JPH06252192A - Device for forming resin-encapsulated package - Google Patents

Abstract

PURPOSE:To prevent interference of a male mold and a female mold with a work and its transferring device by constituting the male mold and the female mold to shift relatively in a direction that crosses the die clamping direction. CONSTITUTION:At the time of supplying a female mold 32 with a lead frame 1 as a work and at the time of taking out the lead frame 1A after resin- encapsulated package formation, a male mold 31 or the female mold 32 is permitted to shift in a direction that is vertical to the die clamping direction from the die clamping position. Thus, interference of the male mold 31 and the female mold 32 with the works 1 and 1A and the transferring device can be prevented. Therefore, the male mold 31 and the female mold 32 are not necessarily separated largely in the vertical direction and the height of the whole transfer molding device can be designed low. Thus, the structures of the transfer device and the peripheral devices can be constituted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding device for a resin-sealed package, and more particularly to a technique for supplying a multiple lead frame as a work to a molding die.

[0002]

2. Description of the Related Art In general, when a pellet and a resin-sealed package for resin-sealing a part of each lead are molded on a lead frame electrically connected to a lead group, The resin-sealed package is molded by a transfer molding device.

Conventionally, a transfer molding apparatus for molding a resin-sealed package of a semiconductor device includes a pair of an upper mold and a lower mold in which a cavity is formed on a mating surface of each other and the mold is clamped by a cylinder device. It is provided with the lead frame on the mating surface of the upper mold and the lower mold in a state where the pellets are aligned and sandwiched in the cavity, and by filling the cavity with a resin material as a molding material, The resin-sealed package is configured to be molded on the lead frame.

In the case of the conventional transfer molding apparatus of this type, the lead frame as a work is constructed so that it is supplied onto the lower mold in a state where the upper mold and the lower mold are vertically separated from each other. Has been done.

As an example in which the transfer molding technique is described, "Electronic Materials 198" issued by Kogyo Kenkyukai Co., Ltd.
"November 3 issue, separate volume" issued November 15, 1983 P1
51 to P157.

[0006]

However, in the conventional transfer molding apparatus, the lead frame as a work is supplied onto the lower mold in a state where the upper mold and the lower mold are vertically separated from each other. The present inventor has clarified the following problems due to the above configuration.

(1) When the lead frame as a work is supplied to the lower mold and when the resin-sealed package-molded lead frame as the worked work is taken out from the lower mold, the upper mold and the lower mold are separated. Therefore, the height of the transfer molding apparatus as a whole increases.

(2) When automating the work of supplying the lead frame to the lower die and the operation of taking out the lead frame from the lower die, the lead frame carrier moves forward and backward in the space between the upper die and the lower die. Therefore, the structure of the transporting device and its peripheral devices is complicated and high-grade.

(3) Since the work of exchanging the upper mold and the lower mold accompanying the change of the product type is a work inside the transfer molding apparatus, the work efficiency becomes low.

An object of the present invention is to provide a molding apparatus for a resin-sealed package, which does not require the upper mold and the lower mold to be largely moved vertically apart from each other and can realize the automation of the molding work of the resin-sealed package. To provide.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0012]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a resin-sealed package for molding a resin-sealed package for resin-sealing the pellet and a part of each lead on a lead frame on which the pellet is mounted and electrically connected to the lead group. A molding apparatus, comprising: a pair of upper and lower molds having cavities formed on their mating surfaces and being clamped together by a cylinder device, wherein the leads are provided on the mating surfaces of the upper and lower molds. In a molding apparatus for a resin-sealed package, the resin-sealed package is molded into a lead frame by filling the cavity with a molding material in a state where the pellet is aligned and sandwiched in the cavity. The upper mold and the lower mold are configured to be relatively moved in a direction intersecting with the mold clamping direction.

[0014]

According to the above-mentioned means, when the lead frame as the work is supplied to the lower mold, and when the resin-sealed package-molded lead frame as the worked work is taken out from the lower mold, Since the upper mold or the lower mold can be moved from the clamping position in the direction perpendicular to the mold clamping direction, it is possible to avoid the interference between the work or its conveying device and the upper mold or the lower mold.

