JPH05305572A - Abrasive grinding wheel - Google Patents

Abrasive grinding wheel

Info

Publication number
JPH05305572A
JPH05305572A JP14001192A JP14001192A JPH05305572A JP H05305572 A JPH05305572 A JP H05305572A JP 14001192 A JP14001192 A JP 14001192A JP 14001192 A JP14001192 A JP 14001192A JP H05305572 A JPH05305572 A JP H05305572A
Authority
JP
Japan
Prior art keywords
polishing
binder
grindstone
grinding wheel
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP14001192A
Other languages
Japanese (ja)
Inventor
Shinji Yokoyama
真司 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP14001192A priority Critical patent/JPH05305572A/en
Publication of JPH05305572A publication Critical patent/JPH05305572A/en
Withdrawn legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PURPOSE:To minimize abrasive resistance by mixing diamond superfine powder having a grain size less than a specified number to a binder as a lubricating material. CONSTITUTION:To a binder 1 consisting of resin or metal, diamond superfine powder 2 having a grain size less than 100Angstrom is mixed as a lubricating material to provide a desired abrasive grinding wheel. The diamond superfine powder 2 has extremely high abrasive resistance, and shows a high rigidity and high lubricating performance when rolled on the critical surface between a material to be polished and the grinding wheel. Thus, a low abrasive resistance is realized, and also an improvement in lubricating performance by the life improvement of the lubricating material is realized. Further, by using the diamond superfine powder 1 less than 100Angstrom , an optical abrasive surface is provided without flawing the surface to be worked.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ガラス等の硬脆材料の
研磨用砥石に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grindstone for polishing hard and brittle materials such as glass.

【0002】[0002]

【従来の技術】従来、硬脆材料用の研削・研磨砥石とし
ては、特公昭53−8950号公報に記載されたものが
知られている。この砥石は、図6に示すように、砥石結
合材の基材となる樹脂または金属に二硫化タングステン
10を2〜15重量%加えたものを結合材11として、
ダイヤモンドまたは立方晶窒化ほう素を砥粒12として
いる。そして、この砥石にあっては、硬脆材料の研削加
工において、結合材中に配置された二硫化タングステン
の耐磨耗性、潤滑性により研削抵抗が小さく、すぐれた
耐磨耗性を有するとしている。なお、結合材中に上記と
同様の目的で加える潤滑材としては、二硫化モリブデ
ン、グラファイト等が知られている。
2. Description of the Related Art Conventionally, as a grinding / polishing grindstone for hard and brittle materials, one disclosed in Japanese Patent Publication No. 53-8950 is known. As shown in FIG. 6, this grindstone has a binder 11 which is made by adding 2 to 15% by weight of tungsten disulfide 10 to a resin or a metal serving as a base material of the grindstone binder.
The abrasive grains 12 are diamond or cubic boron nitride. And, in this grindstone, in the grinding process of hard and brittle material, the grinding resistance is small due to the wear resistance and lubricity of the tungsten disulfide arranged in the binder, and it has excellent wear resistance. There is. Note that molybdenum disulfide, graphite, and the like are known as lubricants added to the binder for the same purpose as above.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記従来の砥
石では、潤滑材として二硫化タングステン、二硫化モリ
ブデン等を用いているが、これらはいずれも硬さが小さ
く(二硫化モリブデン<二硫化タングステン:モース硬
度1〜1.5)、ガラス等の硬脆材料を加工する際に摩
滅が生じ易く、潤滑材としての効果が長く保てないとい
う欠点がある。さらに、加工時の摩擦による潤滑材の目
つぶれ現象によって潤滑効果の減少、研磨屑の付着によ
る目詰まりが生じる虞れがあり、結果として研磨抵抗の
増加による被加工面の面精度の低下を生じるという問題
点があった。本発明は、上記従来技術の問題点を解消
し、研磨抵抗による面精度の低下を防止し得る研磨用砥
石を提供することを目的とする。
However, in the above-mentioned conventional grindstone, although tungsten disulfide, molybdenum disulfide, etc. are used as the lubricant, these are all low in hardness (molybdenum disulfide <tungsten disulfide). : Mohs hardness is 1 to 1.5), and abrasion is likely to occur when processing a hard and brittle material such as glass, and the effect as a lubricant cannot be maintained for a long time. Further, there is a risk that the lubrication effect will be reduced due to friction during processing and the lubrication effect will be reduced, and clogging due to the attachment of polishing debris may occur, resulting in a decrease in the surface accuracy of the work surface due to an increase in polishing resistance. There was a problem. SUMMARY OF THE INVENTION It is an object of the present invention to provide a polishing grindstone that solves the above-mentioned problems of the prior art and can prevent a decrease in surface accuracy due to polishing resistance.

