S4), and if the machining depth does not exceed the threshold value, it is determined that it is not the conductive layer 31 and counted. Is not performed (S5), and the conductive layer 31 is counted as cut only when the processing depth exceeds the threshold value (S6). When the target number of layers is counted by such counting (S7), the cutting process is completed.

[Procedure Amendment 16]

[Document name to be amended] Statement

[Correction target item name] 0067

[Correction method] Change

[Correction content]

Here, an example in which a threshold value is set for the moving distance is shown, but it may be a time interval and the displacement ΔZ (or Δ).
The number of layers of the conductive layer 31 may be counted by using the velocity ΔVz or the angular velocity ΔVθ instead of θ 2 ). (Embodiment 12) In this embodiment, whether the target conductive layer 31 is cut or not is determined without counting the number of conductive layers 31, and the surface of the multilayer wiring board 30 is determined. Utilizing that the depth from the position to the target conductive layer 31 is known, the surface position of the multilayer wiring board 30 is used as a reference position, and the tip of the drill 1 reaches near the depth of the target conductive layer 31. Therefore, the displacement ΔZ (or Δθ 2 ) is compared with the threshold value T.

[Procedure Amendment 17]

[Document name to be amended] Statement

[Correction target item name] 0068

[Correction method] Change

[Correction content]

That is, this embodiment is the third or fourth embodiment.
Similarly, the displacement ΔZ or the displacement Δθ is compared with the threshold value T to determine whether or not the conductive layer 31 is in the cutting state. The drill 1 comes into contact with the surface of the multilayer wiring board 30 to perform the cutting process. After the time when the start is detected, the process of comparing the displacement ΔZ (or Δθ ) with the threshold value T is not performed until the target conductive layer 31 is near the depth. Be different. The method of detecting that the tip of the drill 1 has reached the surface of the multilayer wiring board 30 is the same as that in the first and second embodiments, and the displacement ΔZ (or Δθ ) sampled at constant time intervals is the first. The position exceeding the threshold T is set as the reference position C1. Thereafter, the movement distance or movement time of the drill 1 from the reference position C1 is calculated, and the calculation control unit 20c is operated until the depth reaches a depth Dp which is smaller than the depth of the target conductive layer 31 by a predetermined dimension. Displacement ΔZ
(Or Δθ ) is stopped. The depth of the tip of the drill 1 is the preset depth (ie,
When than the depth of the object of the conductive layer 31 reaches only a small depth) Dp predetermined dimensions, to resume the incorporation of displacement [Delta] Z (or [Delta] [theta]), then the displacement [Delta] Z (or [Delta] [theta]) exceeds a threshold value T Objectives conduction It is determined that the layer 31 (Cn) has been reached.

[Procedure 18]

[Document name to be amended] Statement

[Correction target item name] 0069

[Correction method] Change

[Correction content]

The white circle in FIG. 28 shows the data of the displacement ΔZ (or Δθ ) taken in by the arithmetic control unit 20c, and reaches the specified depth Dp after the displacement ΔZ (or Δθ ) is taken in at the above-mentioned reference position C1. Up to the point where the displacement ΔZ (or Δθ ) data is not captured, the data capture is restarted, and the position Cn at which the displacement ΔZ (or Δθ ) exceeds the threshold T is set to the target conductive layer 31 position. It indicates that it is determined that there is. To summarize this procedure, as shown in FIG. 29, first, the depth Dp is defined based on the position of the conductive layer 31 (S1), and then the cutting process is started (S2). Next, when the displacement ΔZ (or Δθ 2 ) first exceeds the threshold value T (S3), the position is set as the reference position (S4), and the displacement ΔZ
(Or Δθ 2 ) is suspended (S5). After that, when the drill 1 reaches the set depth Dp from the reference position (S6), the data acquisition of the displacement ΔZ (or Δθ 2 ) is restarted (S7), and the displacement ΔZ (or Δθ 2 ) is changed after the data acquisition is restarted. When the threshold value T is exceeded (S8), it is determined that the target conductive layer 31 has been reached, and the cutting process is stopped.

