JPH02177413A - Manufacture of electronic component - Google Patents
Manufacture of electronic componentInfo
- Publication number
- JPH02177413A JPH02177413A JP33082488A JP33082488A JPH02177413A JP H02177413 A JPH02177413 A JP H02177413A JP 33082488 A JP33082488 A JP 33082488A JP 33082488 A JP33082488 A JP 33082488A JP H02177413 A JPH02177413 A JP H02177413A
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- external lead
- coated
- protective
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 110
- 239000011347 resin Substances 0.000 claims abstract description 110
- 239000000463 material Substances 0.000 claims abstract description 106
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 239000011253 protective coating Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 abstract description 31
- 230000001681 protective effect Effects 0.000 abstract description 28
- 239000007787 solid Substances 0.000 abstract description 10
- 238000004140 cleaning Methods 0.000 abstract description 4
- 229910052715 tantalum Inorganic materials 0.000 abstract description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 4
- 238000007598 dipping method Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011295 pitch Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子部品の製造方法に関し、詳しくはディップ
型固体タンタルコンデンサ等のディップ型電子部品の製
造において、部品本体を樹脂ディップ処理して保護及び
外装被覆する方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing electronic components, and more specifically, in manufacturing dip-type electronic components such as dip-type solid tantalum capacitors, the component body is protected by resin dipping treatment. and a method for exterior coating.
〔従来の技術］
タンタルコンデンサ等の固体電解コンデンサの具体的構
造例を第９図に示し説明する。同図において、（１）は
コンデンサエレメントで、タンタル等の弁作用を有する
金属粉末を円柱状に加圧成形して多孔質に焼結し、この
焼結体に誘電体層、半導体層（図示せず）を積層したも
のである。（２）は丸棒状の金属線をその基端部を屈曲
させたＬ字状の陽極引出し用外部リード（以下第１の外
部リードと称す）で、その屈曲部が、コンデンサエレメ
ント（１）に植立した丸棒状の弁作用を有する金属線か
らなる陽掻リード（３）に溶接固定される。（４）は丸
棒状の金属線からなる略ストレート形状の陰橿引出し用
外部リード（以下第２の外部リードと称す）で、その基
端部が、コンデンサエレメント（１）の外周面に形成し
た電極引出し層（５）に半田付けあるいは導電性接着剤
により固定される。（６）はコンデンサエレメント（１
）の外周面をディップ処理により被覆した低粘度のエポ
キシ系樹脂等の保護樹脂材で、上記コンデンサエレメン
ト（１）の外表面に存在するピンホールを被覆すると共
に、後述の外装樹脂材との間に介在して熱的ストレスを
緩和する。（７）はコンデンサエレメント（１）を含む
主要部分をディップ処理により被覆した高粘度のエポキ
シ系樹脂等の外装樹脂材である。[Prior Art] A specific structural example of a solid electrolytic capacitor such as a tantalum capacitor is shown in FIG. 9 and will be described. In the figure, (1) is a capacitor element, which is made by press-molding metal powder such as tantalum that has a valve action into a cylindrical shape and sintering it into a porous structure.This sintered body is covered with a dielectric layer, a semiconductor layer ( (not shown) are laminated. (2) is an L-shaped anode lead external lead (hereinafter referred to as the first external lead) made by bending the base end of a round bar-shaped metal wire, and the bent part is connected to the capacitor element (1). It is welded and fixed to a raised positive reed (3) made of a metal wire having a valve action in the shape of a round rod. (4) is a substantially straight external lead for drawing out the shade (hereinafter referred to as the second external lead) made of a round metal wire, the base end of which is formed on the outer peripheral surface of the capacitor element (1). It is fixed to the electrode lead layer (5) by soldering or conductive adhesive. (6) is the capacitor element (1
) is coated with a protective resin material such as a low-viscosity epoxy resin by dip treatment to cover the pinholes present on the outer surface of the capacitor element (1), and also to protect the outer peripheral surface between the capacitor element (1) and the exterior resin material described below. mediate to alleviate thermal stress. (7) is an exterior resin material such as a high-viscosity epoxy resin that coats the main parts including the capacitor element (1) by dipping.
