JPH06279895A - Lead material - Google Patents

Lead material

Info

Publication number
JPH06279895A
JPH06279895A JP19877893A JP19877893A JPH06279895A JP H06279895 A JPH06279895 A JP H06279895A JP 19877893 A JP19877893 A JP 19877893A JP 19877893 A JP19877893 A JP 19877893A JP H06279895 A JPH06279895 A JP H06279895A
Authority
JP
Japan
Prior art keywords
grain size
lead material
copper alloy
copper
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19877893A
Other languages
Japanese (ja)
Other versions
JP2501290B2 (en
Inventor
Haruka Machitori
晴香 待鳥
Masato Sakai
真人 阪井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP5198778A priority Critical patent/JP2501290B2/en
Publication of JPH06279895A publication Critical patent/JPH06279895A/en
Application granted granted Critical
Publication of JP2501290B2 publication Critical patent/JP2501290B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To provide a lead material commonly having electrical conductivity, strength and mass producibility. CONSTITUTION:This lead material is the one using a copper alloy having a compsn. contg., by weight, 0.05 to <0.3% chromium and/or 0.05 to 0.5% zirconium, and the balance substantial copper and in which the grain size is regulated to >=7 in the size number of JIS-G-0551 or this lead material is another one using a copper alloy obtd. by incorporating 0.005 to 0.1% of one or >=two kinds selected from silicon, germanium, boron and magnesium into the same copper alloy.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、リード材に関する。FIELD OF THE INVENTION The present invention relates to a lead material.

【0002】[0002]

【従来の技術】一般に、リード材などの導電材料として
は、導電性が優れていることから純銅が用いられてい
る。
2. Description of the Related Art Generally, pure copper is used as a conductive material such as a lead material because of its excellent conductivity.

【0003】しかし、純銅は、その強度が弱く、製造時
に伸びを生じたり、切断などの問題を生じていた。その
ため、近年クロムあるいはジルコニウムなどの添加元素
を添加し、析出硬化処理によって強度の向上を図ること
が行われていた。
However, pure copper is weak in strength, and causes problems such as elongation and cutting during manufacturing. Therefore, in recent years, it has been attempted to improve the strength by adding an additional element such as chromium or zirconium and performing precipitation hardening treatment.

【0004】[0004]

【発明が解決しようとする課題】しかし、強度を向上す
るために添加元素を添加し、析出硬化処理を施したクロ
ム銅あるいはジルコニウム銅などの銅合金は強度を向上
することができるが、導電率が低く、また溶体化処理や
析出処理を行うため、リード材のような大量生産には不
向きであるという欠点があった。
However, a copper alloy such as chromium copper or zirconium copper which has been subjected to a precipitation hardening treatment by adding an additive element to improve the strength can improve the strength, but the conductivity However, it has a drawback that it is not suitable for mass production such as a lead material because the solution treatment is carried out by solution treatment or precipitation treatment.

【0005】本発明は、上記銅合金の欠点を解消し、導
電性,強度,大量生産性をも兼ね備えたリード材を提供
するものである。
The present invention solves the above-mentioned drawbacks of the copper alloy and provides a lead material having electrical conductivity, strength and mass productivity.

【0006】[0006]

【課題を解決するための手段と作用】本発明の第1の発
明であるリード材は、重量%で、クロム0.05〜0.3 %未
満および/またはジルコニウム0.05〜0.5 %含有し、残
部実質的に銅であると共に、結晶粒度がJIS G 0551の粒
度番号において7番以上である銅合金を用いてなること
を特徴とするものである。
The lead material according to the first aspect of the present invention contains, by weight, 0.05 to less than 0.3% of chromium and / or 0.05 to 0.5% of zirconium, and the balance is substantially copper. In addition, it is characterized by using a copper alloy having a grain size of 7 or more in the grain size number of JIS G 0551.

