JPH062781U - Ventilation resistance plate to be inserted in the unmounted space between printed circuit boards - Google Patents

Abstract

(57) [Abstract] [Purpose] The fan 3 does not flow in the unmounted areas between the printed circuit boards 1 and the printed circuit board 1 by the fan 3 does not flow.
Increase the heat dissipation effect. [Structure] The ventilation resistance plate 4 has a first resistance plate 4A attached to a first end portion thereof for resisting ventilation of the fan 3, and a ventilation air flow of the fan 3 at a second end portion opposite to the first end portion. A second resistance plate 4B that resists the is attached, and the external dimensions are formed to be the same as the printed circuit board 1. The ventilation resistance plate 4 is inserted into the unmounted space between the printed circuit boards 1.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 This invention relates to a heat dissipation mechanism of an electronic device in which a plurality of printed circuit boards are mounted on a shelf and the fans are ventilated in the shelf to air-cool the printed circuit boards.

[0002]

[Prior art]

 Next, the structure of the heat dissipation mechanism of the electronic device according to the related art will be described with reference to FIGS. 3 and 4. In FIG. 3, reference numeral 2 is a shelf, 3 is a fan, 5A and 5B are convection guide plates, and 6A and 6B are racks to which a plurality of shelves 2 are attached. FIG. 4 is a front view of FIG. 3, and in FIG. 4, the printed circuit boards 1 are arranged parallel to each other and mounted on the shelf 2. The upper and lower surfaces of the schulff 2 are punched out, leaving the guide rails of the printed circuit board 1 for ventilation.

Although a plurality of shelves 2 are stacked in FIG. 3, a convection guide plate 5 A is arranged in the middle to thermally isolate the shelves 2. Air passes through the shelf 2 as indicated by the dotted line in FIG. 3 to forcibly cool the plurality of printed circuit boards 1. 3 and 4 are the same as FIGS. 1 and 2 described in Japanese Utility Model Laid-Open No. 58-46494. Further, as a similar heat radiation mechanism, there are JP-A-54-86769 and JP-A-56-105698.

[0004]

[Problems to be solved by the device]

 FIG. 5 is a configuration diagram of the heat dissipation mechanism in which the fan 3 is attached to the shelf 2, and is a front view seen from the insertion surface of the printed circuit board 1. In FIG. 5, the printed circuit board 1 in the shell 2 is air-cooled by the air blown by the fan 3. Further, in order to enhance the heat dissipation effect, the front surface, the side surface, and the flat surface of the shelf 2 are shielded, and the air blown by the fan 3 passes through the inside of the shelf 2 and is discharged.

However, if the specifications of the electronic device shelves shown in FIGS. 3 and 5 are different, the printed circuit board 1 may not be partially mounted. FIG. 5 shows a state where only one printed circuit board 1 is not mounted in the central portion. In the state shown in FIG. 5, the air blown by the fan 3 passes through an unmounted portion where air is easily blown by the mounted component 1A of the printed circuit board 1, and heat is dissipated as compared with the case where the printed circuit board 1 is entirely mounted on the shelf 2. The effect decreases.

According to the present invention, a ventilation resistance plate having the same external dimensions as the printed circuit board 1 is inserted into an unmounted portion of the printed circuit board 1 of the shelf 2 so that the wind of the fan 3 is blown to the unmounted portion between the printed circuit boards 1. It is an object of the present invention to provide a ventilation resistance plate that is inserted into an unmounted space between the printed circuit boards 1 so that the fan 3 can improve the heat dissipation effect of the printed circuit board 1 by preventing the air flow.

[0007]

[Means for Solving the Problems]

 In order to achieve this object, in the present invention, the ventilation resistance plate 4 is inserted into the unmounted space between the printed circuit boards 1, and the ventilation resistance plate 4 has a first end portion which resists the ventilation of the fan 3. A resistance plate 4A is attached, and a second resistance plate 4B that resists ventilation of the fan 3 is attached to a second end opposite to the first end, and the external dimensions are the same as those of the printed circuit board 1. It

[0008]

[Action]

 Next, the structure of the heat dissipation mechanism according to the present invention will be described with reference to FIG. 1 is a ventilation resistance plate, 4A and 4B are resistance plates, and others are the same as those in FIG. The ventilation resistance plate 4 of FIG. 1 has the same outer shape as the printed circuit board 1, and is mounted on the shroud 2. Ventilation resistance plate 4 has a resistance 4A for resisting ventilation of fan 3 attached to a first end, and a resistance 4B for resistance to ventilation of fan 3 attached to a second end opposite to the first end. To be In FIG. 1, since the resistance plates 4A and 4B are attached to the ventilation resistance plate 4 at the same height as the mounting component 1A of the printed circuit board 1, the wind from the fan 3 flows evenly between the printed circuit boards 1. FIG. 2 is a configuration diagram of an embodiment of the ventilation resistance plate 4.

[0009]

[Effect of device]

 According to this invention, since the ventilation resistance plate having the same external dimensions as the printed circuit board is inserted into the unmounted location of the printed circuit board of the shelf, the air flow of the fan is prevented from flowing to the unmounted location between the printed circuit boards. The heat dissipation effect of the printed circuit board can be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a heat dissipation mechanism according to the present invention.

FIG. 2 is a configuration diagram of a ventilation resistance plate 4 according to an embodiment.

FIG. 3 is a configuration diagram of a heat dissipation mechanism according to a conventional technique.

FIG. 4 is a front view of FIG.

FIG. 5 shows a printed circuit board 1 having a heat dissipation mechanism according to the related art.
It is a state diagram in which one sheet is not mounted.

[Explanation of symbols]

 1 Printed circuit board 2 Shelf 3 Fan 4 Ventilation resistance plate 4A Resistance plate 4B Resistance plate

Claims (1)

[Scope of utility model registration request] 1. A shelf (2) comprising a plurality of printed circuit boards (1).
In the heat dissipation mechanism of the electronic device, in which the fan (3) mounted on the shelf (2) ventilates the inside of the shelf (2) by air-cooling the printed circuit board (1), it is not mounted between the printed circuit boards (1). The ventilation resistance plate (4) is inserted into the space, and the ventilation resistance plate (4) has the first resistance plate (4A) for resisting the ventilation of the fan (3) attached to the first end and the first end. The second resistance plate (4B) that resists the ventilation of the fan (3) is attached to the second end on the side opposite to this part, and the external dimensions are formed to be the same as the printed circuit board (1). A ventilation resistance plate that is inserted into the unmounted space between the printed circuit boards.