JP3477260B2 - Grinding / polishing whetstone and processing method using the whetstone - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding / polishing grindstone for grinding / polishing a work made of a hard and brittle material such as ceramics or glass by an electrolytic in-process dressing method, and a processing method using the grindstone. The present invention relates to a grinding / polishing grindstone that can be commonly used for machining and fine grinding, and a machining method using the grindstone.

[0002]

2. Description of the Related Art Conventionally, as a grinding method for performing a fine grinding process and a fine grinding process using the same grindstone, Japanese Patent Laid-Open No. 4-210
The technology described in Japanese Patent No. 364 (Prior Art 1) is disclosed. FIG. 16 is a conceptual diagram showing a front surface of a main part of a grinding apparatus according to this conventional technique. Reference numeral 21 shown in the figure is the rotary shaft 2.
1 is a drive means provided upright. A glass material 23, which is a workpiece, is loaded and arranged at the tip of the rotary shaft 22. Further, a driving means 24 is provided on the diagonal side of the work piece 23 and has a rotary shaft 25 protruding from one end surface thereof.
The cylindrical conductive grindstones 26 and 27 are superposed and mounted on the tip of the. The conductive grindstone 26
Electrodes (cathodes) 28 are arranged on the outer peripheral surfaces of the electrodes 27 and 27 at predetermined positions at positions facing the shape along the outer peripheral surface. The conductive grindstones 26 and 27 themselves are used as anodes, and the workpiece 23 is processed while applying a voltage between both electrodes. In the figure, reference numeral 29 is a power source connected to the conductive grindstones 26 and 27 and the electrode 28. Further, the block shape provided on the outer peripheral side wall surface of the driving means 24 is a power feeding brush 30 which feeds power to the conductive grindstones 26 and 27.

First, the driving means 21 and 24 are actuated in the directions indicated by the arrows, respectively, and the grinding process is started while the weak electric coolant is supplied from the nozzle 33. In this case, it is located on the outer periphery of the work piece 23, and rotates and moves along the center of curvature 32 of the work piece 23 according to the machining trajectory according to the curvature of the curvature generating point 31 of the finishing grindstone 27. That is, rough grinding is performed at the front stage (tip side conductive grindstone) 26, and at the same time, a finishing allowance of a desired shape is ground at the rear stage (rear end side conductive grindstone) 27. At this time, the above-mentioned grindstones 26 and 27 are electrically conductive, and a minus electrode 28 is arranged along the shape of the grindstone with a desired gap provided between them. Is applied, and the workpiece 23 is ground while the weak electric coolant is jetted from the nozzle 33 to the grinding position. In the above grinding method, roughing and finishing are performed at the same time by using at least two or more grindstones, and the finishing grindstones are machined at the curvature generation point to automatically stand out during machining. Grinding process can be performed.

On the other hand, in order to stabilize the electrolytic action, a method for producing conductive abrasive grains and an electrolytic grindstone is disclosed in Japanese Patent Laid-Open No. 5-2.
The technology disclosed in Japanese Patent No. 5462 (Prior Art 2) is disclosed. As shown in FIG. 17, this technique comprises capsule particles 13 in which an oxide or the like having electrical conductivity is used as core particles 11 and a noble metal or its alloy is used as coated particles 12. In addition, this technique is a method utilizing the above-mentioned configuration, and after forming an encapsulated particle 13 by using an electrically conductive oxide or the like as a core particle 11 and a noble metal or its alloy as a coated particle 12, the encapsulated particle is formed. The powder of No. 13 and the powder of normal abrasive grains are mixed and the mixture is subjected to electric current sintering.

With the above structure, the core particles function as abrasive grains, impart conductivity, and secure stable uniformity. Further, according to the above method, the capsule particles also function as a binder, and an electrolytic whetstone that is not deteriorated by electrolysis can be obtained.

