JPH06268356A - Method for using preflux and manufacture of printed wiring board - Google Patents

Method for using preflux and manufacture of printed wiring board

Info

Publication number
JPH06268356A
JPH06268356A JP5354691A JP35469193A JPH06268356A JP H06268356 A JPH06268356 A JP H06268356A JP 5354691 A JP5354691 A JP 5354691A JP 35469193 A JP35469193 A JP 35469193A JP H06268356 A JPH06268356 A JP H06268356A
Authority
JP
Japan
Prior art keywords
acid
preflux
chemical
metal
chemical formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5354691A
Other languages
Japanese (ja)
Inventor
Hideaki Yamaguchi
秀明 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP5354691A priority Critical patent/JPH06268356A/en
Publication of JPH06268356A publication Critical patent/JPH06268356A/en
Pending legal-status Critical Current

Links

Landscapes

  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To form a chemical film which excels in rust preventive, moisture proofness, heat resistance and chemical resistance by applying a preflux containing a specific compound, an organic acid, inorganic acid, a metal compound, ion exchange mater and the like. CONSTITUTION:A compound represented by a formula (However, in the formula; R1 = hydrogen, alkyl group, phenyl alkyl group, allyl group, R2 = alumel group, phenyl alkyl group, R3 = hydrogen, sulfonic acid group, alkyl group, phenyl group, halogen atoms, n=0 to 17) and a water soluble preflux containing an organic acid, a metal compound and the like is applied to a metal surface, and then a rosin preflux or a resin preflux is applied thereto. For the organic acid, an acetic acid and the like are added by 0.01 to 20% with respect to water, and for an effective component, the compound represented by the formula is added by 0.1 to 5% with respect to an acid aqueous solution. Also, for a compound of metal ions, a metal compound such as lithium is added by 0.001 to 5% with respect to water. Thereby, a chemical film which excels in rust preventive can be formed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、金属の防錆処理に関
するものであり、プリント配線板の銅または銅合金の回
路部を防錆し、低融点クリームはんだの濡れ性、広がり
性、リフロー後のはんだ付け性を向上させる耐熱プリフ
ラックスとして好適なものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal anticorrosion treatment, which is used for anticorrosion of a copper or copper alloy circuit portion of a printed wiring board, and has a low melting point cream solder wettability, spreadability, and after reflow. It is suitable as a heat-resistant preflux for improving the solderability of

【0002】[0002]

【従来の技術】プリント配線板の銅又は銅合金からなる
回路部を防錆し、はんだ付け性を保持する目的で使用さ
れているプリフラックスは、プリント配線板全体をコー
ティングするロジン系、樹脂系プリフラックスが使用さ
れている。有効成分として天然ロジン、ロジンエステ
ル、ロジン変成マレイン酸樹脂等を、有機溶剤に溶解さ
せたものをロールコターで塗布するか、噴霧又は浸漬に
よつてプリント配線板全体に塗布し、乾燥して被膜を形
成する方法で用いられる。
2. Description of the Related Art Preflux, which is used for the purpose of preventing the circuit portion of a printed wiring board made of copper or copper alloy from rusting and maintaining solderability, is a rosin-based or resin-based resin that coats the entire printed wiring board. Pre-flux is used. As an active ingredient, natural rosin, rosin ester, rosin-modified maleic acid resin, etc. dissolved in an organic solvent is applied by a roll coater, or sprayed or dipped to apply to the entire printed wiring board and dried to form a film. Used in the method of forming.

【0003】[0003]

【発明が解決しょうとする課題】近年プリント配線板に
電子部品をはんだ付けする方法として表面実装法が多く
採用されている。この表面実装法、電子部品の仮止め低
融点クリームはんだのりフロー等、プリント配線板が高
温に曝される機会が多くなり、プリント配線板のはんだ
付け性を保持するために用いられるプリフラックスの耐
熱性、即ちプリント配線板が高温に曝された後での低融
点クリームはんだの濡れ性、拡がり性、また、リフロー
後のはんだ上がり性が優れていることがプリフラックス
の性能に要求されるようになった。
In recent years, the surface mounting method has been widely adopted as a method for soldering electronic components to a printed wiring board. Due to this surface mounting method, temporary fixing of electronic parts, low melting point cream solder paste flow, etc., the printed wiring board is often exposed to high temperatures and the heat resistance of the pre-flux used to maintain the solderability of the printed wiring board. That the pre-flux performance is required to have excellent wettability and spreadability of the low melting point cream solder after the printed wiring board is exposed to high temperature, and solder rising property after reflow. became.