【0004】[0004]

【課題を解決するための手段】上記目的を達成するため
に、本発明の研磨用砥石は、図1に示すように、樹脂ま
たは金属からなる結合材1に100Å以下の粒径からな
るダイヤモンド超微粉2を潤滑材として混合して構成し
た。本発明の研磨用砥石の砥粒3としては、酸化セリウ
ム、アルミナ系、炭化ケイ素系、酸化ジルコニウム等の
材質のものが挙げられ、また、結合材1としては、ポリ
イミド系、フェノール系、ポリアミド系、ABS系等の
樹脂、または錫、銅、ニッケル等の金属やそれらの合金
が挙げられる。
In order to achieve the above object, the polishing grindstone of the present invention, as shown in FIG. 1, has a bonding material 1 made of resin or metal, and a diamond super-particle having a particle size of 100 Å or less. The fine powder 2 was mixed and used as a lubricant. The abrasive grains 3 of the polishing grindstone of the present invention include materials such as cerium oxide, alumina-based, silicon carbide-based, zirconium oxide, and the like, and the binder 1 is polyimide-based, phenol-based, polyamide-based. , ABS-based resins, metals such as tin, copper, nickel, and alloys thereof.

【0005】[0005]

【作用】上記構成からなる研磨用砥石によれば、ダイヤ
モンド超微粉は耐磨耗性が非常に高く被研磨物と砥石と
の界面における転動時に高い剛性を示し高い潤滑性能を
示すことにより、低研磨抵抗が実現されると同時に潤滑
材のライフ向上による潤滑能力の向上が実現される。さ
らに、100Å以下のダイヤモンド超微粉を用いること
で被加工面にキズを与えることなく光学研磨面を得るこ
とができ、また、従来の潤滑材と比べて硬度が大きいた
め結合材からの離脱後に砥石表面のドレッシング効果も
得られる。
According to the polishing grindstone having the above structure, the ultrafine diamond powder has a very high abrasion resistance and exhibits high rigidity during rolling at the interface between the object to be ground and the grindstone, thus exhibiting high lubricating performance. A low polishing resistance is realized, and at the same time, the lubrication ability is improved by improving the life of the lubricant. Furthermore, by using ultrafine diamond powder of 100 Å or less, it is possible to obtain an optically polished surface without scratching the surface to be processed, and because the hardness is higher than that of conventional lubricants, the grindstone after detachment from the binder A dressing effect on the surface is also obtained.

【0006】[0006]

【実施例1】図2は、本発明に係る研磨用砥石の実施例
1を示す拡大断面図である。研磨用砥石の成形時に、酸
化セリウム砥粒3が55重量%、砥粒結合材1が40重
量%、ダイヤモンド超微粉2が5重量%の比重となるよ
うに秤量する。ここで、砥粒結合材1にはポリイミド系
の樹脂を用い、ダイヤモンド超微粉2には粒径が100
Å以下のものを用いる。そして、砥粒結合材1をピロリ
ドン系の有機溶剤に溶解させ、ダイヤモンド超微粉2と
攪拌混合し、この溶液を70℃で48時間乾燥炉で乾燥
させ粉砕する。この粉砕物と砥粒3とを充分に混合して
圧縮成形した後、100℃で焼成し研磨用砥石を製作し
た。
[Embodiment 1] FIG. 2 is an enlarged cross-sectional view showing Embodiment 1 of a grinding stone for polishing according to the present invention. When the polishing grindstone is formed, the cerium oxide abrasive grains 3 are weighed so that the specific gravity is 55% by weight, the abrasive grain binder 1 is 40% by weight, and the ultrafine diamond powder 2 is 5% by weight. Here, a polyimide resin is used for the abrasive grain binding material 1, and the diamond ultrafine powder 2 has a particle diameter of 100.
Å Use the following. Then, the abrasive grain binding material 1 is dissolved in a pyrrolidone-based organic solvent and mixed with the ultrafine diamond powder 2 by stirring, and this solution is dried in a drying furnace at 70 ° C. for 48 hours and pulverized. The pulverized material and the abrasive grains 3 were sufficiently mixed, compression-molded, and then fired at 100 ° C. to produce a polishing grindstone.