[0006]

In the grinding method according to the prior art 1, a composite grindstone in which a grindstone for rough grinding and a grindstone for precise grinding are overlapped is used in order to perform rough grinding and fine grinding with the same grindstone. Therefore, the grindstone attachment / detachment method and apparatus become complicated, and the grinding apparatus itself needs to be improved. Further, in the composite grindstone, there is a problem that it is difficult to make corrections due to the different wear amounts of the grindstones, and to correct the machining allowance and the machining shape.

Further, in the abrasive grain according to the prior art 2 and the electrolytic grindstone in which the abrasive grain is combined, the abrasive grain is coated to impart conductivity to prevent an increase in the applied voltage, and an electrolytic in-process dressing method without deterioration due to electrolysis. Although it is effective to obtain a grindstone used for the above, the dropping or holding of the abrasive grains during electrolysis is not controlled by the presence or absence of the abrasive grain coating. That is, there is a problem that rough grinding and fine grinding cannot be performed with the same grindstone.

The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to perform both rough grinding and fine grinding with the same grindstone by controlling dropping or holding of abrasive grains by electrolysis. It is to provide a simple and efficient grinding / polishing grindstone capable of performing the above processing and a processing method using the grindstone.

[0009]

In order to solve the above problems, the invention according to claim 1, 2 or 3 grinds and polishes a work made of a hard and brittle material while dressing by an electrolytic in-process dressing method. For grinding / polishing grindstones, abrasive grains with a large grain size are coated with a metal that is more likely to be electrolyzed than the bond material, and a conductive resin that is not electrolyzed is coated on it. It is characterized in that the abrasive grains are bonded by a bond material made of a metal to be electrolyzed. In addition to the above means, the invention according to claim 2 is characterized in that the abrasive grains for fine grinding are coated with a conductive resin. The invention according to claim 4 is to bond to the processed surface of the grindstone according to claim 1.
After the abrasive particles for rough grinding are projected by applying a strong electrolysis that elutes the material, a step of bringing the processed surface of the grindstone into contact with the work and rough grinding the work, and the processed surface of the grindstone by the rough grinding a step of coarse grinding abrasive coating was peeled off of the conductive resin, only coated metal to the grinding wheel Ru is falling from the processing surface by applying a weak electrolyte eluting before
After stopping the electrolysis of the grindstone, the step of fine-grinding the work again with the fine-grinding abrasive grains held by the bond material existing on the processed surface of the grindstone.
Characterized in that it. In addition to the above-described processing method, the invention according to claim 5 is, in addition to the above-described processing method, subjecting the electrolysis from which the bond material is eluted to a grindstone to remove the fine-grinding abrasive grains and the residual conductive resin coat, It is characterized in that a new abrasive grain layer appears on the processed surface of.

[0010]

In the operation of the invention according to claim 1, 2 or 3,
Before the rough grinding, a strong electrolysis is applied to elute the bond material and expose both the rough grinding grains and the fine grinding grains to the processed surface of the grindstone. Since the rough-grinding abrasive grains having a large amount of protrusion of the abrasive grains are exposed, rough-grinding with high processing capability becomes possible.
When performing fine grinding, by applying a weak electrolysis, the metal coat that is more easily electrolyzed than the bond material elutes, and only the abrasive particles for rough grinding fall off. Since the bond material is not eluted, only the fine-grinding abrasive grains are exposed on the processed surface of the grindstone. This enables precise grinding. In the operation of the invention according to claim 2, in addition to the above-mentioned operation, the fine-grinding abrasive grains are coated with a conductive resin to act as a cushion for the work. In the operation of the invention according to claim 3, in addition to the above operation, by using a material having a high hardness for the abrasive grains for rough grinding and a material having a low hardness for the fine grinding abrasive grains, the working capacity is increased during the rough grinding, Improves the finished surface of the work during fine grinding. In the operation of the invention according to claim 4 or 5, dropping or holding of the rough-grinding abrasive grains and the fine-grinding abrasive grains is controlled by electrolysis, and the same grindstone is used for both rough-grinding and fine-grinding. Can be processed.

