JPH0631617A - Polishing device and its method - Google Patents

Polishing device and its method

Info

Publication number
JPH0631617A
JPH0631617A JP20845692A JP20845692A JPH0631617A JP H0631617 A JPH0631617 A JP H0631617A JP 20845692 A JP20845692 A JP 20845692A JP 20845692 A JP20845692 A JP 20845692A JP H0631617 A JPH0631617 A JP H0631617A
Authority
JP
Japan
Prior art keywords
polishing
holding member
work
work holding
rocking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP20845692A
Other languages
Japanese (ja)
Inventor
Tsutomu Sawano
勉 澤野
Takeshi Yamane
剛 山根
Hiroshi Komura
浩史 小村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Sheet Glass Co Ltd
Original Assignee
Nippon Sheet Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Co Ltd filed Critical Nippon Sheet Glass Co Ltd
Priority to JP20845692A priority Critical patent/JPH0631617A/en
Publication of JPH0631617A publication Critical patent/JPH0631617A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To shorten the polishing time by rotatably holding a work holding member on a rocking arm to face the polishing face of a surface plate, and rotating the work holding member synchronously with the rocking of the rocking arm in a polishing device of a glass plate or the like. CONSTITUTION:A work holding member 3 is rotatably provided in the free state on a support shaft 6 suspended at the tip of a rocking arm 5 to face the polishing face 2 of a surface plate 1. A motor 8 is fitted to the tip section of the rocking arm 5, and its rotation is transferred to the spur gear 11 of a rotary member 10 rotatably supported on the support shaft 6 via a spur gear 9. The work holding member 3 is connected to the rotary member 10 with a connecting pin 12. A rocking angle detecting sensor 7 is provided on the rocking shaft 4 of the rocking arm 5, and the motor 8 is driven according to the detected angle. The work holding member 3 is rotated according to the rocking angle. Only one direction of a work can be selectively polished, and fine irregularities having directivity can be polished in a short time.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はガラス板等を研磨する装
置に関し、特に液晶用基板ガラスの表面を高精度に平坦
研磨する装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for polishing a glass plate or the like, and more particularly to a device for polishing the surface of a liquid crystal substrate glass with high precision.

【0002】[0002]

【従来の技術】液晶用基板ガラスは、表面の平坦度が極
めて要求されるガラス板であり、通常、この平坦度を達
成するためにフロート式製造装置によって製造したフロ
ート板ガラスをさらに研磨装置で研磨するようにしてい
る。
2. Description of the Related Art Substrate glass for liquid crystals is a glass plate whose surface flatness is extremely required. Usually, in order to achieve this flatness, a float plate glass manufactured by a float type manufacturing apparatus is further polished by a polishing apparatus. I am trying to do it.

【0003】このような研磨装置としては、図6及び図
7に示すように研磨布又は研磨パッド等の研磨面101
を有する定盤102と、この定盤102上に対向してガ
ラス板(ワーク)Wを貼り付けるガラス保持部材103
とを備え、このガラス保持部材103は揺動アーム10
4の先端部に垂下した支軸105の下端部にフリー状態
で回転可能に取付けた所謂オスカー式研磨機がある。
As such a polishing apparatus, as shown in FIGS. 6 and 7, a polishing surface 101 such as a polishing cloth or a polishing pad is used.
And a glass holding member 103 to which a glass plate (work) W is attached so as to face the surface plate 102.
And the glass holding member 103 includes a swing arm 10
There is a so-called Oscar type polishing machine which is rotatably attached to a lower end portion of a support shaft 105 which hangs at a tip portion of No. 4.

【0004】この研磨装置においては、定盤102を一
定速度で回転させながら研磨面101に酸化セリウム等
の研磨剤を含むスリラーを流し、他方ガラス保持部材1
03に貼り付けたワークWを定盤102の研磨面101
に一定の研磨加工圧で押し付けることにより、ガラス保
持部材103はその中心を軸として自由に回転できるの
で、定盤102の回転に応じて自由回転しながら定盤1
02上で揺動する。
In this polishing apparatus, while rotating the platen 102 at a constant speed, a chiller containing an abrasive such as cerium oxide is flown on the polishing surface 101, while the glass holding member 1 is used.
03 is attached to the polishing surface 101 of the surface plate 102.
Since the glass holding member 103 can freely rotate about its center by pressing it against the surface plate 1 with a constant polishing pressure, the surface plate 1 can be freely rotated according to the rotation of the surface plate 102.
Rock on 02.