[Procedure Amendment 19]

[Document name to be amended] Statement

[Name of item to be corrected] 0070

[Correction method] Change

[Correction content]

When the target conductive layer 31 is detected by the above procedure, the displacement ΔZ (or Δ ) with respect to the other conductive layers 31 is detected.
It is not necessary to detect θ 2 ) and consequently the number of data input to the arithmetic control unit 20c can be reduced and the burden on the arithmetic control unit 20c can be reduced. (Embodiment 13) This embodiment is similar to Embodiment 12 in depth D.
When defining and cutting p, it is possible to deal with a plurality of types of multilayer wiring boards 30, and the depth and number of layers of each conductive layer 31 of the multilayer wiring board 30 to be cut are set. Build a database that registers relationships,
The depth Dp used during cutting is defined based on the data registered in this database. Registration of data in the database is automated, and the procedure is as follows. First, a waste hole is formed in the unnecessary position of the multilayer wiring board 30 to be processed by the above apparatus. When the displacement ΔZ (or Δθ 2 ) exceeds the threshold value T when forming the abandoned hole, it is determined as the position of the conductive layer 31, and the conductive layer 3 is detected.
Information indicating that the relationship between the number of layers of 1 and the depth at that time is paired, that is, the conductive layer 31 of the xth layer as shown in FIG. 30 has a depth of ymm from the surface of the multilayer wiring board 30 ( It is registered in the database in the form of a pair (xth layer, ymm). If such a database is constructed, thereafter, the depth of the conductive layer 31 is obtained from the target conductive layer 31 based on the data of this database, and the depth at which sampling is restarted according to the obtained depth. It is possible to determine Dp.

[Procedure amendment 20]

[Document name to be amended] Statement

[Correction target item name] 0071

[Correction method] Change

[Correction content]

That is, since the process of creating the database is performed for each member to be processed, as shown in FIG. 31, the member to be processed is first exchanged (S1) and an appropriate threshold value T is set.
Is input (S2). Next, the above-described waste hole is formed (S3), and the number of layers and the depth from the surface of the multilayer wiring board 30 when the displacement ΔZ or the displacement Δθ exceeds the threshold T are output and registered in the database. It ’s good (S
4).

[Procedure correction 21]

[Document name to be amended] Statement

[Correction target item name] 0073

[Correction method] Change

[Correction content]

This process is summarized as shown in FIG. That is, first, an appropriate threshold value T is input (S1),
When the machining is started (S2) and the displacement ΔZ or the displacement Δθ exceeds the threshold value T (S3), that position is set as the reference position (S).
4). Next, when the displacement ΔZ (or Δθ 2 ) exceeds the threshold value T (S5), the depth from the reference position is obtained (S6), and the acquisition of the displacement ΔZ (or Δθ 2 ) is stopped (S7). In the meantime, the depth Dp corresponding to the intended depth of the conductive layer 31 is set to the depth from the reference position (S8), and when the tip of the drill 1 reaches this depth Dp, data acquisition is restarted ( S9). After that, when the displacement ΔZ (or Δθ 2 ) exceeds the threshold value T, it is determined that the target conductive layer 31 has been reached (S1).
0), the cutting process is completed.

[Procedure correction 22]

[Document name to be amended] Statement

[Correction target item name] 0074

[Correction method] Change

[Correction content]

(Embodiment 15) This embodiment, like Embodiments 3 and 4, counts the conductive layer 31 cut based on the displacement ΔZ (or Δθ ), and the arithmetic control unit 20c. By changing the sampling interval for fetching the data of the displacement ΔZ (or Δθ 2 ) into the calculation control unit 20c, the position of the target conductive layer 31 can be accurately detected while the number of data fetched to the arithmetic control unit 20c is relatively small. To do.