【0004】[0004]

【課題を解決するための手段】本発明者は、このような
事情に鑑み、高温に曝された後でも低融点クリームはん
だの濡れ性、拡がり性。リフロー後のはんだ上がり性、
濡れ性の良い耐熱性表面保護剤に関して鋭意検討を重ね
た結果、本発明の実施において用いられる有機酸として
は、酢酸、ヨード酢酸、ブロモ酢酸、ジメチル酢酸、ジ
エチル酢酸、α−ブロモ酢酸、パラニトロ安息香酸、パ
ラトルエンスルホン酸、ピクリン酸、蓚酸、蟻酸、コハ
ク酸、マレイン酸、アクリル酸、フマール酸、酒石酸、
アジピン酸、乳酸、オレイン酸、クエン酸、メタスルホ
ン酸、スルファミン酸等の有機酸、塩酸、硫酸、亜りん
酸、燐酸等の無機酸、その他のカルボン酸、ハロゲン化
脂肪酸、ハロゲン化芳香族カルボン酸等があり水に対し
て0.01〜20%の割合で添加すれば良い。有効成分
として(化1)〜(化10)で表わされる化合物を1種
類又は2種類以上を酸水溶液に対して0.1〜5%の割
合で添加すれば良い。本発明方法の実施において使用さ
れる金属イオンとしての化合物の代表的なものとしては
リチウム、ベリリウム、カリウム、マグネシウム、酢酸
亜鉛、蟻酸亜鉛、乳酸亜鉛、クウン酸亜鉛、安息香酸亜
鉛、蓚酸亜鉛、水酸化亜鉛、臭化亜鉛、リン酸亜鉛、酸
化亜鉛、塩化亜鉛、酢酸鉛、水酸化鉛、臭化鉛、ヨウ化
鉛、蓚酸鉛、ほう酸鉛、塩化第一鉄、塩化第二鉄、臭化
第一銅、臭化第二銅、ヨウ化第一銅、蟻酸銅、塩化ニッ
ケル、酢酸ニッケル、塩化第一銅、塩化第二銅、酸化第
一銅、酸化第二銅、水酸化銅、リン酸銅、炭酸銅、酢酸
銅、硫酸銅等の金属化合物であり、水に対して0.00
1〜5%の割合で添加すれば良い。本発明の実施におい
て用いられるハロゲン化芳香族カルボン酸としては、3
−ブロモ−4メチル安息香酸、4−(ブロモメチル)フ
ェニル酢酸、α−ブロモフェニル酢酸、α−ブロモテト
ラデカン酸、2−ブロモフェニル酢酸、3−ブロモフェ
ニル酢酸、4−ブロモフェニル酢酸等であり、水溶液に
対して0.01〜20%の範囲、好ましくは0.1〜5
%の割合で添加すれば良い。本発明の実施において用い
られるハロゲン化脂肪酸としては、ブロモ酢酸、3−ブ
ロモ−2−(ブロモメチル)プロピオン酸、2−ブロモ
ブタン酸、4−ブロモブタン酸、2−ブロモヘキサンデ
カン酸、2−ブロモヘキサン酸、2−ブロモ−3−メチ
ルブタン酸、2−ブロモ2−メチルプロピオン酸、2−
ブロモオクタン酸、8−ブロモオクタン酸、2−ブロモ
プロピオン酸、3−ブロモプロピオン酸、2−ブロモペ
ンタン酸、5−ブロモペンタン酸、クロロ酢酸、クロロ
酪酸、クロロプロピオン酸等であり、水溶液に対して
0.01〜20%の範囲、好ましくは0.1〜5%の割
合で添加すれば良い。本発明の実施においては、(化
1)〜(化10)で表わされる化合物及び有機酸、金属
化合物、ハロゲン化芳香族カルボン酸、ハロゲン化脂肪
酸の溶解が困難となる場合には乳化あるいは、メタノー
ル、エタノール、イソプロピルアルコール、ブタノー
ル、アセトン等の水溶性溶媒を夫々単独に用いることが
できる他、任意の割合で混合して使用することも可能で
ある。例えば上記水溶性溶媒は単独で用いられる他有機
酸等と併用することもでき、特に有機酸等単独では、
(化1)〜(化10)で表される化合物あるいはその誘
導体の溶解が困難となる場合には、水溶性溶媒を含有さ
せることが好ましく、この場合の含有率は0.01〜6
0%とすることが適当である場合が多い。なお処理液に
は、アンモニア水あるいはアミン類等の緩衝作用を有す
る物質を添加することは、水溶液のPHの安定性を高め
るばかりでなく被膜形成速度を速めるために有効であ
る。本発明の金属表面処理剤により防錆化成被膜、耐熱
性化成被膜、耐薬品性化成被膜を金属表面に施すには、
金属と処理液とを接触させる。接触させる方法としては
浸漬、噴霧、塗布による方法を用いる。接触させる処理
液の温度は、0〜100℃の温度範囲で浸漬時間は数秒
〜数十分の処理が適当である。また、化成被膜形成後ロ
ジン系、樹脂系プリフラックス(一例である。タムラ化
研(株)社製RT−02、RT−05、RT−07、メ
ック(株)社製R−4000、(株)アサヒ化研社製P
−63、サンワ化学工業(株)社製KL−741、
(株)日本ポリテック社製SMT−10等のプリフラッ
クス)を塗布することも有効であることを見いだし、本
発明を完成するに至ったものである。
In view of such circumstances, the present inventors have found that the low melting point cream solder has wettability and spreadability even after being exposed to a high temperature. Solderability after reflow,
As a result of extensive studies on a heat-resistant surface protective agent having good wettability, as the organic acid used in the practice of the present invention, acetic acid, iodoacetic acid, bromoacetic acid, dimethylacetic acid, diethylacetic acid, α-bromoacetic acid, paranitrobenzoic acid were used. Acid, p-toluenesulfonic acid, picric acid, oxalic acid, formic acid, succinic acid, maleic acid, acrylic acid, fumaric acid, tartaric acid,
Organic acids such as adipic acid, lactic acid, oleic acid, citric acid, metasulfonic acid, sulfamic acid, etc., inorganic acids such as hydrochloric acid, sulfuric acid, phosphorous acid, phosphoric acid, other carboxylic acids, halogenated fatty acids, halogenated aromatic carboxylic acids Therefore, it may be added at a ratio of 0.01 to 20% with respect to water. One or two or more compounds represented by (Chemical formula 1) to (Chemical formula 10) may be added as an active ingredient at a ratio of 0.1 to 5% with respect to the acid aqueous solution. Typical examples of the compound as a metal ion used in the method of the present invention include lithium, beryllium, potassium, magnesium, zinc acetate, zinc formate, zinc lactate, zinc counate, zinc benzoate, zinc oxalate, and water. Zinc oxide, zinc bromide, zinc phosphate, zinc oxide, zinc chloride, lead acetate, lead hydroxide, lead bromide, lead iodide, lead oxalate, lead borate, ferrous chloride, ferric chloride, bromide Cuprous, cupric bromide, cuprous iodide, copper formate, nickel chloride, nickel acetate, cuprous chloride, cupric chloride, cuprous oxide, cupric oxide, copper hydroxide, phosphorus It is a metal compound such as copper oxide, copper carbonate, copper acetate, and copper sulfate, and is 0.00 with respect to water.