上記固体電解コンデンサの製造では、第１Ｏ図に示すよ
うに金属製の帯板（８）に多数の第１の外部リード（２
）（２）・・・を定ピツチで固定し、その屈曲部にコン
デンサエレメント（１）（１）・・・の陽掻リード（３
）（３）・・・を溶接固定した第１のテーピング部材（
９）を用意する、この第１のテーピング部材（９）に対
して、絶縁性を有する帯板（ｌＯ）に多数の第２の外部
リード（４）（４）・・・を定ピツチで植設した第２の
テーピング部材（１１）を用意する。そして、第１のテ
ーピング部材（９）に第２のテーピング部材（１１）を
重ね合わせて位置決めし、第２の外部リード（４）（４
）・・・をコンデンサエレメント（１）（１）・・・の
外周面の電極引出し層（５）（５）・・・に半田付けす
る。その後、上記第１、第２のテーピング部材（９）
（１１）を上下逆さにして低粘度の保護樹脂材（６）
内に浸漬し、このディップ処理後、第１１図に示すよう
に第１、第２のテーピング部材（９） （１１）を正
規の姿勢に復帰させてコンデンサニレメン１−（１）（
１）・・・に被着した保護樹脂材（６）（６）・・・を
乾燥させる。この保護樹脂材（６）の形成後、第１２図
に示すように第１、第２のテーピング部材（９） （
１１）を再度上下逆さにして高粘度の外装樹脂材（７）
内に浸漬し、その後、第１３図に示すようにコンデンサ
エレメント（１）（１）・・・を含む主要部分に被着し
た外装樹脂材（７）（７）・・・を乾燥させる。そして
、帯板（８） （１０）から第１、第２の外部リード
（２）・・・（４）・・・を切断分離することにより第
９図に示す固体電解コンデンサを得る。In manufacturing the solid electrolytic capacitor described above, as shown in Figure 1O, a large number of first external leads (2
) (2)... are fixed at a fixed pitch, and the positive lead (3) of the capacitor element (1) (1) is attached to the bent part.
) (3) The first taping member (
9), and for this first taping member (9), a large number of second external leads (4) (4)... are planted at a fixed pitch on an insulating strip (lO). A second taping member (11) is prepared. Then, the second taping member (11) is superposed and positioned on the first taping member (9), and the second external lead (4) (4
)... are soldered to the electrode lead-out layers (5) (5)... on the outer peripheral surfaces of the capacitor elements (1) (1).... After that, the first and second taping members (9)
(11) upside down and low viscosity protective resin material (6)
After this dipping treatment, the first and second taping members (9) (11) are returned to their normal positions as shown in FIG.
1) Dry the protective resin material (6) (6) attached to.... After forming the protective resin material (6), the first and second taping members (9) (
Turn 11) upside down again and remove the high viscosity exterior resin material (7).
Then, as shown in FIG. 13, the exterior resin materials (7) (7) attached to the main parts including the capacitor elements (1), (1), etc. are dried. The solid electrolytic capacitor shown in FIG. 9 is then obtained by cutting and separating the first and second external leads (2), . . . (4), .
ところで、前述した固体電解コンデンサの従来製法では
、コンデンサエレメント（１）（１）・・・を保護樹脂
材（６）でディップ処理により被覆するに際し、第１０
図に示すように第１．第２のテーピング部材（９）
（１１）を上下逆さにして保護樹脂材（６）内に浸漬し
た後、引き上げる。この状態、即ち上記第１、第２のテ
ーピング部材（９） （１１）を上下逆さにした状態
のままで上記保護樹脂材（６）を乾燥させようとすると
、保護樹脂材（６）が低粘度であるため流動し易く、コ
ンデンサエレメント（１）（１）・・・の頭部側（第１
０図の姿勢では下端側）での樹脂量が多くなって最終的
に外装樹脂材（７）にて被覆した時に外形寸法が高く、
規格外れになるという不都合が発生する。そこで、保護
樹脂材（６）を乾燥させるに際しては、第１１図に示す
ように、第１、第２のテーピング部材（９）（１１）を
コンデンサエレメント（１）（１）・・・の頭部側を上
方に向けた状態で保持している。By the way, in the conventional manufacturing method of the solid electrolytic capacitor described above, when coating the capacitor elements (1), (1), etc. with the protective resin material (6) by dip treatment, the 10th
As shown in the figure, the first. Second taping member (9)
(11) is turned upside down and immersed in the protective resin material (6), and then pulled out. If you try to dry the protective resin material (6) in this state, that is, with the first and second taping members (9) and (11) upside down, the protective resin material (6) will become low. Because of its viscosity, it flows easily, and the head side (first
In the posture shown in Figure 0, the amount of resin at the bottom end is large, and when it is finally covered with the exterior resin material (7), the external dimensions are high.