【0007】以下に、本実施例の研磨用砥石と従来の二
硫化タングステンを潤滑材に用いて同様に製作した研磨
用砥石とにより、光学ガラスBK−7(φ30)の試料
をそれぞれ砥石回転数1000rpmで研磨加工したと
きの結果を示す。図3は、本実施例の研磨用砥石による
被加工面の干渉縞図で、図4は、二硫化タングステンを
用いた従来の研磨用砥石による干渉縞図であり、それぞ
れ50個目を加工した試料の被加工面を示している。砥
石ラッピング直後は、双方とも同様の面精度で加工でき
たが、50個目では図3及び図4に示すように被加工面
の精度に差が生じた。これは、二硫化タングステンを用
いた従来の研磨用砥石では、前記した理由により研磨抵
抗が増加してくるため、加工中に振動が生じ、それによ
り面精度が悪化するためである。さらに、研磨取り代の
比較では、本実施例の研磨用砥石は、従来の研磨用砥石
に比べ1.2〜1.3倍となっており、研削比が同等で
あることから高研磨性が得られていることがわかる。す
なわち、本実施例の研磨用砥石にあっては、結合材1に
混合されるダイヤモンド超微粉2が、大きな潤滑作用を
なすとともにその硬度が大きいという特性により、研磨
用砥石表面の目立て作用をなしているため研磨性が向上
するものと考えられる。
The samples of the optical glass BK-7 (φ30) were respectively subjected to the number of rotations of the grinding wheel by the grinding wheel of the present example and the conventional grinding wheel similarly manufactured by using tungsten disulfide as a lubricant. The results when polishing is performed at 1000 rpm are shown. FIG. 3 is an interference fringe diagram of a surface to be processed by the polishing grindstone of the present embodiment, and FIG. 4 is an interference fringe diagram of a conventional polishing grindstone using tungsten disulfide. The surface to be processed of the sample is shown. Immediately after lapping the grindstone, both could be machined with the same surface accuracy, but at the 50th piece, there was a difference in the accuracy of the surface to be machined as shown in FIGS. 3 and 4. This is because, in the conventional grinding wheel using tungsten disulfide, the polishing resistance increases due to the above-mentioned reason, and vibration occurs during processing, which deteriorates the surface accuracy. Further, in comparison of the polishing allowance, the polishing grindstone of this example has a ratio of 1.2 to 1.3 times that of the conventional polishing grindstone, and since the grinding ratio is the same, high polishing property is obtained. You can see that it has been obtained. That is, in the polishing grindstone of the present embodiment, the ultrafine diamond powder 2 mixed with the binder 1 has a large lubricating effect and a large hardness, so that the polishing grindstone has a sharpening function. Therefore, it is considered that the polishing property is improved.

【0008】本実施例では、ダイヤモンド超部粉2を結
合材1に5重量%を混合して研磨用砥石を製作した場合
について説明したが、このダイヤモンド超微粉2は、
0.1〜20重量%の範囲内で混合して実施でき、この
範囲内では低研磨抵抗の効果を有する。ダイヤモンド超
微粉2の添加量が0.1重量%未満では低研磨抵抗の効
果があまり得られず、20重量%を越えると研磨性の低
下が見られた。また、ダイヤモンド超微粉2の粒径は1
00Å以下としたが、これは最大粒径が100Åを越え
る粒体を用いた場合には、ダイヤモンド粉が被加工面に
キズを生じさせてしまい、光学研磨面が安定して得られ
なくなってしまうためである。
In this embodiment, the case was explained in which the diamond superfine powder 2 was mixed with the binder 1 in an amount of 5% by weight to produce a polishing grindstone.
It can be carried out by mixing within a range of 0.1 to 20% by weight, and within this range, an effect of low polishing resistance is obtained. When the amount of the ultrafine diamond powder 2 added was less than 0.1% by weight, the effect of low polishing resistance was not obtained so much, and when it was more than 20% by weight, the polishing property was deteriorated. The particle size of the ultrafine diamond powder 2 is 1
Although it is set to 00 Å or less, this means that when a particle having a maximum particle size of more than 100 Å is used, the diamond powder causes scratches on the surface to be processed, and the optically polished surface cannot be stably obtained. This is because.

