JPH06283653A - Semiconductor device - Google Patents

Abstract

PURPOSE:To provide a wiring mounting technique which can be applied to the COB by only changing the bonder program on a bonding device. CONSTITUTION:When it becomes necessary to increase the number of wires after wiring the wires on a printed wiring board, insulated bonding wires 30 are lengthily hung down onto the wiring board and the wires 30 are ball-bonded to electrode pads 23 and 25 on the printed wiring board. The jumper line which has been used conventionally at the time of modifying wiring can be used in a small mounting area on a bonding device by using the insulated wires 30 and the remaking work of the printed wiring board for changing the wiring can be minimized and the occupying space of the wiring can be reduced. In addition, the wiring can be performed in a short time, because the wiring length of this semiconductor device is reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting method.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor device having an integrated circuit element formed on a printed wiring board, the device itself rarely operates normally from the beginning of development, and some change operations are required to operate the device normally. Also exists. Improvements will be made to ensure normal operation by changing the mounted elements and circuit wiring. In particular, in order to change the wiring, it is possible to connect any electrode terminals for improvement on the circuit board without electrical contact so that even if exposed on the printed circuit board, sufficient weather resistance can be obtained. A circuit line that replaces the printed wiring is newly formed on the printed wiring by the conductive wire. This covered electric wire is generally called a jumper wire. It was a general method to repair the wiring with a jumper wire, confirm the normal operation, and then remake the printed wiring board.

[0003]

In recent years, a semiconductor integrated circuit element is directly mounted on a circuit board by a bare chip without packaging, and a bonding wire or a TAB (Tape Aut) is formed.
Chip-on-board (CO
B, semiconductor devices using Chip On Board technology have come to the fore in terms of volume efficiency and operating speed. Higher operating frequency to achieve higher performance (higher speed, more functions) of computers, higher speed of communication, high speed and advanced processing associated with encryption are integrated circuits (DSP, Digita
signal processor, etc.), even the wiring of the lead frame used for the package is such that signal delay is a problem. To aggregate function, but the wiring length large area integrated circuit chips outermost <br/> ginger is ideal, relying semiconductor integrated circuit creation, from the relationship of the yield is inversely proportional to the area on a combination of multiple integrated circuit chips The current situation is unavoidable. Therefore, there is a demand for a mounting technique in which bare chips are arranged and wired at a high density as a modularized device as a functional assembly in which the distance between integrated circuit devices is wired as short as possible. However, the repair work after mounting, especially the replacement of the element parts and the measures for the normal operation by the jumper wires, etc., still remain as a difficult problem in the COB technology which requires work in a small area. Is the reality.

As a part of the above-mentioned conventional repair technique, the present invention provides a wiring mounting technique which can be used for COB only by changing a bonder program on a bonding apparatus.

[0005]

In order to carry out the present invention, the ordinary bonding apparatus has a sufficient dielectric strength even when it is brought into contact with wires or a wiring board without special modification, and a bare gold wire is used. Insulated wires with similar bondability are used as micro jumper wires on the wiring board. Bonding wire used as a jumper wire has a diameter of 1
0 μm to 50 μm, the thickness of the insulation coating is 1 of the wire diameter.
% To 5% is desirable. Perform reprogrammable mounting level wiring work by using a general purpose bonding machine.

[0006]

[Function] If jumper wiring with an insulation coating wire that does not cause a short circuit is wired on the printed wiring board, the circuit can be repaired on the bonding device, and the fine electrode terminals of the conventional integrated circuit element can be handled by the printed wiring. It will be possible to make changes at the mounting level, which was only available in the wiring space. Furthermore, the insulation coated wire already stretched on the printed wiring board is crimped to the extent that the coating is destroyed without cutting the wire with a tool, or ball bonding or wedge bonding is used to perform gold ball or gold wire. If the coating is destroyed and pressure is applied to the printed board, the contact with the electrode on the board is made and the electric signal can be branched. A quick circuit wiring change at the same mounting scale as the bonding wire that can be done only by changing the program of the bonder drastically reduces the development period of the printed circuit board prototype, especially with the wiring change of the semiconductor device. Products that are never manufactured can easily achieve thinness and miniaturization, and contribute to performance improvement at the mounting level without being bound by the limits of printed wiring boards.

[0007]

EXAMPLES The present invention will be described below with reference to examples. (Embodiment 1) FIG. 1 is a schematic view of a COB-mounted multichip module in which wiring is corrected. The multi-chip module shown in FIG. 1 includes an IC bare chip 11, an IC electrode pad 12 provided on the IC bare chip,
It has an electrode pad 13 on a printed board, a bonding wire 14, and a correction insulating coating bonding wire 15. The wiring of the multi-chip module mounted on the bare chip was changed by wiring between the electrode pads 13 and 13 on the printed board using the insulating coated gold bonding wire 15 having a coating thickness of 30 μmφ and polyarylate 0.46 μm. (Figure 1). This was achieved without changing the wiring of the COB-mounted multichip module that had to be changed, which was previously discarded, and at the same time changing the overall size.

(Embodiment 2) FIG. 2 is a schematic view of wiring on an insulating coating wire on a printed wiring board. The multi-chip module shown in FIG. 2 includes an IC 121, an IC electrode pad 22 provided on the IC 1, an insulating coating wire fixing electrode pad 23, a ball bonding 24, a signal extracting electrode pad 25, and a branched print. Wiring 2
6, relay common electrode pad 27, IC 229, IC
2 has an IC2 electrode pad 28 and an insulating coating bonding wire 30. Since it was necessary to increase the number of wirings on the printed wiring board later, the same insulating coating bonding wire 30 as in Example 1 was hung on the substrate for a long time to separate the insulating coating bonding wire 30 and the electrode pads 23, 25 on the printed board. Ball bonded. The insulation coating was broken and joined by pressing the ball by the first bonding, the wire was cut immediately above the ball, and electrical contact and fixing of the wire were performed at the same time for wiring (FIG. 2).

[0009]

As described above, according to the present invention, in the mounting level of the semiconductor device by the wire covered with the insulation, the flexible wiring change at the program level of the bonder causes the signal delay, and the wiring is largely drawn to the outside. Can be realized without providing the wiring, and the wiring at the bonding wire level of about 30 μmφ can be easily replaced in place of the printed wiring, which brings about a more general application of the COB technology and a higher speed, higher performance and smaller size of the semiconductor device.

[Brief description of drawings]

FIG. 1 is a schematic view of a COB-mounted multichip module when wiring is corrected.

FIG. 2 is a schematic view of wiring on an insulation-coated wire on a printed wiring board.

[Explanation of symbols]

 11 IC Bare Chip 12 IC Electrode Pad 13 Electrode Pad on Printed Board 14 Bonding Wire 15 Insulation Coating Bonding Wire for Correction 21 IC1 22 IC1 Electrode Pad 23 Insulation Coating Wire Fixing Electrode Pad 24 Ball Bonding 25 Signal Extraction Electrode Pad 26 Branched Printed wiring 27 Relay common electrode pad 28 IC2 electrode pad 29 IC2 30 Insulation coating bonding wire

Claims (2)

[Claims] 1. A semiconductor device mounted on a circuit board by using an insulating coating wire as a jumper wire for connecting between electrode terminals. 2. A method of using an insulation-coated wire as a jumper wire for mounting with a wire bonding device.