JPH06296093A - Electronic component holding equipment - Google Patents

Abstract

PURPOSE:To provide an electronic component holding equipment which is simple in structure and wherein a holder holds a component holding head by a negative pressure. CONSTITUTION:A suction body 140 of a holder 92 is connected to a power supply, A spline shaft 94 is grounded, and a head path 148 is opened on a suction plane 144 composed of the spline shaft 94, a lower end surface 138, and an underside 142 of the suction body 140 to feed a negative pressure. A blocking surface 186 is composed of a metal circular plate 180 and a disc 178 fixed to the support plate 172 of a component suction head 90. The blocking surface 186 is brought into close contact with the suction plane 144 to block the head path 148 so as to enable the holder to hold the component suction head 90, and a closed circuit is composed of the suction body 140, the circular plate 180, a spring 176, a printed board 166, a spring 174, the disc 178, and the spline shaft 94, and a luminous body 160 emits light towards a suction tube 164.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component holding device, and more particularly to an electronic component holding device in which a component holding head can be replaced.

[0002]

2. Description of the Related Art Some electronic component holding devices have a holder and a component holding head which is detachably held by the holder and holds an electronic component. In recent years, the types of electronic components have diversified, and it is not possible to hold them by the same component holding head depending on the shape and size of the electronic components, and it is necessary to use different component holding heads depending on the type of electronic components. There are cases. Therefore, the component holding head is detachably held by the holder, and the component holding head corresponding to the type of electronic component is held by the holder. Moreover, when the component holding head is damaged or reaches the end of its life. If the component holding head can be attached to and detached from the holder, only the component holding head needs to be replaced, and the device cost can be reduced as compared with the case where the holder is replaced.

In the conventional electronic component holding device, the holder is provided with the engaging member and the component holding head is provided with the engaged member, and the engaging member engages with the engaged member. It is movable to a non-engaging position that does not engage with the position, and when the component holding head is attached to or detached from the holder, the engaging member is moved to engage the engaged member with the engaging member, Alternatively, it is assumed to have a drive mechanism for releasing the engagement.

[0004]

However, when the component holding head is held by the holder in this way, an engaging member and a drive mechanism that move between the engaging position and the non-engaging position are required, and the structure is required. Is complicated and costly.
An object of the present invention is to provide an electronic component holding device in which a holder can hold a component holding head with a simple structure. The invention of claim 2 further includes
An object of the present invention is to provide an electronic component holding device capable of avoiding damage to a holder and a component holding head. It is another object of the present invention to provide an electronic component holding device in which the component holding head has a light emitting plate, in which an electric current can be easily supplied to the light emitting plate.

[0005]

In order to solve the above-mentioned problems, an electronic component holding device according to the invention of claim 1
(A) a negative pressure source; (b) a holder having a negative pressure supply passage connected to the negative pressure source and a suction surface where the negative pressure supply passage opens; and (c) a holder in close contact with the suction surface. And a component holding head having a component holding portion that holds an electronic component.

The suction surface and the closing surface may be flat surfaces,
Alternatively, it may be a surface having concavities and convexities fitted to each other. The former is the aspect of claim 2.

According to a third aspect of the present invention, there is provided an electronic component holding device, wherein the component holding head has a light emitting plate opposite to the closing surface which emits light when electric current is supplied to an electric circuit, and a central portion of the closing surface. While the first central electrode and the first outer peripheral electrode connected to the electric circuit are respectively provided on the outer peripheral portion and the outer peripheral portion, the second central electrode and the first outer peripheral electrode at positions corresponding to the first central electrode and the first outer peripheral electrode of the adsorption surface, respectively. A second outer peripheral electrode is provided, one of the second central electrode and the second outer peripheral electrode is connected to a power source, the other is grounded, and when the closed surface is in close contact with the suction surface, a closed circuit including the electric circuit is formed. It is formed.

[0008]

In the electronic component holding apparatus according to the first aspect of the present invention, the suction surface and the closing surface are brought into close contact with each other to close the opening of the negative pressure supply passage, and the negative pressure source supplies the negative pressure supply passage. The blocking surface is sucked onto the suction surface by the negative pressure generated, and the component holding head is held by the holder under negative pressure. Further, when the supply of the negative pressure to the negative pressure supply passage is stopped, the holding of the component holding head by the holder is released.

According to the second aspect of the invention, the component holding head is held by the holder in a state where the suction surface and the closing surface, which are flat surfaces, are in close contact with each other.

In the electronic component holding apparatus according to the third aspect of the present invention, when the suction surface of the holder and the closed surface of the component holding head are brought into close contact with each other, a closed circuit including the electric circuit of the light emitting plate is formed. A current is supplied to the electric circuit to cause the light emitting plate to emit light in the direction opposite to the closed surface, and form a projected image of the electronic component held by the component holding head, for example.

[0011]

As described above, according to the invention of claim 1, the holder is provided with the negative pressure supply passage and the suction surface, the component holding head is provided with the closing surface, and the negative pressure is supplied to the negative pressure supply passage. The component holding head can hold the holder,
As compared with the conventional case where an engaging member or a drive mechanism that needs to be moved is provided, the structure is simple and an inexpensive electronic component holding device can be obtained.

Further, if the suction surface and the closing surface are surfaces having concavities and convexities that can be fitted to each other, the component holding head is positioned and held by the holder in a direction parallel to the suction surface and the closing surface. can get.

According to the second aspect of the present invention, since the suction surface and the closing surface are flat, the component holding head and the holder can move relative to each other in a direction parallel to the suction surface and the closing surface. When the component holding device is a device that moves in a direction parallel to the suction surface and the closing surface, even if the component holding head collides with an obstacle during the movement, a slip occurs between the suction surface and the closing surface, and the holder Is allowed to move, so that no excessive load is applied and damage is avoided. The same applies when the electronic component holding device is a device that does not move and an obstacle moving in a direction parallel to the suction surface and the closing surface collides with the component holding head.

Further, when the opening of the negative pressure supply passage is closed by the closing surface, the component holding head is attracted and held by negative pressure, so that the axes of the holder and the component holding head are displaced from each other. The holder can also hold the component holding head. Therefore, when holding the component holding head in the holder, the positioning accuracy of the holder and the component holding head does not need to be so high, and the holding can be performed easily. Further, it is not necessary to make the housing device for housing the component holding head to be detached and attached so that the component holding head can be positioned and housed with high accuracy, and can be manufactured at low cost.

According to the third aspect of the invention, since the closed circuit is formed at the same time when the component holding head is held by the holder,
Each time the component holding head is replaced, it is not necessary to remove and connect the wiring that connects the electric circuit of the light emitting plate to the power supply, and the component holding head having the light emitting plate can be quickly replaced.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An apparatus for mounting an electronic component on a printed circuit board, which is an embodiment common to the inventions of claims 1 to 3, will now be described in detail with reference to the drawings.

In FIG. 6, 10 is a base. A plurality of columns 12 are erected on the base 10, and a fixed base 14 fixed on the columns 12 is provided with an operation panel 16 and the like. On the base 10, as shown in FIG. 8, a board conveyor 2 that conveys a printed board 20 as a mounting target material in the X-axis direction (left and right directions in FIGS. 6 and 8).
Two are provided. The printed board 20 is conveyed by a board conveyor 22, and the printed board 20 is positioned and supported at a predetermined position by a positioning support device (not shown).

A cartridge type electronic component supply device 26 and a tray type electronic component supply device 28 are provided on both sides of the base 10 in the Y axis direction orthogonal to the X axis direction in the horizontal plane. In the cartridge-type electronic component mounting apparatus 26, a large number of component supply cartridges 30 are installed side by side in the X-axis direction. A taping electronic component is set in each component supply cartridge 30. In the taping electronic component, the electronic component is accommodated in each of the component accommodating recesses formed in the carrier tape at equal intervals, and the openings of the component accommodating recesses are closed by the cover film attached to the carrier tape, whereby The electronic component is prevented from jumping out from the component accommodating recess when the tape is fed. The carrier tape is fed in the Y-axis direction by a predetermined pitch, the cover film is peeled off, and the electronic component is fed to the component feeding position. Other configurations are the same as those of the parts supply cartridge described in Japanese Patent Application No. 4-185966 of the present applicant, and detailed description thereof will be omitted.

