JPH06260729A - Printed board - Google Patents

Printed board

Info

Publication number
JPH06260729A
JPH06260729A JP4784793A JP4784793A JPH06260729A JP H06260729 A JPH06260729 A JP H06260729A JP 4784793 A JP4784793 A JP 4784793A JP 4784793 A JP4784793 A JP 4784793A JP H06260729 A JPH06260729 A JP H06260729A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
perforations
copper foil
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4784793A
Other languages
Japanese (ja)
Inventor
Hiroshi Sugiura
洋 杉浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP4784793A priority Critical patent/JPH06260729A/en
Publication of JPH06260729A publication Critical patent/JPH06260729A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To provide a printed board wherein perforations provided for it so as to divide it by bending are protected against unexpected cracks. CONSTITUTION:In a printed board 10 where perforations 16 are provided, a reinforcing copper foil 14b is attached around the perforations 16 composed of round holes 16a and slots 16b provided to a rear side 22 of the board 10.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、1枚のプリント基板に
多数のプリント基板がミシン目により接続され、ミシン
目から分離して多数のプリント基板を取得するプリント
基板に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board in which a large number of printed circuit boards are connected to one printed circuit board by perforations and the printed circuit boards are separated from the perforated lines to obtain a large number of printed circuit boards.

【0002】[0002]

【従来の技術】従来、1枚のプリント基板から多数のプ
リント基板を取得する場合、図1に示すように、プリン
ト基板10の表面12上に多数のパターン配線用の銅箔
14aを形成し、目的の違う基板ごとに丸穴16aと長
穴16bで区分され(以下、丸穴16a長穴16bとを
合わせてミシン目16と言う)、プリント基板10の部
品実装穴18に電子部品20を実装した後、前記ミシン
目を割ることにより1枚のプリント基板10から多数の
基板10a,10bを取得するものがあった。
2. Description of the Related Art Conventionally, in the case of obtaining a large number of printed circuit boards from a single printed circuit board, as shown in FIG. 1, a large number of copper foils 14a for pattern wiring are formed on a surface 12 of the printed circuit board 10, Boards with different purposes are divided into round holes 16a and long holes 16b (hereinafter, round holes 16a and long holes 16b are collectively referred to as perforations 16), and electronic components 20 are mounted in the component mounting holes 18 of the printed circuit board 10. After that, there is one that obtains a large number of boards 10a and 10b from one printed board 10 by breaking the perforations.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、従来は
電子部品20の実装の際、実装するための圧力がプリン
ト基板10の表面12にかかり、プリント基板10が反
ってしまい、ミシン目16から割れてしまうことがあっ
た。
However, conventionally, when the electronic component 20 is mounted, the pressure for mounting is applied to the surface 12 of the printed circuit board 10 and the printed circuit board 10 warps and breaks from the perforations 16. There was something that happened.

【0004】本発明は、上述した問題点を解決するため
になされたものであり、プリント基板の裏面のミシン目
の周囲に金属箔を覆うことにより不用意な割れを防止し
得るプリント基板を提供することを目的とする。
The present invention has been made to solve the above-mentioned problems, and provides a printed circuit board capable of preventing inadvertent cracking by covering a metal foil around the perforations on the back surface of the printed circuit board. The purpose is to do.

【0005】[0005]

【課題を解決するための手段】この目的を達成するため
に本発明のプリント基板は、折り曲げて分離するための
ミシン目と、電子部品を実装するための表面とを有し、
プリント基板の裏面のミシン目の周囲が金属箔で覆われ
た構成としたものである。
In order to achieve this object, a printed circuit board of the present invention has perforations for folding and separating, and a surface for mounting electronic parts,
The perimeter of the perforations on the back surface of the printed circuit board is covered with a metal foil.

【0006】[0006]

【作用】上記の構成を有する本発明のプリント基板は、
金属箔をプリント基板の裏面のミシン目の周囲に付着さ
せたものである。
The printed circuit board of the present invention having the above structure is
The metal foil is attached around the perforations on the back surface of the printed circuit board.

【0007】[0007]

【実施例】以下、本発明を具体化した一実施例を図面を
参照して説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0008】図1は本実施例のプリント基板の表面を示
す斜視図であり、プリント基板10の表面12上の構成
については、従来の技術にて説明したプリント基板10
と同一であるので、その説明は省略する。
FIG. 1 is a perspective view showing the surface of the printed circuit board of the present embodiment. The structure on the surface 12 of the printed circuit board 10 is the printed circuit board 10 described in the prior art.
Since it is the same as, the description thereof will be omitted.