【0009】[0009]

【実施例2】図5は、本発明に係る研磨用砥石の実施例
2を示す拡大断面図である。本実施例の研磨用砥石は、
ダイヤモンド超微粉2の表面を耐溶剤系の撥水剤4(シ
リコーン系、フッ素系等の撥水剤または結合材として用
いる物質との接着性を低下させる物質)にて被覆して、
結合材1中に混合して製作した。これにより、ダイヤモ
ンド超微粉2が結合材1から離脱するのを促進させ、被
加工物と研磨用砥石との界面にダイヤモンド超微粉2を
遊離した状態で存在させやすくして、潤滑作用、目立て
作用を増進させることとした。本実施例の研磨用砥石を
製作する際には、上記実施例1の研磨用砥石の製作工程
における結合材1を溶融解し、ダイヤモンド超微粉2を
混合する前工程として、ダイヤモンド超微粉2の表面を
上記撥水剤4により被覆処理を行なう。このあとの製作
工程には上記実施例1と同様である。
[Embodiment 2] FIG. 5 is an enlarged cross-sectional view showing Embodiment 2 of a grinding wheel for polishing according to the present invention. The polishing wheel of this embodiment is
The surface of the ultrafine diamond powder 2 is coated with a solvent-resistant water repellent 4 (silicone-based, fluorine-based water repellent, or a substance that reduces adhesiveness to a substance used as a binder).
It was manufactured by mixing in the binder 1. This accelerates the detachment of the ultrafine diamond powder 2 from the binder 1 and facilitates the presence of the ultrafine diamond powder 2 in the free state at the interface between the work piece and the polishing grindstone, thereby providing a lubricating action and a dressing action. Decided to improve. When manufacturing the polishing grindstone of the present embodiment, as a pre-process of melting and melting the binder 1 and mixing the diamond ultrafine powder 2 in the manufacturing process of the polishing grindstone of Example 1 above, The surface is coated with the water repellent 4. The subsequent manufacturing process is the same as that of the first embodiment.

【0010】本実施例によれば、ダイヤモンド超微粉2
を撥水剤4で被覆して結合材1と混合することにより、
ダイヤモンド超微粉2と結合材1との濡れ性が低下し、
ダイヤモンド超微粉2を保持する力が低下する。これに
より、研磨加工時にダイヤモンド超微粉2が結合材1か
ら離脱しやすくなり、加工界面にて潤滑作用、目立て作
用を起こしやすくなる。
According to this embodiment, the ultrafine diamond powder 2 is used.
Is coated with the water repellent 4 and mixed with the binder 1,
The wettability between the ultrafine diamond powder 2 and the binder 1 is reduced,
The force for holding the ultrafine diamond powder 2 is reduced. As a result, the ultrafine diamond powder 2 is easily separated from the binder 1 during polishing, and a lubricating action and a dressing action are likely to occur at the processing interface.

【0011】なお、本実施例では撥水剤処理したダイヤ
モンド超微粉2を用いているため、ダイヤモンド超微粉
2が離脱しやすくなる分、研削比は低下する傾向になる
が、撥水剤4で被覆処理したダイヤモンド超微粉2と被
覆処理していないダイヤモンド超微粉2とを被加工物に
応じて所望の割合で調合して結合材1に混合することに
より、研削比の低下を抑えつつ潤滑作用、目立て作用を
もたせることができる。また、被加工物によってダイヤ
モンド超微粉2が離脱過剰になる場合には、撥水剤4の
代わりにシラン系、チタン系等のカップリング剤を用い
ることで、結合材1とダイヤモンド超微粉2との濡れ性
を向上させ、ダイヤモンド超微粉2を保持する力を増大
させることができる。
In this embodiment, since the ultrafine diamond powder 2 treated with the water repellent agent is used, the grinding ratio tends to decrease due to the easy removal of the ultrafine diamond powder 2, but with the water repellent agent 4. The coated ultrafine diamond powder 2 and the uncoated ultrafine diamond powder 2 are mixed at a desired ratio according to the work piece and mixed with the binder 1 to suppress a decrease in the grinding ratio and to provide a lubricating action. , It can have a sharpening effect. Further, when the diamond ultrafine powder 2 is excessively released due to the work piece, a coupling agent such as silane-based or titanium-based is used in place of the water repellent 4, so that the binder 1 and the diamond ultrafine powder 2 are separated from each other. It is possible to improve the wettability and to increase the force for holding the ultrafine diamond powder 2.

