JP3310385B2 - Polishing whetstone - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to optical parts, mechanical parts,
The present invention relates to a polishing grindstone used for polishing or grinding of ceramics, semiconductors, and the like, and more particularly to a polishing grindstone effective for electrolytic in-process dressing.

[0002]

2. Description of the Related Art Conventionally, a grindstone for polishing has been disclosed in, for example, Japanese Patent Application Laid-Open No. 4-141375. FIG.
FIG. 2 is a cross-sectional view showing the polishing grindstone 30. The polishing grindstone 30 is formed by adding abrasive grains 32, metal particles 33 eluted by electrolysis, and a conductive material 34 to a synthetic resin as a grindstone binding material 31. In the polishing whetstone 30, electrolytic in-process dressing becomes possible by elution of the metal particles 33 and the conductive material 34 by electrolysis while holding the abrasive grains 32 with the binder 31, so that the holding power of the abrasive grains 32 is reduced. Without this, an electrolytic in-process dressing process using a resinoid grindstone can be performed.

[0003]

In the above-mentioned conventional grindstone 30, metal particles 33 and the like are added to a binder 31 to enable electrolytic in-process dressing, but the metal particles 33 are eluted by electrolysis. To do so, the metal particles 33 need to be in contact with each other. For that purpose, the ratio of the metal particles 33 dispersed in the binder 31 needs to be considerably increased. However, if the addition ratio of the metal particles 33 is increased, the hardness of the synthetic resin as the binder 31 increases, so that the characteristic of the resinoid grindstone that elastically retains the abrasive grains 32 has been reduced. As a result, there is a problem that the surface to be processed is easily scratched.

[0004] The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a polishing whetstone which does not cause scratches on a surface to be processed while utilizing the above-mentioned features of a resinoid whetstone. .

[0005]

According to a first aspect of the present invention, there is provided a polishing grindstone obtained by fixing abrasive grains with a binder, wherein a plurality of abrasive grains are contained in a binder made of a synthetic resin. A plurality of abrasive grains coated with a metal coating eluted by electrolysis and a plurality of conductive fiber materials are dispersedly arranged. A polishing wheel according to a second aspect of the present invention is the polishing wheel according to the first aspect, wherein a plurality of metal particles eluted by electrolysis are further dispersed in the binder.

[0006]

In other words, the polishing grindstone according to the present invention comprises a plurality of abrasive grains, a plurality of abrasive grains having a metal coating eluted by electrolysis and a plurality of conductive fibers in a binder made of synthetic resin. By dispersing the material, dressing by electrolytic in-process dressing becomes possible while elastically retaining the abrasive grains.

[0007]

Embodiment 1 First, before describing a specific embodiment of the present invention, an outline of the present invention will be described. FIG. 1 is an enlarged cross-sectional view showing a polishing whetstone 1 of the present invention by way of example. In a synthetic resin 2 as a binder, abrasive grains 3 and abrasive grains 5 provided with a metal coating 4 eluted by electrolysis are shown. And a fiber material 6 having conductivity are dispersedly arranged. Further, in addition to the abrasive grains 3, the abrasive grains 5 provided with the metal coating 4, and the fiber material 6, metal particles eluted by electrolysis may be dispersedly arranged. Abrasive grains 3,
5 is made of a material such as cerium oxide, alumina, silicon carbide, zirconium oxide, and diamond. As the fiber material 6, carbon fiber or various metal fiber materials are used.
A synthetic resin 2 such as a polyimide resin is used. According to the polishing whetstone 1 having the above structure, the resinoid whetstone using the synthetic resin 2 as the binder is made conductive by the fiber material 6, and the metal coating 4 of the abrasive grains 5 is eluted by electrolysis in an electrolytic in-process dressing. It becomes possible to do. Grinding wheel 1
In giving conductivity to the metal particles, the probability that the fibrous materials 6 are in contact with each other is higher than when metal particles are used and the particles are in contact with each other to obtain conductivity. It is possible to make use of the properties of resinoid grinding stones. Further, when the surface (working surface) of the polishing grindstone 1 is electrolyzed, the metal coating 4 elutes and the surface of the grinding stone is eroded to stand out, and the abrasive grains 5 released by the elution of the metal coating 4 become in contact with the work surface. Rolling between the layers allows mechanical dressing.

