JPH06258244A - Instruction method of mounting part inspection data - Google Patents

Abstract

PURPOSE:To correct inspection data easily to the optimal value by judging correctly whether already instructed inspection data is optimal or not. CONSTITUTION:A test board on which goodness or badness of mounting quality is already known is carried in a mounting part inspection device, and images of respective parts on the board are picked up, and an image pattern is extracted by using instructed inspection data, and a numeric value of a characteristic parameter is calculated to judge the mounting quality, and this is displayed (step 1-5) together with a criterion value instructed beforehand. An operator judges whether the inspection data instructed by this display is proper or not, and corrects it (step 6 and 7) when it is not proper. After this procedure is practiced on all parts on the board, the board is carried out (step 9-11).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounted on a printed circuit board (hereinafter simply referred to as "substrate"), for example, whether or not the electronic component is present or not before soldering, and soldering after soldering. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounted component inspection device used for inspecting quality, and in particular, the present invention provides a mounted component inspection device for inspecting data necessary for automatically inspecting the mounting quality of each mounted component on a substrate to be inspected. And a teaching method of mounting part inspection data for teaching and correcting the teaching data.

[0002]

2. Description of the Related Art Conventionally, a visual inspection has been performed to inspect the mounting quality of mounted components on a substrate to be inspected (collectively, the one before soldering and the one after soldering). It is being appreciated. However, in this type of visual inspection, the occurrence of inspection errors is unavoidable, the inspection results vary depending on the inspector, and the inspection processing capacity is also limited.

Therefore, in recent years, a mounted component inspection apparatus has been put into practical use which automatically inspects the mounting quality of a board on which a large number of components are mounted by using an image processing technique. When using this mounted component inspection device, prior to the inspection, the mounted component inspection device is instructed for each board type about what position, what component, etc. are mounted on the inspected substrate. There is a need to. This teaching work is generally called "teaching".

Information relating to the inspection of the mounting quality of the components (generally referred to as "inspection data" hereinafter) includes the position, type, orientation, etc. of the components mounted on the substrate to be inspected, as well as the soldering of each component. Information about the land and parts to be attached on the board (shape, length, width, etc.), information about the window set as the inspection area (shape, size, etc.), and the soldered part on the land from the captured image The information about the hue and the lightness for extracting the image pattern, the determination reference value for determining the quality of the characteristic parameter obtained from the image pattern, and the like are included.

At the time of inspecting a board to be inspected, this mounting component inspecting apparatus extracts an image pattern of, for example, a soldered portion from the image obtained by picking up an image of the board to be inspected, and extracts the image pattern. The electrode width, electrode continuous length, fillet width, fillet continuous length, distance between the fillet and the electrode, the ratio of each hue area of the fillet, etc. are calculated as characteristic parameters, and each calculated value is an individual judgment reference value. The quality of the soldering state is determined by comparing with.

The inspection data is manually input to the mounted component inspection device by the operator for each type of the substrate to be inspected, and when the teaching work of the inspection data is completed, the quality of the mounting quality of each component is judged. Using a known test board, a test inspection is carried out by the mounted component inspection device, and a non-defective board is judged to be a good one, while a defective board is judged to be a defective one. I am trying to fix.

[0007]

However, in such a correction method, since the operator can confirm only the inspection result of the non-defective product or the defective product, for example, when the non-defective product is judged as the non-defective product, the calculated value of the characteristic parameter is calculated. Even if is a value that slightly clears the judgment reference value, the taught inspection data will be determined and determined to be optimal. A situation may occur in which discrimination cannot be made.

Further, since the teaching and correction of the inspection data are performed by the experience and perception of the operator, the operator is overloaded, and the inspection data to be taught depends on the operator and the same operator. Even if there is, there is also a problem that variations sometimes occur.

The present invention has been made in view of the above problems. By outputting the calculated value of the characteristic parameter and comparing the calculated value with the judgment reference value to correct the inspection data, An object of the present invention is to provide a teaching method of mounting component inspection data, which can easily correct the inspection data to an optimum value.

Further, according to the present invention, it is possible to correct the inspection data without relying on the experience or perception of the operator, thereby reducing the excessive burden on the operator in the teaching work, and changing the inspection data due to the difference between the operators. The purpose is to eliminate the variation of.

