JPH06304871A - Polishing grinding wheel - Google Patents

Abstract

PURPOSE:To attain dressing of a grinding wheel surface by dispersedly arranging abrasive grains, abrasive grains of applying a metal film eluted by electrolysis and a fiber material having conductivity in a binding agent with synthetic resin serving as the binding agent. CONSTITUTION:In a resinoid grinding wheel using synthetic resin 2 for a binding material in a polishing grinding wheel 1, conductivity is provided by a fiber material 6, and a metal film 4 of an abrasive grain 5 is eluted by electrolytic inprocess dressing by electrolysis. In the case of providing conductivity in the polishing grinding wheel 1, in the fiber material 6 having a high probability of coming into contact with each other, conductivity is provided in the grinding wheel 1 by a low charging amount, to usefully display nature of the resinoid grinding wheel. In the case of electrolyzing a surface of the polishing grinding wheel 1, its surface is violated to be dressed by eluting the metal film 4, and also by rolling the abrasive grains 5, made free by eluting the metal film 4, between the grinding wheel surface and a worked surface, mechanical dressing is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to optical parts, mechanical parts,
The present invention relates to a polishing grindstone used for polishing or grinding in ceramics, semiconductors, etc., and particularly to a polishing grindstone for electrolytic in-process dressing processing.

[0002]

2. Description of the Related Art Conventionally, a grindstone for polishing has been disclosed in, for example, Japanese Patent Application Laid-Open No. 4-141375. Figure 6
FIG. 2 is a cross-sectional view showing the polishing grindstone 30, which is formed by adding abrasive grains 32, metal particles 33 eluted by electrolysis and a conductive material 34 to a synthetic resin as a grindstone binding material 31. In this polishing grindstone 30, while holding the abrasive grains 32 by the binding material 31, electrolytic in-process dressing is possible by elution by electrolysis of the metal particles 33 and the conductive material 34, so that the holding force of the abrasive grains 32 is reduced. It is possible to perform electrolytic in-process dressing processing with a resinoid grindstone without performing the above.

[0003]

In the conventional grindstone 30 described above, the metal particles 33 and the like are added to the binder 31 in order to enable electrolytic in-process dressing, but the metal particles 33 are eluted by electrolysis. To do so, the metal particles 33 must be in contact with each other. For that purpose, it is necessary to considerably increase the ratio of the metal particles 33 dispersed in the binder 31. However, if the addition ratio of the metal particles 33 is increased, the hardness of the synthetic resin as the binder 31 becomes high, so that the property of elastically holding the abrasive grains 32 peculiar to the resinoid grindstone is deteriorated. As a result, there is a problem in that the work surface is likely to be scratched.

The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to provide a polishing grindstone which produces the above-mentioned characteristics of a resinoid grindstone and does not cause scratches on a surface to be processed. .

[0005]

FIG. 1 is an enlarged sectional view showing a polishing grindstone 1 of the present invention, in which a synthetic resin 2 as a binder is used.
An abrasive grain 3, an abrasive grain 5 coated with a metal coating 4 that is eluted by electrolysis, and a fiber material 6 having conductivity are dispersed and arranged. Further, in addition to the abrasive grains 3, the abrasive grains 5 having the metal coating 4 and the fiber material 6, metal particles eluted by electrolysis may be dispersed.

As the abrasive grains 3 and 5, cerium oxide,
Materials made of alumina, silicon carbide, zirconium oxide, diamond or the like are used. As the fibrous material 6, single set fibers or fibrous materials of various metals are used.
The binder is a synthetic resin such as phenol or polyimide 2
Is used.

[0007]

According to the polishing grindstone 1 having the above structure, the resinoid grindstone using the synthetic resin 2 as the binder is made electrically conductive by the fiber material 6, and the metal coating 4 of the abrasive grains 5 is electrically charged by electrolytic in-process dressing. It becomes possible to elute by decomposition. When the polishing grindstone 1 is made to have conductivity, metal particles are used, which are in contact with each other to obtain conductivity.
The fibrous materials 6 are more likely to come into contact with each other, and the grindstone 1 can be made conductive with a small filling amount, and the properties of the resinoid grindstone can be utilized. Further, when the surface (processed surface) of the polishing grindstone 1 is electrolyzed, the metal coating 4 elutes and the surface of the grindstone is attacked to be conspicuous, and the abrasive grains 5 liberated by the elution of the metal coating 4 become By rolling between them, mechanical dressing can be performed.