[Procedure amendment 23]

[Document name to be amended] Statement

[Correction target item name] 0075

[Correction method] Change

[Correction content]

That is, as shown in FIG. 34, the displacement ΔZ
When counting the number of conductive layers 31 by (or Δθ 1 ), the sampling interval is relatively long until reaching one layer before the target conductive layer 31 (however, the displacement necessary to detect the conductive layer 31 is It is set so that a change in ΔZ (or Δθ ) can be detected (white circles indicate sampled data), and the position Cn-1 of the conductive layer 31 one layer before the position Cn of the target conductive layer 31 is detected. Then, the sampling interval is reduced. In this way, the position where the displacement ΔZ (or Δθ ) exceeds the threshold value can be accurately determined. Further, as compared with the case where the sampling interval is always reduced, the amount of data taken in can be reduced without lowering the measurement accuracy, and as a result, the load on the arithmetic control unit 20c can be reduced.

[Procedure correction 24]

[Document name to be amended] Statement

[Correction target item name] 0076

[Correction method] Change

[Correction content]

This procedure is summarized as shown in FIG. That is, when the processing is started (S1) and the displacement ΔZ (or Δθ ) exceeds the threshold value T (S2), it is determined that the cutting is started and the counting of the conductive layer 31 is started (S3). When the number of the counted conductive layers 31 becomes one less than the target number of layers (S4), the sampling interval is shortened and the data is captured densely (S5). Then the displacement Z (or
When Δθ 2 exceeds the threshold T (S6), the target conductive layer 31
And the cutting process is stopped.

[Procedure correction 25]

[Document name to be corrected] Drawing

[Correction target item name] Fig. 22

[Correction method] Change

[Correction content]

FIG. 22

Claims (15)

