JPH06314642A - Electronic component painting method - Google Patents
Electronic component painting methodInfo
- Publication number
- JPH06314642A JPH06314642A JP5127917A JP12791793A JPH06314642A JP H06314642 A JPH06314642 A JP H06314642A JP 5127917 A JP5127917 A JP 5127917A JP 12791793 A JP12791793 A JP 12791793A JP H06314642 A JPH06314642 A JP H06314642A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- conductive paste
- chip
- paste
- helium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、チップ状電子部品等の
電子部品の一部または全部に導電ペースト等の塗料を塗
布する電子部品塗装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for coating an electronic component, such as a chip-shaped electronic component, by coating a part or all of the electronic component with a paint such as a conductive paste.
【０００２】[0002]
【従来の技術】従来、チップ状電子部品の端部に端子電
極を形成する場合、チップ状電子部品の端部を導電ペー
スト浸漬し、これを乾燥した後、焼き付けるという手段
がとられている。この方法により形成された端子電極の
表面には、空気の巻き込みに起因する穴がしばしば発生
することがある。すなわち、空気を巻き込むと、それが
導電ペーストの外部に出るときに穴が形成され、そのま
ま導電ペーストが焼付けられることにより、それが穴と
なって残るものである。2. Description of the Related Art Conventionally, in the case of forming a terminal electrode at an end of a chip-shaped electronic component, the end of the chip-shaped electronic component is dipped in a conductive paste, dried, and then baked. On the surface of the terminal electrode formed by this method, holes due to air entrainment often occur. That is, when air is taken in, a hole is formed when it goes out of the conductive paste, and the conductive paste is baked as it is, so that it remains as a hole.
【０００３】端子電極にこのような穴が発生すると、外
観不良となる。また、残った穴は、半田付け時に熱が加
えられると、膨張して破裂し、いわゆる半田ボールを発
生させ、この半田ボールが絶縁不良の原因となる等の問
題がある。そこで、この穴の発生の対策として、チップ
状電子部品の端部を導電ペーストにディップした後、導
電ペーストを塗布した側を上に向けて乾燥させる方法が
とられる。この方法では、巻き込まれた空気がチップ状
電子部品の端部に塗布された導電ペーストの表面付近に
移動し、泡となって大気で出る。その後、導電ペースト
の粘性流動により、泡の痕が埋められてレベリングされ
る。こうして空気巻き込みによる穴の発生が防止され
る。If such a hole is formed in the terminal electrode, the appearance becomes poor. In addition, the remaining holes expand and burst when heat is applied during soldering, generating so-called solder balls, and these solder balls cause insulation failure. Therefore, as a countermeasure against the occurrence of the hole, a method is adopted in which the end of the chip-shaped electronic component is dipped in a conductive paste and then the side coated with the conductive paste is faced up and dried. In this method, the entrained air moves to the vicinity of the surface of the conductive paste applied to the end of the chip-shaped electronic component, and becomes bubbles in the atmosphere. Thereafter, due to the viscous flow of the conductive paste, the traces of bubbles are filled and leveling is performed. In this way, the formation of holes due to air entrapment is prevented.
【０００４】[0004]
【発明が解決しようとしている課題】しかし、この場
合、導電ペーストに巻き込まれた空気が、導電ペースト
の表面に移動し、大気に出るまでに時間がかかり、この
空気が移動している間に、導電ペーストが乾燥して流動
性を失い、レベリングによる穴埋めの効果が充分に発揮
されないという問題があった。また、空気が導電ペース
トから大気に出るまで導電ペーストの乾燥をあえて早め
ることができないため、次の工程に移行するまでに時間
がかかる。そのため、電子部品の製造時間が長くなり、
生産性を向上させるのに障害となる。However, in this case, it takes time for the air entrapped in the conductive paste to move to the surface of the conductive paste and reach the atmosphere, and while this air is moving, There has been a problem that the conductive paste is dried and loses fluidity, and the effect of filling holes by leveling is not sufficiently exerted. Further, since it is not possible to expedite the drying of the conductive paste until the air is released from the conductive paste to the atmosphere, it takes time to move to the next step. Therefore, the manufacturing time of electronic parts becomes longer,
It is an obstacle to improving productivity.