[0011]

According to the present invention, there is provided a teaching procedure for teaching a mounting component inspection apparatus the inspection data necessary for automatically inspecting the mounting quality of each mounting component on a substrate to be inspected,
A teaching method of mounting component inspection data comprising a correction procedure for correcting the inspection data taught by the teaching procedure, wherein the correction procedure determines whether the mounting quality is good or not with respect to the taught mounting component inspection device. The procedure of introducing a known board and imaging it by the mounted component inspection device, and the numerical values of the characteristic parameters used by the mounted component inspection device to determine the mounting quality of the mounted component, the inspection data from the image of the substrate. And a procedure for calculating and outputting by the mounted component inspection device, and a procedure for correcting the inspection data by comparing the calculated value of the characteristic parameter with a determination reference value for determining the quality of mounting quality. Are carried out in series.

[0012]

With respect to the board of which the mounting quality is known, the mounted component inspection apparatus calculates and outputs the numerical value of the characteristic parameter used to judge the mounting quality of the mounted component. By comparing with the judgment reference value for judgment, the operator can correctly judge whether or not the taught inspection data is optimum, and can easily correct the inspection data to the optimum value.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the overall structure of a mounted component inspection device. This mounted component inspection apparatus includes characteristic parameters of the inspection region of each component 2S on the reference substrate 1S obtained by imaging the reference substrate 1S having a good mounting quality, and the substrate to be inspected 1
X is for inspecting the mounting quality of each component 2T by comparing with the characteristic parameters of the inspection region of each component 2T on the inspected substrate 1T obtained by imaging T.
The axis table unit 3, the Y-axis table unit 4, the light projecting unit 5, the image pickup unit 6, the control processing unit 7, and the like are included in the configuration.

The X-axis table section 3 and the Y-axis table section 4 each include a motor (not shown) that operates based on a control signal from the control processing section 7. The X-axis table section is driven by these motors. The unit 3 moves the imaging unit 6 in the X-axis direction, and the Y-axis table unit 4 moves the substrates 1S, 1T.
The conveyor 8 supporting the is moved in the Y-axis direction.

The light projecting unit 5 has three annular light sources 9, 10, 11 which have different diameters and which simultaneously emit red light, green light, and blue light based on a control signal from the control processing unit 7. The light sources 9, 10 and 11 are arranged so as to be centered right above the observation position and in directions corresponding to different elevation angles when viewed from the observation position.

The image pickup section 6 is a color television camera, and is positioned downward above the observation position. As a result, the reflected light on the surface of the substrate 1S, 1T to be observed is imaged by the imaging unit 6, converted into color signals R, G, B of the three primary colors and supplied to the control processing unit 7.

The control processor 7 includes an A / D converter 12,
Memory 13, teaching table 14, image processing unit 1
5, the judgment unit 16, the XY table controller 17, the image pickup controller 18, the control unit 19, the display unit 20, the printer 21, the keyboard 22, the floppy disk device 23, etc., the reference board 1S in the teaching mode. Process the color signals R, G, B of each of the components, and inspect the inspection area of each component 2S that is in a good mounting state.
Each hue pattern of blue is detected, characteristic parameters are generated, and a judgment data file is created.

In the inspection mode, the control processing unit 7 processes the color signals R, G, B of the substrate 1T to be inspected, and red, green, and blue are inspected for the inspection area of each component 2T on the substrate 1T to be inspected. Each hue pattern is detected, characteristic parameters are generated, and an inspection data file is created. Then, the inspection data file is compared with the determination data file, and the mounting quality of each component 2T on the inspection substrate 1T is automatically determined from the comparison result.

FIG. 2 is a cross-sectional view of the solder 25 when soldering is good, when parts are missing, when there is insufficient solder, and in each case the imaging pattern by the imaging unit 6 and the red pattern. The relationship between the green pattern and the blue pattern is shown in a list, and a clear difference appears between any of the hue patterns. Therefore, it is possible to determine the presence or absence of a component and the quality of soldering.

Returning to FIG. 1, the A / D conversion section 12 converts the color signals R, G, B from the image pickup section 6 into digital signals and outputs them to the control section 19. Memory 13 is RA
It is provided with M etc. and is used as a work area of the control unit 19. The image processing unit 15 performs image processing on the image data supplied via the control unit 19 to create the inspection data file and the judgment data file, and supplies these to the control unit 19 and the judgment unit 16.

The teaching table 14 stores the judgment data file when it is supplied from the control unit 19 at the time of teaching, and when the control unit 19 outputs a transfer request at the time of inspection, the judgment data file is stored according to this request. It is read and supplied to the control unit 19, the determination unit 16, and the like.