Further, the tray type electronic component supply device 28 is
Electronic components are stored and supplied in the component tray 34 (see FIG. 2). The electronic components are housed one by one in a large number of component accommodating recesses 36 (see FIG. 5) provided in the component tray 34, and the component accommodating recesses 36 have through holes 3 for reducing the weight.
7 is provided. The component tray 34 includes a large number of component tray storage boxes 38 arranged in the vertical direction as shown in FIG.
Multiple sheets are stacked inside each. Each of the component tray storage boxes 38 is supported by a support member (not shown) and is sequentially raised to a component supply position by an elevating device provided in the column 40. Above the component supply position, a component holding unit described later is provided. It is necessary to secure a space for taking out electronic components.

Therefore, the component tray storage box 38 that has finished supplying the electronic components is raised by the above-mentioned space at the same time when the next component tray storage box 38 is raised to the component supply position and is moved to the upper retreat area. Evacuated. In this tray type electronic component supply device 28, even if the component tray 34 has finished supplying the electronic components, the component tray housing box 38 is not raised one component tray at a time, and the component supply position is increased as the component tray 34 is discharged. Is the same as the electronic component supply apparatus described in Japanese Patent Publication No. 2-57719, except that the component tray 34 is lowered by one sheet at a time. The component tray storage box 38 is drawn out in the X-axis direction as shown by the chain double-dashed line in FIG. 8 so that an operator can inspect the inside.

These cartridge type electronic component supply devices 2
6 and the electronic components 44 (see FIG. 2) supplied by the tray-type electronic component supply device 28 are mounted on the printed circuit board 20 by the electronic component mounting device 46 provided on the base 10. As shown in FIG. 7, guide rails 48 extending in the X-axis direction are provided on both sides of the substrate conveyor 22 on the base 10 in the Y-axis direction, and an X-axis slide 50 as a first moving member is provided in the guide block 52. It is movably fitted.

The X-axis slide 50, as shown in FIG.
It has a length from the cartridge type electronic component supply device 26 to the tray type electronic component supply device 28 across the substrate conveyor 22 and two nuts 54 (only one is shown in FIG. 2) are respectively ball screws. The ball screws 56 are screwed together and are rotated in synchronization with the X-axis servomotors 58, respectively, whereby the ball screws 56 are moved in the X-axis direction. The X-axis direction is the first movement direction, and the nut 5
4, the ball screw 56 and the X-axis servomotor 58 form a first drive device, and together with the X-axis slide 50 form a first moving device.

A Y-axis slide 60 as a second moving member is provided on the X-axis slide 50 so as to be movable in the Y-axis direction which is the second moving direction. As shown in FIG. 7, a ball screw 64 extending in the Y-axis direction is attached to the vertical side surface 62 of the X-axis slide 50, and the Y-axis slide 60 is screwed with a nut 66 (see FIG. 2). , The ball screw 64 is the Y-axis servomotor 68 shown in FIG.
By being rotated by the gears 70 and 72, the Y-axis slide 60 is guided by the pair of guide rails 74 and moved in the Y-axis direction. The ball screw 64, the nut 66, the Y-axis servomotor 68, and the like constitute a second drive device, and together with the Y-axis slide 60, a second moving device.

On the vertical side surface 78 of the Y-axis slide 60,
As shown in FIG. 2 and FIG. 3, the component holding unit 80 is attached so as to be able to move up and down and rotatably, and the elevating device 82 for raising and lowering the component holding unit 80 and the electronic component 44 held by the component holding unit 80 are center lines. A rotating device 84 for rotating the device, and a CCD camera 86 for picking up an image of a reference mark provided on the printed board 20 (see FIG. 8).
And a CCD camera 88 as an image pickup device for picking up an image of the electronic component 44.

The component holding unit 80 is a component suction head 90 as a component holding head for sucking the electronic component 44.
And a holder 92 for holding the component suction head 90. The holder 92 is moved by the first moving device and the second moving device, and these first moving device and second moving device form a holder moving device. There are small, large, and extra large electronic components 44, and the component suction head 90 sucks a large electronic component 44. Therefore, the component suction head 90 is hereinafter referred to as a large component suction head 90. To do.

The holder 92 has a spline shaft 94 as shown in FIG. 3, and is fitted in a spline hole 98 of a sleeve 96. The sleeve 96 is rotatably and axially immovably held by an arm 100 projecting from a side surface 78 of the Y-axis slide 60.
A pair of gears 102 and 104 are provided at the lower end portion projecting from 0 for removing backlash, and a gear 108 rotated by a rotation drive motor 106 of a rotating device 84.
Have been meshed with. As a result, the spline shaft 94
Is accurately rotated about its own axis by the rotary drive motor 106 via the gears 102, 104, 108 and the sleeve 96, and the electronic component 44 held by the large component suction head 90 is rotated. The rotary drive motor 106 is also a servo motor.

As shown in FIG. 2, the CCD camera 88 for picking up the image of the electronic component 44 is the projecting end of the arm 100, and the position in the Y-axis direction is the component suction unit 8.
It is provided downward at a position corresponding to 0.

An engagement member 110 made of metal is attached to the upper end of the spline shaft 94 so as to be relatively rotatable and immovable in the axial direction, and the engagement member 110 extends horizontally from the engagement member 110. The piece 112 is the solenoid 11
4 is supported from below. The solenoid 114 is attached to an elevating slide 120 as an elevating member of the elevating device 82. The large component suction head 90 includes a lifting member 120 via a solenoid 114 and an engaging member 110.
Is supported from below by.

The elevating slide 120 is a Y-axis slide 60.
Ball screw 12 vertically attached to the side surface 78 of the
2 is screwed into a nut (not shown), and the ball screw 122 is rotated by the lifting motor 130 via the pulleys 124, 126 and the belt 128, so that the lifting slide 120 is lifted and lowered.
The large component suction head 90 is moved up and down via the solenoid 114 and the engaging member 110. Since the large component suction head 90 is supported from below by the elevating slide 120, when the elevating slide 120 descends, it follows and descends, and when ascending, it rises and ascends. The raising / lowering motor 130 is a servo motor, and the rotation amount of the raising / lowering motor 130 is detected by the encoder 132, and the raising / lowering distance of the raising / lowering slide 120, and by extension, the large component suction head 90 can be known.

The solenoid 114 has a yoke around which a coil is wound. The yoke is electrically insulated and attached to the elevating slide 120, and the upper surface of the yoke is in contact with the lower surface of the engaging piece 112 of the engaging member 110. Therefore, when an exciting current is supplied to the coil and a magnetic field is formed, the engaging member 110 is attracted to the yoke and fixed to the elevating slide 120. Solenoid 114
The component holding head attracting device is configured to apply a pulling force that attracts the large component suction head 90, which is the component holding head, to the lifting slide 120, which is the lifting member.
The timing when the solenoid 114 applies the attractive force will be described later.

Further, the yoke of the solenoid 114 and the engaging member 110 are respectively connected to a power source (not shown), and when the yoke is in contact with the engaging member 110, they are electrically connected to each other and are separated from each other so that they are not electrically connected. Composite material 1
A contact detection switch 134 (see FIG. 9) that detects whether 10 is in contact with the solenoid 114 is configured.