[0011]

Embodiment 1 FIGS. 1 to 5 show Embodiment 1, FIG. 1 is a longitudinal sectional view of a grindstone in an initial state, FIG. 2 is a longitudinal sectional view of a grindstone at the end of rough grinding, and FIG. Longitudinal section of the grindstone, Fig. 4
Is a vertical cross-sectional view of the grindstone at the end of fine grinding, and FIG. 5 is a vertical cross-sectional view of the grindstone at the time of strong electrolysis.

In FIG. 1, the abrasive grains 3 for rough grinding and the abrasive grains 4 for fine grinding are held by a bond material 5. The rough grinding abrasive grains 3 and the fine grinding abrasive grains 4 are generally used abrasive grains such as diamond, cBN, and SiC. The grain size is not particularly limited, and there is only a condition that the abrasive grain 3 for rough grinding has a larger grain size than the abrasive grain 4 for fine grinding. Abrasive grains for rough grinding 3
When # 400 abrasive grains are used for the
It suffices to use 1000. Further, the abrasive grains 3 for rough grinding are the metal coat 2 which is more likely to be electrolyzed than the bond material 5.
And the conductive resin coat 1 which is not electrolyzed thereon, and the fine-grinding abrasive grains 4 are covered by the electroconductive resin coat 1 which is not electrolyzed. Metal coat 2
Is preferably Ni-coated, and the bond material 5 is preferably an iron-based material which is less likely to be electrolyzed than the Ni-coated. The conductive resin coat 1 is a resin made of carbon, a resin containing metal powder (Ag, Cu, etc.) (epoxy resin, etc.), or the like. Further, the same conductive resin is used for coating the rough grinding abrasive grains 3 and the fine grinding abrasive grains 4.

A method of manufacturing this grindstone will be described. The rough-grinding abrasive grain 3 includes a Ni-metal coating 2 on the abrasive grain having a large abrasive grain size.
Is applied by a usual method, and the conductive resin 1 having a thickness of several μm to several tens of μm is further coated thereon. In addition, the fine-grinding abrasive grains 4 include several μm to several tens of μm for abrasive grains having a small abrasive grain size.
Only the conductive resin 1 having the thickness of is coated. After that, the rough-grinding abrasive grains 3, the fine-grinding abrasive grains 4 and the metal powder to be the bonding material 5 are uniformly mixed and filled in a mold, and then a load is applied for firing.

Next, the process of changing the working surface of the grindstone in the grinding process using this grindstone will be described. In the initial state of the processed surface of the grindstone, as shown in FIG. 1, the rough grinding abrasive grains 3 and the fine grinding abrasive grains 4 are exposed on the processed surface. In this state,
When a work made of a hard and brittle material is roughly ground, the coating on the protruding portion of the abrasive grains comes off due to contact with the work. This state is shown in FIG. Here, by applying a weak electrolysis (determined in the range of 30 to 60 V depending on the size of the grindstone), the metal coat 2 of the abrasive grain 3 for rough grinding is eluted, and the abrasive grain 3 for coarse grinding held along with it is removed. take off. In the trace, voids 7 are formed and the layer of the conductive resin coat 1 remains. Since the electrolysis is not so large that the bond material 5 is eluted, the oxide film 6 is attached to the surface and the electrolytic action is weakened. Since the fine grinding abrasive grains 4 are not an electrolytic substance, they do not participate in electrolysis and remain held by the bond material 5. The electroconductive resin coat 1 is also electroconductive, but is not electrolyzed, so that the fine-grinding abrasive grains 4 and the remaining electroconductive resin coat 1 do not fall off. This state is shown in FIG.