This causes the inconvenience of non-standardization. Therefore, when drying the protective resin material (6), as shown in FIG. It is held with the side facing upward.
しかしながら、前述したように保護樹脂材（６）が低粘
度であり、しかも第２の外部リード（４）（４）・・・
が略ストレート形状であるため、保護樹脂材（６）が第
２の外部リード（４）（４）・・・の基端部外周面を伝
わって垂れ下がる。この状態で外装樹脂材（７）でコン
デンサエレメント（１）（１）・・・を含む主要部分を
被覆した場合、第１４図に示すように外装樹脂材（７）
から保護樹脂材（６）の垂れ下がり部分（６ａ）が露呈
する。このような固体電解コンデンサの第１、第２の外
部リード（２）（４）をプリント基板のり一ド挿通穴に
挿入して導電パターンと半田付けしようとしても、第２
の外部リード（４）と導電パターン間に保護樹脂材（６
）の垂れ下がり部分（６ａ）が介在するため、接触不良
となって電気的な接続が困難となる。However, as mentioned above, the protective resin material (6) has a low viscosity, and the second external leads (4) (4)...
have a substantially straight shape, the protective resin material (6) hangs down along the outer circumferential surface of the base end of the second external lead (4) (4). In this state, when the main parts including the capacitor elements (1), (1), etc. are covered with the exterior resin material (7), the exterior resin material (7)
The hanging portion (6a) of the protective resin material (6) is exposed. Even if you try to insert the first and second external leads (2) and (4) of such a solid electrolytic capacitor into the printed circuit board glue hole and solder them to the conductive pattern, the second
A protective resin material (6) is placed between the external lead (4) and the conductive pattern.
), the presence of the hanging portion (6a) causes poor contact and makes electrical connection difficult.
そこで、本発明は上記問題点に鑑みて提案されたもので
、その目的とするところは、簡便な手段により保護樹脂
材の垂れ下がり部分を除去し得る電子部品の製造方法を
提供することにある。SUMMARY OF THE INVENTION The present invention was proposed in view of the above-mentioned problems, and an object of the present invention is to provide a method of manufacturing an electronic component in which the hanging portion of the protective resin material can be removed by a simple means.
本発明における上記目的を達成するための技術的手段は
、基端部が屈曲形状をした第１の外部リード、及び第１
の外部リードに平行配置した略ストレート形状の第２の
外部リードを部品本体に接続し、その部品本体を低粘度
の第１樹脂材でディップ処理により保護被覆した後、上
記部品本体を含む主要部分を高粘度の第２樹脂材でディ
ップ処理により外装被覆する電子部品の製造方法におい
て、第１樹脂材のディップ処理に先立って、少なくとも
第２の外部リードを第３樹脂材にて下地被覆し、第１樹
脂材による保護被覆後、上記第３樹脂材を溶剤で洗浄し
て第１樹脂材の垂れ下がり部分を剥離除去するようにし
た電子部品の製造方法である。Technical means for achieving the above object of the present invention include a first external lead whose proximal end has a bent shape;
A substantially straight-shaped second external lead arranged parallel to the external lead of the component body is connected to the component body, and after the component body is protectively coated with a low-viscosity first resin material by dip treatment, the main portion including the component body is In the method of manufacturing an electronic component, the outer lead is coated with a high-viscosity second resin material by dip treatment, and prior to the dip treatment of the first resin material, at least the second external lead is undercoated with a third resin material, In this method of manufacturing an electronic component, after the protective coating with the first resin material, the third resin material is washed with a solvent to peel off and remove the hanging portion of the first resin material.
本発明方法では、第２の外部リードに下地被覆された第
３樹脂材は、部品本体を保護被覆した第１樹脂材が第２
の外部リードで垂れ下がって不所望部分に被着した場合
、上記第１樹脂材による保護被覆後、溶剤にて洗浄除去
され、第１樹脂材が第２の外部リードに対゛して浮いた
状態となるため、上記不所望部分での第１樹脂材を剥離
容易にする。In the method of the present invention, the third resin material with which the second external lead is coated with the base coat is the same as the first resin material with which the component body is protected with the second resin material.
