JPH06283663A - 半導体チップどうしを整合するための方法 - Google Patents

半導体チップどうしを整合するための方法

Info

Publication number
JPH06283663A
JPH06283663A JP31080693A JP31080693A JPH06283663A JP H06283663 A JPH06283663 A JP H06283663A JP 31080693 A JP31080693 A JP 31080693A JP 31080693 A JP31080693 A JP 31080693A JP H06283663 A JPH06283663 A JP H06283663A
Authority
JP
Japan
Prior art keywords
semiconductor chip
semiconductor chips
diameter
semiconductor
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP31080693A
Other languages
English (en)
Japanese (ja)
Inventor
Guenther Dr Schuster
ギュンター・シュスター
Heribert Weber
ヘリベルト・ヴェーバー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Defence and Space GmbH
Original Assignee
Deutsche Aerospace AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Aerospace AG filed Critical Deutsche Aerospace AG
Publication of JPH06283663A publication Critical patent/JPH06283663A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Die Bonding (AREA)
  • Pressure Sensors (AREA)
JP31080693A 1992-12-16 1993-12-10 半導体チップどうしを整合するための方法 Withdrawn JPH06283663A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19924242565 DE4242565C1 (de) 1992-12-16 1992-12-16 Verfahren zur Justage von Halbleiterscheiben zueinander
DE4242565:4 1992-12-16

Publications (1)

Publication Number Publication Date
JPH06283663A true JPH06283663A (ja) 1994-10-07

Family

ID=6475503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31080693A Withdrawn JPH06283663A (ja) 1992-12-16 1993-12-10 半導体チップどうしを整合するための方法

Country Status (4)

Country Link
JP (1) JPH06283663A (de)
DE (1) DE4242565C1 (de)
FR (1) FR2699329A1 (de)
GB (1) GB2274201A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6965166B2 (en) 1999-02-24 2005-11-15 Rohm Co., Ltd. Semiconductor device of chip-on-chip structure
JP2015524155A (ja) * 2012-02-15 2015-08-20 オラクル・インターナショナル・コーポレイション 圧縮可能な構造を用いたマルチチップモジュールにおけるアライメントの維持

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4433343C2 (de) * 1994-09-19 1998-01-22 Suess Kg Karl Verfahren und Vorrichtung zum Ausrichten und Verbinden von mehreren, zueinander ausgerichteten, übereinander angeordneten Scheiben
AT406100B (de) * 1996-08-08 2000-02-25 Thallner Erich Kontaktbelichtungsverfahren zur herstellung von halbleiterbausteinen
DE10133566A1 (de) * 2001-07-13 2003-01-30 Ulrich Krackhardt Vorrichtung und Verfahren zur selbstjustierenden Justage von Bauteilen mit Genauigkeiten im 1/1000 mm-Bereich
US7745301B2 (en) 2005-08-22 2010-06-29 Terapede, Llc Methods and apparatus for high-density chip connectivity
US8957511B2 (en) 2005-08-22 2015-02-17 Madhukar B. Vora Apparatus and methods for high-density chip connectivity
WO2007024774A2 (en) * 2005-08-22 2007-03-01 Vora Madhukar B Apparatus and methods for high-density chip connectivity

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565314A (en) * 1983-09-09 1986-01-21 At&T Bell Laboratories Registration and assembly of integrated circuit packages
US4534047A (en) * 1984-01-06 1985-08-06 The Perkin-Elmer Corporation Mask ring assembly for X-ray lithography
EP0312217A1 (de) * 1987-09-30 1989-04-19 AT&T Corp. Zusammenbau von integrierten Schaltungschips
US5132772A (en) * 1991-05-31 1992-07-21 Motorola, Inc. Semiconductor device having tape automated bonding (TAB) leads which facilitate lead bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6965166B2 (en) 1999-02-24 2005-11-15 Rohm Co., Ltd. Semiconductor device of chip-on-chip structure
JP2015524155A (ja) * 2012-02-15 2015-08-20 オラクル・インターナショナル・コーポレイション 圧縮可能な構造を用いたマルチチップモジュールにおけるアライメントの維持

Also Published As

Publication number Publication date
GB2274201A (en) 1994-07-13
GB9325639D0 (en) 1994-02-16
FR2699329A1 (fr) 1994-06-17
DE4242565C1 (de) 1994-03-17

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20010306