Next, the electrolysis is interrupted and the grinding process is performed again. At this time, since only the fine-grinding abrasive grains 4 are present on the processed surface of the grindstone, the fine-grinding processing is performed only with the fine-grinding abrasive grains 4. Then, when the processed surface of the grindstone comes into contact with the work, the oxide film 6 generated by the electrolysis is peeled off, and the bond material 5 is again in the electrolyzable state. This state is shown in FIG. Strong electrolysis that elutes the bond material 5 after processing (determined in the range of 60 to 90 V depending on the size of the grindstone)
As a result, the fine-grinding abrasive grains 4 and the remaining conductive resin coat 1 drop off, a new abrasive grain layer appears on the processed surface of the grindstone, and the initial state is restored. This state is shown in FIG.

According to this embodiment, when performing the rough grinding, the rough-grinding abrasive grains can mainly act, and when performing the fine-grinding process, only the fine-grinding abrasive grains act. Can be made. Therefore, by electrolyzing the grindstone, it is possible to perform both rough grinding and fine grinding with one grindstone without exchanging the grindstone. Further, if the conductive coating of the fine-grinding abrasive grains is made 1.5 to 2 times thicker than the predetermined thickness, the coated portion acts as a cushion and damages the work during fine-grinding processing. Can be kept to a minimum. Further, with the removal of the abrasive grains for rough grinding, voids are generated, the voids function as chip pockets, clogging is prevented, and fine grinding is smoothly performed.

[0017]

[Embodiment 2] FIGS. 6 to 10 show Embodiment 2, FIG. 6 is a vertical sectional view of a grindstone in an initial state, FIG. 7 is a vertical sectional view of a grindstone at the end of rough grinding, and FIG. FIG. 9 is a vertical sectional view of the grindstone, FIG. 9 is a vertical sectional view of the grindstone at the time of finishing the fine grinding, and FIG. 10 is a vertical sectional view of the grindstone at the time of strong electrolysis. In this example, instead of coating the fine-grinding abrasive grains 4 with the conductive resin coat 1 in the first embodiment, the fine-grinding abrasive grains 4 are used without being coated. Is characterized by. Since other configurations are the same as those of the first embodiment, only the characteristic parts will be described and the description of the same parts will be omitted.

In FIG. 6, the rough grinding abrasive grains 3 and the fine grinding abrasive grains 4 are held by a bond material 5. Similar to the first embodiment, the rough-grinding abrasive grains 3 are covered with the metal coat 2 that is more likely to be electrolyzed than the bond material 5 and the conductive resin coat 1 that is not electrolyzed. On the other hand, as described above, the fine-grinding abrasive grains 4 are bonded together with the rough-grinding abrasive grains 3 by the bonding material 5 without being coated.

Next, the process of changing the working surface of the grindstone in the grinding process using this grindstone will be described. In the initial state of the processed surface of the grindstone, as shown in FIG. 6, the rough grinding abrasive grains 3 and the fine grinding abrasive grains 4 are exposed on the processed surface. In this state,
When a work made of a hard and brittle material is roughly ground, the coating on the protruding portion of the abrasive grains comes off due to contact with the work. This state is shown in FIG. Here, by applying a weak electrolysis (determined in the range of 30 to 60 V depending on the size of the grindstone), the metal coat 2 of the abrasive grain 3 for rough grinding is eluted, and the abrasive grain 3 for coarse grinding held along with it is removed. take off. In the trace, voids 7 are formed and the layer of the conductive resin coat 1 remains. Since the electrolysis is not so large that the bond material 5 is eluted, the oxide film 6 is attached to the surface and the electrolytic action is weakened. Since the fine grinding abrasive grains 4 are not an electrolytic substance, they do not participate in electrolysis and remain held by the bond material 5. The conductive resin coat 1 also has conductivity, but is not electrolyzed, so that the conductive coat 1 does not fall off. This state is shown in FIG.