[Claims] 1. A cutting tool is operated at a time point when a housing supporting a rotating device for rotating a cutting tool for drilling is moved in a fixed direction to reduce a distance from the work, and the work can be cut by the cutting tool. Detected by the change in the reaction force in the rotating direction of the rotating device, and the position of the housing at the time when the change in the reaction force is detected is set as the reference position, and the housing is moved from this reference position by a distance corresponding to the desired depth of the hole. A hole drilling method characterized in that cutting is stopped when the hole moves. 2. A cutting tool is moved at a time point when a housing supporting a rotating device for rotating a cutting tool for drilling is moved in a fixed direction to reduce a distance from the work, and the work can be cut by the cutting tool. The housing position at the time when the change in the reaction force is detected is set as the reference position, and the distance corresponding to the desired hole depth is set from this reference position. A hole drilling method characterized in that the cutting process is stopped when the housing moves. 3. A work is a multi-layer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a distance between the work and a housing supporting a rotating device for rotating a cutting tool for drilling is reduced. A layer of a conductive layer that is moved in a certain direction, detects the cutting of the conductive layer by the cutting tool by the change in the reaction force in the rotation direction of the rotating device that acts on the cutting tool, and cuts based on the number of times the reaction force changes A hole drilling method characterized by counting the number and stopping the cutting process at the time when a desired number of conductive layers are cut. 4. The work is a multilayer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a distance between the work and a housing supporting a rotating device for rotating a cutting tool for drilling is reduced. The conductive layer is moved in a certain direction and the cutting of the conductive layer by the cutting tool is detected by the change in the reaction force in the direction along the moving direction of the housing acting on the cutting tool, and the conductive layer is cut based on the number of times the reaction force changes. The hole drilling method is characterized in that the number of layers is counted, and the cutting process is stopped when a desired number of conductive layers are cut. 5. The rotating device is supported on the housing through a magnetic levitation device that supports the rotating device at least in the moving direction of the housing in a state of being levitated with respect to the housing by the magnetic force of an electromagnet, and cuts a desired number of conductive layers. Immediately after stopping the movement of the housing at this point, stop the cutting process by rapidly changing the current supplied to the electromagnet of the magnetic levitation device so as to move the rotating device in the direction to increase the distance from the work. The hole drilling method according to claim 3 or 4, characterized in that. 6. A magnetic levitation device for moving a housing, which supports a rotating device for rotating a cutting tool for drilling, via a magnetic levitation device in a constant direction to reduce a distance from a work, and at least in a moving direction of the housing. The rotating device is levitated with respect to the housing by the magnetic force of the electromagnet installed in the device, and the position of the housing is set as the reference position when the time when the cutting tool can cut the workpiece is detected, and the housing is moved at this reference position. A hole drilling method characterized in that the cutting process is stopped after the rotating device is moved by the magnetic levitation device by a distance corresponding to a desired hole depth from the reference position. 7. An approach to a position where cutting is stopped is detected by a moving amount of the housing or a moving time of the housing, and a moving speed of the housing is decelerated when an approach to a position where cutting is stopped is detected. The hole drilling method according to any one of claims 1 to 4. 8. The rotating device is supported on the housing via a magnetic levitation device that supports the rotating device in a form levitated by the magnetic force of the electromagnet so as to allow parallel movement and rotational movement with respect to the housing in all directions. 5. The displacement from a predetermined position defined by the applied current is used as an index of the reaction force, and when this displacement exceeds a specified threshold, it is determined that the conductive layer is being cut. 5
Described hole drilling method. 9. The method according to claim 8, wherein an average value of displacements during a period from the movement start position of the housing to the contact of the cutting tool with the work is obtained, and the threshold value is determined based on the obtained average value. Hole processing method. 10. When the displacement or the time interval of the housing when the displacement exceeds a threshold is measured, and the displacement exceeds the threshold after a specified distance or a specified time has elapsed after the displacement exceeds the threshold, the cut conductive material is cut. The hole drilling method according to claim 8 or 9, wherein the number of layers is counted. 11. The conductive layer is cut when a specified change occurs in at least one of an angular velocity of the rotating device with respect to the housing in a rotating direction of the rotating device and a moving speed of the rotating device in a direction along the moving direction of the housing. The hole drilling method according to claim 4 or 5, wherein it is determined that the hole is drilled. 12. A work is a multi-layer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a distance between the work and a housing supporting a rotating device for rotating a cutting tool for drilling is reduced. Moving in a fixed direction, the cutting of the conductive layer by the cutting tool is detected by the change of the reaction force in the rotating direction of the rotating device acting on the cutting tool or the moving direction of the housing, from the specified reference position to the target conductive layer position. Is smaller than the distance of the target conductive layer and is larger than the depth to the previous layer of the target conductive layer. Detection of the reaction force starts when the cutting tool reaches the specified depth, and the cutting process starts when the reaction force changes. A hole drilling method characterized by stopping. 13. A database is prepared by cutting a waste hole at a position different from a drilled hole, registering the depth of each conductive layer in the database in association with each conductive layer, and designating a target conductive layer at the time of drilling. 13. The hole drilling method according to claim 12, wherein the depth at which the detection of the reaction force is started is determined based on the corresponding depth read from. 14. When the hole is drilled, the distance between the first conductive layer and the second conductive layer is detected, and the depth to the target conductive layer is calculated by multiplying the distance by a predetermined magnification, and this depth is calculated. The hole drilling method according to claim 12, wherein the depth at which the detection of the reaction force is started is determined based on the above. 15. The work is a multi-layer wiring board in which a plurality of conductive layers and insulating layers are alternately laminated, and a distance between the work and a housing supporting a rotating device for rotating a cutting tool for drilling is reduced. The conductive layer is moved in a fixed direction, and the cutting of the conductive layer by the cutting tool is detected by sampling the change in the reaction force in the rotating direction of the rotating device or the moving direction of the housing that acts on the cutting tool. A hole drilling method characterized in that the subsequent sampling interval is made smaller than the sampling interval until the conductive layer is cut, and after the sampling interval is made small, the cutting process is stopped when the reaction force changes. .