【０００５】そこで本発明は、以上の課題に鑑み、電子
部品に塗布した塗料への空気巻き込みによる穴の発生を
単時間で防止し得る塗装方法を提供するもので、これに
より、塗装部分の穴の発生を抑え、且つ生産性の向上を
図るものである。In view of the above problems, the present invention provides a coating method capable of preventing the formation of holes due to air entrainment in the coating material applied to electronic parts in a single hour. It is intended to suppress the occurrence of the above and to improve the productivity.
【０００６】[0006]
【課題を解決するための手段】すなわち、本発明では、
前記の目的を達成するため、電子部品の一部または全部
に塗料を塗布する電子部品塗装方法において、電子部品
への塗料の塗布をヘリウム雰囲気中で行うことを特徴と
する電子部品ディップ塗装方法を提供する。That is, according to the present invention,
In order to achieve the above-mentioned object, in an electronic component coating method of applying a paint to a part or all of electronic components, an electronic component dip coating method is characterized in that coating of electronic components is applied in a helium atmosphere. provide.
【０００７】[0007]
【作用】本発明により、塗料の塗布をヘリウム雰囲気中
で行うと、塗布時に塗料に巻き込まれるのはヘリウムで
ある。このヘリウムは空気より軽いので、塗料に巻き込
まれたヘリウムが空気よりも速く表面付近に移動し、塗
料の外に出る。このため、塗料の流動性が充分残ってい
るうちに塗装された塗料中の気泡が無くなるので、塗料
のレベリングによる穴埋めの効果が充分に発揮される。
また、その間の時間が短縮できるため、塗料を強制的に
早めに乾燥させて次の工程に移行できる。その結果、所
定の時間内により多くの電子部品の塗装が可能となる。According to the present invention, when the coating material is applied in a helium atmosphere, it is helium that is caught in the coating material during the application. Since this helium is lighter than air, the helium entrained in the paint will move closer to the surface and out of the paint than air will. For this reason, air bubbles in the applied paint disappear while the fluidity of the paint remains sufficiently, so that the effect of filling holes by leveling the paint is sufficiently exerted.
Further, since the time can be shortened, the paint can be forcibly dried early and the process can be shifted to the next step. As a result, more electronic parts can be coated within a predetermined time.
【０００８】[0008]
【実施例】次に、図面参照しながら、本発明の実施例に
ついて詳細に説明する。例えば、チップ形コンデンサや
チップ形抵抗器等のチップ形電子部品の両端に導電ペー
ストを塗布する場合、図２に示されたような治具が使用
される。同図に示す様に、この治具１は、複数の貫通孔
４、４…を有するシリコンゴム等の弾性体３、３を、ア
ルミ製等の枠体２に取り付けたものである。Embodiments of the present invention will now be described in detail with reference to the drawings. For example, when the conductive paste is applied to both ends of a chip type electronic component such as a chip type capacitor or a chip type resistor, a jig as shown in FIG. 2 is used. As shown in the figure, this jig 1 is one in which elastic bodies 3, 3 such as silicon rubber having a plurality of through holes 4, 4, ... Are attached to a frame body 2 made of aluminum or the like.
【０００９】図１に示すように、チップ状電子部品８
は、前記弾性体３の複数の貫通孔４、４…に嵌合され、
さらに導電ペーストを塗布しようとする一方の端部９を
所定の突出高さに揃える。そして、これら挿入固定され
たチップ状電子部品８の端部９を、ペースト槽１２の導
電ペースト１３に浸漬することで、同端部９に導電ペー
ストを塗布する。As shown in FIG. 1, a chip-shaped electronic component 8
Is fitted into the plurality of through holes 4, 4, ... Of the elastic body 3,
Further, one end portion 9 to which the conductive paste is to be applied is aligned with a predetermined protruding height. Then, the end portion 9 of the inserted and fixed chip-shaped electronic component 8 is dipped in the conductive paste 13 of the paste tank 12 to apply the conductive paste to the end portion 9.