Next, the electrolysis is interrupted and the grinding process is performed again. At this time, since only the fine-grinding abrasive grains 4 are present on the processed surface of the grindstone, the fine-grinding processing is performed only with the fine-grinding abrasive grains 4. Then, when the processed surface of the grindstone comes into contact with the work, the oxide film 6 generated by the electrolysis is peeled off, and the bond material 5 is again in the electrolyzable state. This state is shown in FIG. Strong electrolysis that elutes the bond material 5 after processing (determined in the range of 60 to 90 V depending on the size of the grindstone)
As a result, the fine-grinding abrasive grains 4 and the remaining conductive resin coat 1 drop off, a new abrasive grain layer appears on the processed surface of the grindstone, and the initial state is restored. This state is shown in FIG.

According to this embodiment, the same effect as that of the first embodiment can be obtained, and the step of applying the conductive resin coating to the fine-grinding abrasive grains can be omitted. Therefore, the production of this grinding / polishing grindstone is simplified. Can be Further, since the surface area of the uncoated abrasive grains is smaller than that of the coated abrasive grains, the abrasive grain holding power is reduced. That is, when the grinding resistance is large, the abrasive grains are likely to fall off, so that it is possible to perform processing without applying an extra load to the processing surface of the grindstone. Further, since the iron-based metal bond holds the fine-grinding abrasive grains during the fine-grinding, there is no cushioning material between the bond material and the abrasive grains as in the first embodiment. Therefore, the processed surface accuracy is higher than that of the grindstone of Example 1.

[0022]

Third Embodiment FIGS. 11 to 15 show a third embodiment, and FIG.
Is a longitudinal sectional view of the grindstone in the initial state, FIG. 12 is a longitudinal sectional view of the grindstone at the end of rough grinding, FIG. 13 is a longitudinal sectional view of the grindstone at the time of weak electrolysis, and FIG. 14 is a longitudinal sectional view of the grindstone at the end of fine grinding. , Fig. 15
FIG. 4 is a vertical sectional view of a grindstone during strong electrolysis. The present embodiment is characterized in that the rough-grinding abrasive grain 3 and the fine-grinding abrasive grain 4 are made of the same material in the first embodiment, but are made of different materials. Since other configurations are the same as those of the first embodiment, only the characteristic parts will be described and the description of the same parts will be omitted.

In FIG. 11, the rough grinding abrasive grains 3 and the fine grinding abrasive grains 4 are held by a bond material 5. As the abrasive grains 3 for rough grinding, those which are superior in hardness to the abrasive grains for fine grinding are used. For example, when diamond is used for the rough grinding abrasive grains 3, the fine grinding abrasive grains 4 include cBN and SiC.
To use. Further, similarly to Example 1, the abrasive grains 3 for rough grinding are
The metal coat 2 which is easily electrolyzed by the bond material 5 and the electroconductive resin coat 1 which is not electrolyzed are covered, and the fine-grinding abrasive grains 4 are covered by the electroconductive resin coat 1 which is not electrolyzed. Here, the metal coat 2, the conductive resin coat 1, and the bond material 5 are made of the same materials as those in the first embodiment.

Next, the process of changing the working surface of the grindstone in the grinding process using this grindstone will be described. In the initial state of the processed surface of the grindstone, as shown in FIG. 11, the rough grinding abrasive grains 3 and the fine grinding abrasive grains 4 are exposed on the processed surface. In this state, when a work made of a hard and brittle material is roughly ground, the coating of the protruding portion of the abrasive grains is peeled off due to contact with the work. At this time, the coarse-grinding abrasive grain 3 having high abrasive grain hardness is less likely to be worn or crushed, but the fine-grinding abrasive grain 4 having low abrasive grain hardness is likely to be worn or crushed. This state is shown in FIG. Here, weak electrolysis (30-60 depending on the size of the grindstone)
(Determined within the range of V) 3 for rough grinding
The metal coat 2 of No. 3 is eluted, and the abrasive grains 3 for rough grinding held by the metal coat 2 fall off. In the trace, voids 7 are formed and the layer of the conductive resin coat 1 remains. Since the electrolysis is not so large that the bond material 5 is eluted, the oxide film 6 is attached to the surface and the electrolytic action is weakened. Since the fine grinding abrasive grains 4 are not an electrolytic substance, they do not participate in electrolysis and remain held by the bond material 5. The electroconductive resin coat 1 is also electroconductive, but is not electrolyzed, so that the fine-grinding abrasive grains 4 and the remaining electroconductive coat 1 do not fall off. This state is shown in FIG.