The determination section 16 compares the determination data file supplied from the control section 19 at the time of inspection with the inspected data file transferred from the image processing section 15 for each component 2T of the inspected substrate 1T. The mounting quality is determined and the determination result is output to the control unit 19.

The image pickup controller 18 is provided with an interface for connecting the control unit 19 to the light projecting unit 5 and the image pickup unit 6, and adjusts the light amount of each of the light sources 9 to 11 of the light projecting unit 5 based on the output of the control unit 19. Control is performed or the mutual balance of the light output of each hue of the image pickup unit 6 is maintained.

The XY table controller 17 is the controller 1
9 is provided with an interface for connecting the X-axis table unit 3 and the Y-axis table unit 4, and the drive of the X-axis table unit 3 and the Y-axis table unit 4 is controlled based on the output of the control unit 19.

The display unit 20 receives image data, inspection results, key input data, etc. from the control unit 19,
This is displayed on the display screen, and when the inspection result and the like are supplied from the control unit 19, the printer 21 prints this out in a predetermined format.

The keyboard 22 is used for operating information and the reference board 1.
Various keys necessary for inputting S and data relating to the inspected substrate 1T are provided, and the key input data is supplied to the control unit 19. The control unit 19 includes a microprocessor and the like, and sequentially controls the operation of the mounted component inspection device in teaching and board inspection according to a control procedure described later.

FIG. 3 shows a teaching control procedure by the control processing unit 7. First, in step 1 of the figure, the operator operates the keyboard 22 to register the name of the board to be taught, and after key-inputting the board size, in step 2, the mounting quality of each component is good. The reference board 1S is set on the Y-axis table portion 4 and the start key is pressed.

Then, in step 3, the origin of the reference board 1S and the upper right and lower left corners are imaged by the image pickup section 6, and the actual size of the reference board 1S is input according to the position of each point. X-axis table section 3 based on input data
The Y-axis table unit 4 is controlled to position the reference substrate 1S at the initial position.

The reference board 1S has a good mounting quality in which the predetermined component 2S is properly mounted at the component mounting position. When the reference board 1S is positioned at the initial position, the next step is performed. 4, the image pickup unit 6 is the reference substrate 1S.
The upper area is imaged to teach the mounting position of the first component 2S, and in the following step 5, as the inspection data for the component 2S, the type and orientation of the component, the size and shape of the component or land, and the shape of the window. And size, thresholds of brightness and chromaticity for image pattern extraction, and judgment reference values of characteristic parameters.

When the same procedure is repeatedly executed for all the components on the reference board 1S, the determination in step 6 becomes "YES" and the process proceeds to step 7, and step 4,
The teaching data created in 5 is stored in the teaching table 14 as a determination data file.

FIG. 4 shows a procedure for correction teaching.
This correction teaching is for actually testing and inspecting a board of which mounting quality is known by a taught mounting component inspection device, and correcting the taught inspection data to an optimum one.

First, in step 1, the name of the board to be modified and teaching is input, and in the next step 2, the test board is carried onto the Y-axis table portion 4 and positioned. When the inspection command is input, the control processing unit 7 then causes the imaging unit 6 to operate.
Used to determine the mounting quality after capturing the color image of the first part on the test board and extracting the image pattern of the first inspection target area using the taught inspection data. The numerical values of the respective characteristic parameters are automatically calculated (steps 3 and 4).

FIG. 5 shows an example of the inspection logic for determining the quality of the soldering state of the soldered portion. In steps 1 to 6 of FIG. 5, the electrode width, the electrode continuous length, the fillet width, and the fillet are shown. The numerical values of the respective characteristic parameters such as the continuous length, the distance between the fillet and the electrode, and the ratio of each hue region of the fillet are compared with individual threshold values. If the judgment is "YES", the normal judgment is made, and if either is smaller than the threshold value, the corresponding step becomes "NO" and the abnormality judgment is made.

Returning to FIG. 4, in the next step 5, the control processing unit 7 displays the calculated numerical values of the respective characteristic parameters together with the judgment reference value (each threshold value in the example of FIG. 5) which has been taught. To display. FIG. 6 shows an example of this display, in which calculated values, threshold values, and average values are displayed for each characteristic parameter. The average value here is the average value of each characteristic parameter for the same component type of the reference board 1S used in the teaching.

Since the operator knows whether the mounting quality of the test board is good or bad, by comparing the calculated value of each characteristic parameter with the individual threshold value during the display, which characteristic parameter is used to determine whether the product is a good product or a defective product. It is possible to know whether an erroneous determination has been made. Further, since the operator can know the distribution of the numerical values of the characteristic parameters from the display value of the average value, he can know where to set the determination reference value (threshold value).