Therefore, it is not necessary to largely separate the upper mold and the lower mold in the vertical direction, so that the height of the transfer molding apparatus as a whole can be designed to be low. Also,
When the operation of supplying the lead frame to the lower die and the operation of removing the lead frame from the lower die are automated, the lead frame transporting device is configured to be able to move back and forth into the space between the upper die and the lower die. Since it is not necessary, the structure of the transfer device and its peripheral devices can be easily configured. Furthermore, since the work of exchanging the upper mold and the lower mold due to the change in the product type is a work outside the transfer molding device,
Work efficiency can be improved.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view showing an apparatus for molding a resin-sealed package according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a front view thereof, and FIG. FIG. 5 is a partially omitted side view of the same as seen from FIG. Figure 6
Is a partially omitted plan view showing the molding die, and FIG. 7 is a partially omitted side sectional view thereof. 8A and 8B are a partially omitted plan view and a front cross-sectional view showing a work. FIG. 9 is a perspective view showing the work storage rack.

In this embodiment, the molding apparatus for a resin-sealed package according to the present invention is configured to mold a plurality of resin-sealed packages 14 on the multiple lead frame 1. A multiple lead frame (hereinafter, also referred to as a work) 1 which is a work of the molding apparatus 10 for the resin-sealed package is formed by arranging a plurality of unit lead frames 2 in a row and continuously connecting them in series. There is.

Each unit lead frame 2 has a pair of outer frames 3 arranged in parallel with each other, a plurality of section frames 4 installed in parallel between the outer frames 3 and 3, and outer frames 3 and 3. And a tab 6 arranged in the center of the frame formed by the pair of section frames 4 and 4 and suspended by a tab suspension lead 5.
A dam member 7 arranged in parallel with the outer frames 3 and 3 and the section frames 4 and 4, respectively, a plurality of outer leads 8 protruding at right angles to the outside of the dam member 7, and a dam member 7 And an inner lead 9 that projects at a right angle from the inside.

A pellet 12 in which an integrated circuit (not shown) is formed is bonded on the tab 6 in each unit lead frame 2 by a bonding layer 11, and the bonding pad of this pellet 12 and each inner lead. Bonding wires 13 are bridged between the respective wires 9. Therefore, the integrated circuit formed in the pellet 12 is electrically drawn to the outside by the bonding wire 13, the inner lead 9 and the outer lead 8.

In the present embodiment, a plurality of the works 1 thus constructed are housed in a rack 20 which is an example of a carrier jig and supplied to the molding apparatus 10 for a resin-sealed package according to the present embodiment. To be done.

The rack 20 is provided with a main body 21 having a rectangular parallelepiped box shape having a similar planar shape to the planar shape of the work 1. A pair of openings 22A and 22B are formed in both side walls (hereinafter, referred to as front and rear walls) on the short sides of the main body 21. In addition, long grooves 23 are arranged on the inner surfaces of both long side walls (hereinafter, referred to as left and right walls) of the main body 21 in a plurality of steps at equal intervals in the vertical direction, and the longitudinal direction (hereinafter, referred to as the front-back direction). .) Are respectively buried so as to extend.

The work 1 is supported by the long grooves 23, 23 with the end sides of the outer frames 3, 3 respectively inserted in the pair of long grooves 23, 23 facing each other on the inner surfaces of the left and right walls. Therefore, it is stored in the rack 20. Further, when the work 1 is pushed from one opening 22A, it slides in the long groove 23 and is pushed out from the other opening 22B, and is discharged from the rack 20 one by one.

In this embodiment, the molding apparatus 10 for a resin-sealed package according to the present invention is provided with a machine base 25, and a multi-pot type transfer molding die 30 is provided at the center of the machine base 25 as described later. Is equipped with. This transfer molding die 30 is configured as follows.