【0009】図2は本実施例のプリント基板の裏面を示
す斜視図であり、プリント基板10の裏面22上には、
表面12と同様に銅箔14aを付着させて、電子部品2
0と電子部品20とを導通させるためのパターンが形成
されている。また、本プリント基板10には1枚の基板
10から多数の基板10a,10bを得るために丸穴1
6aと長穴16bとから成るミシン目16が設けられて
いる。さらにプリント基板10は電子部品20を実装す
るための部品実装穴18を有している。
FIG. 2 is a perspective view showing the back surface of the printed circuit board of this embodiment.
The copper foil 14a is attached in the same manner as the surface 12, and the electronic component 2
A pattern for electrically connecting 0 and the electronic component 20 is formed. In addition, the printed circuit board 10 has a round hole 1 in order to obtain a large number of boards 10a and 10b from one board 10.
A perforation 16 composed of 6a and an elongated hole 16b is provided. Further, the printed circuit board 10 has a component mounting hole 18 for mounting the electronic component 20.

【0010】プリント基板10の裏面22には、丸穴1
6aと長穴16bとの周囲に補強用の銅箔14bがベタ
状に付着されている。
On the back surface 22 of the printed circuit board 10, a round hole 1
A copper foil 14b for reinforcement is solidly attached around 6a and the elongated hole 16b.

【0011】なぜプリント基板10の裏面に銅箔14b
を付着するかを図3を参照して説明する。電子部品20
の実装時、プリント基板10は両端を固定されて、表面
12の上方から部品が実装される。その際プリント基板
10には、上方から実装される力23が働く。その時プ
リント基板10の表面12の銅箔14は縮まる。すなわ
ち圧縮力24が働く。つぎに裏面22では、銅箔14は
伸びる。つまり引張力26が働く。一般に金属類は引張
力26に強いのでプリント基板10の裏面22に銅箔1
4bを付着することにした。
Why is the copper foil 14b on the back surface of the printed circuit board 10?
Whether to attach will be described with reference to FIG. Electronic component 20
At the time of mounting, both ends of the printed circuit board 10 are fixed, and components are mounted from above the surface 12. At that time, a force 23 is applied to the printed circuit board 10 from above. At that time, the copper foil 14 on the surface 12 of the printed circuit board 10 shrinks. That is, the compression force 24 works. Next, on the back surface 22, the copper foil 14 is stretched. That is, the tensile force 26 works. In general, metals are strong against the tensile force 26, so that the copper foil 1 is formed on the back surface 22 of the printed circuit board 10.
It was decided to attach 4b.

【0012】したがって、ミシン目16の予期せぬ割れ
を防ぐことができる。しかも、パターンを形成する際に
電子部品20と電子部品20とを導通させる銅箔14a
と補強用の導箔14bとの付着が同時にできるので、工
程を増やさずにすむ。
Therefore, it is possible to prevent unexpected breakage of the perforations 16. Moreover, the copper foil 14a that electrically connects the electronic components 20 to each other when forming the pattern
Since the reinforcing conductive foil 14b and the reinforcing conductive foil 14b can be attached at the same time, the number of steps is not increased.

【0013】尚、本実施例においては、補強用の銅箔1
4bをプリント基板10の裏面22にのみ付着したが、
プリント基板10の表面12と裏面22との両面に付着
してもよい。
In this embodiment, the reinforcing copper foil 1 is used.
4b was attached only to the back surface 22 of the printed circuit board 10,
It may be attached to both the front surface 12 and the back surface 22 of the printed circuit board 10.

【0014】また、補強用の銅箔14bを付着する場所
は、ミシン目16の丸穴16aと長穴16bとの側面2
8(図2に網線にて示す)だけでもよい。
Further, the place where the reinforcing copper foil 14b is attached is the side surface 2 between the round hole 16a and the long hole 16b of the perforation 16.
8 (indicated by a mesh line in FIG. 2) may be sufficient.

【0015】さらに、図4のように、補強用の銅箔14
bにミシン目16の丸穴16aと長穴16bとの平行線
上に銅箔14bを付着させない部分30をつくってもよ
い。これにより、ミシン目16の強化の他に、折り曲げ
て分離させる際に、ミシン目16の不規則な割れを防止
できる。
Further, as shown in FIG. 4, a copper foil 14 for reinforcement is used.
In b, a portion 30 where the copper foil 14b is not attached may be formed on the parallel line between the round hole 16a of the perforation 16 and the elongated hole 16b. As a result, in addition to strengthening the perforations 16, it is possible to prevent irregular cracks in the perforations 16 when bending and separating.

【0016】また、本実施例では金属箔として銅箔14
を用いたが、銀箔など他の金属箔であってもよい。
In this embodiment, the copper foil 14 is used as the metal foil.
However, other metal foil such as silver foil may be used.

【0017】[0017]

【発明の効果】以上説明したことから明かなように、本
発明のプリント基板は、ミシン目の周囲に金属箔を付着
することにより、ミシン目から予期せぬ割れを防止する
ことができる。したがって実用上の効果はきわめて大き
い。
As is apparent from the above description, the printed circuit board of the present invention can prevent unexpected cracks from perforations by attaching the metal foil around the perforations. Therefore, the practical effect is extremely large.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は本発明の実施例および従例来におけるプ
リント基板の表面を示す斜視図である。
FIG. 1 is a perspective view showing a surface of a printed circuit board according to an embodiment of the present invention and a conventional example.