Thus, looking at this display, the operator judges whether or not it is necessary to correct the inspection data. If the correction is necessary, the operator proceeds from step 6 to step 7 in FIG. 4 to correct the inspection data. If no correction is necessary, the process proceeds from step 6 to step 8. When the correction is made in step 7, the numerical values of the characteristic parameters are calculated based on the inspection data after the correction and the calculation results are displayed (steps 4 and 5). Go to 8.

When the correction judgment and correction have been made for all the inspection target areas, step 8 becomes "YES", and in the next step 9, it is checked whether or not the correction procedure is completed for all the parts on the board. It If this determination is “NO”, the process proceeds to step 10 and the control processing unit 7
Moves the image pickup unit 6 to the next component position and executes the same procedure.

When the above correction work is performed for all the components on the test board, step 9 becomes "YES" and the test board is unloaded at step 11. It should be noted that this correction teaching is preferably performed a plurality of times using a non-defective substrate having good mounting quality and a defective product having poor mounting quality.

FIG. 7 shows a control procedure of automatic inspection by the control processing unit 7. In Steps 1 and 2 of the figure, the name of the board to be inspected is selected and a board inspection start operation is performed. In the next Step 3, the supply of the board 1T to be inspected to the mounted component inspection apparatus is checked. If the determination is "YES", the conveyor 8 is activated, the substrate 1T to be inspected is carried into the Y-axis table portion 4, and automatic inspection is started (steps 4 and 5).

In step 5, the control section 19 controls the X-axis table section 3 and the Y-axis table section 4 to position the field of view of the image pickup section 6 with respect to the first component 2T on the inspected substrate 1T and pick up an image. Then, the numerical value of each characteristic parameter is calculated from the image pattern in the inspection target area to create the inspection data file. Then, the control unit 19 compares the inspection data file with the determination data file,
The mounting quality of the first component 2T is determined.

Such an inspection is repeatedly executed for all the components 2T on the inspected substrate 1T. As a result, if there is a defect in the mounting state, the determination in step 6 becomes "YES", and the defective component and the content of the defect are determined. Is displayed on the display unit 20 or printed on the printer 21, the inspected substrate 1T is carried out from the Y-axis table unit 4 (steps 7 and 8).
Thus, when the same inspection procedure is executed for all the inspected substrates 1T, the determination in step 9 becomes "YES", and the inspection is completed.

[0042]

As described above, according to the present invention, the numerical value of the characteristic parameter used for determining the mounting quality of the mounted component is calculated and output by the mounted component inspection device for the substrate whose mounting quality is known. By comparing the calculated value with the judgment reference value for judging the quality of the mounting quality, the operator can correctly judge whether the taught inspection data is optimum or not, and easily correct the inspection data to the optimum value. It has a remarkable effect that it can be done.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of a mounted component inspection device.

FIG. 2 is an explanatory diagram showing the relationship between the quality of the soldered state and the pattern.

FIG. 3 is a flowchart showing a procedure of teaching.

FIG. 4 is a flowchart showing a procedure of correction teaching for color parameters.

FIG. 5 is an explanatory diagram showing an inspection logic for determining whether the soldering state is good or bad.

FIG. 6 is an explanatory diagram showing a display example of a display unit.

FIG. 7 is a flowchart showing an inspection procedure.

[Explanation of symbols]

 1S Reference board 7 Control processing unit 14 Teaching table 15 Image processing unit 16 Judgment unit 19 Control unit 20 Display unit

Claims (1)

[Claims] 1. A teaching procedure for teaching a mounting component inspecting apparatus the inspection data necessary for automatically inspecting the mounting quality of each mounting component on a substrate to be inspected, and the inspection data taught by this teaching procedure. A method of teaching mounted component inspection data comprising a correction procedure for modifying, wherein the modifying procedure introduces a substrate of known quality of mounting into a taught mounting component inspection device to perform the mounting component inspection. A procedure of imaging by the device, and a numerical value of the characteristic parameter used by the mounted component inspection device to determine the mounting quality of the mounted component are calculated by the mounted component inspection device from the image of the board using the inspection data. And a procedure for correcting the inspection data by comparing the calculated value of the characteristic parameter with a determination reference value for determining the quality of mounting quality. The method of teaching mounted component inspection data, wherein Rukoto.