The transfer molding die 30 according to this embodiment.
Includes a pair of upper mold 31 and lower mold 32 that are clamped to each other by a mold clamping device described later. A plurality of sets of upper mold cavity concave portions 33a and lower mold cavity concave portions 33b are formed on the mating surface of the upper mold 31 and the lower mold 32, and a pair of them cooperate with each other to form one cavity 33. It is buried in.

When the resin-sealed package is transfer-molded by using the work 1 having the above structure, each cavity 33 in the upper die 31 and the lower die 32 is a unit lead of the multiple lead frame 1 which is a work. The frames 2 are arranged so as to correspond to the spaces between the pair of dam members 7, 7.

A plurality of pots 34 are provided on the mating surface of the upper mold 31 so as to respectively correspond to the two cavities 33, 33, and a cylinder device (not shown) is provided in each pot 34. ) Moved back and forth by plunger 3
5 squeeze a tablet 40 (described later) as a molding material, and are inserted so that a liquid resin (hereinafter, referred to as a resin) obtained by melting the tablet can be fed.

On the mating surface of the lower mold 32, a plurality of culls 36 are arranged at positions facing the pots 34 and are recessed, and two runners 37 are connected to each cull 36, respectively. It is arranged radially and is respectively buried. The other end of each runner 37 is connected to each of the two lower cavity recesses 33b.
A gate 38 is formed at a connecting portion between the cavity and the cavity recess 33b so that the resin can be injected into the cavity 33.

Here, as shown in FIG. 6, two runners 37, 37 connected to one cull 36 are provided.
Are arranged so as to be rotationally symmetric with respect to the cull 36 in order to make the conditions for pumping the resin into the pair of cavities 33, 33 equal to each other.

Further, the relief recess 3 is formed on the mating surface of the lower mold 32.
In order that the lead frame 9 can escape the thickness of the lead frame, it is a rectangle slightly larger than the outer shape of the multiple lead frame 1, and is recessed at a constant depth of a dimension substantially equal to the thickness.

Although not shown, an upper heat block and a lower heat block are provided outside the upper mold 31 and the lower mold 32, and an electric heater is provided in the upper and lower heat blocks, respectively. In the pot,
It is laid to heat the tablets and resin in the cals, runners and cavities. By this heating, the tablets are melted, and the resin formed by melting the tablets is reduced to a predetermined viscosity.

In the transfer molding method in which the transfer molding die 30 is used, a tablet 40 made of epoxy resin or the like (hereinafter referred to as resin) as a molding material is used. The tablet 40 is formed by impregnating a powdered resin into a cylindrical shape. The tablet 40 is formed to have an outer diameter slightly smaller than the inner diameter of the pot 34 of the transfer molding die 30 and is charged into the pot 34 and heated and melted. It is configured to be.

On the other hand, a mold clamping device 41 is provided at the center of the machine base 25 of the transfer molding device 10. The mold clamping device 41 clamps the upper mold 31 and the lower mold 32. Has become. The mold clamping device 41 includes a stand 42, and the stand 42 is erected vertically at the center of the machine base 25. An upper die mounting plate 43 is horizontally arranged and fixed to the stand 42, and the upper die 31 having the above-described structure is disposed on the lower surface of the mounting plate 43 so that the cavity recess 33a faces downward. , Is designed to be replaceable.

The stand 42 includes a plunger drive device 44.
Is equipped. Although detailed description is omitted, the plunger driving device 44 includes a plunger mounting plate 45 to which a plurality of plungers 35 are mounted and which is movably supported in the vertical direction, and a plunger mounting plate 45 which is disposed in the vertical direction. To the feed screw device 46, a load cell 47 interposed between the feed screw device 46 and the plunger mounting plate 45 for detecting the output of the molding material, and the screw shaft of the feed screw device 46 is rotationally driven. And a servo motor 48 with a transmission device.