Next, a specific embodiment of the present invention will be described with reference to the drawings. FIG. 2 is an enlarged sectional view showing the first embodiment of the present invention. The polishing whetstone 10 of this embodiment uses a phenol resin 11 as a binder, and contains diamond abrasive grains (# 3000) 12 and nickel coating 1 in the phenol resin 11.
3 and diamond fibers (# 3000) 14 and carbon fibers 15 dispersed therein.

The above mixing ratio is such that the phenol resin 11 is
% By weight, 40% by weight of diamond abrasive grains 12, 15% by weight of diamond abrasive grains 14 coated with nickel 13 and 7% by weight of carbon fiber. A polishing grindstone 10 of an example was obtained.

FIG. 3 is a schematic diagram showing a polishing method using the polishing grindstone 10 of the present embodiment, and FIG. 4 is an enlarged sectional view showing the surface of the polishing grindstone 10 during electrolytic in-process dressing. Polishing is performed by the base 1 that also serves as the rotating shaft.
The polishing is performed by sliding the workpiece 17 on the surface of the grinding wheel 10 fixed to 6 (hereinafter, referred to as the grinding wheel surface). An electrode of a power supply 18 is connected to the base metal 16, and an electrode 19 is provided opposite to the grindstone surface with a gap provided between the base metal 16 and the grindstone surface.
Is connected to a cathode of a power supply 18. In the electrolytic in-process dressing, a coolant 20 for electrolytic in-process dressing is used, and the grindstone surface is electrolyzed by being interposed in a gap between the electrode 19 and the grindstone surface.
It is designed to stand out.

Next, the electrolytic in-process dressing will be described with reference to FIG. When a current flows from the anode of the electrode 18 to the base metal in a state where the coolant 20 is interposed in the gap between the electrode 19 and the grinding wheel surface, the current flows through the carbon fiber 15 or the nickel coating 13 in the grinding wheel 10 for polishing. It is transmitted to the nickel coating 13 exposed on the whetstone surface, and then flows to the electrode 19 via the coolant 20. At this time, the nickel coating 13 is electrolyzed and elutes into the coolant 20. Thereby, the grindstone surface is eroded and dressed. Further, the diamond abrasive grains 14 that have been loosely abrasively formed by the elution of the nickel coating 13 are interposed between the workpiece 17 and the surface of the grinding stone, and the rolling of the abrasive grains 14 causes the grinding stone surface to mechanically move. Sharpening is performed.

When the optical glass BK-7 was polished using the polishing whetstone 10 of the present embodiment, it could be processed into a mirror-like state with less damage. On the other hand, when the optical glass was polished using the conventional polishing grindstone 30 (see FIG. 6), the result was that although the mirror glass approached the mirror surface state, fine scratches occurred.

In this embodiment, the nickel coating 1
If the diamond abrasive grain 14 subjected to No. 3 is 7% by weight or less, the dressing effect is reduced and clogging is caused, and if it exceeds 25% by weight, the polishing ability is reduced. When the carbon fiber 15 is less than 3% by weight, the conductivity is reduced.
The holding power of No. 4 decreases.

According to the present embodiment, the nickel coating 13 applied to the surface of the diamond abrasive 14 is eluted by the electrolytic action to dress the grinding wheel surface, and the diamond abrasive released by the elution of the nickel coating 13 By the rolling of No. 14, mechanical dressing of the grindstone surface can be performed, and a processed surface with less damage can be obtained.