[0008]

Embodiment 1 FIG. 2 is an enlarged sectional view showing Embodiment 1 of the present invention. The polishing grindstone 10 of this embodiment uses a phenol resin 11 as a binder, and the diamond resin (# 3000) 12 and the nickel coating 13 are contained in the phenol resin 11.
The diamond abrasive grains (# 3000) 14 and the carbon fibers 15 are dispersed and arranged.

The above compounding ratio is 38 for phenol resin 11.
% By weight, 40% by weight of diamond abrasive grains 12, 15% by weight of diamond abrasive grains 14 coated with nickel 13 and 7% by weight of carbon fiber, and these are mixed and compression-molded and then fired A polishing grindstone 10 of the example was obtained.

FIG. 3 is a schematic view showing a polishing method using the polishing grindstone 10 of this embodiment, and FIG. 4 is an enlarged sectional view showing the surface of the polishing grindstone 10 during electrolytic in-process dressing. For polishing, a base metal that doubles as a rotating shaft 1
It is performed by sliding the work piece 17 on the surface of the polishing grindstone 10 fixed to 6 (hereinafter referred to as the grindstone surface). An anode of a power source 18 is connected to the base metal 16 and an electrode 19 is disposed opposite to the surface of the grindstone with a gap provided between the base metal 16 and the surface of the grindstone.
The cathode of the electrode 18 is connected to. For electrolytic in-process dressing, a coolant 20 for electrolytic in-process dressing is used, and the surface of the grindstone is electrolyzed by interposing it in the gap between the electrode 19 and the surface of the grindstone.
It's designed to stand out.

Next, electrolytic in-process dressing will be described with reference to FIG. When a current is passed from the anode of the electrode 18 to the base metal with the coolant 20 interposed in the gap between the electrode 19 and the surface of the grindstone, the current flows through the carbon fiber 15 or the nickel coating 13 in the grinding grindstone 10, It is transmitted to the nickel coating 13 exposed on the surface of the grindstone, and then flows to the electrode 19 via the coolant 20. At this time, the nickel coating 13 is electrolyzed and eluted into the coolant 20. As a result, the grindstone surface is eroded and sharpened. Further, the diamond abrasive grains 14 which have been made into free abrasive grains by the elution of the nickel coating 13 are present between the work piece 17 and the surface of the grindstone, and the rolling of the abrasive grains 14 causes the surface of the grindstone to mechanically move. Sharpening is done.

When the optical grindstone 10 of this embodiment was used to polish the optical glass BK-7, it could be processed into a mirror surface state with less damage. On the other hand, when the above-mentioned optics were polished using the conventional grinding stone 30 for polishing (see FIG. 6), fine scratches were generated although the mirror-like state was approached.

In this embodiment, the Nirel coating 1
If the content of the diamond abrasive grains 14 subjected to No. 3 is 7% by weight or less, the dressing effect is reduced to cause clogging, and if it exceeds 25% by weight, the polishing ability is reduced. Further, when the carbon fiber 15 is less than 3% by weight, the conductivity is lowered, and when it exceeds 10% by weight, the abrasive grains 12, 1 by the phenol resin 11 are reduced.
The holding power of No. 4 decreases.

According to this embodiment, the nickel coating 13 applied to the surface of the diamond abrasive grains 14 is eluted by the electrolytic action to dress the surface of the grindstone, and the diamond abrasive grains released by the elution of the nickel coating 13 are released. The rolling of 14 makes it possible to mechanically dress the surface of the grindstone and to obtain a machined surface with less damage.