It may be added at a rate of 1 to 5%. The halogenated aromatic carboxylic acid used in the practice of the present invention is 3
-Bromo-4-methylbenzoic acid, 4- (bromomethyl) phenylacetic acid, α-bromophenylacetic acid, α-bromotetradecanoic acid, 2-bromophenylacetic acid, 3-bromophenylacetic acid, 4-bromophenylacetic acid, etc. In the range of 0.01 to 20%, preferably 0.1 to 5
% May be added. Examples of the halogenated fatty acid used in the practice of the present invention include bromoacetic acid, 3-bromo-2- (bromomethyl) propionic acid, 2-bromobutanoic acid, 4-bromobutanoic acid, 2-bromohexanedecanoic acid, 2-bromohexanoic acid. , 2-bromo-3-methylbutanoic acid, 2-bromo-2-methylpropionic acid, 2-
Bromooctanoic acid, 8-bromooctanoic acid, 2-bromopropionic acid, 3-bromopropionic acid, 2-bromopentanoic acid, 5-bromopentanoic acid, chloroacetic acid, chlorobutyric acid, chloropropionic acid, etc. In the range of 0.01 to 20%, preferably 0.1 to 5%. In the practice of the present invention, when it becomes difficult to dissolve the compounds represented by (Chemical Formula 1) to (Chemical Formula 10) and organic acids, metal compounds, halogenated aromatic carboxylic acids, and halogenated fatty acids, emulsification or methanol Water-soluble solvents such as ethanol, isopropyl alcohol, butanol, and acetone can be used alone, or can be used by mixing them at an arbitrary ratio. For example, the water-soluble solvent may be used in combination with other organic acids or the like, which are used alone.
When it becomes difficult to dissolve the compound represented by (Chemical Formula 1) to (Chemical Formula 10) or its derivative, it is preferable to add a water-soluble solvent, and the content ratio in this case is 0.01 to 6
In many cases, 0% is appropriate. It should be noted that adding a substance having a buffering action such as aqueous ammonia or amines to the treatment liquid is effective not only for enhancing the stability of PH of the aqueous solution but also for accelerating the film formation rate. To apply a rust-preventive conversion coating, a heat-resistant conversion coating, and a chemical-resistant conversion coating to the metal surface with the metal surface treatment agent of the present invention,
Contact the metal with the treatment liquid. As a method of contacting, a method of dipping, spraying or coating is used. It is suitable that the temperature of the treatment liquid to be brought into contact is in the temperature range of 0 to 100 ° C. and the immersion time is several seconds to several tens of minutes. In addition, after forming the chemical conversion film, rosin-based and resin-based pre-flux (for example, RT-02, RT-05, RT-07 manufactured by Tamura Chemical Co., Ltd., R-4000 manufactured by Mech Co., Ltd. ) Asahi Kaken P
-63, KL-741 manufactured by Sanwa Chemical Industry Co., Ltd.,
It was found that applying a pre-flux such as SMT-10 manufactured by Nippon Polytech Co., Ltd. was also effective, and completed the present invention.