【0005】これにより、ワークWは研磨面101と研
磨剤とによって均一な研磨が行われ、ワーク表面の微小
凹凸は研磨とともに消失し、高い平坦度を有する液晶用
基板ガラスが得られる。
As a result, the work W is uniformly polished by the polishing surface 101 and the polishing agent, and the fine irregularities on the work surface disappear along with the polishing, and a liquid crystal substrate glass having high flatness is obtained.

【0006】[0006]

【発明が解決しようとする課題】ところで、液晶用基板
ガラスの素材として使用されるフロート式製造装置によ
り製造されたフロート素材は、図4に示すように、引き
上げ方向と直交する方向には微小な凹凸が存在するが、
引き上げ方向には微小凹凸は存在しない。このように微
小凹凸に方向性があるガラス素材を研磨する場合には、
上述した従来のオスカー式の研磨装置では研磨時間が長
くなる。
By the way, as shown in FIG. 4, the float material manufactured by the float type manufacturing apparatus used as the material of the substrate glass for liquid crystal has a small amount in the direction orthogonal to the pulling direction. There are irregularities,
There are no minute irregularities in the pulling direction. When polishing a glass material that has directionality in such fine irregularities,
In the above-mentioned conventional Oscar type polishing apparatus, the polishing time becomes long.

【0007】[0007]

【課題を解決するための手段】本発明は上記の課題を解
決するため、ワーク保持部材を揺動アームの揺動に同期
させて回転させ、微小凹凸に対して一定方向から研磨す
るようにした。
In order to solve the above problems, the present invention rotates a work holding member in synchronism with the swing of a swing arm to polish minute irregularities from a certain direction. .

【0008】[0008]

【作用】ワーク保持部材を揺動アームの揺動に同期させ
て回転させることによって、ワークの一方向のみを選択
的に研磨することができ、微小凹凸に方向性がある場合
の研磨時間を短縮できる。
By rotating the work holding member in synchronism with the swing of the swing arm, it is possible to selectively polish only one direction of the work and shorten the polishing time when the minute irregularities have directionality. it can.

【0009】[0009]

【実施例】以下に本発明の実施例を添付図面に基づいて
説明する。図1は本発明に係る研磨装置の正面図、図2
は同装置の平面図、図3は同装置の作用説明図、図4は
同装置で研磨するガラス素材の説明図、図5は同装置の
作用説明図である。
Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is a front view of a polishing apparatus according to the present invention, FIG.
Is a plan view of the same apparatus, FIG. 3 is an operation explanatory view of the same apparatus, FIG. 4 is an explanatory view of a glass material polished by the same apparatus, and FIG. 5 is an operation explanatory view of the same apparatus.

【0010】この研磨装置は、上面に研磨布又は研磨パ
ッド等を貼付してなる研磨面2を有する定盤1と、この
定盤1上に対向してガラス板(ワーク)Wを貼り付ける
ワーク保持部材3とを備えている。このワーク保持部材
3は、揺動軸4で軸支された揺動アーム5の先端部に垂
下した支軸6の下端部にフリー状態で回転可能に取付け
ている。
This polishing apparatus has a surface plate 1 having a polishing surface 2 formed by sticking a polishing cloth or a polishing pad on the upper surface, and a work on which a glass plate (work) W is attached so as to face the surface plate 1. And a holding member 3. The work holding member 3 is rotatably attached to a lower end portion of a support shaft 6 that is suspended from a tip end portion of a swing arm 5 that is pivotally supported by a swing shaft 4.

