JPS5870862A - Method for decorating outer surface of electronic parts with resin - Google Patents

Abstract

PURPOSE:To apply partial painting to predetermined parts of plural electronic parts certainly and inexpensively, by a method wherein the part of the electronic parts is masked by immersion painting and the whole of the electronic parts are subsequently subjected to immersion painting. CONSTITUTION:In a first process, an object formed by fixing lead members 5 etc. protruded from plural capacitor elements 2 etc. to a strip plate is introduced into a liquid water repellent composition such as a silicone resin except the upper surface thereof so as to immerse only the parts of each condenser elements 2 etc. and, after drawn up, subjected to heat treatment to form a water repellent film 11. In a second process, each capacitor elements 2 etc. are immersed in a high viscosity resin material 12 such as an epoxy resin to a definite depth to embed anode leads 1 etc. When said capacitor elements are drawn up, the resin material 12 is not adhered to the water repellent film 11 but adhered only to the upper surfaces of the capacitor elements 2 etc. and the peripheries of the anode leads 1 etc. in an almost uniform conical appearance.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to the packaging of chip-type electronic components.

In recent years, with the miniaturization of nausea products, electronic components such as capacitors and resistors tend to be chip-shaped with a leadless structure, where the component body is directly soldered to a printed circuit board or other I/C. be. This chip-type electronic component has the characteristics of being small, inexpensive, and has a high mounting density on a printed circuit board. The anode lead (2) is a porous capacitor element (part wood) made by press-molding and sintering a metal powder having a large amount of F@ on a part of the outer periphery of the anode lead (1). (14) Tea is an electrode lead layer such as silver paste formed on the circumferential surface of the capacitor element 12) via an oxide layer and a semiconductor layer.
) is a solder layer formed on the magnetic pole drawer /ii +31 by the solder dipping method, and the polarity is 4 poles. 16) is a 4-pole external lead member (6) connected by welding to the tip of 44 lead Il+ output from capacitor element (2).
) is an exterior resin material that seals the part of the anode lead (1) that protrudes from the capacitor element (21). Exterior resin material (6) is the base of the rfi anode lead (1) that protrudes from the capacitor element (2). It is formed for the purpose of reinforcing the mechanical strength of the part and improving the outer wall and moisture resistance.

This solid electrolytic capacitor has a solder layer (4
) and outer d1≦A part of the lead member (5) is mounted, for example, on the printed conductor of the printed circuit board (7) by soldering to the hinge.

By the way, the chip cedar solid il requires a partial resin outer surface! Currently, as a method for forming the exterior resin material 16) of a capacitor, a method is adopted in which a constant voltage liquid resin material is dropped onto the exterior portion of the capacitor element (2) to be coated with resin. F4=l has been set.

However, this commercial operation is limited in scope: q ≦ minutes, and the exterior is set in January, but the capacitor elements 12 + 121... of the Gi summer attack are collectively covered with resin. j
- The 6-patch area is sticky and the workability is very poor. In the dripping method of 1, the outer isosugi shape of the exterior horizontal moon material (6) is not safe,
I am worried that this will damage both product value.

The present invention is based on the initial steps of the resin-cladding method for magnetic products, and the desired portion (i?
We provide the current resin exterior method with this exterior. Hereinafter, the present invention will be explained with reference to the drawings.
61 Kaneki Hatsukawa's method is 111; situation? Example of a husband
In the picture of the housewife, I have an older brother.

First, a band-shaped component (8) shown in FIG. 2 is prepared. This is 7
External lead member of solid electrolytic capacitor [61161
The tips of ... are aligned and fixed at regular intervals. The e7i has a single external lead member +61161... fixed to the strip plate (9), and an anode lead +11111... protruding from the capacitor element tel +... is welded to each of these. , each capacitor element (211!lΦ...) was subjected to the following steps to form an electrode lead layer (3) and a solder layer (4).

Next, support the strip plate (9) of the strip component ($), and
As shown in the figure, each capacitor element f! l ill
...Fluorine based fat or silicone m except for the top surface of @
The solder layer (4), which is the surface of the non-IU1i1 exterior part except for the top surface of each capacitor element 121 F2)... Water-repellent coatings Uυ are formed on the surface (see causes of ringing).

After that, as shown in Figure WI41, each capacitor element 121121... in the strip component (8) is placed inside a high viscosity st resin lI21 such as epoxy resin with an anode lead C.
0(l)9... is immersed in the housing at a certain depth.

After analysis time A, each capacitor element 121+
21 @ @ @ t- When it is pulled up from the resin material t121, it does not adhere to the resin material 11zI/i water repellent coating 11'') as shown in factor J, and the capacitor element +21
121... and around the anode lead 1ll(1) and fist, the chevron shape is almost unified and adheres in a telescopic appearance.

If this is heated and cured, it becomes the exterior resin material (6) shown in the figure. When the resin sheathing is completed, each outer s1-
The board member (5) is cut and separated to obtain individual solid electrolytic capacitors. Note that the water-repellent coating 1111 deposited on the solder layer (4) of the capacitor element (21) is extremely thick and will not pose much of a problem if left as is.
To remove it, wash it off with a special solvent while it is still in the band-shaped part (8).

Next, we will explain a specific example of the above-mentioned resin packaging method.@ A capacitor element made of Kuntal powder (the height of the wire is &sha, straight 4 is J, Jmm, an anode lead made of Tankle wire (1
) has a diameter of 0.5 mm, the water-repellent member is immersed in a fluororesin under the trade name Diasuya-7i4 manufactured by Daikin Corporation for 3 seconds, then pulled up and heat-treated. After that, thixoto a with a viscosity of 1ooooocpa
It is immersed in an epoxy resin with bulk properties for 70 seconds, then pulled out and heat treated. Then, a plurality of exterior resin materials (6) (6)... having an attractive shape as shown in FIG. It was divinely proven. In addition, if it is necessary to remove the water-repellent coating formed on the capacitor element (2), it can be easily removed by washing it with Daikin Corporation's product name Dia-Nle-Vent. It can be applied not only to the m-resin exterior of solid electrolytic capacitors, but also to other chip-shaped electronic components such as resistors, and partial resin exteriors of non-chip-shaped electronic components. Further #i
In addition to the water-repellent material in the form of a solution, water-repellent resin powder mixed with water, an organic solvent, etc. can also be used.As explained above, according to the present invention, a chip-shaped electronic component can be used. This makes it easy to apply resin to narrow areas such as the casing, and it is also possible to process multiple electronic components at once, greatly improving the efficiency of the resin packaging process. Furthermore, since the dipping method is employed, the appearance of the exterior resin material can be made uniform and the commercial value can be improved.

[Brief explanation of drawings]

Figure 1 shows the -
A cross-sectional view showing an example, Figure 1 is a front view of a band-shaped component consisting of a plurality of electronic components in Figure 7, and Figures IJ to 3 are operations in each resin packaging process to explain the method of the present invention. It is an explanatory diagram. +ue*Water repellent el [material, Ill a e Water repellent af&
, u2゜0 resin material. ″ Jiang Fu Xiu I No. 1
Figure W43 Figure

Claims (1)

[Claims] A step of forming a water-repellent film on the surface of the non-skin-greasy exterior part of the electronic component by dipping it in a liquid water-repellent material;
An electronic component characterized by comprising the step of: immersing a portion of the electronic component on which a water-repellent coating is to be formed and a resin exterior portion in a desired resin material to adhere the resin material only to the resin exterior portion. Resin exterior is perfect.