【0005】[0005]

【作用】上記した処理方法によれば、銅、銅合金等の金
属表面に防錆に有効な、(化1)〜(化10)を主体と
する防錆化成被膜、耐熱性化成被膜、耐薬品性化成被膜
が形成される。これらの化成被膜は揆水性で防錆、耐湿
性、耐熱性、耐薬品性にも優れ金属表面を長期間保護す
ると共に、低融点クリームはんだの濡れ性、拡がり性、
リフロー後のはんだ上がり性、濡れ性が良好である。ま
た、化成被膜形成後、ロジン系、樹脂系プリフラックス
を塗布することにより低融点クリームはんだの濡れ性、
拡がり性、リフロー後のはんだ上がり性、濡れ性が良好
である。
According to the above-mentioned treatment method, a rust-preventive chemical conversion film mainly composed of (Chemical formula 1) to (Chemical formula 10), a heat-resistant chemical conversion film, and a corrosion-resistant film, which are effective for rust prevention on metal surfaces such as copper and copper alloys, A chemical conversion coating is formed. These chemical conversion coatings are water repellent, rust-proof, moisture-resistant, heat-resistant, have excellent chemical resistance, and protect the metal surface for a long time, as well as wettability and spreadability of low-melting point cream solder,
Good solderability and wettability after reflow. Also, after forming the chemical conversion film, the wettability of the low melting point cream solder by applying a rosin-based or resin-based preflux,
Good spreadability, solderability after reflow, and wettability.

【0006】[0006]