【００１０】この場合に、本発明では、外部から仕切ら
れ、ヘリウムガス雰囲気とされたヘリウム室１４内でチ
ップ状電子部品８の導電ペースト１３へのディップを行
う。その後、治具１ごとチップ状電子部品８をヘリウム
室１４から取り出し、チップ状電子部品８の導電ペース
トが塗布された側の端部を上側に向け、塗布された導電
ペーストに巻き込まれたヘリウムを外部に放出させる。
ヘリウムは空気より軽いので、塗料に巻き込まれたヘリ
ウムが空気よりも速く表面付近に移動し、塗料の外に出
る。In this case, according to the present invention, the chip-shaped electronic component 8 is dipped into the conductive paste 13 in the helium chamber 14 which is partitioned from the outside and has a helium gas atmosphere. Then, the chip-shaped electronic component 8 together with the jig 1 is taken out from the helium chamber 14, and the end portion of the chip-shaped electronic component 8 on the side where the conductive paste is applied faces upward, so that the helium caught in the applied conductive paste is removed. Release it to the outside.
Since helium is lighter than air, helium entrained in the paint will move closer to the surface and out of the paint faster than air.
【００１１】その後、塗布された導電ペーストを乾燥す
る。さらに、チップ状電子部品８の他方の端部にも導電
ペーストを塗布する場合は、チップ状電子部品８を前記
貫通孔４の反対側に押し出し、チップ状電子部品８の他
端部９を突出させる。その後、同様にしてこの他端部９
に導電ペースト１３を塗布し、ヘリウムを放出し、乾燥
させる。そして、これら塗布された導電ペーストを焼き
付けることにより、外部電極が形成される。After that, the applied conductive paste is dried. Furthermore, when the conductive paste is applied to the other end of the chip-shaped electronic component 8, the chip-shaped electronic component 8 is pushed out to the opposite side of the through hole 4 and the other end 9 of the chip-shaped electronic component 8 is projected. Let Then, similarly, this other end 9
Conductive paste 13 is applied to the substrate, helium is released, and dried. Then, an external electrode is formed by baking the applied conductive paste.
【００１２】次に、本発明の具体例について説明する。
１．６ｍｍ×０．８ｍｍ×０．８ｍｍサイズの素子、つ
まり前述のチップ状電子部品８を用意し、これを前述の
ような治具１に保持し、その一端を弾性体３の通孔４か
ら突出させた。そして、ヘリウム室１４内のヘリウム雰
囲気下で、チップ状電子部品８の一方の端部を、粘度６
００ポアズ（ずり速度１ｓｅｃ-1）の銀ペースト中に深
さ３００μｍまで浸漬し、引き上げた。その後、このチ
ップ状電子部品８を、導電ペーストが塗布された端部側
を上向きにし、室温で２時間放置し、空気中で乾燥し
た。その後、同様の作業をチップ状電子部品の他方の端
部について行った。こうして両端に導電ペーストを塗布
したチップ状電子部品８を大気中８００℃で１０分間焼
付けした。Next, a specific example of the present invention will be described.
An element having a size of 1.6 mm × 0.8 mm × 0.8 mm, that is, the above-mentioned chip-shaped electronic component 8 is prepared, and is held by the jig 1 as described above, and one end thereof is provided with the through hole 4 of the elastic body 3. Made to stick out from. Then, in a helium atmosphere in the helium chamber 14, one end of the chip-shaped electronic component 8 is set to have a viscosity of 6
It was dipped to a depth of 300 μm in a silver paste of 00 poise (shear rate 1 sec −1 ) and pulled up. Thereafter, the chip-shaped electronic component 8 was left at room temperature for 2 hours with the end side coated with the conductive paste facing upward, and dried in air. Then, the same operation was performed on the other end of the chip-shaped electronic component. The chip-shaped electronic component 8 with the conductive paste applied to both ends in this way was baked at 800 ° C. for 10 minutes in the atmosphere.