Then, the feed screw device 46 is rotationally driven by the servo motor 48, the plunger mounting plate 45 is lowered by the rotation of the feed screw device 46, and each plunger 35 is press-fitted into each pot 34.
A resin as a molding material is sent from the pot 34 to the runner 37. At this time, load cell 4
By measuring the load acting on the plunger mounting plate 45 by 7, the output of the resin as the molding material is detected.

A guide rail 49 is provided below the stand 42.
Are laid so as to extend in the vertical direction by being arranged in a pair on the left and right, respectively, and between the guide rails 49, 49, a lower die mounting plate 50 is horizontally disposed so as to project forward and is vertically movable. Are straddled. A vertical movement device 51 composed of a torque mechanism or the like is installed directly below the mounting plate 50. The vertical movement device 51 includes a servomotor 52 with a transmission device.
Is driven by. That is, the vertical movement device 51 is configured to convert the rotational movement of the servo motor 52 into a linear movement in the vertical direction to move the lower die mounting plate 50 up and down.

A pair of guide rails 53 are laid on the lower die mounting plate 50 so as to be horizontally arranged and extend horizontally in the front-rear direction. The lower die 32 is placed between the guide rails 53, 53 in the front-rear direction. It is slidable in the direction. That is, the lower mold 32 is slidable in the front-back direction on the mounting plate 50.
And it is attached so that it can be replaced.

A lower die front-back AC servomotor 54 is installed horizontally forward at the rear position of the lower die mounting plate 50. The servomotor 54 slides to the front position of the lower die mounting plate 50. The lower die 32 is detachably connected to a freely arranged lower die 32 so that the lower die 32 can be moved back and forth.

On the other hand, a work loading device 60 is installed at the front position of the left end on the machine base 25. The loading device 60 is provided with an elevator 61, and the elevator 61 is configured to be capable of pitch-feeding in the vertical direction in a state where the two racks 20, 20 are arranged and supported in two upper and lower stages.

On the right side of the elevator 61, a waiting station 62 is installed at a height facing the work 1 housed in the lowermost rack of the lower rack 20 or the uppermost rack of the upper rack. There is. Further, the lower die 31 which has come to the standby position on the lower die mounting plate 50 is positioned on an extension line to the right of the waiting station 62.

Further, the loading device 60 is provided with a feed screw device 63, and the feed screw device 63 is laid in the left-right direction at the front end portion of the machine base 25. A moving table 64 is laid across the feed screw device 63, and the moving table 64 is fed and operated in the left-right direction by the feed screw device 63.

An arm 65 is fixed to the rear end of the moving table 64 so as to project rearward, and a work holding device 66 is supported at the rear end of the arm 65. The work holding device 66 is composed of a vacuum suction head or the like, pulls out the work 1 in the rack 20 onto the standby station 62, and lowers the work 1 in the standby station 62 from the lower mold 3.
It is designed to be reprinted on page 1.

On the other hand, an unloading device 70 is installed at the front position of the right end on the machine base 25. An unloading device stock section 71 is provided, and the stock section 71 is adapted to place a rack for storing the formed work (hereinafter referred to as an empty rack) 26. The empty rack 26 is formed in a rectangular quadrangular cylinder shape whose plane shape is slightly larger than the work, and has an upper surface opened so that the work can be dropped. The lower mold 31 that has come to the standby position on the lower mold mounting plate 50 is located on the leftward extension line of the empty rack 26 in the stock portion 61.

Further, the unloading device 70 is provided with a feed screw device 73, and the feed screw device 73 is a machine base 25.
Is laid in the left-right direction at the front end of the. A moving base 74 is laid across the feed screw device 73, and the moving base 74 is fed and operated in the left-right direction by the feed screw device 73.

An arm 75 is fixed to the rear end of the moving table 74 so as to project rearward, and a work holding device 76 is supported at the rear end of the arm 75. The work holding device 76 is composed of a vacuum suction head or the like, and holds the work 1 on the lower die 32 by vacuum suction and transfers it to the empty rack 26 of the stock section 61.