【0011】そして、揺動アーム5の先端部には駆動モ
ータ8を取付け、この駆動モータ8の回転を平歯車9を
介して支軸6外周に回転自在に取付けた回転部材10に
形成した平歯車11に伝達し、回転部材10を結合ピン
12を介してワーク保持部材3に結合している。また、
揺動アーム5の揺動軸4には揺動角度を検出するための
ロータリエンコーダ等からなる角度センサ13を設けて
いる。これらの部材によってワーク保持部材3を揺動ア
ーム5の揺動に同期させて回転させる。
A drive motor 8 is attached to the tip of the swing arm 5, and the rotation of the drive motor 8 is formed on a rotary member 10 rotatably attached to the outer periphery of the support shaft 6 via a spur gear 9. It is transmitted to the gear 11 and the rotating member 10 is connected to the work holding member 3 via the connecting pin 12. Also,
The swing shaft 4 of the swing arm 5 is provided with an angle sensor 13 such as a rotary encoder for detecting the swing angle. These members rotate the work holding member 3 in synchronization with the swing of the swing arm 5.

【0012】以上のように構成した研磨装置において、
定盤1を一定速度で回転させながら研磨面2に酸化セリ
ウム等の研磨剤を含むスリラーを流し、他方ワーク保持
部材3に貼り付けたワークWを定盤1の研磨面2に一定
の研磨加工圧で押し付けることによりワーク保持部材3
が揺動アーム5の揺動に応じて定盤1上で揺動する。
In the polishing apparatus configured as described above,
While rotating the platen 1 at a constant speed, a chiller containing a polishing agent such as cerium oxide is flown on the polishing surface 2, while the work W attached to the work holding member 3 is uniformly polished on the polishing surface 2 of the platen 1. Workpiece holding member 3 by pressing with pressure
Swings on the surface plate 1 in accordance with the swing of the swing arm 5.

【0013】このとき角度センサ7で揺動アーム5の揺
動位置を検出し、図3に示すように、検出した揺動アー
ム5の位置に応じて駆動モータ8を回転駆動して回転部
材10を介してワーク保持部材3を揺動アーム5の揺動
に同期させて回転させる。この場合、ワークWと研磨面
2が擦れ合う方向を常にワークWの微小凹凸が存在する
方向に一致させておけば、研磨の仕事量はワークW表面
の微小凹凸の除去のみに有効に利用されることになる。
At this time, the angle sensor 7 detects the swing position of the swing arm 5, and as shown in FIG. 3, the drive motor 8 is rotationally driven according to the detected position of the swing arm 5 to rotate the rotary member 10. The work holding member 3 is rotated in synchronism with the swing of the swing arm 5. In this case, if the direction in which the work W and the polishing surface 2 rub is consistent with the direction in which the fine irregularities of the work W always exist, the work of polishing is effectively used only for removing the fine irregularities on the surface of the work W. It will be.

【0014】つまり、図4に示すようにフロート製造装
置で製造されたフロートガラス板は、その引き上げ方向
Bと直交する方向Aには微小な凹凸が存在するが、引き
上げ方向Bには微小凹凸は存在しない。そこで、ワーク
W(フロートガラス板)と研磨面2が擦れ合う方向を引
き上げ方向Bと直交する方向Aに一致させることによ
り、有効な研磨を行うことができる。
That is, as shown in FIG. 4, the float glass plate manufactured by the float manufacturing apparatus has fine irregularities in the direction A orthogonal to the pulling direction B, but there is no fine irregularity in the pulling direction B. not exist. Therefore, by making the direction in which the work W (float glass plate) and the polishing surface 2 rub against each other coincide with the direction A orthogonal to the pulling direction B, effective polishing can be performed.

【0015】この場合、実際には、両者の方向を常に一
致させておくことは不可能であり、通常、ワークWと研
磨面2が擦れ合う速度のワークW表面の微小凹凸が存在
する方向への成分の研磨中の累積値が最大になるよう
に、ワーク保持部材3の回転と揺動アーム5の揺動とを
同期させる。
In this case, in reality, it is impossible to always match the directions of the two with each other, and normally, in the direction in which the minute unevenness on the surface of the work W exists at the speed at which the work W and the polishing surface 2 rub. The rotation of the work holding member 3 and the swing of the swing arm 5 are synchronized so that the cumulative value of the components during polishing is maximized.