【実施例】(化1)〜(化10)で表される化合物(表
1の記載の化合物)を1%、蟻酸、カルボン酸、アンモ
ニア水、塩化第二銅、イオン交換水等を含む各種類の水
溶液を作り、100ml容器に入れ、液温を40゜Cに
加熱し調整した。他方、1cm×10cm×0.3mm
の銅板に、硫酸銅めっきした試料片を準備し、次いで、
、脱脂、水洗、ソフトエッチング、水洗、酸洗、水洗
し表面を洗浄して、上記(化1)〜(化10)で表され
る化合物を有効成分とする各種類の1%水溶液に60秒
間接触させその後水洗し乾燥した。、の試料片にタ
ムラ社製RT−07を塗布して乾燥した。、の試料
片にメック社製R−4000を塗布して乾燥した。、
の試料片に日本ポリテック社製SMT−10を塗布し
て乾燥した。、の試料片にサンワ化学工業社製KL
−714を塗布して乾燥した。〜の試料片を準備し
次いで、(1)〜の試料片にクリームはんだを印刷
してリフロー処理後のはんだ広がり率を測定した。
(2)〜の試料片を熱風乾燥機に入れ200℃で5
分間加熱して測定前にポストフラックスに浸漬しはんだ
濡れ性試験機を用いて濡れ時間を測定した。(3)〜
の試料片を耐湿試験器を用いてMIL−STD−20
2F−M−106E処理を行い、その試験片をポストフ
ラックスに浸漬してはんだ濡れ性試験機を用いて濡れ時
間を測定した。この試験結果は表1に示した。
EXAMPLES Each containing 1% of the compound represented by (Chemical formula 1) to (Chemical formula 10) (compound described in Table 1), formic acid, carboxylic acid, aqueous ammonia, cupric chloride, ion-exchanged water, etc. A variety of aqueous solutions were prepared, placed in a 100 ml container, and the liquid temperature was adjusted to 40 ° C by heating. On the other hand, 1 cm x 10 cm x 0.3 mm
Prepare a copper sulfate-plated sample piece on the copper plate, and then
, Degreasing, washing with water, soft etching, washing with water, pickling, washing with water, and the surface is washed for 60 seconds in each kind of 1% aqueous solution containing the compound represented by the above (Chemical formula 1) to (Chemical formula 10) as an active ingredient. It was contacted and then washed with water and dried. Tamura RT-07 was applied to the sample pieces of and were dried. R-4000 manufactured by MEC Co., Ltd. was applied to the sample pieces of No. 3, and dried. ,
SPT-10 manufactured by Nippon Polytech Co., Ltd. was applied to the sample piece of No. 1 and dried. , KL manufactured by Sanwa Chemical Industry Co., Ltd.
-714 was applied and dried. Sample pieces of to were prepared, and then cream solder was printed on the sample pieces of (1) to measure the solder spreading rate after the reflow treatment.
Put the sample pieces of (2) to 5 in a hot air dryer at 200 ° C.
It was heated for a minute, immersed in post flux before measurement, and the wetting time was measured using a solder wettability tester. (3) ~
MIL-STD-20 using the moisture resistance tester
2F-M-106E treatment was performed, the test piece was immersed in post flux, and the wetting time was measured using a solder wettability tester. The test results are shown in Table 1.

【表1】 [Table 1]

【0007】[0007]

【発明の効果】プリフラックスを金属表面に塗布するこ
とにより、防錆性、耐湿性、耐熱性、耐薬品性に優れた
化成被膜が形成する。また、化成被膜形成後、ロジン
系、樹脂系プリフラックを塗布することにより低融点ク
リームはんだの濡れ性、拡がり性、また、リフロー後の
はんだ上がり性、濡れ性が良好という効果で、電子部品
を表面実装するのに特に顕著な効果を発揮しうるもので
ある。
EFFECTS OF THE INVENTION By applying pre-flux to a metal surface, a chemical conversion coating having excellent rust resistance, moisture resistance, heat resistance and chemical resistance is formed. In addition, after forming the chemical conversion film, by applying rosin-based or resin-based pre-frac, the wettability and spreadability of the low melting point cream solder, and the solder riseability and wettability after reflow are good, so that the electronic component surface It can be particularly effective for implementation.

