JPH06310389A - Manufacture of ceramic electronic component - Google Patents

Abstract

PURPOSE:To provide a method of manufacturing a ceramic electronic component, wherein a ceramic green sheet of continuous length can be cut into pieces each of certain length through a comparatively simple apparatus. CONSTITUTION:A ceramic green sheet 11 of continuous length is wound on the outer circumferential face 12a of a cylindrical drum 12, the drum 12 is rotated to transfer the ceramic green sheet 11, a cutting edge 13a is moved towards the outer circumferential face 12a adjacent to a point at which the green sheet 11 is separated from the outer circumferential face 12a to cut off the ceramic green sheet 11, and a ceramic electronic component is formed by the use of a cut ceramic green sheet piece 11a through various processes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component using a ceramic green sheet, and more particularly, to a ceramic electronic component having an improved process of cutting a long ceramic green sheet into a predetermined size. Manufacturing method.

[0002]

2. Description of the Related Art An example of a method of manufacturing a ceramic electronic component such as a multilayer capacitor or a ceramic multilayer substrate will be described by taking a multilayer capacitor as an example.

First, a ceramic slurry containing a dielectric ceramic powder is prepared, and the ceramic slurry is molded by a doctor blade method or an extrusion molding method,
Obtain a ceramic green sheet. Next, the obtained ceramic green sheet is cut into a predetermined shape, and internal electrodes are printed on the upper surface of the cut ceramic green sheet. After that, a plurality of ceramic green sheets with internal electrodes printed are laminated, and an appropriate number of ceramic green sheets with no internal electrodes printed are laminated on top and bottom, and then pressure-bonded in the thickness direction to form a laminate. obtain.
The obtained laminated body is fired at a predetermined temperature to obtain a ceramic sintered body, and external electrodes are formed on the outer surface of the ceramic sintered body.

By the way, in the production of the above-mentioned ceramic electronic component, a long-sized ceramic green sheet formed into a sheet is often cut into a certain size. Conventionally, such a long ceramic green sheet has been cut using a cutting device shown in FIG.

That is, the long ceramic green sheet 1 is placed on the sheet holding portion 2. Sheet holder 2
Has a large number of suction holes 3 opened on the upper surface 2a, as shown in a perspective view in FIG. The suction hole 3 is connected to suction means (not shown), and by driving the suction means, the ceramic green sheet 1 placed on the upper surface 2a is sucked and held.

Returning to FIG. 6, by moving the sheet holding portion 2 from the position indicated by the imaginary line to the position indicated by the solid line,
The ceramic green sheet 1 is moved. After that, the ceramic green sheet 1 is pressed with the pressers 4a and 4b.
, And the cutting blade 5 is lowered in the direction of the arrow in the figure to cut the ceramic green sheet 1. next,
Retreat the seat holder 2 to the position shown by the imaginary line in FIG.
The above series of steps is repeated again.

As described above, in the conventional method for cutting a ceramic green sheet, the cutting blade 5 cuts the ceramic green sheet of a fixed length by keeping the moving distance of the sheet holding portion 2 constant.

[0008]

However, since the sheet holding portion 2 holds the ceramic green sheet 1 by suction, the ceramic green sheet 1 is held.
Is thin, especially when a thinner ceramic green sheet is required such as a large-capacity capacitor, the green sheet portion near the suction hole 3 may be wrinkled and deformed by suction holding.

Further, since the ceramic green sheet 1 sucked and held is fed by the sheet holding portion 2, the deformed portion near the suction hole is deformed more during the feeding and the ceramic green sheet 1 meanders. There is also a problem that the lengthwise dimension of the ceramic green sheet 1 varies due to the pulling force applied during feeding.

Further, the above ceramic green sheet 1
When cutting, the ceramic green sheet had to be temporarily stopped at a certain position. Therefore,
Since it is necessary to feed the ceramic green sheet 1 intermittently, it is difficult to increase the speed of the cutting process of the ceramic green sheet 1. In addition, the ceramic green sheet 1 could not be accurately cut into a predetermined size without providing a feeding mechanism and a highly accurate positioning mechanism. Therefore, an expensive device must be used to cut the ceramic green sheet.

An object of the present invention is to provide a method of manufacturing a ceramic electronic component including a process capable of accurately cutting a long ceramic green sheet into a predetermined size by using a relatively simple device. Especially.