At the lower end of the spline shaft 94 of the holder 92, a resin ring 136 is fixed as shown in FIG. The ring 136 has a larger diameter than the spline shaft 94, but the lower surface of the ring 136 is the lower end surface 1 of the spline shaft 94.
It is a short distance from 38. A metal adsorbent 140 is fixed to the outside of the ring 136. Adsorbent 14
The lower surface 142 of No. 0 is located in the same plane as the lower end surface 138 of the spline shaft 94, and the lower end surface 138 and the lower surface 142 form the suction surface 144.

In the spline shaft 94, as shown in FIGS.
As shown in FIG. 7, a component passage 146 extending in the axial direction and a head passage 148 as a negative pressure supply passage are provided in parallel. The lower end of the component passage 146 is concentric with the axis of the spline shaft 94 as shown in FIG.
8 and the head passage 148 has a ring 136.
Is opened to the lower surface 149.

The component passage 146, as shown in FIG.
Rotary joint 15 formed integrally with the engaging member 110
0, the negative pressure source 15 via the piping connected to it and the electromagnetic directional control valves 151 and 152 provided in the middle of the piping.
3. Alternately communicate with positive pressure source 154 and atmosphere. The head passage 148 includes a rotary joint 156 formed integrally with the engaging member 110, a pipe connected to the rotary joint 156, and an electromagnetic directional control valve 15 provided in the middle of the pipe.
By means of 8, the negative pressure source 153 and the atmosphere are selectively communicated.

As shown in FIG. 1, the large component suction head 90 has a light emitting body 160, a diffusion plate 162, and a suction tube 164 as a component holder. The light emitting body 160 is an annular printed circuit board 166 to which a large number of light emitting diodes 168 are attached. The inner peripheral portion of the printed circuit board 166 is made of resin and has a support plate 172 whose diameter is equal to that of the adsorbent 140. However, the outer peripheral portion of the printed circuit board 166 is not fixed to the support plate 172.
It is possible to contact and separate from 2.

The light-emitting body 160 thus supported by the support plate 172 is fitted and fixed to the projection 173 provided at the center of the diffusion plate 162 together with the support plate 172, and is formed on the diffusion plate 162. It is housed in a circular annular recess 170. The light emitting body 160 and the support plate 17
2 is provided with a slight gap 175 between the light emitting diode 168 and the bottom surface of the recess 170 in a state of being fixed to the diffusion plate 162 to define the outer peripheral edge portion of the support plate 172 and the recess 170 of the diffusion plate 162. A slight gap 177 is provided between the outer peripheral wall and the upper surface of the outer peripheral wall.

On the upper surface of the support plate 172, a metal disk 178 having a diameter slightly larger than the lower end surface 138 of the spline shaft 84, and a metal annular plate 180 having an outer diameter equal to the diameter of the support plate 172. And are concentrically fixed. Disk 1
The upper surface 182 of 78 and the upper surface 184 of the annular plate 180 are respectively projected above the upper surface of the support plate 172 and located in the same plane, and the suction surface 14
4 forms a closing surface 186 that is in close contact. Support plate 17
In addition, 2 is also provided with a plurality of through holes penetrating in the center line direction at the portions where the circular plate 180 and the circular plate 178 are fixed, respectively, and accommodates the springs 174 and 176, respectively. One end of 176 is the light emitter 1.
60 is contacted with the electric circuit of the printed circuit board 166,
The other end is in contact with the circular plate 180 and the circular plate 178. Further, a through hole 188 is provided through the centers of the diffusion plate 162, the support plate 172, and the circular plate 178, and the suction pipe 164 is fitted therein.

When the suction surface 144 and the closing surface 186 are in contact with each other, the suction pipe 164 is communicated with the component passage 146, and the head passage 148 is provided with the disc 178, the annular plate 180, the support plate 172 and The space 190 surrounded by the adsorbent 140 is opened. Therefore, if negative pressure is supplied to the component passage 146 in this state, the suction pipe 164 sucks the electronic component 44, and if negative pressure is supplied to the head passage 148, the suction surface 144 is closed.
86 is sucked and the large component suction head 90 is sucked and held by the holder 92 by negative pressure.

The adsorbent 140 is connected to a power source through a switch by a lead wire (not shown), and the spline shaft 14
6 is grounded. The plus side circuit of the printed board 166 and the annular plate 180 are electrically connected by the spring 174, and the minus side circuit and the disc 178 are connected by the spring 176. Therefore, when the large component suction head 90 is sucked by the holder 92, the suction member 140, the annular plate 180, the spring 174, the light emitting diode 168, and the spring 17 are attached.
6, electric current is supplied to the electric circuit including the disc 178 and the spline shaft 94, and the electronic component 44 adsorbed by the adsorption tube 164 is irradiated.

In the present embodiment, the spline shaft 146
Is the first central electrode, the adsorbent 140 is the first outer electrode, and the disc 1
78 constitutes a second central electrode, the annular plate 180 constitutes a second outer peripheral electrode, and the first central electrode and the first outer peripheral electrode are respectively,
The springs 176 and 174 are connected to the electric circuit of the printed circuit board 166 of the light emitter 160.

The luminous body 160 is a printed circuit board 166.
The inner peripheral side portion of the spline shaft 94 is fixed to the support plate 172, and the outer peripheral portion can contact and separate from the support plate 172. Even if the end surface 138 and the circular plate 178 and the lower surface 142 of the suction body 140 and the circular plate 180 cannot be in contact at the same time, they can be brought into contact with each other to ensure the conduction.

For example, the lower end surface 1 which constitutes the suction surface 144
When 38 contacts the upper surface 182 prior to the lower surface 142 forming the suction surface 144, the support plate 172 is sucked by the negative pressure, so that the supporting plate 172 is separated from the printed board 166 and is bent concavely toward the spline shaft 94 side. The upper surface 184 is the lower surface 1
42.

On the contrary, when the lower surface 142 comes into contact with the upper surface 184 before the lower surface 138 comes into contact with the upper surface 182, the support plate 172 is sucked by the negative pressure, so that the support plate 172 moves toward the spline shaft 94 side. The upper surface 182 is bent to be brought into contact with the lower end surface 138. The outer peripheral portion of the printed circuit board 166 is not fixed to the support plate 172, and
Has a low rigidity, and the light emitting diode 168 is
Since gaps 175 and 177 are provided between the outer peripheral edge portion of the support plate 172 and the outer peripheral edge portion of the support plate 172, respectively, the support plate 172 bends. Is allowed, and the closing surface 186
Is surely brought into contact with the suction surface 144 to ensure conduction.

Even if the support plate 172 is bent and attracted as described above, the positive side circuit of the printed circuit board 166 and the annular plate 180 are electrically connected and the negative side circuit and the circular plate 178 are electrically connected. , And is maintained by the expansion and contraction of the springs 174 and 176. Furthermore, in this way the closure surface 1
By securely contacting the suction surface 144 with the suction surface 144, leakage of negative pressure is prevented, and the component suction nozzle 90 is attached to the holder 9
It is firmly held by 2.

The component suction head is composed of the shape of the electronic component 44,
Different ones are used depending on the size and the like. For example, when the size of the electronic component 44 is small, the suction tube 164 and the light emitter 160 may be small, and as shown by the alternate long and short dash line in FIG. The head 194 is used. Note that such a small electronic component 44 is used in the component supply cartridge 30.
The suction pipe 164 has a short length because the component accommodating concave portion of the carrier tape is shallow.

When the electronic component 44 is relatively large, the diameter of the diffusion plate 162 is equal to that of the suction member 140 of the holder 92 and the suction pipe 164 is thick, as in the large component suction head 90 shown in FIG. , A long large component suction head is used. The large electronic components 44 are often supplied by the component tray 34, and the suction pipe 164 of the large component suction head 90 for large electronic components is also electronically supplied from the component tray 34 accommodated in the lowermost stage of the component tray storage box 38. Part 44
It is supposed to be long enough to be taken out. The large component suction head 90 of this size can also take out the electronic component 44 from the component supply cartridge 30.