[0015]

Second Embodiment FIG. 5 is an enlarged sectional view showing a second embodiment of the present invention. The polishing grindstone 21 of the present embodiment is characterized in that a small amount of metal powder that can be eluted by electrolysis is added to the binder to promote the dressing action by electrolysis. The polishing grindstone 21 uses a polyimide resin 22 as a binder,
Cerium oxide abrasive grains (particle size about 1μ in polyimide resin 22
m) 23, cerium oxide abrasive grains (particle size of about 1 μm) 25 coated with copper 24, carbon fiber 26 and copper particles (particle size of about 5 μm
m) 27 are arranged in a distributed manner.

The above mixing ratio is such that the polyimide resin 22 is 35
% By weight, 35% by weight of cerium oxide abrasive grains 23, copper coating 2
20% by weight of cerium oxide abrasive grains 25, 5% by weight of carbon fibers 26 and 5% by weight of copper particles 27, which were mixed and compression-molded and then fired for polishing of this example. The grindstone 21 was obtained.

The polishing method using the polishing grindstone 21 of the present embodiment is the same as the case of using the polishing grindstone 10 of the first embodiment. In this embodiment, the copper coating 24 and the copper particles 27 are eluted by the electrolytic action. As a result, the portion eluted on the surface of the grindstone is larger than the elution of only the nickel coating 13 in Example 1, and the dressing effect of electrolytic in-process dressing is correspondingly increased.

In this embodiment, when the cerium oxide abrasive grains 25 coated with the copper coating 24 were 1% by weight or less, the dressing effect was lowered, and when the amount was more than 15% by weight, the dressing was excessive and the grinding ratio was lowered. Occurs. If the copper particles 27 exceed 15% by weight, the surface to be processed may be damaged.

According to this embodiment, the same effect as that of the first embodiment can be obtained, and the polyimide resin 22 as the binder is obtained.
The elution action of the copper particles 27 in the inside can further increase the action of dressing the surface of the grindstone by electrolysis.

In Examples 1 and 2 described above, diamond and cerium oxide were used as the abrasive grains, but alumina, silicon carbide, zirconium oxide or the like can be used. Further, the abrasive particles coated with a metal and the abrasive particles not coated with a metal may be used by changing the type and particle size of the abrasive particles according to the purpose of polishing. Furthermore, in addition to carbon fibers, cast iron, metal fibers such as copper may be used as the conductive fiber material, and bronze, nickel, silver particles other than copper may be used as the metal particles. The fibrous material and the metal particles are preferably as soft as possible so as not to damage the work piece.

[0021]

As described above, according to the polishing grindstone of the present invention, it is possible to sharpen the surface of the grindstone by electrolytic in-process dressing without impairing the elasticity which is a characteristic of the resinoid grindstone, and to provide a mirror surface with less damage. Processing can be performed.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view showing a polishing grindstone of the present invention.

FIG. 2 is an enlarged cross-sectional view showing the first embodiment of the present invention.

FIG. 3 is a schematic view showing a polishing method using the polishing grindstone of Example 1 of the present invention.

FIG. 4 is an enlarged cross-sectional view showing a grindstone surface of Example 1 of the present invention during electrolytic in-process dressing.

FIG. 5 is an enlarged cross-sectional view showing a second embodiment of the present invention.

FIG. 6 is an enlarged sectional view showing a conventional grinding wheel.

[Explanation of symbols]

 1 Grinding stone for polishing 2 Synthetic resin 3,5 Abrasive grains 4 Metal coating 6 Fiber material

Claims (2)

[Claims] 1. A polishing grindstone obtained by fixing abrasive grains with a binder, wherein a rigid resin is used as the binder, abrasive grains in the binder, and abrasive grains coated with a metal that is eluted by electrolysis.
A grindstone for polishing, comprising a conductive fiber material dispersedly arranged. 2. A polishing grindstone obtained by fixing abrasive grains with a binder, wherein synthetic resin is used as the binder, abrasive grains in the binder, and abrasive grains having a metal coating eluted by electrolysis,
A polishing grindstone comprising a conductive fiber material and metal particles eluted by electrolysis dispersedly arranged.