If the external lead hangs down and adheres to an undesired part, the first resin material is washed away with a solvent after being covered with the protective first resin material, and the first resin material is left floating relative to the second external lead. Therefore, the first resin material can be easily peeled off at the undesired portion.
本発明方法の一実施例を第１図乃至第８図を参照しなが
ら説明する。尚、第９図乃至第１４図と同一部分には同
一参照符号を付して重複説明は省略する。An embodiment of the method of the present invention will be described with reference to FIGS. 1 to 8. Note that the same parts as in FIGS. 9 to 14 are given the same reference numerals, and redundant explanation will be omitted.
まず、第１図に示すように絶縁性を有する帯板（１０）
に多数の第２の外部リード（４）（４）・・・を定ピツ
チで植設した第２のテーピング部材（１１）を用意する
。そして、第２の外部リード（４）（４）・・・を部品
本体であるコンデンサエレメント（１）（１）・・・に
接続するに先立って、上記第２のテーピング部材（１１
）を上下逆さにしてその第２の外部リード（４）（４）
・・・をフロン系樹脂等の第３樹脂材である下地樹脂材
（１２）内に浸漬し、このディップ処理により第２図に
示すように第２の外部リード（４）（４）・・・を下地
樹脂材（１２）で被覆する。First, as shown in Fig. 1, a strip plate (10) having insulation properties is used.
A second taping member (11) is prepared in which a large number of second external leads (4), (4), etc. are implanted at regular pitches. Then, before connecting the second external leads (4) (4)... to the capacitor elements (1) (1)... which are the component bodies, the second taping member (11
) upside down and its second external lead (4) (4)
... is immersed in a base resin material (12) which is a third resin material such as a fluorocarbon resin, and through this dipping treatment, the second external leads (4) (4)... are formed as shown in FIG.・Cover with base resin material (12).
この下地樹脂材（１２）の被覆処理後、第３図に示すよ
うに金属製の帯板（８）に多数の第１の外部リード（２
）（２）・・・を定ピツチで植設し、その屈曲部にコン
デンサエレメント（１）（１）・・・の陽極リード（３
）（３）・・・を溶接固定した第１のテーピング部材（
９）を用意し、前述の第２のテーピング部材（１１）に
第１のテーピング部材（９）を重ね合わせて位置決めす
る。この状態で第２の外部リード（４）（４）・・・を
コンデンサエレメント（Ｌ）（１）・・・の外周面の電
橋引出しＪｉ（５）（５）・・・に半田付は固定する。After coating with this base resin material (12), as shown in FIG. 3, a large number of first external leads (2
) (2)... are planted at a fixed pitch, and the anode lead (3) of the capacitor element (1) (1)... is placed at the bent part.
) (3) The first taping member (
9) is prepared, and the first taping member (9) is superposed and positioned on the second taping member (11) described above. In this state, solder the second external leads (4) (4)... to the electrical bridge drawer Ji (5) (5)... on the outer peripheral surface of the capacitor element (L) (1)... Fix it.
この時、上記第２の外部リード（４）（４）・・・は下
地樹脂材（１２）にて下地被覆されているが、半田付は
時の熱により第２の外部リード（４）（４）・・・の半
田付は部分の下地樹脂材（１２）は除去されるので問題
ない。At this time, the second external leads (4), (4), etc. are coated with a base resin material (12), but the heat of soldering causes the second external leads (4) ( 4) There is no problem with soldering because the underlying resin material (12) is removed.