【0007】また、本発明の第2の発明であるリード材
は、クロム0.05〜0.3 %未満および/またはジルコニウ
ム0.05〜0.5 %、けい素,ゲルマニウム,ほう素および
マグネシウムから選ばれた1種または2種以上を 0.005
〜0.1 %含有し、残部実質的に銅であると共に、結晶粒
度がJIS G 0551の粒度番号において7番以上である銅合
金を用いてなることを特徴とするものである。
The lead material according to the second aspect of the present invention is one or two selected from chromium, 0.05 to less than 0.3% and / or zirconium, 0.05 to 0.5%, silicon, germanium, boron and magnesium. Species over 0.005
.About.0.1%, the balance being substantially copper, and a copper alloy having a grain size of 7 or more in the grain size number of JIS G 0551.

【0008】本発明の最重要点は、従来析出硬化処理型
材料とされてきた銅合金を溶体化処理することなく、焼
鈍と加工を繰返すことにより結晶粒度がJIS G 0551の粒
度番号において7番以上の銅合金を初めて得るに至り、
この銅合金をリード材に用いたことにある。したがっ
て、大量生産性という点での有利さが、工業上の効果と
して存在する。
The most important point of the present invention is that the grain size of JIS G 0551 is No. 7 by repeating annealing and working without subjecting a copper alloy, which has been conventionally regarded as a precipitation hardening type material, to solution treatment. For the first time to obtain the above copper alloy,
This copper alloy is used as a lead material. Therefore, an advantage in terms of mass productivity exists as an industrial effect.

【0009】以下に、0.15重量%クロム, 0.3重量%ジ
ルコニウム,残部実質的に銅よりなる銅合金をリード材
に用いた場合を例にとり、本発明を具体的に説明する。
The present invention will be specifically described below by taking as an example a case where a copper alloy consisting of 0.15 wt% chromium, 0.3 wt% zirconium and the balance substantially copper is used as a lead material.

【0010】上記組成を溶解,鋳造後、 700〜850 ℃で
熱間加工を施し直径7〜10mmの線材とし、これを酸洗
後、冷間加工と 500〜650 ℃の焼鈍を繰返して直径0.26
mmの線材とした。
After melting and casting the above composition, hot working is performed at 700 to 850 ° C. to obtain a wire having a diameter of 7 to 10 mm, which is pickled and then cold worked and annealed at 500 to 650 ° C. repeatedly to obtain a diameter of 0.26.
mm wire rod.

【0011】このとき、冷間加工上りの結晶粒度はJIS
G 0551の粒度番号において9番、導電率は90IACS%、引
張強さは49kg/mm2 であった。
At this time, the grain size after cold working is JIS
The particle size of G 0551 was 9, the conductivity was 90 IACS%, and the tensile strength was 49 kg / mm 2 .

【0012】さらに 550℃の焼鈍を行った場合の結晶粒
度はJIS G 0551の粒度番号において10番、導電率は93IA
CS%、引張強さは44kg/mm2 であった。
When further annealed at 550 ° C., the grain size is JIS G 0551 grain size number 10, and the conductivity is 93IA.
The CS% and the tensile strength were 44 kg / mm 2 .

【0013】このように、加工上りか焼鈍上りかによっ
て導電率および強度などは種々変化するので、所望の特
性が容易に得られる。
As described above, since the electric conductivity and the strength are variously changed depending on whether the work is finished or the finished work is annealed, desired characteristics can be easily obtained.

【0014】結晶粒度は、JIS G 0551の粒度番号におい
て7以上とすることにより、従来の析出硬化処理を施し
た場合に比較し優れた特性を得ることができるが、諸特
性から8以上の粒度番号であることが好ましく、さらに
は10〜11番の粒度番号が好ましい。
By setting the grain size to 7 or more in the grain size number of JIS G 0551, excellent characteristics can be obtained as compared with the case of performing the conventional precipitation hardening treatment, but from the various characteristics, the grain size of 8 or more is obtained. It is preferably a number, and more preferably a particle size number of 10 to 11.

【0015】この場合、あえて上限を規定した理由とし
ては、導電率および強度の点から考慮すると結晶粒度は
細かいほど(粒度番号が大きいほど)好ましいが、製造
法の経済性から考慮するとその結晶粒度は粒度番号にお
いて14番以下、さらには11番以下とすれば、比較的経済
的であるという意味であり、経済性を考慮せず、その特
性を良好とするためには、その結晶粒度の上限は規定さ
れない。
In this case, the reason why the upper limit is intentionally defined is that the finer the crystal grain size (the larger the grain size number) is preferable in view of the conductivity and the strength, but the crystal grain size is considered from the economical point of the manufacturing method. Means that if the grain size number is 14 or less, or even 11 or less, it is relatively economical, and in order to improve its characteristics without considering economic efficiency, the upper limit of its grain size is Is not specified.