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 (化1)〜(化10)で表される化合物
および有機酸、金属化合物等を含む水溶性プリフラック
スを金属表面に塗布後、ロジン系プリフラックスもしく
は樹脂系プリフラックスを塗布することを特徴とするプ
リフラックスの使用方法およびプリント配線板の製造方
法。 【化1】 【化2】 【化3】 【化4】 【化5】 【化6】 【化7】 【化8】 【化9】 【化10】
1. A water-soluble preflux containing a compound represented by (Chemical Formula 1) to (Chemical Formula 10), an organic acid, a metal compound, etc. is applied to a metal surface, and then a rosin-based preflux or a resin-based preflux is applied. A method of using a pre-flux and a method of manufacturing a printed wiring board. [Chemical 1] [Chemical 2] [Chemical 3] [Chemical 4] [Chemical 5] [Chemical 6] [Chemical 7] [Chemical 8] [Chemical 9] [Chemical 10]
【請求項2】 ロジン系プリフラックスもしくは樹脂系
プリフラックスに(化1)〜(化10)で表される化合
物を添加したプリフラックスを金属表面に塗布すること
を特徴とするプリフラックスの使用方法およびプリント
配線板の製造方法。
2. A method of using a preflux, which comprises applying a preflux obtained by adding a compound represented by (Chemical Formula 1) to (Chemical Formula 10) to a rosin-based preflux or a resin-based preflux to a metal surface. And a method for manufacturing a printed wiring board.
【請求項3】 (化1)〜(化10)で表される化合物
および有機酸、金属化合物にカルボン酸、ハロゲン化脂
肪酸、ハロゲン化芳香族カルボン酸等を1種類または2
種類以上を含む水溶性プリフラックスを金属表面に塗布
後、ロジン系プリフラックスもしくは樹脂系プリフラッ
クスを塗布することを特徴とするプリフラックスの使用
方法およびプリント配線板の製造方法。
3. A compound represented by (Chemical Formula 1) to (Chemical Formula 10), an organic acid, a metal compound, and one or more of carboxylic acid, halogenated fatty acid, halogenated aromatic carboxylic acid and the like.
A method for using a preflux and a method for manufacturing a printed wiring board, which comprises applying a water-soluble preflux containing at least one kind to a metal surface and then applying a rosin-based preflux or a resin-based preflux.
【請求項4】 (化1)〜(化10)で表される化合物
及び有機酸、金属化合物を含む水溶性プリフラックスを
金属表面に塗布することを特徴とする金属の表面保護剤
および使用方法。
4. A surface protective agent for metal and a method for using the same, comprising applying a water-soluble preflux containing a compound represented by (Chemical formula 1) to (Chemical formula 10), an organic acid and a metal compound to a metal surface. .
【請求項5】 (化1)〜(化10)で表される化合物
および有機酸、金属化合物にカルボン酸、ハロゲン化脂
肪酸、ハロゲン化芳香族カルボン酸等を1種類または2
種類以上を含む水溶性プリフラックスを金属表面に塗布
することを特徴とする金属の表面保護剤および使用方
法。
5. A compound represented by (Chemical formula 1) to (Chemical formula 10), an organic acid, a metal compound, a carboxylic acid, a halogenated fatty acid, a halogenated aromatic carboxylic acid, or the like, or a combination thereof.
A surface protective agent for metal, which comprises applying a water-soluble preflux containing at least one kind to a metal surface, and a method of using the same.
【請求項6】 請求項1〜請求項5記載の金属表面処理
後、はんだ付け処理を行うことを特徴とするプリント配
線板の製造方法。
6. A method for manufacturing a printed wiring board, which comprises performing a soldering treatment after the metal surface treatment according to any one of claims 1 to 5.
【請求項7】 請求項1〜請求項5記載の金属表面処理
後、空気中または窒素雰囲気中で加熱する赤外線リフロ
ー、近赤外線リフロー、遠赤外線リフロー、窒素リフロ
ー、ベーパーリフロー処理を行うことを特徴とするプリ
ント配線板の製造方法。
7. After the metal surface treatment according to any one of claims 1 to 5, infrared reflow, near-infrared reflow, far-infrared reflow, nitrogen reflow, vapor reflow treatment of heating in air or a nitrogen atmosphere is performed. And a method for manufacturing a printed wiring board.
JP5354691A 1993-01-18 1993-12-21 Method for using preflux and manufacture of printed wiring board Pending JPH06268356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5354691A JPH06268356A (en) 1993-01-18 1993-12-21 Method for using preflux and manufacture of printed wiring board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP5-37247 1993-01-18
JP3724793 1993-01-18
JP5354691A JPH06268356A (en) 1993-01-18 1993-12-21 Method for using preflux and manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPH06268356A true JPH06268356A (en) 1994-09-22

Family

ID=26376375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5354691A Pending JPH06268356A (en) 1993-01-18 1993-12-21 Method for using preflux and manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPH06268356A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008047928A (en) * 2007-09-06 2008-02-28 Seiko Epson Corp Method of manufacturing semiconductor device and method of processing electric connection
WO2008071574A1 (en) 2006-12-13 2008-06-19 F. Hoffmann-La Roche Ag Novel 2 -imidazoles as ligands for trace amine associated receptors (taar)
US7652055B2 (en) 2007-07-02 2010-01-26 Hoffman-La Roche Inc. 2-imidazolines
US8389507B2 (en) 2007-07-27 2013-03-05 Hoffmann-La Roche Inc. 2-azetidinemethaneamines and 2-pyrrolidinemethaneamines as TAAR-ligands
JP2017503920A (en) * 2013-12-27 2017-02-02 ダウ グローバル テクノロジーズ エルエルシー Bis-imidazoline compounds as corrosion inhibitors and their preparation
US10329672B2 (en) 2013-12-27 2019-06-25 Dow Global Technologies Llc Corrosion inhibiting compositions including bis-imidazoline compounds derived from enriched linear tetramines
US10428454B2 (en) 2013-12-27 2019-10-01 Dow Global Technologies Llc Textile treatment compositions including quternary bis-imidazoline compounds derived from linear tetramines useful to improve moisture management and provide antimicrobial protection