【0012】なお、前記実施例1,2にあっては、砥粒
3に酸化セリウムを用いた場合について例示したが、ア
ルミナ系、炭化ケイ素系、酸化ジルコニウム系等のもの
を用いてもよい。また、結合材1としてポリイミド系樹
脂を用いた場合を例示したが、フェノール系、ポリアミ
ド系、ABS系等の樹脂、あるいは被加工物にキズを生
じさせなければ、錫、銅、ニッケル等の金属やその合金
を用いてもよい。
In the first and second embodiments, the case where cerium oxide is used as the abrasive grains 3 has been exemplified, but alumina type, silicon carbide type, zirconium oxide type or the like may be used. In addition, although the case where a polyimide resin is used as the binder 1 is illustrated, a resin such as a phenol resin, a polyamide resin, or an ABS resin, or a metal such as tin, copper, or nickel unless scratches are formed on the workpiece. And its alloys may be used.

【0013】[0013]

【発明の効果】以上のように、本発明によれば、潤滑材
としてダイヤモンド超微粉を結合材に混合したので、研
磨抵抗が小さくなるとともに、潤滑材のライフ向上によ
る潤滑能力が向上する。さらに、ダイヤモンド超微粉の
粒径を100Å以下としたので被加工面にキズを与える
ことなく加工でき、また硬度が大きいので離脱後のドレ
ッシング効果が向上する。
As described above, according to the present invention, since ultrafine diamond powder is mixed as the lubricant into the binder, the polishing resistance is reduced and the lubricating ability is improved by the life of the lubricant being improved. Further, since the ultrafine diamond particles have a particle size of 100 Å or less, they can be processed without causing scratches on the surface to be processed, and since the hardness is large, the dressing effect after separation is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の研磨砥石を示す断面図である。FIG. 1 is a sectional view showing a polishing grindstone of the present invention.

【図2】本発明の実施例1の研磨用砥石を示す拡大断面
図である。
FIG. 2 is an enlarged sectional view showing a polishing grindstone of Example 1 of the present invention.

【図3】本発明の実施例の研磨用砥石で加工した被加工
面の干渉縞図である。
FIG. 3 is an interference fringe diagram of a surface to be processed which is processed by a polishing grindstone according to an embodiment of the present invention.

【図4】従来の研磨用砥石で加工した被加工面の干渉縞
図である。
FIG. 4 is an interference fringe diagram of a processed surface processed by a conventional polishing grindstone.

【図5】本発明の実施例2の研磨用砥石を示す拡大断面
図である。
FIG. 5 is an enlarged sectional view showing a polishing grindstone according to a second embodiment of the present invention.

【図6】従来の研磨用砥石を示す断面図である。FIG. 6 is a cross-sectional view showing a conventional polishing grindstone.

【符号の説明】[Explanation of symbols]

1 結合材 2 ダイヤモンド超微粉 3 砥粒 1 Binder 2 Diamond Ultrafine Powder 3 Abrasive Grains

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 研磨材を樹脂または金属からなる結合材
で固定して得られる研磨用砥石において、前記結合材に
100Å以下の粒径からなるダイヤモンド超微粉を潤滑
材として混合したことを特徴とする研磨用砥石。
1. A polishing grindstone obtained by fixing an abrasive with a binder made of resin or metal, wherein the binder is mixed with ultrafine diamond powder having a particle size of 100 Å or less as a lubricant. A grindstone for polishing.
JP14001192A 1992-05-01 1992-05-01 Abrasive grinding wheel Withdrawn JPH05305572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14001192A JPH05305572A (en) 1992-05-01 1992-05-01 Abrasive grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14001192A JPH05305572A (en) 1992-05-01 1992-05-01 Abrasive grinding wheel

Publications (1)

Publication Number Publication Date
JPH05305572A true JPH05305572A (en) 1993-11-19

Family

ID=15258862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14001192A Withdrawn JPH05305572A (en) 1992-05-01 1992-05-01 Abrasive grinding wheel

Country Status (1)

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JP (1) JPH05305572A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003011063A (en) * 2001-06-28 2003-01-15 Ricoh Co Ltd Grinding wheel for polishing and manufacturing method therefor
CN108296993A (en) * 2017-12-21 2018-07-20 白鸽磨料磨具有限公司 A kind of heavy duty grinding wheel combined binder, heavy duty grinding wheel and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003011063A (en) * 2001-06-28 2003-01-15 Ricoh Co Ltd Grinding wheel for polishing and manufacturing method therefor
CN108296993A (en) * 2017-12-21 2018-07-20 白鸽磨料磨具有限公司 A kind of heavy duty grinding wheel combined binder, heavy duty grinding wheel and preparation method thereof

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