Further, when the electronic component 44 is extremely large, as shown by the solid line in FIG. 4, the luminous body 160 has a larger diameter than the suction body 140 of the holder 92, and the suction pipe 164 has a larger diameter. Head 196 is used.

The component tray 34 of the tray type electronic component supply device 28 needs to be discharged, for example, if all the electronic components 44 accommodated in the component tray 34 are mounted. Therefore, in the present electronic component mounting apparatus, the holder 92 is made to hold the tray suction head 200 shown in FIG. 5 in place of the large component suction head 90, and the electronic component mounting apparatus 46 ejects the component tray 34. . In this case, the tray suction head 200 constitutes a tray holding head.

The tray suction head 200 has a cylindrical suction body 202 and an air supply body 204. Adsorbent 20
No. 2 has flange portions 208 and 210 extending outward in the radial direction, respectively, formed at both ends of the cylindrical portion 206 in the longitudinal direction. The diameter of the flange portion 208 is equal to the diameter of the suction member 140 of the holder 92, and the flange portion 210
Has a diameter larger than that of the flange portion 208 and is equal to the diameter of the diffusion plate 162 of the extra-large component suction head 196.
In addition, a plurality of through holes 212 are formed at equal angular intervals in a portion of the cylindrical portion 206 adjacent to the flange portion 208.

Further, of the inner peripheral surface of the portion of the cylindrical portion 206 where the through hole 212 is formed and the flange portion 210, the portion adjacent to the through hole 212 is the flange portion 2.
The partial conical surface 214 whose inner diameter gradually decreases toward the 10th side, the part following the partial conical surface 214 is a cylindrical surface 216, and the part following the cylindrical surface 216 is a partial conical surface 218 whose inner diameter gradually increases toward the flange 210 side. Has been done.

The air supply body 204 has a disk portion 222 having the same diameter as the flange portion 208, and a projection 224 projecting from the center of the disk portion 222, and the projection 224 is the cylindrical portion 20.
6, the disc portion 222 is seated and fixed to the flange portion 208. Protrusion 22
The protruding end portion 226 of No. 4 is slightly retracted from the flange portion 210 and has a large diameter, and the outer peripheral surface of the protruding end portion 226 on the side of the disk portion 222 is a partial conical surface 228 whose diameter gradually increases toward the protruding end side. After the cylindrical surface 230 following the partial conical surface 228 is formed, the outer peripheral surface on the tip side is a partial conical surface 232 whose diameter gradually decreases toward the tip. Thereby, in the annular space between the projecting end 226 and the cylindrical portion 206, a narrow annular passage 234 is formed between the portion on the side of the through hole 212 and the portion on the side of the flange portion 210 in the center line direction.
Are formed.

A bottomed air passage 238 opening to the disc portion 222 is formed in the protrusion 224, and a plurality of jet outlets 240 opening to the partial conical surface 228 are formed in the protrusion end 226. It is formed obliquely toward the through hole 212. Further, a sponge 242 is attached to the projecting end surface of the projecting end portion 226 and is projected from the flange portion 210.

The tray suction head 2 configured as described above
00 and the extra large component suction head 196 are used less frequently, and the large component suction head 90 and the small component suction head 194 are used more frequently. Therefore, when these heads are not used, as shown in FIG.
0, the first head support base 250 and the second head support base 2 respectively provided at two positions separated from each other in the substrate transport direction.
It is divided into 52 and supported.

The first head support base 250 is for the large component suction head 90 and the small component suction head 194, and the second head support base 252 is for the extra large component suction head 196 and the tray suction head 200. Five head fitting holes 254 and three head fitting holes 256 are provided as supporting portions. The head fitting holes 254 and 256 have the same structure except for the difference in size, and the head fitting hole 256 will be described as a representative.

As shown in FIG. 8, the three head fitting holes 256 are formed in a zigzag shape by vertically penetrating the second head support 252, and the dimension of the second head support 252 in the Y-axis direction. Is smaller and more compact than the case where three head fitting holes 256 are formed in line in the Y-axis direction. The diameter of the upper surface side of each head fitting hole 256 is made equal to the diameter of the diffusion plate 162 of the extra-large component suction head 196 as shown in FIG. 4, and the diameter of the lower surface side is made slightly smaller than that. An upward supporting seat surface 260 is formed. Further, as shown in FIG. 8, the second head support 252 has a head fitting hole 256 and a second head support 252.
And a notch 262 that is wide enough to allow the suction tube 164 to pass therethrough.

The tray suction head 200 has a head fitting hole 25 in the flange portion 210 as shown in FIG.
6 is seated on the supporting seat surface 260. Therefore, of the three head fitting holes 256, the head fitting hole 25 on the front end side is included.
6 is for the tray suction head 200, is provided below the head fitting hole 256 for another special component suction head 196, and the upper surface of the flange portion 208 is located in the same plane as the upper surface of the large component suction head 196. Has been As a result, the holder 92 can hold and release the tray suction head 200 with the same vertical distance as when the extra-large component suction head 196 is sucked.

On the X-axis slide 50, as shown in FIGS. 2 and 8, there are two prisms 270 as reflecting devices.
Is fixed and constitutes an image pickup system together with the CCD camera 88. These prisms 270 are located at positions corresponding to the ball screws 56 that move the X-axis slide 50 in the Y-axis direction below the X-axis slide 50, and between the cartridge-type electronic component supply device 26 and the printed circuit board 20. It is provided at a position between the tray type electronic component supply device 28 and the printed circuit board 20.

The structures of these prisms 270 are the same. The casing 272 of the prism 270 is fixed to the X-axis slide 50 as shown in FIG.
70 is tilted about 45 degrees with respect to a vertical plane including the center line of the large-component suction head 90 just below the movement path of the large-component suction head 90 in the Y-axis direction, and on the side far from the X-axis slide 50. Reflective surface 274 whose end is located below
And a reflection surface 276 symmetrically with respect to the reflection surface 274 and the vertical surface, at a position directly below the movement path of the CCD camera 88 in the Y-axis direction. The outer surface of the reflecting surface 274 is subjected to a half mirror process so that most of the light emitted from the large component suction head 90 side is reflected while the light emitted from below is transmitted.

Further, the X-axis slide 5 of the casing 272
A shutter 280 is fixed to the outer surface opposite to the 0 side. The dimension of the shutter 280 in the Y-axis direction is the reflection surface 27.
No. 4,276, which is made to project upward from the casing 272, and the projecting end portion is the X-axis slide 50.
It is bent horizontally to the side, the reflecting surface 276 and the CCD camera 88.
It is a shielding portion 282 that projects between and. Further, a cutout 284 is provided in the central portion of the shield portion 282 in the Y-axis direction. Therefore, when the Y-axis slide 60 moves, the CCD camera 88 moves on the shielding portion 282, and when passing through the cutout 284, the reflected light from the reflecting surface 276 is obtained, and the cutout 284 in the X-axis direction is obtained. The size is made large enough to allow the image forming light reflected from the reflecting surface 276 to pass, and the size of the notch 284 in the Y-axis direction is C.
The length vt is obtained by multiplying the moving speed v of the CD camera 88 in the Y-axis direction by the exposure time t.

As shown in FIG. 10, the reflected light from the reflecting surface 276 is inverted by the lens and enters the image pickup surface constituted by the image pickup element of the CCD camera 88, and the visual field range of the CCD camera 88 is shown by a solid line. The range is indicated by. When the CCD camera 88 moves in the Y-axis direction shown by the arrow in the figure, light from respective corresponding positions within the field of view enters the imaging surface. Taking the upstream end in the moving direction of the imaging surface as an example, from the downstream end in the moving direction of the visual field range until the CCD camera 88 moves from the position shown by the solid line to the position shown by the alternate long and short dash line. Reflected light enters through the notch 284 and exposes the image sensor. Therefore, notch 2
The length of 84 in the Y-axis direction is the exposure time t of the CCD camera 88.
If the length is multiplied by the moving speed v, the image pickup element can be exposed for the time required for the image pickup and the electronic component 44 can be imaged.