【0016】ここで、具体的な実施例について説明する
と、従来のオスカー式研磨装置と本発明にかかる研磨装
置を使用して、定盤1及びワーク保持部材3の各直径、
研磨加工圧、揺動アーム5の揺動周期、ワーク保持部材
3の回転周期を表1に示すように設定し、300角、厚
み1.1mmのガラスを研磨した。
Now, a concrete example will be described. Using the conventional Oscar type polishing apparatus and the polishing apparatus according to the present invention, the diameters of the surface plate 1 and the work holding member 3 are
The polishing processing pressure, the swing cycle of the swing arm 5, and the rotation cycle of the work holding member 3 were set as shown in Table 1, and 300 square glass with a thickness of 1.1 mm was polished.

【0017】このとき、本発明にかかる研磨装置は、図
3に示すように、揺動アーム5が定盤1の中央にある時
には、微小凹凸の存在する方向Aが揺動アーム5と直交
する方向に、また揺動アーム5が定盤1の両端部にある
時は微小凹凸が存在する方向Aが揺動アーム5が定盤1
の中央にある時の揺動アーム5の方向に一致するように
した。
At this time, in the polishing apparatus according to the present invention, as shown in FIG. 3, when the swing arm 5 is at the center of the surface plate 1, the direction A in which the minute irregularities exist is orthogonal to the swing arm 5. Direction, and when the swinging arm 5 is located at both ends of the surface plate 1, the swinging arm 5 moves in the direction A in which minute irregularities exist.
The direction of the swing arm 5 when it is in the center of the is matched.

【0018】この条件のときに、ガラスと研磨面2とが
擦れ合う速度の微小凹凸が存在する方向Aへの成分の研
磨中の累積値が最大となり、結果的に表1に示すように
研磨時間は5分から4分に約1分短縮した。
Under these conditions, the cumulative value of the components during polishing in the direction A in which minute irregularities of the speed at which the glass and the polishing surface 2 rub against each other is maximized, and as a result, as shown in Table 1, the polishing time is increased. Was reduced from 5 minutes to 4 minutes by about 1 minute.

【0019】ここで、揺動角度の検出によるワーク保持
部材の回転位置の制御について説明しておく。図5を参
照して、揺動アーム5の揺動角度は数1で、ワーク保持
部材3の回転角度は数2でそれぞれ表され、上記具体的
実施例では、ワーク保持部材3の角速度α及び揺動アー
ム5の揺動の角度を決定するパラメータcはいずれもπ
/4(8秒/サイクル)である。
Here, the control of the rotational position of the work holding member by detecting the swing angle will be described. Referring to FIG. 5, the swing angle of the swing arm 5 is represented by the equation 1, and the rotation angle of the work holding member 3 is represented by the equation 2. In the above-described specific example, the angular velocity α of the work holding member 3 and The parameters c that determine the swing angle of the swing arm 5 are all π
/ 4 (8 seconds / cycle).

【0020】[0020]

【数1】 [Equation 1]

【0021】[0021]

【数2】 [Equation 2]

【0022】また、ワーク保持部材3の中心O2を原点
とする座標系のx点のある時刻tにおける位置は数3で
表され、ワーク保持部材3の中心O2は揺動中心O1を原
点とする座標系からみると数4で表され、x点の揺動中
心O1を原点とした座標系では数5で表される。
Further, the position of the point x of the coordinate system having the center O2 of the work holding member 3 as the origin at a certain time t is expressed by Equation 3, and the center O2 of the work holding member 3 has the swing center O1 as the origin. When viewed from the coordinate system, it is expressed by Equation 4, and by a coordinate system in which the swing center O1 at the point x is the origin, it is expressed by Equation 5.

【0023】[0023]

【数3】 [Equation 3]

【0024】[0024]

【数4】 [Equation 4]

【0025】[0025]

【数5】 [Equation 5]

【0026】[0026]

【発明の効果】以上に説明及び以下の(表1)からも明
らかなに本発明によれば、ワーク保持部材を揺動アーム
の揺動に同期させて回転させるようにしたので、ワーク
の一方向のみを選択的に研磨することができ、ワークの
微小凹凸に方向性がある場合の研磨時間が短縮できて生
産性が向上する。
As is apparent from the above description and the following (Table 1), according to the present invention, the work holding member is rotated in synchronization with the swing of the swing arm. Only the direction can be selectively polished, and the polishing time can be shortened when the fine irregularities of the work have directionality, thus improving the productivity.