【0016】また、その結晶粒形状は、圧延上りにおい
ては比較的細長く、焼鈍上りにおいては比較的円板状に
近くなる。
Further, the crystal grain shape is relatively elongated after rolling and becomes relatively disk-like after annealing.

【0017】なお、従来の析出処理を施した場合の銅合
金の結晶粒度はJIS G 0551の粒度番号において5〜6
番、導電率は70〜85IACS%、引張強さは50〜60kg/mm2
である。
The crystal grain size of the copper alloy when subjected to the conventional precipitation treatment is 5 to 6 in the grain size number of JIS G 0551.
No., conductivity 70-85IACS%, tensile strength 50-60kg / mm 2
Is.

【0018】次にこの銅合金をリード線として使用した
場合は、純銅を用いる場合の製造時における断線や伸び
すぎるという問題は生じない。このような断線や伸びす
ぎるという問題は、本発明者らの研究によれば、耐力と
伸線性に関係するのであり、この点で本発明においては
耐力および伸線性に優れており、リード材として好適で
ある。
Next, when this copper alloy is used as a lead wire, there is no problem of breakage or excessive elongation during manufacture when pure copper is used. According to the research conducted by the present inventors, such a problem of wire breakage and excessive elongation is related to proof stress and wire drawability, and in this respect, the present invention is excellent in proof stress and wire drawability, and is used as a lead material. It is suitable.

【0019】以上の説明においは、クロム,ジルコニウ
ム銅合金をリード材に用いた場合について述べたが、上
述の技術思想は従来析出効果型として知られている銅合
金をリード材として用いた場合においても適用できるこ
とは、容易に理解できるであろう。
In the above description, the case where the chromium, zirconium copper alloy is used as the lead material has been described. However, the above-mentioned technical idea is applied when the copper alloy known as the precipitation effect type is used as the lead material. It will be easily understood that the above can also be applied.

【0020】本発明のリード材の具体的な用途として
は、耐力,耐摩耗性,繰返し曲げ,熱伝導,導電性,耐
酸化性,耐食性などの特性が要求される架線用のより
線,リード線の用途が好ましい。
Specific applications of the lead material of the present invention include stranded wires and leads for overhead wires which are required to have properties such as proof stress, wear resistance, repeated bending, heat conduction, conductivity, oxidation resistance and corrosion resistance. Line applications are preferred.

【0021】また、繰返し曲げ,導電性,熱伝導,耐食
性などの特性が要求される半導体装置のリードフレーム
などの用途がさらに好ましい。
Further, it is more preferable to use it as a lead frame of a semiconductor device which is required to have characteristics such as repeated bending, conductivity, heat conduction and corrosion resistance.

【0022】本発明組成の銅合金を溶体化処理すること
なく、結晶粒度がJIS G 0551の粒度番号において7番以
上に調整することにより、導電率,熱伝導,耐酸化性,
耐力,繰返し曲げ,疲労,ラプチヤー,フレキシブル
性,メッキ性,伸線性などの改良がなされ、従来、純銅
の利用されているリード材の分野において有効な改善も
たらされる。
By adjusting the grain size to 7 or more in the grain size number of JIS G 0551 without subjecting the copper alloy having the composition of the present invention to solution treatment, electrical conductivity, heat conduction, oxidation resistance,
Improvements in yield strength, repeated bending, fatigue, rupture, flexibility, plating properties, wire drawability, etc. have been made, which brings about effective improvements in the field of lead materials in which pure copper has been conventionally used.

【0023】また、けい素,ゲルマニウム,ほう素およ
びマグネシウムは、強度および結晶粒粗大化の抑制など
に対し有効な元素である。
Further, silicon, germanium, boron and magnesium are effective elements for suppressing strength and coarsening of crystal grains.

