JPH06304958A - Resin molding device - Google Patents

Abstract

PURPOSE:To manufacture an excellent piece by a device wherein a resin package part can be molded in an excellent molding way and warp of the resin package does not occur. CONSTITUTION:In a resin molding device wherein a pot 18 is communicated with a cavity 14 by a resin passage 22 and a melted resin is sent with pressure from the pot 18 to the cavity 14 so as to mold the resin, a heat resisting space is provided around the resin passage 22 in order to restrain heat conduction from a main body of a mold to the resin passage 22. For the heat resisting space, for example, a heat resisting groove 26 is provided on the outside of the resin passage 22. Thus, a product having a thin resin package can be molded ideally.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding device, and more particularly to a resin molding device which improves the moldability of a resin package portion.

[0002]

2. Description of the Related Art A transfer mold device is used for manufacturing a resin-sealed semiconductor device. In this mold device, a resin tablet is put into a pot and the molten resin is pumped into a cavity by a plunger to fill it. By doing so, resin molding is performed. In the resin-sealed semiconductor device, an epoxy thermosetting resin is generally used, and the pot and the molding die are heated to a predetermined temperature for resin molding in order to improve moldability.

The cavity and the pot are connected by a resin passage, and the resin passage portion just before connecting to the cavity narrows the resin passage as a gate, and the resin cured in the resin passage after the resin package is cured is easily removed from the resin package. It can be separated into. Also, in the resin molding process, after the resin is filled from the resin passage into the cavity, the resin package should be molded through a pressure-holding process in order to form it with good moldability so that voids and resin unfilling do not occur I have to.

[0004]

The above pressure holding step is a step of hardening the resin while applying a constant pressure to the resin filled in the cavity, and the resin is supplemented according to the shrinkage of the resin, and the resin package Has the meaning of being molded with good moldability. Therefore, the resin should have fluidity in the pressure-holding step. However, the resin in the resin passage gradually hardens depending on the heating temperature of the mold, and in particular, the gate portion is blocked by the heat curing effect more strongly than others because the cross-sectional area of the resin passage is small. In this case, the gate is closed, so that the pressure holding effect on the cavity does not work.

By the way, with the recent demand for resin-sealed semiconductor devices having a very thin resin package, the gate portion must be thinned accordingly. There is. For this reason, the fluidity of the resin during resin filling is limited, and the resin is easily thermoset at the gate, and the pressure-holding function does not function effectively, resulting in poor moldability of the resin package and warping of the resin package. It is easy to cause problems such as.

As a method of improving the fluidity of the resin in the resin passage, there is a method of cooling the mold in the resin passage portion so as to suppress the thermosetting of the resin (Japanese Patent Laid-Open No. 56-44639).
issue). In this method, a flow path for allowing a cooling fluid to flow is provided in the vicinity of the resin passage portion so that the temperature in the vicinity of the resin passage is lowered so that the curing reaction of the resin material is not promoted. However, in the case of this method, there is a problem in that the structure of the mold device is complicated because the cooling fluid is passed through.

The present invention has been made to solve the above problems, and the object thereof is to be effectively used for manufacturing a resin-sealed product having a thin resin package. A resin molding device capable of manufacturing a resin-sealed product with good moldability, simplifying the structure of a mold, facilitating its manufacture, and handling the device. Is to provide.

[0008]

The present invention has the following constitution in order to achieve the above object. That is, in the resin molding apparatus for connecting the pot and the cavity by the resin path and for forming the resin by pressure-feeding the molten resin from the pot to the cavity, in order to suppress heat conduction from the main body of the molding die to the resin path, A heat insulating space is provided around the resin path. Further, a heat insulating groove for heat insulation is provided on a side of the resin path on the clamp surface of the molding die. Further, the upper mold and the lower mold are characterized in that dust is provided as a heat insulating space above and below the resin path.

[0009]

By providing a heat insulating space around the resin passage, heat conduction from the mold body to the resin passage is suppressed, and when the resin is sealed with a thermosetting resin, the fluidity of the resin in the resin passage is improved. The resin can be held to a certain degree, and the cavity is preferably filled with the resin and pressed, so that the resin can be appropriately sealed without the resin being unfilled. The heat conduction can be suppressed by providing the heat insulating groove and the dust, and the heat exchange amount can be controlled by controlling the heat capacity around the resin passage, which enables suitable resin molding.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a sectional view showing the structure of an embodiment of a resin molding apparatus according to the present invention. 10 in the figure
Reference numerals a and 10b are a lower mold and an upper mold, and cavities 14 for molding the molded product 12 are provided on the opposing surfaces thereof. Reference numerals 16a and 16b are a lower insert block and an upper insert block installed adjacent to the lower mold 10a and the upper mold 10b.

The pot 1 is provided in the lower insert block 16a.
8 is provided, and a plunger 20 is slidably arranged in the pot 18. The upper portion of the pot 18 and the cavity 14 are communicated with each other by a resin passage 22, and a gate 22a is provided at a communication end communicating with the cavity 14. Incidentally, 24a, 24b, 24c and 24d are ejector pins. In this embodiment, four ejector pins are provided in the vicinity of the corner of the cavity 14 so that the upper die and the lower die face each other.