【図2】図2は本発明の実施例おけるプリント基板の裏
面を示す斜視図である。
FIG. 2 is a perspective view showing a back surface of a printed circuit board according to an embodiment of the present invention.

【図3】図3はプリント基板が反った時に金属箔にかか
る力を説明する図である。
FIG. 3 is a diagram illustrating a force applied to a metal foil when a printed circuit board is warped.

【図4】図4は本発明の変形例におけるプリント基板の
裏面を示す斜視図である。
FIG. 4 is a perspective view showing a back surface of a printed circuit board according to a modified example of the present invention.

【符号の説明】 12 表面 14b 補強用の銅箔 16 ミシン目 16a 丸穴 16b 長穴 20 電子部品 22 裏面[Explanation of reference symbols] 12 front surface 14b copper foil for reinforcement 16 perforations 16a round hole 16b long hole 20 electronic component 22 back surface

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 折り曲げて分離するためのミシン目と、
電子部品を実装するための表面とを有するプリント基板
において、 プリント基板の裏面のミシン目の周囲が金属箔で覆われ
たことを特徴とするプリント基板。
1. A perforation for folding and separating,
A printed circuit board having a front surface for mounting electronic components, wherein the perimeter of the perforations on the back surface of the printed circuit board is covered with a metal foil.
JP4784793A 1993-03-09 1993-03-09 Printed board Pending JPH06260729A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4784793A JPH06260729A (en) 1993-03-09 1993-03-09 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4784793A JPH06260729A (en) 1993-03-09 1993-03-09 Printed board

Publications (1)

Publication Number Publication Date
JPH06260729A true JPH06260729A (en) 1994-09-16

Family

ID=12786763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4784793A Pending JPH06260729A (en) 1993-03-09 1993-03-09 Printed board

Country Status (1)

Country Link
JP (1) JPH06260729A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5617985B1 (en) * 2013-09-27 2014-11-05 富士ゼロックス株式会社 LIGHT EMITTING BOARD MANUFACTURING METHOD, EXPOSURE DEVICE MANUFACTURING METHOD, LIGHT EMITTING SUBSTRATE, EXPOSURE DEVICE, AND IMAGE FORMING APPARATUS

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5617985B1 (en) * 2013-09-27 2014-11-05 富士ゼロックス株式会社 LIGHT EMITTING BOARD MANUFACTURING METHOD, EXPOSURE DEVICE MANUFACTURING METHOD, LIGHT EMITTING SUBSTRATE, EXPOSURE DEVICE, AND IMAGE FORMING APPARATUS
JP2015066793A (en) * 2013-09-27 2015-04-13 富士ゼロックス株式会社 Method for manufacturing light emission substrate and method for manufacturing exposure equipment, and light emission substrate, exposure equipment and image formation device
CN104516235A (en) * 2013-09-27 2015-04-15 富士施乐株式会社 Method for manufacturing light-emitting substrate and method for manufacturing exposure device
CN104516235B (en) * 2013-09-27 2019-02-15 富士施乐株式会社 The manufacturing method of light-emitting substrate and the manufacturing method of exposure device

Similar Documents

Publication Publication Date Title
JPH06152077A (en) Flexible circuit board
US5105261A (en) Semiconductor device package having particular lead structure for mounting multiple circuit boards
JPH06260729A (en) Printed board
JP3984032B2 (en) Rigid flex multilayer printed wiring board
US20010017769A1 (en) Printed circuit board and method for mounting electrical component thereon
JPH0752790B2 (en) Parent-child board mounting method
JPH11346036A (en) Electric board and electrical mounting installation method
JP2723077B2 (en) Electronic circuit device and electronic component mounting method
JP3354308B2 (en) Large current circuit board and method of manufacturing the same
JP2003017823A (en) Fpc and soldering structure thereof
JPS6112698Y2 (en)
JP2537639Y2 (en) Bending structure of flexible circuit board
JPH01278004A (en) Mounting construction for coil
JPH09321417A (en) Single side printed-wiring board
JPH04206888A (en) Printed board reinforcing device
JPH07245451A (en) Method for bending flexible printed wiring board
JPH069287B2 (en) Printed wiring board
JP2541488B2 (en) Printed circuit board mounting method
JP2990071B2 (en) Jack mounting structure
JP2905384B2 (en) Jumper member mounting structure to flexible wiring board
JP3752728B2 (en) Printed circuit board manufacturing method and printed circuit board
JP2002290002A (en) Printed board
JPH1197816A (en) Printed wiring board
JPS60143697A (en) Method of fixing lead wire to printed circuit board
JP2000261146A (en) Multilayer printed board