Next, the electrolysis is interrupted and the grinding process is performed again. At this time, since only the fine-grinding abrasive grains 4 are present on the processed surface of the grindstone, the fine-grinding processing is performed only with the fine-grinding abrasive grains 4. Moreover, at this point, the fine-grinding abrasive grains 4 have been worn or crushed to some extent. Then, when the processed surface of the grindstone comes into contact with the work, the oxide film 6 generated by the electrolysis is peeled off, and the bond material 5 is again in the electrolyzable state. This state is shown in FIG. After processing,
By applying a strong electrolysis (determined in the range of 60 to 90 V depending on the size of the grindstone) so that the bond material 5 is eluted, the fine grinding abrasive grains 4 and the remaining conductive resin coat 1
Are removed, a new abrasive grain layer appears on the processed surface of the grindstone, and the initial state is restored. This state is shown in FIG.

According to this embodiment, the same effect as in Embodiment 1 can be obtained, and the coarse-grinding abrasive grains having a relatively high hardness are used. By using the one having a low hardness, it can be made to function as a grindstone having a high processing ability during rough grinding and as a grindstone for improving the quality of the finished surface of the work during fine grinding. This is because the higher the abrasive grain hardness, the greater the mechanical action on the work, and thus the greater the processing capability (the degree to which the grinding dust of the work is removed) becomes, and the lower the abrasive grain hardness becomes. Further, in fine grinding abrasive grains with low abrasive grain hardness, abrasion or crushing of the abrasive grains easily occurs due to the load during processing, and the sharp portion of the abrasive grain surface decreases due to abrasion,
The crushing reduces the size of the abrasive grains. Therefore, the quality of the finished surface of the work can be improved.

In the present invention, the bond material of the grindstone is defined as a metal bond, but any material may be used as the material of the metal bond itself as long as it is hard to be electrolyzed by the metal coat. Regarding the conductive resin, any material may be used as long as it is a conductive resin. The abrasive grains are diamond,
Any abrasive grains other than cBN and SiC may be used.
Further, the shape of the grindstone may be any shape such as a cup type, a straight type, and a spherical type as long as a device for electrolysis can be attached.

Further, in the third embodiment, the rough grinding abrasive grains and the fine grinding abrasive grains of the first embodiment are replaced with those having different hardness. And the abrasive grains for precise grinding can be replaced with those having different hardness.

[0029]

According to the invention of claim 1, 2 or 3 and the invention of claim 4 or 5, the removal or retention of the abrasive grains is controlled by electrolysis, so that rough grinding and fine grinding can be performed with the same grindstone. Both grinding can be performed efficiently by a simple method. Further, although the electrolytic device is required, the improvement of the grinding device and the special jigs and tools are not required. further,
By electrolyzing, it is possible to always process with new abrasive grains during rough grinding, and during fine grinding, voids generated due to the removal of rough grinding grains serve as chip pockets, preventing problems such as clogging. You can According to the invention of claim 2, in addition to the above effects, since the fine-grinding abrasive grains are held by the bond material via the conductive resin having elasticity, damage to the work (crack or the like during fine-grinding) ) Is minimized. According to the third aspect of the invention, in addition to the above effects, it is possible to cause the abrasive grains having a high processing ability to act during the rough grinding, and to act on the finished surface quality of the workpiece during the fine grinding.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a grindstone in an initial state of Example 1.