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008071574A1 (en) 2006-12-13 2008-06-19 F. Hoffmann-La Roche Ag Novel 2 -imidazoles as ligands for trace amine associated receptors (taar)
US7858653B2 (en) 2006-12-13 2010-12-28 Hoffman-La Roche Inc. 2-imidazoles
US7652055B2 (en) 2007-07-02 2010-01-26 Hoffman-La Roche Inc. 2-imidazolines
US8389507B2 (en) 2007-07-27 2013-03-05 Hoffmann-La Roche Inc. 2-azetidinemethaneamines and 2-pyrrolidinemethaneamines as TAAR-ligands
JP2008047928A (en) * 2007-09-06 2008-02-28 Seiko Epson Corp Method of manufacturing semiconductor device and method of processing electric connection
JP2017503920A (en) * 2013-12-27 2017-02-02 ダウ グローバル テクノロジーズ エルエルシー Bis-imidazoline compounds as corrosion inhibitors and their preparation
US10329672B2 (en) 2013-12-27 2019-06-25 Dow Global Technologies Llc Corrosion inhibiting compositions including bis-imidazoline compounds derived from enriched linear tetramines
US10428454B2 (en) 2013-12-27 2019-10-01 Dow Global Technologies Llc Textile treatment compositions including quternary bis-imidazoline compounds derived from linear tetramines useful to improve moisture management and provide antimicrobial protection
US10487406B2 (en) 2013-12-27 2019-11-26 Dow Global Technologies Llc Bis-imidazoline compounds as corrosion inhibitors and preparation thereof

Similar Documents

Publication Publication Date Title
JP3547028B2 (en) Copper and copper alloy surface treatment agent
EP0627499B1 (en) Agent for treating surfaces of copper and copper alloys
KR100556679B1 (en) Process for selective deposition of copper substrates
JP2009500842A (en) Preflux composition
JP4647073B2 (en) Method of soldering copper and copper alloy
JP2005226082A (en) Surface treatment agent for metal, printed circuit board, and surface treatment method for metal of printed circuit board
JPH06268356A (en) Method for using preflux and manufacture of printed wiring board
JP2004238658A (en) Surface treatment agent for silver and silver alloy
EP0490161A2 (en) A method for protecting surfaces of copper or a copper alloy from corrosion
JPH0525407A (en) Surface protectant for printed circuit board
JPH04206681A (en) Printed circuit board and surface processing method thereof
JPH07243053A (en) Surface treating agent for copper and copper alloy
JPH03124395A (en) Preflux for soldering
JP2913410B2 (en) Surface treatment agent for copper or copper alloy
JPH07330738A (en) Protecting agent for metal surface and production using the same
JP3668767B2 (en) Surface treatment method for metals such as solder, electroless solder, silver, nickel and zinc
JPH06299375A (en) Treatment of metallic surface such as solder, electroless solder, ag, ni, zn, cu and cu alloy
JPH07202386A (en) Metal surface protective agent and surface treatment method
JP3205927B2 (en) A method for forming a surface protective agent and a surface protective film for a copper-gold coexisting substrate.
WO2010024472A1 (en) Surface treating agent for copper or copper alloy and use thereof
JPH07118880A (en) Metal surface protective agent and treatment using the same
JPH07243068A (en) Electrolytic treatment of metal surface
JPH08183778A (en) Surface-protecting agent of metal and production using the same
JPH05345984A (en) Surface treating agent for copper and copper alloy
JPH05202492A (en) Surface treatment of metal

Legal Events

Date Code Title Description
S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080218

Year of fee payment: 8

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090218

Year of fee payment: 9

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090218

Year of fee payment: 9

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100218

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110218

Year of fee payment: 11

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 11

Free format text: PAYMENT UNTIL: 20110218

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 11

Free format text: PAYMENT UNTIL: 20110218

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

LAPS Cancellation because of no payment of annual fees