この半田付は後、第１、第２のテーピング部材（９）
（１１）を上下逆さにして低粘度のエポキシ系樹脂等
の第１樹脂材である保護樹脂材（６）内に浸漬し、この
ディップ処理後、第４図に示すように第１、第２のテー
ピング部材（９） （１１）を正規の姿勢に復帰させ
てコンデンサエレメント（１）（１）・・・に被着した
保護樹脂材（６）（６）・・・を乾燥させる。この時、
保護樹脂材（６）（６）・・・が低粘度であり、しかも
第２の外部リード（４）（４）・・・が略ストレート形
状であるため、上記保護樹脂材（６）（６）・・・が第
２の外部リード（４）（４）・・・を伝わって垂れ下が
る。この保護樹脂材（６）（６）・・・の被着形成後、
第５図に示すように第１、第２のテーピング部材（９）
（１１）を上下逆さにしてフロン液等の溶剤（１３
）内に浸漬し、第２の外部リード（４）（４）・・・に
被着した下地樹脂材（１２） （１２）・・・を上記
溶剤（１３）で洗浄除去する。これにより第６図に示す
ように、第２の外部リード（４）（４）・・・における
保護樹脂材（６）（６）・・・が、外部リード（４）（
４）・・・の外周面から浮いた状態となり、保護樹脂材
（６）（６）・・・の第２の外部リード（４）（４）・
・・における垂れ下がり部分（６ａ） （６ａ）・・
・を、ブラシ等の弱い力により容易に剥離除去すること
ができる。尚、上記溶剤（１３）は、下地樹脂材（１２
）のみを溶かし、保護樹脂材（６）を溶かすことはない
。After this soldering, the first and second taping members (9)
(11) is turned upside down and dipped into a protective resin material (6) which is a first resin material such as a low viscosity epoxy resin, and after this dipping treatment, the first and second The taping members (9) (11) are returned to their normal positions and the protective resin materials (6) (6) attached to the capacitor elements (1) (1) are dried. At this time,
Since the protective resin materials (6) (6)... have a low viscosity and the second external leads (4) (4)... have a substantially straight shape, the protective resin materials (6) (6)... )... are transmitted through the second external leads (4) (4)... and hang down. After forming the protective resin material (6) (6)...,
As shown in Fig. 5, the first and second taping members (9)
Turn (11) upside down and use a solvent such as Freon liquid (13).
), and the base resin material (12) (12)... adhering to the second external leads (4) (4)... is washed and removed with the solvent (13). As a result, as shown in FIG. 6, the protective resin material (6) (6)... in the second external leads (4) (4)...
4) The second external lead (4) (4) of the protective resin material (6) (6) is lifted from the outer peripheral surface of the protective resin material (6) (6).
Hanging part (6a) (6a)...
・can be easily peeled off and removed using a weak force such as a brush. In addition, the above solvent (13) is used for the base resin material (12).
), but not the protective resin material (6).
この下地樹脂材（１２）の洗浄により第〉の外部リード
（４）（４）・・・のコンデンサエレメント（１）（１
）・・・への接触状態が不安定となるおそれがあるので
、その後、半田リフローにより第２の外部リード（４）
（４）・・・のコンデンサエレメント（１）（１）・・
・への半田付は状態を確実にして内部接触を良好なもの
とする。By cleaning this base resin material (12), the capacitor elements (1) (1) of the external leads (4) (4)...
)... Since there is a risk that the contact state with
(4) Capacitor element (1) (1)...
・Solder to ensure good condition and good internal contact.
第７図、第２の外部リード（４）（４）・・・の保護樹
脂材（６）（６）・・・の垂れ下がり部分（６ａ）
（６ａ）・・・を除去した状態を次に第１、第２のテー
ピング部材（９） （１１）を上下逆さにして高粘度
のエポキシ系樹脂等の第２樹脂材である外装樹脂材（７
）内に浸漬する。この時、前述した第２の外部リード（
４）（４）・・・の下地樹脂材（１２） （１２）・
・・が除去されたあとの隙間には、外装樹脂材（７）（
７）・・・が充填されるので問題ない。このディップ処
理後、第８図に示すように第１、第２のテーピング部材
（９）（１１）を正規の姿勢に復帰させてコンデンサニ
レメン）（１）（１）・・・を含む主要部分に被着した
外装樹脂材（７）（７）・・・を乾燥させる。Fig. 7, hanging portion (6a) of the protective resin material (6) (6)... of the second external lead (4) (4)...
After removing (6a)..., the first and second taping members (9) and (11) are turned upside down and the exterior resin material ( 7
). At this time, the second external lead (
4) (4)... Base resin material (12) (12)
The exterior resin material (7) (
7) There is no problem because... is filled. After this dipping treatment, as shown in FIG. 8, the first and second taping members (9) and (11) are returned to their normal positions, and the Dry the exterior resin material (7) (7) attached to the portion.
そして、最後に帯板（８） （１０）から第１、第２
の外部リード（２）・・・（４）・・・を切断分離する
ことによりディップ型の固体電解コンデンサを得る。Finally, from the strips (8) and (10), the first and second
By cutting and separating the external leads (2)...(4)..., a dip type solid electrolytic capacitor is obtained.