The lengths of the reflecting surfaces 274 and 276 in the Y-axis direction are reflected by the reflected light from the reflecting surface 276 and are incident on the image pickup surface of the CCD camera 88. The length from the position where the incidence of light to the downstream end in the moving direction of the surface to the position where the incidence of light ends to the upstream end in the moving direction of the imaging surface ends as indicated by the dashed line. It is a minimum requirement and will be slightly longer than that. The length of the reflecting surfaces 274 and 276 in the Y-axis direction varies depending on the length of the notch 284 in the Y-axis direction and may be narrower than the field of view of the CCD camera 88, but in the present embodiment, it is wider than the field of view. There is.

As shown in FIG. 2, the X-axis slide 50 further has front lights 290, 292 attached to the lower side and the upper side of the reflecting surface 274 of the prism 270 by attaching members (not shown). The front light 290 below the reflection surface 274 is formed by fixing a large number of light emitting diodes 296 to a printed circuit board 294 and is horizontally arranged. The front light 292 above the reflection surface 274 has a large number of light emitting diodes 3 on the inner peripheral surface of the printed circuit board 298 whose inner peripheral surface and outer peripheral surface are tapered surfaces.
00 is fixed, and the large diameter side is provided at a position concentric with the component holding unit 80 when the component holding unit 80 is at the central position in the Y-axis direction of the prism 270. These front lights 290 and 292 are electronic components 4
4 is irradiated with light from below, and is used when acquiring the surface image of the electronic component 44.

This electronic component mounting apparatus is controlled by the control device 310 as the control means shown in FIG. The control device 310 includes a CPU 312, a ROM 314, and a RAM 31.
6 and a computer having a bus 318 connecting them. An image input interface 322 is connected to the bus 318, and the CCD camera 8
6, 88 are connected. A servo interface 324 is also connected to the bus 318, and the encoder 13
2, the X-axis servo motor 58, the Y-axis servo motor 68, the rotary drive motor 106, and the lifting motor 130 are connected. A digital input interface 326 is also connected to the bus 318, and a contact detection switch 134 is connected to the bus 318. A digital output interface 328 is further connected to the bus 318, and the board conveyor 22 and electromagnetic directional control valves 151, 152, 158 are also connected.

Next, the operation will be described. When mounting an electronic component on the printed circuit board 20, a component holding unit 80
Moves to the parts supply position of the cartridge type electronic parts supply device 26 or the tray type electronic parts supply device 28 by the movement of the X axis slide 50 and the Y axis slide 60, and holds the electronic parts 44. Here, the large component suction head 90
Is held by the holder 92, and the large electronic component 44 supplied by the cartridge type electronic component supply device 26 is mounted.

The component holding unit 80 moves to the component supply position of the component supply cartridge 30 which supplies a predetermined electronic component 44 according to the data designating the type of the electronic component 44 to be mounted. After the movement, it is lowered by the elevating device 82. As shown in the graph of FIG. 11, the descending speed is accelerated by a certain distance and then becomes a constant high speed, and after being decelerated, the adsorption pipe 164 is moved. Immediately before coming into contact with the electronic component 44, the suction tube 164 is brought into contact with the electronic component 44 with a low impact at a constant low speed. Solenoid 1
14 is excited during acceleration, the engaging member 110 is attracted to the yoke and is integrally lowered, and the component holding unit 80 will not be separated from the elevating slide 120 due to inertia even if the descending acceleration is larger than the gravitational acceleration. To be

The solenoid 114 is demagnetized except during acceleration. Therefore, the suction tube 164 is connected to the electronic component 44.
When contacting the
Is not adsorbed, and the descending distance of the elevating slide 120 is
The suction pipe 164 is made longer than the distance between the suction pipe 164 and the electronic component 44 before the descent is started so that the suction pipe 164 surely contacts the electronic component 44.
4, the solenoid 114 disengages from the engagement member 110 and the lift slide 120 can be lowered an extra distance. In this way, the contact detection switch 134 detects that the solenoid 114 is separated from the engaging member 110 and the suction tube 164 contacts the electronic component 44.

Further, the solenoid 114 has the engaging member 110.
Since the electronic component 44 is separated from the component holding unit 8
Only a weight of 0 is added. In this way, lift slide 1
If the component holding unit 80 is supported from below by the solenoid 114 and the engaging member 110 is attracted by the excitation of the solenoid 114 so that the component holding unit 80 does not separate from the elevating slide 120, the solenoid 114 is moved to the elevating slide 120. Instead of the above, a supporting member is provided to support the engaging member 110 from below, and a rod is projectingly provided on the supporting member so as to project above the engaging piece 112, and between the protruding end portion and the engaging piece 112. The load applied to the electronic component 44 can be reduced as compared with the case where a spring is provided to press the engagement piece 112 against the support member so that the engagement member 110 does not separate from the elevating slide 120 when descending.

In order to prevent the component holding unit 80 from being separated from the elevating slide 120 by using the spring, it is necessary to set the set load F of the spring to a value that satisfies the expression (1). . (Α−g) m ≦ F (1) where α: maximum descending acceleration of the elevating slide 120 g: gravitational acceleration m: mass of the component holding unit 80

Then, the suction tube 1 of the large component holding head 90
After the contact of 64 with the electronic component 44, the slide 1
In order for 20 to descend, it is necessary to overcome the set load F of the spring and compress the spring, and the weight of the component holding unit 80 and the set load of the spring are applied to the electronic component 44. On the other hand, the engaging member 1
If the component suction head 90 is attracted by the solenoid 114 and released when the component suction head 90 comes into contact with the electronic component 44 and the elevating slide 120 is separated from the component holding head 80, the electronic component 44 has a weight m of the component holding unit 80.
Only g is added, and the load is small.

When the component holding unit 80 is lowered, the descending speed is controlled as follows. Electronic component 4
Even if the dimensions of No. 4 and the position of the bottom surface of the component accommodating recess formed in the carrier tape of the component supply cartridge 30 are varied, the distance by which the component holding unit 80 can be lowered at a constant low speed is 0.3 mm. Is done. There are variations in the size of the electronic component 44 and the position of the bottom surface of the component housing recess, and the lower end surface of the suction pipe 164 and the electronic component 44 are
If the actual distance of the upper surface of the component holding head 80 is shorter than when there is no variation, the component holding head 80 is not sufficiently decelerated.
Touches the electronic component 44 to cause a large impact, and if the actual distance is longer than when there is no variation, the descent time at a constant low speed becomes long, and it takes a long time to pick up the component. Therefore, speed control is performed without causing a large impact and a long descent time.

First, when the suction of the electronic component 44 is started, the initial setting is performed so that the distance at which the suction pipe 164 is lowered at a constant low speed immediately before contacting the electronic component 44 is approximately 2 mm. The acceleration distance and the deceleration distance are constant, and the distance L ₁ that makes the descending speed a constant high speed after acceleration is adjusted so that the constant low speed descending distance becomes 2 mm. Then, the component holding unit 80 is lowered to determine the speed change timing from deceleration to a constant low speed, the contact timing of the suction pipe 164 with the electronic component 44 detected by the contact detection switch 134, and the detection value of the encoder 132 at each timing. As shown in FIG. 11, the actual distance L _R descending at a constant low speed is calculated, and the difference between this distance L _R and 0.3 mm is added to the distance L ₁ descending at a constant high speed. As a result, when the distance L _R is longer than 0.3 mm, the distance L
₁ is increased by the distance L ₁ is shorter in the case the distance L _R is shorter than 0.3 mm, the distance of falling at a constant low speed immediately before the suction pipe 164 contacts the electronic component 44 0.
It will be 3 mm.

