JPH0627981Y2 - プリント回路形成用基板 - Google Patents
プリント回路形成用基板Info
- Publication number
- JPH0627981Y2 JPH0627981Y2 JP1987088751U JP8875187U JPH0627981Y2 JP H0627981 Y2 JPH0627981 Y2 JP H0627981Y2 JP 1987088751 U JP1987088751 U JP 1987088751U JP 8875187 U JP8875187 U JP 8875187U JP H0627981 Y2 JPH0627981 Y2 JP H0627981Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- diameter
- printed circuit
- circuit board
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003973 paint Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088751U JPH0627981Y2 (ja) | 1987-06-09 | 1987-06-09 | プリント回路形成用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088751U JPH0627981Y2 (ja) | 1987-06-09 | 1987-06-09 | プリント回路形成用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63197377U JPS63197377U (enrdf_load_html_response) | 1988-12-19 |
| JPH0627981Y2 true JPH0627981Y2 (ja) | 1994-07-27 |
Family
ID=30947126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987088751U Expired - Lifetime JPH0627981Y2 (ja) | 1987-06-09 | 1987-06-09 | プリント回路形成用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0627981Y2 (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2737652B2 (ja) * | 1994-07-13 | 1998-04-08 | 日本電気株式会社 | 多層セラミック基板およびその製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6096875U (ja) * | 1983-12-09 | 1985-07-02 | アルプス電気株式会社 | 両面回路基板 |
| JPS61104579U (enrdf_load_html_response) * | 1984-12-13 | 1986-07-03 |
-
1987
- 1987-06-09 JP JP1987088751U patent/JPH0627981Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63197377U (enrdf_load_html_response) | 1988-12-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0627981Y2 (ja) | プリント回路形成用基板 | |
| JPH1080897A (ja) | セラミック基板の製造方法 | |
| EP1494516A3 (en) | Wiring board and manufacturing method thereof | |
| JPS6454265U (enrdf_load_html_response) | ||
| JPS59148132U (ja) | バ−リング加工装置 | |
| JPS5938063Y2 (ja) | スル−ホ−ルプリント板 | |
| JPH04206802A (ja) | 絶縁基板及びそれを用いたチップ形抵抗器連 | |
| JPH07326837A (ja) | セラミック基板 | |
| JPS63197382U (enrdf_load_html_response) | ||
| JPS5839351U (ja) | オ−ナメントモ−ル | |
| JPH1080895A (ja) | セラミック基板の製造方法 | |
| JPH0420246U (enrdf_load_html_response) | ||
| JPH0385793A (ja) | 厚膜配線板の外部端子形成方法 | |
| JPS62204315U (enrdf_load_html_response) | ||
| JPH05259637A (ja) | スルーホール形成方法 | |
| JPS59114893A (ja) | 金属芯プリント基板の絶縁膜形成方法 | |
| JPS59148387A (ja) | セラミツク焼結体基板の穴加工方法 | |
| JPH0355893A (ja) | 両面配線板 | |
| JPH04152594A (ja) | プリント配線板の製造方法 | |
| JPS59193699U (ja) | 穴あけ治具 | |
| JPS63119274U (enrdf_load_html_response) | ||
| JPH0261078U (enrdf_load_html_response) | ||
| JPS63162566U (enrdf_load_html_response) | ||
| JPH0183365U (enrdf_load_html_response) | ||
| JPS6321595U (enrdf_load_html_response) |