[0012]

The present invention relates to a method of manufacturing a ceramic electronic component, in which a long ceramic green sheet is directly or indirectly wound around the outer peripheral surface of a cylindrical drum, and the drum is rotated to rotate the ceramic. The step of feeding the green sheet, and the ceramic green sheet is supported directly or indirectly on the outer peripheral surface of the drum by moving the cutting blade toward the outer peripheral surface of the drum in the vicinity of the portion away from the outer peripheral surface of the drum. The method includes a step of cutting the ceramic green sheet and a step of manufacturing a ceramic electronic component using the cut ceramic green sheet.

The present invention is characterized by the step of feeding and cutting a long ceramic green sheet,
The step of obtaining a ceramic electronic component using the ceramic green sheet obtained by cutting can be performed by using a conventionally known and commonly used ceramic lamination / integral firing technique.

The ceramic green sheet may be directly wound and supported on the outer peripheral surface of the drum, or the ceramic green sheet laminated on the carrier film may be wound on the outer peripheral surface of the drum from the carrier film side. May be supported. That is, in the latter case, the ceramic green sheet is indirectly wound around and supported by the outer peripheral surface of the drum.

[0015]

In the method of manufacturing the ceramic electronic component of the present invention,
The long ceramic green sheet is directly or indirectly wound around the outer peripheral surface of a cylindrical drum, and the ceramic green sheet is fed by rotating the drum. That is, the ceramic green sheet is not sucked and held, but is supported on the drum by its own weight and the frictional force between the ceramic green sheet and the drum outer peripheral surface. Therefore, when the long ceramic green sheet is conveyed, it is difficult for the force necessary for holding the ceramic green sheet to be partially applied to the ceramic green sheet.

Moreover, the ceramic green sheet is cut by the cutting blade in the vicinity of the portion away from the outer peripheral surface of the drum. Therefore, just by making the time interval for moving the cutting blade toward the outer peripheral surface of the drum constant,
It is possible to reliably cut a ceramic green sheet of a certain length.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be clarified by describing embodiments of the present invention with reference to the drawings.

FIG. 1 is a front sectional view for explaining a step of cutting a long ceramic green sheet in a method for manufacturing a ceramic electronic component according to an embodiment of the present invention.

Long ceramic green sheet 11
Is formed by molding a ceramic slurry by a doctor blade method, an extrusion molding method, or the like. The elongated ceramic green sheet 11 is wound around the outer peripheral surface 12a of the cylindrical drum 12 as shown in the drawing, and is rotated in the clockwise direction as shown by the arrow to be fed in the direction of arrow A shown in the drawing. To be

As shown in the perspective view of FIG. 2, the drum 12 has flange portions 12b and 12b at both ends. The flange portions 12b and 12b are the ceramic green sheets 1
It has a larger diameter than the main body portion on which the outer peripheral surface 12a around which 1 is wound is formed. Flange portion 12b, 12
b is provided to prevent the positional deviation of the conveyed ceramic green sheet 11 in the width direction. Therefore, the distance between the flange portions 12b and 12b is almost equal to the width of the ceramic green sheet 11, or the ceramic green sheet 11 is not separated. It is made slightly wider than the width of the seat 11.

Since the flange portions 12b, 12b are provided to prevent the positional deviation of the ceramic green sheet 11 in the width direction when the ceramic green sheet 11 is conveyed, the flange portions 12b, 12b are provided in the lateral direction of the ceramic green sheet 11 near both ends of the drum 12. When the guide plate that restricts the movement to the is provided, the flange portions 12b and 12b are not necessarily provided.

The outer peripheral surface 12a of the drum 12 may be made of a material that supports the ceramic green sheet 11 and can be conveyed as described later. The material is not particularly limited, but may be, for example, metal or synthetic material. Composed of resin.

Returning to FIG. 1, in this embodiment, the long ceramic green sheet 11 is the outer peripheral surface 12 of the drum 12.
It is directly wound around a and conveyed in the direction of arrow A. The ceramic green sheet 11 can be conveyed by rotating the drum 12 in the clockwise direction by a rotation drive source (not shown).

On the other hand, a cutter 13 is disposed near the drum 12 near the portion B where the ceramic green sheet 11 is about to leave the outer peripheral surface 12a of the drum 12. The cutter 13 has a cutting blade 13a extending toward the drum 12, and the cutting blade 13a has a rotating roller 13a.
It is attached to b. The rotating roller 13b is shown in FIG.
As shown in, the roller 13c is mounted concentrically with a roller 13c having a smaller diameter, and the roller 13c is configured to be rotatable together with the rotating roller 13b.