As described above, the descending distance at a constant low speed is 0.
Distance L for 3 mm₁ Correction of parts supply cartridge
It is performed every 30 days. At this time, the dimensions of the electronic component 44
Due to the difference in the size of the component accommodating recess,
If the heights are different, the distance L is set at the initial setting.₁ Is electronic
The distance is set according to the height of the upper surface of the component 44. Electronic
The distance between the upper surface of the component 44 and the lower end surface of the suction tube 164 is set in advance.
I know, distance L ₁ According to the height of the electronic component 44
It can be set to a distance.

Then, the distance L ₁ is stored in the RAM 316 in association with the type of the component supply cartridge 30, and when the electronic component 44 is next taken out from the same component supply cartridge 30, the distance L ₁ is read from the RAM 316. In the component holding head 80, the suction pipe 164 has the electronic component 4
It is lowered at a constant low speed of 0.3 mm just before contacting No. 4. Even when the second and subsequent electronic components 44 are taken out from the same component supply cartridge 30, the contact detection switch 134 detects when the suction tube 164 contacts the electronic component 44, and the actual distance L _R is calculated and fixed. The distance L ₁ is corrected so that the descending distance at low speed becomes 0.3 mm.
As a result, even if there is an error in the dimensional error of the electronic component 44 or in the height of the bottom surface of the component accommodating recess, the suction tube 164 is attached to the electronic component
4 can be brought into quick contact with less impact.

The component holding unit 80 is the electronic component 4
The constant low descent speed immediately before contacting 4 is, for example,
It is determined by the magnitude of the impact force when the component holding unit 80 contacts the electronic component 44 and the weight of the component holding unit 80.

After the suction pipe 164 is brought into contact with the electronic component 44 in this manner, negative pressure is supplied to the component passage 146 and the suction pipe 164 sucks the electronic component 44. After the suction, the component holding unit 80 is raised by raising the elevating slide 120. After that, the component holding unit 80 detects the component supply position of the component supply cartridge 30 and the printed circuit board 2.
The component can be moved to the component mounting position along a straight line connecting the component mounting position of 0 and the X-axis slide 50 at this time.
On the prism 270 fixed at a position between the component supply position and the component mounting position.

The cartridge-type electronic component supply device 28 and the printed circuit board 20 are located at the component supply position and the component mounting position.
In any of the above positions, in order for the component holding unit 80 to move from the component supply position to the component mounting position,
It moves on the X-axis slide 50 in the Y-axis direction and passes through a portion between the cartridge type electronic component supply device 26 and the printed circuit board 20. Therefore, the prism 27 is provided at a portion located between the component supply position and the component mounting position of the X-axis slide 50.
If 0 is fixed, the component holding unit 80 always passes over the prism 270.

At this time, the light emitted from the light emitter 160 and forming the projected image of the electronic component 44 is reflected by the reflecting surface 274 and then upward by the reflecting surface 276. When the component holding unit 80 passes over the prism 270, the electronic component 44 passes over the reflection surface 274 and the CCD
The camera 88 passes over the reflecting surface 276, and the shutter 280
The electronic component 44 is imaged by the image forming light that enters the imaging surface through the notch 284 formed in the shielding portion 282.

The CCD camera 88 is a component holding unit 80.
Together with the arm 100, the component holding unit 80
Since the electronic component 44 held by the camera moves integrally with the electronic component 44, the image forming light reflected by the reflecting surface 276 follows the CCD camera 88 when the electronic component 44 and the CCD camera 88 pass over the prism 270. And CC
The D camera 88 can image the electronic component 44 in the same state as when the electronic component 44 is stationary. As described above, the shutter 28
The length of the notch 284 of 0 in the Y-axis direction is the length obtained by multiplying the exposure time of the CCD camera 88 by the moving speed, and the image pickup element is sufficiently exposed by the image forming light to image the electronic component 44.

The data of the imaged image is stored in the computer 32.
At 0, normal image data having no holding position error is compared, and center position errors ΔX and ΔY and a rotational position error Δθ are calculated. In addition, the horizontal position error Δ of the printed circuit board 20
X ′ and ΔY ′ are calculated by previously capturing an image of the reference mark provided on the printed circuit board 20 with the CCD camera 86, and the moving distance of the electronic component is calculated based on these errors before moving to the component mounting position. Is corrected and the electronic component 44 is rotated by the rotating device 84 to correct the rotational position error Δθ, and the electronic component 44 is mounted at the component mounting position on the printed circuit board 20 in a regular posture.

The component holding unit 80 is the printed circuit board 20.
After being moved to the component mounting position, the electronic component 44 is mounted on the printed circuit board 20 by being lowered by the lifting device 82. At this time, the descending speed is the same as in the case where the electronic component 44 is taken out from the component supply cartridge 30 as shown in FIG.
As shown in FIG. 1, after acceleration, the speed is set to a constant high speed, and after deceleration, the speed is set to a constant low speed immediately before the electronic component 44 contacts the printed circuit board 20. When accelerating, the solenoid 1
14 is excited to attract the engaging member 110, and even if the descending acceleration is larger than the gravitational acceleration, the component holding unit 80 is integrally lowered with the elevating slide 120, and is demagnetized except during acceleration, so that the electronic component 44 is Printed circuit board 20
After being placed on the upper side, the elevating slide 120 is allowed to descend further as in the case of sucking the electronic component 44.

Even when the electronic component 44 is mounted on the printed circuit board 20, the electronic component 44 is mounted on the printed circuit board 20 as in the case where the component holding unit 80 holds the electronic component 44.
Immediately before coming into contact with, the distance that descends at a constant low speed is 0.3 mm
The descending speed is controlled so that Initial setting is performed at the start of mounting, and after the electronic component 44 is mounted on the printed circuit board 20 by setting the distance L ₁ so that the descending distance at a constant low speed is 2 mm, the descending distance at a constant low speed is set. 0.3
The distance L ₁ is corrected to be mm. By controlling the descending speed in this way, even if the printed circuit board 20 has irregularities due to manufacturing errors or post-manufacturing distortion, the electronic component 44 can be mounted on the printed circuit board 20 without increasing the descending time and reducing the impact. Can be attached to.

When the electronic component 44 is mounted on the printed circuit board 20, the component holding unit 80 is moved down from the upper end position to the printed circuit board 20. However, depending on the size of the electronic component 44, the electronic component 44 and the printed circuit board 20 may be separated from each other. The distance is different. Since the type and size of the electronic component 44 to be mounted are known, the distance L ₁ at the time of initial setting is the electronic component 44.
Each time, a different value is set so that the descending distance at a constant low speed immediately before contacting the printed circuit board 20 is 2 mm.

The distance L ₁ is associated with the type of electronic component 44 and the electronic component mounting position of the printed circuit board 20 in the RAM.
It is stored in 136. Then, when the same type of electronic component 44 is mounted at the same component mounting position on the same type of printed circuit board 20 next time, it is read from the RAM 136, and a constant low voltage is reached 0.3 mm immediately before the electronic component 44 contacts the printed circuit board 20. It is made to descend at a speed. The distance L ₁ is corrected every time the electronic component 44 is mounted on the printed circuit board 20.

Further, when the mounting program is changed, the type of electronic component 44 to be mounted, the printed circuit board 20.
Even if the type and the component mounting position are the same, the distance L ₁ is initialized when the component supply cartridge 30 or the component tray 34 is replaced, and the speed immediately before the electronic component 44 contacts the printed circuit board 20. Is corrected so that the constant distance becomes 2 mm.