Although the resin passage 22 is provided on the lower mold side in this embodiment, the resin passage 22 and the pot 18 and the cavity 1 are shown in FIG.
4 shows a plane layout of No. 4. As shown in the figure, the resin path 22 is the pot 1
8 through the lower insert block 16a and the lower mold 10a to communicate with the cavity 14, and one corner of the cavity 14 communicates with the cavity 14. The pot 18, the resin passage 22, the cavity 14 and the like are arranged in the same manner as in a normal transfer molding apparatus, but in the resin molding apparatus of this embodiment, in order to suppress heat conduction to the resin passage 22, heat insulation is provided around the resin passage 22. It is characterized by providing a space for use.

In FIG. 2, reference numeral 26 denotes a heat insulating groove which is provided as a space for heat insulation in the outer peripheral portion of the pot 18 and a side surface portion of the resin passage 22 so as to surround the resin passage 22 and the outer edge portion of the pot 18 slightly apart from each other. is there. As shown in FIG. 1, the heat insulating groove 26 is provided in a groove shape on the clamp surface of both the upper mold and the lower mold.

Further, as shown in FIG. 1, dusts 28a and 28b as heat insulating spaces are provided above and below the resin path 22 extending from the pot 18 to the cavity 14 side. The dusts 28a and 28b are formed by hollowing out upper and lower portions of the lower die 10a, the upper die 10b, the lower insert block 16a and the upper insert block 16b where the resin passage 22 is disposed.

When resin molding is performed using the resin molding apparatus of the present embodiment, the heat conduction to the resin path 22 is suppressed by the heat insulating effect of the heat insulating groove 26 and the dust 28a, 28b, and the thermosetting property is obtained. It becomes possible to suitably maintain the fluidity of the resin in the resin passage 22 when the resin is molded using the resin. Since the heat capacity of the peripheral portion of the resin passage 22 can be reduced by providing the heat insulating groove 26 and the dusts 28a and 28b, the amount of heat exchange in the resin passage 22 can be suppressed and the resin flow in the resin passage 22 can be suppressed. It becomes possible to control sex.

When resin molding is performed using the resin molding apparatus of the above-described embodiment, first, the molded article 12 is set on the lower mold 10a with the mold opened, and the resin tablet is put into the pot 18. Clamp the mold. here,
A thermosetting resin is used as the resin tablet. Next, the plunger 20 is pushed to move the pot 18
The molten resin therein is filled in the cavity 14 through the resin passage 22, and when the resin is filled in the cavity 14, the filling step is followed by the pressure holding step. In the pressure-holding step, the resin is cured while applying pressure with the plunger 20.

In the case of the resin molding apparatus of this embodiment,
Insulation groove 26 and dust 2 provided on the outer side of the resin path 22
Heat conduction from the mold body to the resin passage 22 is suppressed by the heat insulation effect of 8a and 28b, the curing reaction of the resin in the resin passage 22 is suppressed, and the fluidity of the resin in the resin passage 22 can be maintained. Become. With such a structure of the die structure, even if the resin path 22 and the gate 22a are formed in a considerably narrow width, the pressure holding effect can be effectively exerted.
As a result, it is possible to prevent the occurrence of voids in the resin package portion and the non-filling of the resin, and it is possible to suitably perform resin molding.

Further, since the resin filling property from the resin passage 22 is good, the influence of the shrinkage of the resin package portion can be alleviated and the warp of the resin package can be prevented. Further, since it is possible to take a long time until the resin passage is closed, it becomes possible to select and control the molding conditions of the resin until the resin is cured. Finely detailed resin molding is possible by selectively adjusting filling, void generation, and wiring flow. In this way, it can be suitably used for resin encapsulation of a product having a particularly thin resin package, and a good product can be manufactured.

Further, in the resin molding apparatus of this embodiment, the heat insulating space for insulating the resin passage from the die body is provided in the die as described above, so that the fluidity of the resin in the resin passage is maintained. Therefore, it is possible to secure the fluidity of the resin without complicating the mold structure, enabling suitable resin molding without incurring the manufacturing cost of the mold, and improving the handleability of the resin molding device. There is also an advantage that it becomes possible. It should be noted that the method of providing the heat insulating space in the molding die can be appropriately used for a multi-pot type resin molding device, a projection molding type resin molding device, etc., and should be designed appropriately according to the resin-sealed product. You can

[0020]

According to the resin molding apparatus of the present invention, as described above, the resin package portion can be resin-molded with good moldability, and a product having a suitable resin package portion with high resin density can be obtained. be able to. Further, it is possible to manufacture a non-defective product without warping of the resin package, and it is possible to suitably use the product having a thin resin package.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration of each part of a resin molding device.

FIG. 2 is an explanatory diagram showing a planar arrangement of resin paths, pots, and cavities.

[Explanation of symbols]

 10a Lower mold 10b Upper mold 12 Molded product 14 Cavity 16a Lower insert block 16b Upper insert block 18 Pot 20 Plunger 22 Resin path 22a Gate 26 Insulation groove 28a, 28b Dirt

Claims (3)

[Claims] 1. In a resin molding apparatus for connecting a pot and a cavity by a resin path and forcing a molten resin from the pot to the cavity to perform resin molding, heat conduction from a main body of a molding die to the resin path is suppressed. In order to do so, a resin molding device characterized in that a heat insulating space is provided around the resin path. 2. The resin molding apparatus according to claim 1, wherein a heat insulating groove for heat insulation is provided laterally of the resin path on the clamp surface of the molding die. 3. The resin molding apparatus according to claim 1, wherein the upper mold and the lower mold are provided with dust as a heat insulating space above and below the resin passage.