尚、上記実施例では、第２の外部リード（４）が完全に
ストレート形状の場合について説明したが、コンデンサ
エレメント（１）の固着部分のみを若干屈曲させた電子
部品においても同様の効果が得られる。In the above embodiment, the second external lead (4) is completely straight, but the same effect can be obtained in an electronic component in which only the fixed portion of the capacitor element (1) is slightly bent. It will be done.
また、上記実施例では、第２の外部リード（４）のみに
下地樹脂材（１２）を被覆する場合について説明したが
、本発明はこれに限定されることなく、第１の外部リー
ド（２）にも下地樹脂材（１２）を被覆するようにして
もよい、ただし、上記第１の外部リード（２）は基端部
が屈曲形状をしているため、第２の外部リード（４）と
比較して保護樹脂材（６）が垂れ下がることは稀であり
、保護樹脂（６）で被覆する積掻的な必要性はほとんど
ないが、第１、第２のテーピング部材（９） （１１
）を結合状態でも、第２の外部リード（４）に保護樹脂
材（６）を浸漬被覆できるという製造上の便利さがある
。Further, in the above embodiment, the case where only the second external lead (4) is coated with the base resin material (12) is described, but the present invention is not limited to this, and the first external lead (2) is coated with the base resin material (12). ) may also be coated with the base resin material (12).However, since the base end of the first external lead (2) has a bent shape, the second external lead (4) may also be coated with the base resin material (12). The protective resin material (6) rarely hangs down compared to the first and second taping members (9) (11
), there is a manufacturing convenience in that the second external lead (4) can be coated with the protective resin material (6) by dip coating even when the second external lead (4) is connected.
本発明方法によれば、第１樹脂材のディップ処理に先立
って、少なくとも第２の外部リードを第３樹脂材で下地
被覆し、第１樹脂材の保護被覆後、第３樹脂材を溶剤で
洗浄して第１樹脂材の垂れ下がり部分を除去するように
したから、プリント基板等への実装時、上記プリント基
板の導電パターンとの間に樹脂材が介在することなく、
外部リードの導電パターンへの良好なＷＣ触が確実に得
られ、製品歩留まりが大幅に向上すると共に信転性の向
上が図れる。According to the method of the present invention, before dipping the first resin material, at least the second external lead is coated with a third resin material, and after the first resin material is protectively coated, the third resin material is coated with a solvent. Since the hanging portions of the first resin material are removed by cleaning, there is no resin material interposed between the conductive pattern of the printed circuit board and the like when mounting on a printed circuit board, etc.
Good WC contact with the conductive pattern of the external lead is reliably obtained, and product yield is greatly improved and reliability is improved.
第１図乃至第８図は本発明に係る電子部品の製造方法の
一実施例を説明するためのもので、第１図は第３樹脂材
被覆前の状態を示す第２のテーピング部材の正面図、第
２図は第３樹脂材被覆後の状態を示す第２のテーピング
部材の断面図、第３図は第１樹脂材被覆前の状態を示す
第１、第２のテーピング部材の断面図、第４図は第１樹
脂材被覆後の乾燥時状態を示す第１、第２のテーピング
部材の断面図、第５図は第３樹脂材洗浄前の状態を示す
第１、第２のテーピング部材の断面図、第６図は第３樹
脂材洗浄後の乾燥時の状態を示す第１、第２のテーピン
グ部材の断面図、第７図は第２樹脂材被覆前の状態を示
す第１、第２のテーピング部材の断面図、第８図は第２
樹脂材被覆後の乾燥時の状態を示す第１、第２のテーピ
ング部材の断面図である。
第９図はディップ型固体電解コンデンサの具体例を示す
断面図、第１０図は第１樹脂材被覆前の状態を示す第１
、第２のテーピング部材の断面図、第１１図は第１樹脂
材被覆後の乾燥時の状態を示す第１、第２のテーピング
部材の断面図、第１２図は第２樹脂材被覆前の状態を示
す第１、第２のテーピング部材の断面図、第１３図は第
２樹脂材被覆後の乾燥時の状態を示す第１、第２のテー
ピング部材の断面図、第１４図は第１樹脂材が垂れ下が
った状態で第２樹脂材で被覆したディップ型固体電解コ
ンデンサを示す断面図である。
（１）−・・部品本体（コンデンサエレメント）、（２
）−・〜第１の外部リード、
（４）・−第２の外部リード、
（６）・−第１樹脂材、（７）・−第２樹脂材、（１２
）−第３樹脂材、（１３）−・溶剤。
特 許 出 願 人 関西日本電気株式会社代
理 人 江 原 省 吾第８図
第４図
第１
第２図
第５図
第６
第７図
第８図
第９図
第１４図1 to 8 are for explaining one embodiment of the method for manufacturing an electronic component according to the present invention, and FIG. 1 is a front view of the second taping member showing the state before being coated with the third resin material. 2 is a sectional view of the second taping member showing the state after being coated with the third resin material, and FIG. 3 is a sectional view of the first and second taping members showing the state before being covered with the first resin material. , FIG. 4 is a sectional view of the first and second taping members showing their dry state after being coated with the first resin material, and FIG. 5 is a sectional view of the first and second taping members showing their state before being cleaned with the third resin material. 6 is a sectional view of the first and second taping members showing their dry state after cleaning with the third resin material, and FIG. 7 is a sectional view of the first taping member showing their state before being coated with the second resin material. , a sectional view of the second taping member, FIG.