In this way, the electronic component 44 is mounted on the printed circuit board 2
Even when mounted on 0, the elevating slide 120 supports the component holding unit 80 from below via the solenoid 114, and is lowered at a constant low speed in the final stage, so that the electronic component 44 is placed on the printed circuit board 20. When mounted on the solenoid 114 and separated from the engaging member 110, the electronic component 44 is pressed against the printed circuit board 20 with an appropriate pressing force determined by the weight of the component holding unit 80.
After the electronic component 44 is placed on the printed circuit board 20, when the component holding unit 80 separates from the printed circuit board 20, the electromagnetic directional control valve 152 is switched to cut off the supply of the negative pressure to the component passage 146. On the other hand, a positive pressure is supplied for a short time to release the holding of the electronic component 44 by the large component suction nozzle 90, and after the release, the component passage 146 is connected to the atmosphere.

Next, the replacement of the component suction head will be described. When it is necessary to replace the component suction head due to a change in the type of the electronic component 44 mounted on the printed circuit board 20 or damage to the component suction head, the component holding unit 80 first The component suction head currently held by the holder 92 is supported on the head support base. Here, since the holder 92 holds the large component suction head 90 for the large electronic component 44, the component holding unit 80 is moved to the first head support 250. At this time, the component holding unit 80 is moved to the rising end position. Although the component holding unit 80 does not interfere with the X-axis slide 50 at this raised end position, the suction pipe 164 of the large component suction head 90 does not interfere with the first head support 25.
The height of the component holding unit 80 interferes with 0, and the component holding unit 80 inserts the notch 262 of the empty head fitting hole 254 into the suction pipe 16
4 is inserted into the head fitting hole 254,
The diffusion plate 162 is lowered until it seats on the support seat surface 260. After descending, the head passage 148 is released to the atmosphere and the holding of the large component suction head 90 by the holder 92 is released.

Next, the holder 92 is raised and moved to the component suction head to be held next. Here, it is assumed that the small component suction head 194 supported by the first head support base 250 is held. The holder 90 is moved onto the small component suction head 194 and then lowered, the suction surface 144 is brought into close contact with the closing surface 186 of the small component suction head 194, and a negative pressure is supplied to the head passage 148, so that the small pressure is supplied. The component suction head 194 is sucked. After adsorption,
The holder 90 is slightly raised and the small component suction head 1
After the diffuser plate 162 of 94 is lifted from the support seat surface 260, it is moved in the X-axis direction, and the suction pipe 164 is cut into the cutout 2.
It is pulled out of the head fitting 254 through 62.
Then, it moves to the cartridge type electronic component supply device 26, takes out the small electronic component 44, and mounts it on the printed circuit board 20.

In this way, the component suction heads 90, 194
196 and, as will be described later, if the holder 92 sucks and holds the tray discharge head 200 by negative pressure,
While the component holding unit 80 is moving, the component suction head 90,
Even if 194, 196 and the tray discharge head 200 collide with some obstacle, horizontal relative movement occurs between the holder 92 and the heads 90, 194, 196, 200 to allow movement of the holder 90. Therefore, the first and second moving devices that move the component holding unit 80 are not unduly loaded, and damage is avoided.

The component suction head 90 is used for the electronic component 44.
Is provided with a negative pressure source 153, and the holder 92 can hold the component suction heads 90, 194, 196 by negative pressure by using this negative pressure source 153. Therefore, the apparatus cost can be reduced as compared with the case where a dedicated negative pressure source is provided to hold the component suction head.

The first and second head support bases 2 may be damaged due to damage to the component suction head or change in the type of electronic component to be mounted.
When exchanging the component suction head supported by 50, 252, the operator may replace it, or an automatic exchange device may be provided to automatically replace it.

When the electronic component 44 is taken out from the tray-type electronic component supply device 28 and mounted, if the electronic component 44 in the component tray 34 is exhausted, the component suction head is replaced with the tray suction head 200, and the component tray 34 is replaced with the electronic component 44. It is conveyed and discharged by the component mounting device 46. Since the electronic component mounting device 46 also serves as the tray ejection device, it is not necessary to provide a dedicated tray ejection device.

At the time of discharging the component tray, the component holding unit 80 first moves to the first head support 250 or the second head support 252 to support the component suction head held by the holder 92. Then, it is moved onto the tray suction head 200 supported by the second head support 252, and suction-held. As shown in FIG. 5, the suction member 140 is brought into contact with the disk portion 222 of the tray suction head 200, and a negative pressure is supplied to the head passage 148 to suck the suction member 140. Also, in this state, the tray suction head 20
The air passage 238 provided at 0 is communicated with the component passage 146.

Then, the tray suction head 200 is moved to a predetermined holding position of the component tray 34 by the movement of the X-axis slide 50 and the Y-axis slide 60, and is then lowered, so that the flange portion 210 is moved to the component. Tray 3
4 is contacted. The flange portion 210 comes into contact with the portion defining the component accommodating recess 36, and the sponge 24
2 closes the through hole 37 formed in the component accommodating recess 36. Which part of the component tray 34 is held by the tray suction head 200 is preset in consideration of the holding balance and the like, and the sponge 242 closes the through hole 37 at the holding position. -ing

In this state, the electromagnetic directional control valves 151, 152
Is switched, and compressed air is supplied to the component passage 146. The compressed air passes through the ejection port 240 and then the projection 22
4 spouts into the space between the cylindrical portion 206 and
Since this ejection speed is high, a negative pressure is generated around the ejection outlet 240. A negative pressure is generated around the upper opening of the narrow annular passage 234 between the protrusion 224 and the cylindrical portion 206, and the air in the space on the component tray 34 side is sucked out by the negative pressure from the annular passage 234. The pressure in the space becomes negative and the component tray 34 is adsorbed. Since the through hole 37 formed in the electronic component accommodating recess 36 is closed by the sponge 242, air does not enter between the component tray 34 and the tray suction head 200, and the component tray 34 is sucked by negative pressure. Is done. Further, the inner peripheral surface of the cylindrical portion 206 and the outer peripheral surface of the projecting end portion 228 are partial conical surfaces 214, 218, 228, 232, which guide the air flow to the annular passage 234 without penetrating the flow of air, and through Guide to the hole 212 side.

The tray suction head 200 is a component tray 34.
Is sucked, and then moved to above a not-shown shooter provided adjacent to the tray-type electronic component supply device 28,
The parts tray 34 is discarded, and the parts tray 34 is discharged by the shooter.

As described above, the tray suction head 200 sucks the component tray 34 by negative pressure.
This is obtained by supplying a positive pressure to the component passage 146 that supplies a negative pressure when the component suction head sucks the electronic component 44, and it is necessary to provide a dedicated air passage for supplying the positive pressure. No positive pressure can be easily supplied.

Instead of changing the positive pressure to the negative pressure, the negative pressure can be directly supplied to the tray suction head 200 to suck the component tray 34, but the component tray 34 is large and a large amount of negative pressure is generated. Necessary, component suction head 90
In the component passage 146 of a size that supplies a sufficient amount of negative pressure to suck the electronic component 44, the negative pressure supply amount is insufficient. On the other hand, if the positive pressure is compressed and supplied, it is possible to supply the positive pressure that is sufficient to attract the component tray 34 even if the passage is narrow, so that the component passage 146 is supplied. It can be shared, and the device can be made compact and simple.

Further, the positive pressure source 154 is also already provided to supply the positive pressure to release the holding of the electronic component 44 by the suction tube 164. Since the positive pressure source 154 is used, the positive pressure supply is provided. Is easy and does not increase the device cost.

Even when the electronic component 44 is taken out from the component tray 34 of the tray type electronic component supply device 28, the lowering speed is controlled in the same manner as when the electronic component 44 is taken out from the component supply cartridge 30. In this case,
In consideration of the distortion of the component supply tray 34, the descending distance L ₁ at a constant high speed is set so that the descending distance at a constant low speed is 4 mm in the initial setting. Further, when the electronic component is normally taken out, the descending distance at a constant low speed immediately before the suction tube 164 contacts the electronic component 44 is set to 0.5 mm.