FIG. 2 is a vertical cross-sectional view of a grindstone at the end of rough grinding in Example 1.

FIG. 3 is a vertical cross-sectional view of a grindstone during weak electrolysis of Example 1.

FIG. 4 is a vertical cross-sectional view of a grindstone at the end of precise grinding according to the first embodiment.

5 is a vertical cross-sectional view of a grindstone during strong electrolysis of Example 1. FIG.

FIG. 6 is a vertical sectional view of a grindstone in an initial state of Example 2.

FIG. 7 is a vertical sectional view of a grindstone at the end of rough grinding according to a second embodiment.

FIG. 8 is a vertical cross-sectional view of a grindstone during weak electrolysis of Example 2.

FIG. 9 is a vertical cross-sectional view of a grindstone at the end of precise grinding according to a second embodiment.

FIG. 10 is a vertical sectional view of a grindstone during strong electrolysis of Example 2.

FIG. 11 is a vertical cross-sectional view of a grindstone in an initial state of Example 3.

FIG. 12 is a vertical sectional view of a grindstone at the end of rough grinding according to a third embodiment.

FIG. 13 is a vertical cross-sectional view of a grindstone during weak electrolysis of Example 3.

FIG. 14 is a vertical cross-sectional view of a grindstone at the end of precise grinding according to a third embodiment.

FIG. 15 is a vertical cross-sectional view of a grindstone during strong electrolysis of Example 3.

FIG. 16 is a conceptual diagram showing a front surface of a main part of a grinding device of prior art 1.

FIG. 17 is a vertical cross-sectional view showing a capsule particle of Prior Art 2.

[Explanation of symbols]

1 Conductive resin coat 2 metal coat 3 Coarse grinding abrasive grains 4 Abrasive grains for fine grinding 5 Bond material 6 oxide film 7 void

Claims (5)

(57) [Claims] 1. In a grinding / polishing grindstone for grinding / polishing a work made of a hard and brittle material while dressing by an electrolytic in-process dressing method, a large grain size abrasive grain is coated with a metal that is easily electrolyzed by a bond material. Rough grinding abrasive grains coated with a conductive resin that does not electrolyze thereon, and fine grinding abrasive grains having a small particle size are configured by bonding with a bond material made of a metal to be electrolyzed. Grinding / polishing whetstone. 2. The grinding / polishing grindstone according to claim 1, wherein the fine-grinding abrasive grains are coated with a conductive resin. 3. The grinding / grinding method according to claim 1, wherein the rough-grinding abrasive grains are made of a material having a high hardness, and the fine-grinding abrasive grains are made of a material having a low hardness.
Polishing whetstone. 4. Abrasive grains for coarse grinding, in which abrasive grains having a large grain size are coated with a metal that is more likely to be electrolyzed than a bond material, and a conductive resin that is not electrolyzed is coated thereon, and fine-grinding grains having a small grain size and grain, the grinding wheel constructed bonded to at bond material made of a metal that is electrolytic, after the bonding material has is projected abrasive grains for the rough grinding over a strong electrolyte you elution, machining of the grinding wheel The surface is brought into contact with the work and the work is roughly ground .
A step, wherein the conductive resin <br/> coat peeled rough grinding abrasive machining surface of the grinding by the rough grinding, the metal in said grindstone
Before by only coat exerts a weak electrolytic eluting
A step of Ru is falling from the serial processing surface, after interrupting the applying electrolysis to the grindstone, fine the fine the workpiece again in a grinding abrasive grain remains held by bond material present in the working surface of the grinding wheel processing method characterized by comprising the steps of grinding, the. 5. After the precise grinding process, an electrolysis that elutes the bond material is applied to a grindstone to remove the fine-grinding abrasive grains and the remaining conductive resin coat, and a new abrasive grain layer is formed on the surface of the grindstone. processing method according to claim 4, wherein the make emerge.