[0015]

Embodiment 2 FIG. 5 is an enlarged sectional view showing Embodiment 2 of the present invention. The polishing whetstone 21 of this embodiment is characterized in that a small amount of metal powder that can be eluted by electrolysis is added to a binder to promote the dressing action by electrolysis. The grinding wheel 21 uses a polyimide resin 22 as a binder,
Cerium oxide abrasive grains (particle diameter of about 1μ)
m) 23, cerium oxide abrasive grains (particle diameter: about 1 μm) 25 coated with copper, carbon fibers 26, and copper particles (particle diameter: about 5 μm) 27 as metal powder are dispersed and arranged.

The compounding ratio is such that the polyimide resin 22 is 35
% By weight, 35% by weight of cerium oxide abrasive grains 23, copper coating 2
The cerium oxide abrasive grains 25 subjected to No. 4 were made into 20% by weight, the carbon fiber 26 was made into 5% by weight, and the copper particles 27 were made into 5% by weight. A grindstone 21 was obtained.

The polishing method using the polishing wheel 21 of the present embodiment is the same as the case of using the polishing wheel 10 of the first embodiment. In this embodiment, the copper coating 24 and the copper particles 27 are eluted by the electrolytic action. As a result, a portion to be eluted on the grindstone surface is increased as compared with the elution of only the nickel coating 13 in Example 1, and accordingly, a sharpening effect by the electrolytic in-process dressing is increased.

In this embodiment, when the amount of the cerium oxide abrasive grains 25 coated with the copper coating 24 is less than 1% by weight, the dressing effect is reduced, and when it exceeds 15% by weight, the dressing becomes excessive and the grinding ratio decreases. Occurs. On the other hand, if the amount of the copper particles 27 exceeds 15% by weight, the surface to be processed may be scratched.

According to this embodiment, the same effects as those of the first embodiment can be obtained, and the polyimide resin 22 as a binder is used.
The action of dissolving the copper particles 27 in the inside can enhance the effect of sharpening the grindstone surface by further electrolysis.

In Examples 1 and 2, diamond and cerium oxide are used as abrasive grains. However, alumina, silicon carbide, zirconium oxide and the like can be used. In addition, the abrasive grains with metal coating and the abrasive grains without metal coating may be used by changing the type and particle size of the abrasive grains according to the use of the polishing process. Furthermore, besides carbon fiber, metal fibers such as cast iron and copper may be used for the conductive fiber material, and particles of bronze, nickel, and silver other than copper may be used for the metal particles. Preferably, the fibrous material and the metal particles are as soft as possible without causing any damage to the workpiece.

[0021]

As described above, according to the polishing whetstone of the present invention, the surface of the whetstone can be sharpened by electrolytic in-process dressing without impairing the characteristic that the abrasive grains such as the resinoid whetstone can be elastically retained. Mirror processing with less damage can be performed.

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view illustrating a polishing grindstone of the present invention.

FIG. 2 is an enlarged sectional view showing Embodiment 1 of the present invention.

FIG. 3 is a schematic view illustrating a polishing method using the polishing grindstone of Example 1 of the present invention.

FIG. 4 is an enlarged cross-sectional view showing a whetstone surface of Example 1 of the present invention during electrolytic in-process dressing.

FIG. 5 is an enlarged sectional view showing a second embodiment of the present invention.

FIG. 6 is an enlarged sectional view showing a conventional polishing grindstone.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Whetstone for grinding 2 Synthetic resin 3,5 Abrasive grains 4 Metal coating 6 Fiber material

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) B24D 3/28 B24D 3/34 B24D 3/00 330

Claims (2)

(57) [Claims] 1. A polishing whetstone obtained by fixing abrasive grains with a binder, wherein a plurality of abrasive grains, a plurality of abrasive grains having a metal coating eluted by electrolysis are provided in a binder made of synthetic resin, and A polishing whetstone comprising a plurality of conductive fibrous materials dispersedly arranged. 2. The polishing wheel according to claim 1, wherein a plurality of metal particles eluted by electrolysis are further dispersed in the binder.