A rotating shaft 12c that rotates with the drum 12 is connected to the drum 12. Rotating shaft 12c
Is rotated by a rotary drive source such as a motor (not shown), and the rotary shaft 12c and the roller 13
A belt 16 is stretched over the roller c via rollers 14 and 15. Therefore, by rotating the drum 12 by a rotary drive source such as a motor, the belt 16
The rotation driving force transmitted via the roller 13c,
As a result, the rotating roller 13b is rotated counterclockwise as shown by the arrow in the figure.

The sizes of the rotary shaft 12c and the roller 13c are selected so that the peripheral speed of the tip of the cutting blade 13a of the cutter 13 of FIG. 1 and the peripheral speed of the outer peripheral surface 12a of the drum 12 coincide with each other.

On the other hand, behind the cutter 13, a cutter moving device 17 is arranged. Cutter moving device 17
As shown in an enlarged schematic view in FIG. 4, it is normally arranged behind the cutter 13 and apart from the cutter 13, and when the ceramic green sheet 11 is cut by the cutting blade 13 a, that is, When the cutting blade 13a coincides with the portion B in FIG. 1, the cutter 14 can be moved toward the drum 12 as shown by an arrow D in FIG. The moving device 17 can be configured by using an appropriate reciprocating drive source such as an air cylinder or a hydraulic cylinder.

Further, in the cutter 13, not only is the cutting blade 13a rotatable in the clockwise direction with the rotation of the rotary roller 13b as described above, but the moving device 17 causes the cutting blade 13a to rotate relative to the drum 12. It is configured so that it can be approached and separated from each other.

Further, the timing for cutting the ceramic green sheet 11 by the cutting blade 13a, that is, the cutting blade 13a is positioned in the direction toward the portion B, and the moving device 17 is used.
Thus, the timing at which the cutting blade 13a is moved to the drum 12 side is determined according to the cutting length of the ceramic green sheet 11.

In this embodiment, as described above, the ceramic green sheet 11 is wound around the outer peripheral surface 12a of the drum 12 and supported by the outer peripheral surface 12a of the drum 12, and the ceramic green sheet 11 of a constant length is conveyed. When it is done, move the cutter 13 with the moving device 17,
The ceramic green sheet 11 is cut by the cutting blade 13a. Next, the cutter 13 is retracted by the moving device 17, and the cutting blade 13a is rotated at the same peripheral speed as the drum 12. On the other hand, when the ceramic green sheet 11 is conveyed by the target length after the cutting, the cutting blade 13a is moved toward the portion B again, and the next predetermined length of the ceramic green sheet is cut.

The cut ceramic green sheet portions 11a are stacked in the storage box 18 as shown in FIG. 5, for example. In FIG. 5, 19 indicates a base, and a guide 20 having an inclined surface inclined toward the drum 12 side is attached to the upper surface of the base 19. A step is formed in the base 19 below the guide 20, and the storage box 18 is arranged on the step. Therefore, the cut ceramic green sheet portion 11 a is adjusted in inclination by the guide 20 and is stacked in the storage box 18. However, the handling method of the cut ceramic green sheet portion 11a is
The method is not limited to the method shown in FIG. 5, and an appropriate method can be used. For example, by arranging a conveyer conveyor below the guide 20, the cut ceramic green sheets of a certain length are sequentially conveyed, and the cut ceramic green sheets are processed at the other end of the conveyer. You may collect.

In the method for manufacturing a ceramic electronic component of this embodiment, the ceramic green sheet 11 is directly wound around the outer peripheral surface 12a of the cylindrical drum 12 as described above, supported and conveyed. Therefore, when the long ceramic green sheet 11 is conveyed, it is not necessary to suck and hold the ceramic green sheet as in the conventional example. Therefore,
When the ceramic green sheet 11 is conveyed, it is very unlikely that the ceramic green sheet 11 will be deformed due to a wrinkle or a force necessary for holding, so that the dimensional accuracy of the cut ceramic green sheet can be effectively improved.