【0027】[0027]

【表1】 [Table 1]

【0028】[0028]

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る研磨装置の正面図FIG. 1 is a front view of a polishing apparatus according to the present invention.

【図2】同装置の平面図FIG. 2 is a plan view of the device.

【図3】同装置の作用説明図FIG. 3 is an explanatory view of the operation of the device.

【図4】同装置で研磨するガラス素材の説明図FIG. 4 is an explanatory diagram of a glass material polished by the same device.

【図5】同装置の作用説明図FIG. 5 is an explanatory view of the operation of the device.

【図6】従来の研磨装置の正面図FIG. 6 is a front view of a conventional polishing apparatus.

【図7】同装置の平面図FIG. 7 is a plan view of the device.

【符号の説明】[Explanation of symbols]

1…定盤、2…研磨面、3…ワーク保持部材、4…揺動
軸、5…揺動アーム、6…支軸、7…角度センサ、8…
駆動モータ、9,11…平歯車、10…回転部材、12
…ピン。
1 ... Surface plate, 2 ... Polishing surface, 3 ... Work holding member, 4 ... Oscillating shaft, 5 ... Oscillating arm, 6 ... Spindle, 7 ... Angle sensor, 8 ...
Drive motors, 9, 11 ... Spur gears, 10 ... Rotating members, 12
…pin.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 研磨面を有する定盤と、この定盤の研磨
面に対向し、揺動アームに回転自在に支持されたワーク
保持部材とを備え、前記定盤を回転させながら前記ワー
ク保持部材に保持したワークを研磨面に押し付けて研磨
する研磨装置において、前記ワーク保持部材を前記揺動
アームの揺動に同期させて回転させる手段を設け、ワー
クの一方向のみを選択的に研磨することを特徴とする研
磨装置。
1. A surface plate having a polishing surface, and a work holding member which faces the polishing surface of the surface plate and is rotatably supported by a swinging arm, and holds the work surface while rotating the surface plate. In a polishing apparatus for polishing a workpiece held by a member against a polishing surface, means for rotating the workpiece holding member in synchronization with the swing of the swing arm is provided, and the workpiece is selectively polished in only one direction. A polishing device characterized by the above.
【請求項2】 回転する定盤の研磨面に、揺動アームに
回転自在に支持されたワーク保持部材に保持したワーク
を押し付けて研磨する研磨方法において、前記ワーク保
持部材を前記揺動アームの揺動に同期させて回転させ、
ワークの一方向のみを選択的に研磨することを特徴とす
る研磨方法。
2. A polishing method in which a workpiece held by a workpiece holding member rotatably supported by a swing arm is pressed against the polishing surface of a rotating surface plate to polish the workpiece holding member of the swing arm. Rotate in synchronization with rocking,
A polishing method which selectively polishes only one direction of a work.
JP20845692A 1992-07-13 1992-07-13 Polishing device and its method Withdrawn JPH0631617A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20845692A JPH0631617A (en) 1992-07-13 1992-07-13 Polishing device and its method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20845692A JPH0631617A (en) 1992-07-13 1992-07-13 Polishing device and its method

Publications (1)

Publication Number Publication Date
JPH0631617A true JPH0631617A (en) 1994-02-08

Family

ID=16556497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20845692A Withdrawn JPH0631617A (en) 1992-07-13 1992-07-13 Polishing device and its method

Country Status (1)

Country Link
JP (1) JPH0631617A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11865671B2 (en) 2019-04-18 2024-01-09 Applied Materials, Inc. Temperature-based in-situ edge assymetry correction during CMP
US11951589B2 (en) 2019-11-22 2024-04-09 Applied Materials, Inc. Wafer edge asymmetry correction using groove in polishing pad

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11865671B2 (en) 2019-04-18 2024-01-09 Applied Materials, Inc. Temperature-based in-situ edge assymetry correction during CMP
US11951589B2 (en) 2019-11-22 2024-04-09 Applied Materials, Inc. Wafer edge asymmetry correction using groove in polishing pad

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