【0024】[0024]

【実施例】以下に、リード材の一実施例として、0.15重
量%クロム, 0.3重量%ジルコニウム,残部実質的に銅
よりなる銅合金をリード線に材に用いた場合を説明す
る。
EXAMPLES An example of a lead material will be described below in which a copper alloy consisting of 0.15 wt% chromium, 0.3 wt% zirconium and the balance substantially copper is used for the lead wire.

【0025】上記組成を溶解,鋳造後、 700〜850 ℃で
熱間加工を施し直径10mmの線材とし、これを酸洗後、直
径2mmまで冷間加工と 500〜650 ℃の焼鈍を繰返し、さ
らに冷間加工を施して直径0.26mmの線材とした。さらに
550℃で焼鈍を行った焼鈍上りの状態および冷間加工上
りの状態で特性を評価したところ、表1の通りであっ
た。
After melting and casting the above composition, hot working is carried out at 700 to 850 ° C. to obtain a wire having a diameter of 10 mm, which is pickled and then repeatedly cold worked to a diameter of 2 mm and annealed at 500 to 650 ° C. Cold working was performed to obtain a wire rod with a diameter of 0.26 mm. further
The characteristics are evaluated in the as-annealed state and the cold-worked state after annealing at 550 ° C.

【0026】また、比較として、純銅および通常の析出
硬化処理を行った場合のものと比較して、耐力,伸線性
ともに優れていることが理解できる。
Further, as a comparison, it can be understood that both the yield strength and the wire drawability are superior to those of pure copper and those subjected to the ordinary precipitation hardening treatment.

【0027】表1における、各評価法は次の方法によっ
た。
The evaluation methods shown in Table 1 were as follows.

【0028】(1) 導電率:比抵抗を室温で測定し、0.72
41(国際標準銅比抵抗値)を 100として換算したもの
(IACS%) (2) 熱伝導:単位面積あたりを一定時間に通る熱量を与
える物質常数( cal/cm・deg ) (3) 耐酸化性: 400℃で30時間加熱した場合の酸化増量
(mg/cm2 ) (4) 耐力: 0.2%歪んだ時の強度(kg/mm2 ) (5) 繰返し曲げ:重荷 250grをかけ、 0.3Rで90°曲げ
を繰返した場合の切断までの回数(回) (6) フレキシブル性:より線とした場合のフレキシブル
性の有無 (7) メッキ性:Ag,Au,Sn,Ni,はんだ等のメ
ッキ加工性の良否 (8) 伸線性:伸線加工の容易性(耐切断性:純銅に比較
して) (9) 結晶粒度:JIS G 0551の粒度番号
(1) Conductivity: Specific resistance measured at room temperature was 0.72
41 (International standard copper resistivity) converted to 100 (IACS%) (2) Thermal conductivity: Material constant (cal / cm · deg) that gives the amount of heat that passes through a unit area for a certain period of time (3) Oxidation resistance Properties: Oxidation weight gain when heated at 400 ° C for 30 hours (mg / cm 2 ) (4) Proof strength: Strength when strained by 0.2% (kg / mm 2 ) (5) Cyclic bending: 0.3R with a load of 250gr (6) Flexibility: Presence or absence of flexibility when used as a stranded wire (7) Platability: Plating of Ag, Au, Sn, Ni, solder, etc. Good workability (8) Wire drawability: Ease of wire drawing (cutting resistance: compared with pure copper) (9) Grain size: JIS G 0551 grain size number

【0029】[0029]

【表1】 上記表1より明らかなように、本発明は耐力,導電性な
ど、各種の特性に優れている。
[Table 1] As is clear from Table 1 above, the present invention is excellent in various characteristics such as yield strength and conductivity.

【0030】次に、本発明のリード材として用いられる
銅合金の各種特性を表2に示す。
Next, Table 2 shows various characteristics of the copper alloy used as the lead material of the present invention.

【0031】[0031]

【表2】 上記、表2より明らかなように、本発明のリード材に用
いられる銅合金は、導電性および強度の双方を兼備する
と共に、その他の特性(熱伝導率,耐酸化性,メッキ
性,伸線性等)も優れている。
[Table 2] As is clear from Table 2 above, the copper alloy used in the lead material of the present invention has both conductivity and strength, and also has other properties (thermal conductivity, oxidation resistance, plating property, wire drawing property). Etc.) are also excellent.