Further, in the method of this embodiment, the drum 12
The ceramic green sheet 11 is cut while the ceramic green sheet 11 is continuously conveyed by rotating. Therefore, since the ceramic green sheet 11 can be cut without stopping the conveyance, the efficiency of the cutting process of the ceramic green sheet can be increased.

Although the cutter 13 is rotated clockwise in the above embodiment, it may be rotated counterclockwise, or the cutter 13 does not necessarily need to be rotated.

Although the ceramic green sheet 11 is wound around the outer peripheral surface 12a of the drum 12 in the range of the central angle of 180 ° of the drum 12 in FIG. 1, the friction between the green sheet 11 and the outer peripheral surface 12a. When the force is large, the winding angle may be appropriately changed within the range of 120 ° to 180 °.

Further, in the above-described embodiment, the ceramic green sheet 11 is directly wound around the outer peripheral surface 12a of the drum 12 and conveyed, but is supported on a carrier film made of a synthetic resin film such as a polyethylene terephthalate film. Alternatively, the ceramic green sheet may be wound around the outer peripheral surface 12a of the drum 12 and conveyed. In that case, it is usually wound on the outer peripheral surface 12a from the carrier film side, but the winding angle in this case is appropriately determined within a range of up to 180 ° depending on the frictional force between the carrier film and the outer peripheral surface 12a. .

The position at which the ceramic green sheet 11 is cut by the cutting blade 13a of the cutter 13 is
In the above-described embodiment, the ceramic green sheet 11 is located directly above the portion away from the outer peripheral surface 12a, but if the ceramic green sheet 11 is up to the portion away from the outer peripheral surface 12a, the cutting blade 13a will be near any position of that portion. Can be abutted and cut.

Further, in the above embodiment, the cutter 13 is rotated so that the peripheral speed of the cutting blade 13a of the cutter 13 matches the peripheral speed of the drum 12, whereby the cutting is smoothly performed. The rotation speed of the cutting blade 13a does not necessarily have to match the peripheral speed of the outer peripheral surface 12a of the drum 12.

In this embodiment, the ceramic green sheet portion 11a having a constant length is obtained as described above.
The step of specifically manufacturing a ceramic electronic component using the can be performed according to a conventionally known method for manufacturing a laminated ceramic electronic component.

[0040]

According to the present invention, the ceramic green sheet is directly or indirectly wound around the outer peripheral surface of the cylindrical drum, and the ceramic green sheet is conveyed by rotating the drum. Therefore, during conveyance for cutting, the ceramic green sheet is unlikely to be deformed by suction or the like.

Moreover, at the time of cutting, since the ceramic green sheet is cut by moving the cutting blade on the outer peripheral surface of the drum toward the outer peripheral surface of the drum, the time interval for moving the cutting blade toward the outer peripheral surface of the drum is set. It is possible to surely obtain a ceramic green sheet having excellent dimensional stability just by making it constant.

Therefore, by using the ceramic green sheet excellent in dimensional stability as described above, it is possible to provide a highly accurate and highly reliable ceramic laminated electronic component.

[Brief description of drawings]

FIG. 1 is a front cross-sectional view for explaining a process of cutting a ceramic green sheet in an example.

FIG. 2 is a perspective view illustrating a drum.

FIG. 3 is a schematic front view for explaining a rotating mechanism of a drum and a cutter.

FIG. 4 is a schematic partially cutaway front view for explaining a configuration in which a cutting blade is moved toward an outer peripheral surface of a drum.

FIG. 5 is a front cross-sectional view for explaining the step of storing the cut ceramic green sheet.

FIG. 6 is a front sectional view for explaining a conventional ceramic green sheet cutting device.

FIG. 7 is a perspective view showing a holding portion used to convey a conventional ceramic green sheet.

[Explanation of symbols]

 11 ... Ceramic green sheet 12 ... Drum 12a ... Outer peripheral surface 13 ... Cutter 13a ... Cutting blade

Claims (1)

[Claims] 1. A step of winding a long ceramic green sheet directly or indirectly on an outer peripheral surface of a cylindrical drum, and rotating the drum to feed the ceramic green sheet, wherein the ceramic green sheet is the outer peripheral surface of the drum. A portion of the ceramic green sheet which is directly or indirectly supported on the outer peripheral surface of the drum by moving the cutting blade toward the outer peripheral surface of the drum in the vicinity of the portion away from And a step of manufacturing a ceramic electronic component by using the ceramic green sheet described above.