【００１３】比較例として、導電ペーストのディップを
大気中で行った以外は、前述と同様にしてチップ状電子
部品８の両端に導電ペーストを塗布し、乾燥し、焼付け
た。本発明の実施例及び比較例のチップを各々５０００
個づつ取り出し、直径５０μｍ以上か或は深さ１５μｍ
以上の穴の発生頻度を調べたところ、比較例では１．２
２％であったが、本発明例では、０．０６％であった。As a comparative example, the conductive paste was applied to both ends of the chip-shaped electronic component 8 in the same manner as described above except that the conductive paste was dipped in the atmosphere, dried and baked. The chips of the example of the present invention and the chip of the comparative example were each made into 5000
Individually take out and have a diameter of 50 μm or more or a depth of 15 μm
When the frequency of occurrence of the above holes was examined, it was 1.2 in the comparative example.
Although it was 2%, in the present invention example, it was 0.06%.
【００１４】なお、以上の実施例は、チップ状電子部品
の端部に導電ペーストをディップ塗装する場合の例であ
るが、本発明は、ラジアルリード部品に絶縁塗装を施す
場合や、チップ状電子部品の中間部に絶縁塗料を塗布す
る場合等、気泡による穴の発生を防止する必要がある電
子部品の塗装全般に適用できることは明らかである。も
ちろん、塗布手段もディップに限らず、ディスペンサに
よる塗布等、一般の塗布手段にも適用することができ
る。The above embodiment is an example in which the conductive paste is dip-coated on the end portion of the chip-shaped electronic component, but the present invention is applied to the case where the radial lead component is subjected to the insulation coating or the chip-shaped electronic component. It is obvious that the present invention can be applied to general painting of electronic parts in which it is necessary to prevent the formation of holes due to air bubbles, such as the case where an insulating paint is applied to the middle part of the parts. Of course, the application means is not limited to the dip, but can be applied to general application means such as application with a dispenser.
【００１５】[0015]
【発明の効果】以上説明した通り、本発明によれば、電
子部品に塗布した塗料への空気巻き込みによる穴の発生
を単時間で防止し得る塗装方法を提供することができ、
これにより、塗装部分の穴の発生を抑え、且つ塗装の時
間の短縮化と生産性の向上を図ることができるようにな
る。As described above, according to the present invention, it is possible to provide a coating method capable of preventing the generation of holes due to air entrainment in the coating material applied to electronic parts in a single hour.
As a result, it is possible to suppress the occurrence of holes in the coated portion, shorten the coating time, and improve the productivity.
【図１】本発明の実施例によりチップ状電子部品に塗料
を塗布する状態の要部断面図である。FIG. 1 is a cross-sectional view of essential parts in a state where a coating material is applied to a chip-shaped electronic component according to an embodiment of the present invention.
【図２】同実施例に使用される治具の例を示す要部断面
斜視図である。FIG. 2 is a perspective sectional view of an essential part showing an example of a jig used in the same embodiment.
８ チップ状電子部品 ９ チップ状電子部品の端部 １３ 導電ペースト（塗料） １４ ヘリウム室 8 Chip Electronic Components 9 Edges of Chip Electronic Components 13 Conductive Paste (Paint) 14 Helium Chamber
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｃ 17/00 Ｚ 8834−5Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Office reference number FI technical display location H01C 17/00 Z 8834-5E
Claims (1)
する電子部品塗装方法において、電子部品への塗料の塗
布をヘリウム雰囲気中で行うことを特徴とする電子部品
塗装方法。1. An electronic part coating method for applying a paint to a part or all of an electronic part, wherein the coating of the electronic part is performed in a helium atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5127917A JPH06314642A (en) | 1993-04-30 | 1993-04-30 | Electronic component painting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5127917A JPH06314642A (en) | 1993-04-30 | 1993-04-30 | Electronic component painting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06314642A true JPH06314642A (en) | 1994-11-08 |
Family
ID=14971840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5127917A Withdrawn JPH06314642A (en) | 1993-04-30 | 1993-04-30 | Electronic component painting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06314642A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111482049A (en) * | 2020-04-21 | 2020-08-04 | 安徽天通精电新科技有限公司 | Noise processing device for semiconductor patch |
-
1993
- 1993-04-30 JP JP5127917A patent/JPH06314642A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111482049A (en) * | 2020-04-21 | 2020-08-04 | 安徽天通精电新科技有限公司 | Noise processing device for semiconductor patch |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000704 |