【0032】[0032]

【発明の効果】本発明によれば、導電性,強度,大量生
産性をも兼ね備えたリード材を提供することができる。
According to the present invention, it is possible to provide a lead material having both conductivity, strength and mass productivity.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 重量%で、クロム0.05〜0.3 %未満およ
び/またはジルコニウム0.05〜0.5 %含有し、残部実質
的に銅であると共に、結晶粒度がJIS G 0551の粒度番号
において7番以上である銅合金を用いてなることを特徴
とするリード材。
1. A content of chromium of 0.05 to less than 0.3% and / or zirconium of 0.05 to 0.5% by weight, the balance being substantially copper, and a grain size of 7 or more in JIS G 0551. A lead material made of a copper alloy.
【請求項2】 重量%で、クロム0.05〜0.3 %未満およ
び/またはジルコニウム0.05〜0.5 %、けい素,ゲルマ
ニウム,ほう素およびマグネシウムから選ばれた1種ま
たは2種以上を 0.005〜0.1 %含有し、残部実質的に銅
であると共に、結晶粒度がJIS G 0551の粒度番号におい
て7番以上である銅合金を用いてなることを特徴とする
リード材。
2. Containing 0.005 to 0.1% by weight of chromium in an amount of 0.05 to less than 0.3% and / or zirconium of 0.05 to 0.5% and one or more selected from silicon, germanium, boron and magnesium. A lead material comprising a copper alloy having a balance of substantially copper and a grain size of 7 or more in JIS G 0551 grain size number.
JP5198778A 1993-07-19 1993-07-19 Lead material Expired - Lifetime JP2501290B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5198778A JP2501290B2 (en) 1993-07-19 1993-07-19 Lead material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5198778A JP2501290B2 (en) 1993-07-19 1993-07-19 Lead material

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP253280A Division JPS56102537A (en) 1980-01-16 1980-01-16 Copper alloy member

Publications (2)

Publication Number Publication Date
JPH06279895A true JPH06279895A (en) 1994-10-04
JP2501290B2 JP2501290B2 (en) 1996-05-29

Family

ID=16396768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5198778A Expired - Lifetime JP2501290B2 (en) 1993-07-19 1993-07-19 Lead material

Country Status (1)

Country Link
JP (1) JP2501290B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015022837A1 (en) 2013-08-12 2015-02-19 三菱マテリアル株式会社 Copper alloy for electronic/electrical devices, copper alloy thin plate for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50122418A (en) * 1974-03-13 1975-09-26
JPS52150327A (en) * 1976-06-10 1977-12-14 Toshiba Corp Lead wire and its production method
JPS5496067A (en) * 1977-12-05 1979-07-30 South African Inventions Device for measuring distance
JPS633936A (en) * 1986-06-11 1988-01-08 フオルクスヴア−ゲン・アクチエンゲゼルシヤフト Manufacture of structure section to which tensile stress is formed
JPS6328971A (en) * 1986-07-14 1988-02-06 株式会社 カナメ Fiber knitted fabric

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50122418A (en) * 1974-03-13 1975-09-26
JPS52150327A (en) * 1976-06-10 1977-12-14 Toshiba Corp Lead wire and its production method
JPS5496067A (en) * 1977-12-05 1979-07-30 South African Inventions Device for measuring distance
JPS633936A (en) * 1986-06-11 1988-01-08 フオルクスヴア−ゲン・アクチエンゲゼルシヤフト Manufacture of structure section to which tensile stress is formed
JPS6328971A (en) * 1986-07-14 1988-02-06 株式会社 カナメ Fiber knitted fabric

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015022837A1 (en) 2013-08-12 2015-02-19 三菱マテリアル株式会社 Copper alloy for electronic/electrical devices, copper alloy thin plate for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar
KR20160042906A (en) 2013-08-12 2016-04-20 미쓰비시 마테리알 가부시키가이샤 Copper alloy for electronic/electrical devices, copper alloy thin plate for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar
US10392680B2 (en) 2013-08-12 2019-08-27 Mitsubishi Materials Corporation Copper alloy for electric and electronic devices, copper alloy sheet for electric and electronic devices, component for electric and electronic devices, terminal, and bus bar

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Publication number Publication date
JP2501290B2 (en) 1996-05-29

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