Then, after the electronic component 44 is taken out with the descending distance at the constant low speed being 4 mm, the descending distance L ₁ at the constant high speed is corrected to be 0.5 mm.
While taking out the electronic component 44 from the same component tray 34, the distance L ₁ is sequentially corrected based on the actual descending distance at a constant low speed. Then, the electronic component 44 in the component tray 34
When the electronic component 44 is discharged from the next component supply tray 34 and is discharged, the descending distance of the component holding unit 80 increases by the thickness of one component tray 34,
The distance L ₁ is initially set so that the descending distance at a constant low speed is 4 mm.

When the projection image of the electronic component 44 is taken, the electronic component 44 is illuminated by the light emitting body 160 emitting light as described above. For example, the electronic component is viewed from the side surface of the main body. The tip of the extended lead wire is bent inward and overlaps the main body in the direction of the center line of the electronic component, and it is necessary to obtain a surface image (image viewed from below in FIG. 1). In this case, the front lights 290 and 292 irradiate the electronic components with light. The light emitted by the front light 290 is reflected by the reflecting surface 274.
The light emitted from the front light 292 directly illuminates the electronic component. In any case, the reflected light from the electronic component is reflected by the reflecting surfaces 274 and 276, and the surface image of the electronic component is captured by the CCD camera 88.

In the above embodiment, the component holding unit 80 can be moved to any position in the horizontal plane by the combination of the linear movement in the X-axis direction and the linear movement in the Y-axis direction. You may make it move to arbitrary positions in a horizontal plane by the combination of rotation and linear movement.

In the above embodiment, the electronic components are supplied by both the cartridge type electronic component supply device 26 and the tray type electronic component supply device 28, and two prisms 270 are provided. Electronic components may be supplied by only one of the component supply devices 26 and 28, and only one prism 270 may be provided.

Further, in the above-described embodiment, the tray holding head sucks the component tray 34 by the negative pressure generated by the jet of compressed air, but the tray suction head 200 is the same as the large component suction head 90. The component tray 34 may be sucked by the negative pressure supplied from the negative pressure source. Further, it may be held by attraction by a magnetic force of a magnet, gripping by a chuck, piercing by a skewered member, or the like.

Further, in the above embodiment, the acceleration pattern and the deceleration pattern are made constant and the distance at which the electronic component 44 is moved at a constant high speed is made constant in order to make the distance of the constant low speed movement just before holding or mounting the electronic component 44 constant. However, the distance for constant low-speed movement can be made constant by changing the acceleration and deceleration patterns. In particular, it is effective when the descending end position changes greatly, such as when electronic components are supplied by the component tray. This is because, for example, when the descending end position changes in the direction in which the descending distance becomes longer, the acceleration distance can be lengthened and the descending speed can be lowered rapidly.

Further, in the above embodiment, the solenoid 1
No. 14 is excited when the elevating slide 120 is accelerating to descend, and attracts the large component suction head 90 to the elevating slide 120, and is demagnetized to release the attraction force except when accelerating to descend. However, when the descending acceleration is smaller than the gravitational acceleration, it is not indispensable to attract it by exciting, and at least during the descending acceleration is larger than the gravitational acceleration, the component holding unit 80 is integrally lowered with the elevating slide 120 by exciting. You can Further, the solenoid 114 is provided at least when the large component suction head 90 comes into contact with the electronic component 44, and also when the electronic component 4 is used.
It suffices that the lifting slide 120 be separated from the large component suction head 90 by being demagnetized when 4 comes into contact with the printed circuit board 20. The component holding head attracting device applies an attracting force that attracts the component holding head to the elevating member while at least the descending acceleration of the elevating member is greater than the gravitational acceleration, and releases the attracting force at least temporarily during the other period. It should be done.

Further, the component holding head attracting device is not limited to the solenoid 114, and various means such as applying an attracting force by negative pressure can be adopted.

Further, in the above embodiment, the first and second head support bases 250 and 252 are the head fitting holes 254 and 25.
The large component suction heads 90, 194, and 196 are fitted to and supported by No. 6, but various modes such as, for example, providing an openable / closable claw member on the head support to grip the component suction head Can be supported by.

Further, although the head support base is provided horizontally, it may be provided in other postures such as vertical, and it is movably provided on the substrate conveyor 22 and the head is supplied on the substrate conveyor 22. You may make it move to a supply position and the retracted position retracted from the board conveyor 22.

Further, although the cartridge type electronic component supply device 26 is fixedly provided in the above embodiment, the electronic component 44 is supplied by moving the cartridge type electronic component supply device 26 in the X-axis direction, the Y-axis direction or both the X-axis and Y-axis directions. You may do it.

In the above embodiment, only one component holding head is provided on the second moving member, but a plurality of component holding heads may be provided to form a multi-head. Also in this case, for example, the reflecting device is capable of reflecting light forming an image of all electronic components held by the multi-head, and
If the image pickup device is a CCD camera capable of picking up the images of all the electronic components at one time, or a line sensor capable of reading the images of all the electronic components lined up in the first movement direction at one time, one component holding head can be used. The image can be taken as in the case.

Furthermore, the present invention can be implemented by a combination of the above-mentioned various embodiments. Besides, the present invention can be implemented in various modified and improved modes based on the knowledge of those skilled in the art without departing from the scope of the claims.

[Brief description of drawings]

FIG. 1 is a front sectional view showing a holder and a component suction head of an electronic component holding device which is an embodiment common to the inventions of claims 1 to 3.

FIG. 2 is a side view (partial cross section) showing the holder and the component suction head together with an imaging system of an electronic component mounting apparatus.

FIG. 3 is a front view (partially sectional view) showing the holder and the component suction head together with an elevating device and a rotating device.

FIG. 4 is a front view (partially sectional view) showing a second head support base that supports the component suction head.

FIG. 5 is a front sectional view showing a tray suction head.

FIG. 6 is a front view showing the electronic component mounting apparatus.

FIG. 7 is a side view showing the electronic component mounting apparatus.

FIG. 8 is a plan view showing the electronic component mounting apparatus.

FIG. 9 is a block diagram of a control device that controls the electronic component mounting device.

FIG. 10 is a diagram illustrating setting of the length of the notch of the shutter and the reflecting surface of the prism in the Y-axis direction that configure the imaging system of the electronic component mounting apparatus.

FIG. 11 is a diagram illustrating control of the descending speed of the component holding unit when the electronic component mounting apparatus mounts an electronic component.

[Explanation of symbols]

 44 Electronic Parts 80 Parts Holding Unit 90 Parts Suction Head 92 Holder 94 Spline Shaft 140 Adsorber 144 Adsorption Surface 148 Head Passage 153 Negative Pressure Source 160 Light Emitting Body 164 Adsorption Tube 166 Printed Circuit Board 178 Disc 180 Circular Plate 186 Closure Surface 194 Small component suction head 196 Oversized component suction head 310 Controller

Claims (3)

[Claims] 1. A holder having a negative pressure source, a negative pressure supply passage connected to the negative pressure source, and a suction surface in which the negative pressure supply passage opens, and a holder in close contact with the suction surface and the opening of the holder. An electronic component holding device, comprising: a component holding head having a closing surface for hermetically closing the component and a component holding portion for holding an electronic component. 2. The electronic component holding device according to claim 1, wherein both the suction surface and the closing surface are flat surfaces. 3. The component holding head has a light emitting plate that faces away from the closing surface and emits light when electric current is supplied to the electric circuit, and is connected to the electric circuit at a central portion and an outer peripheral portion of the closing surface, respectively. While the first central electrode and the first outer peripheral electrode are provided, the second central electrode and the second outer peripheral electrode are provided at positions corresponding to the first central electrode and the first outer peripheral electrode of the adsorption surface, respectively. The closed circuit including the electric circuit is formed in a state where one of the central electrode and the second outer peripheral electrode is connected to a power source and the other is grounded, and the closed surface is in close contact with the suction surface. Electronic component holding device described.