FIG. 3 is a cross-sectional view of the first and second taping members showing their dry state after being coated with a resin material. FIG. 9 is a sectional view showing a specific example of a dip-type solid electrolytic capacitor, and FIG. 10 is a cross-sectional view showing a state before coating with the first resin material.
, a sectional view of the second taping member, FIG. 11 is a sectional view of the first and second taping members showing their dry state after being coated with the first resin material, and FIG. 12 is a sectional view of the first and second taping members before being coated with the second resin material. 13 is a cross-sectional view of the first and second taping members showing the state when they are dried after being coated with the second resin material; FIG. FIG. 3 is a cross-sectional view showing a dip-type solid electrolytic capacitor covered with a second resin material with the resin material hanging down. (1)--Part body (capacitor element), (2
)--first external lead, (4)--second external lead, (6)--first resin material, (7)--second resin material, (12
) - third resin material, (13) - solvent. Patent applicant: Kansai NEC Co., Ltd.
Figure 8 Figure 4 Figure 1 Figure 2 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 14
Claims (1)
第１の外部リードに平行配置した略ストレート形状の第
２の外部リードを部品本体に接続し、その部品本体を低
粘度の第１樹脂材でディップ処理により保護被覆した後
、上記部品本体を含む主要部分を高粘度の第２樹脂材で
ディップ処理により外装被覆する電子部品の製造方法に
おいて、 第１樹脂材のディップ処理に先立って、少なくとも第２
の外部リードを第３樹脂材にて下地被覆し、第１樹脂材
による保護被覆後、上記第３樹脂材を溶剤で洗浄して第
１樹脂材の垂れ下がり部分を剥離除去するようにしたこ
とを特徴とする電子部品の製造方法。(1) Connect a first external lead with a bent base end and a second external lead with a substantially straight shape arranged parallel to the first external lead to a component body, and connect the component body to a low-viscosity In a method for manufacturing an electronic component, the main parts including the main part of the component are coated with a first resin material through a dip treatment, and then the main parts including the component body are coated with a high viscosity second resin material through a dip treatment. At least the second
The external leads of the invention are coated with a third resin material as a base coat, and after the protective coating with the first resin material, the third resin material is washed with a solvent and the hanging portions of the first resin material are peeled off and removed. Characteristic manufacturing method for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33082488A JPH02177413A (en) | 1988-12-28 | 1988-12-28 | Manufacture of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33082488A JPH02177413A (en) | 1988-12-28 | 1988-12-28 | Manufacture of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02177413A true JPH02177413A (en) | 1990-07-10 |
Family
ID=18236955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33082488A Pending JPH02177413A (en) | 1988-12-28 | 1988-12-28 | Manufacture of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02177413A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0487256A (en) * | 1990-07-31 | 1992-03-19 | Shin Kobe Electric Mach Co Ltd | Manufacture of sealed lead-acid battery |
| JP2008185998A (en) * | 2007-01-31 | 2008-08-14 | Optrex Corp | Tool for application of protection agent |
-
1988
- 1988-12-28 JP JP33082488A patent/JPH02177413A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0487256A (en) * | 1990-07-31 | 1992-03-19 | Shin Kobe Electric Mach Co Ltd | Manufacture of sealed lead-acid battery |
| JP2008185998A (en) * | 2007-01-31 | 2008-08-14 | Optrex Corp | Tool for application of protection agent |
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