A tablet supply device 80 is installed at the rear side position of the right end on the machine base 25. The tablet supply device 80 includes a channel-shaped steel-shaped guide frame 81, and the guide frame 81 is laid on the machine base 25 so as to extend long in the left-right direction with the recess facing upward. A movable table 82 is placed on the guide frame 81 so as to be slidable in the front-rear direction.
It is designed to be moved in the front-back direction by 3.

A tablet magazine 84 is mounted on the moving table 82.
Are placed so that they can be exchanged. Although not shown, a large number of tablets 40 are vertically and horizontally arranged in the tablet magazine 84 and stored in a stacked state. Tablet 40 stored in magazine 84
Is a push-up device (not shown) installed on the moving table 82.
It is pushed up in one row by and is delivered to the tablet carrying jig described later.

On the rear side of the guide frame 81, a stand 85 is arranged upright so as to extend in the left-right direction, and a tablet carrying jig 86 is slidable in the left-right direction on the front end side of the stand 85. Supported by. Further, at the right end of the stand 85, a pusher 87 using a feed screw device, an air cylinder device, etc. is installed.
7 is configured so that the tablet carrying jig 86 can be moved in the left-right direction.

The tablet conveying jig 86 chucks and holds the tablet 40 extruded from the tablet magazine 83, and then conveys the tablet 40 to the forming die 30 by the movement of the pusher 87, and further conveys the conveyed tablet 40 to the forming die 30. It is configured so that it can be put into the pot 34. That is, an entrance / exit 88 is provided on a side wall of the stand 42 of the mold clamping device 41 on an extension line of the tablet carrying jig 86, and the tablet carrying jig 86 is inserted into the entrance / exit 88 to allow each pot of the molding die 30 to be inserted. Each tablet 40 corresponds to 34.

On the other hand, an upper die air cleaner moving device 91 is installed at the left end portion on the machine base 25 so as to extend in the left and right directions. The moving device 91 moves the upper die air cleaner 92 in the left and right directions. It is configured to allow. The air cleaner 92 is configured to perform cleaning by evacuating. That is, the air cleaner 92 for the upper die is sent to the position right below the upper die 31 of the molding die 30 by the moving device 91, and the lower surface of the upper die 31 is vacuum-sucked to remove the residue of the upper die 31 and the release agent. It is supposed to do.

A lower mold air cleaner moving device 93 is laid on the front side of the upper mold air cleaner moving device 91. The moving device 93 is configured to move the lower mold air cleaner 94 in the left-right direction. There is. The lower die air cleaner 94 is moved by the moving device 93.
The upper surface of the lower mold 32 is vacuum suctioned to be cleaned immediately above.

Next, the operation will be described. Loading device 6
At 0, the work 1 stored in the rack 20 is addressed to one sheet, and the work holding device 66 holds the right end of the work 1 and pulls it out onto the waiting station 62. Standby station 6
The work 1 drawn out onto the work 2 is re-held by the work holding device 66 and transferred onto the lower die 32 waiting at the front position of the die clamping device 41.

The lower mold 3 is loaded by the loading device 60.
When a predetermined number (two in the illustrated example) of works 1 are supplied onto the lower die 2, the lower die 32 moves the lower die front-back AC servo motor 54.
Is moved rearward along the guide rail 53 of the lower die mounting plate 50. By this movement, the lower mold 32 moves the upper mold 3
It will be in a state of facing directly under 1.

Subsequently, the vertical movement device 51 is driven by the servomotor 52 with a transmission device, and the lower die mounting plate 50 is raised along the guide rail 49. This lower mold mounting plate 50
As the lower mold 32 is lifted by the rising of, the upper mold 31 and the lower mold 32 are clamped. By this mold clamping, each cavity 33 is formed between the mating surfaces of the upper mold 31 and the lower mold 32.

In this clamped state, two work pieces 1
Is in a state of being sandwiched between the upper die 31 and the lower die 32, and is in a state of being accommodated in each cavity 33 in each pellet of both works 1.

Next, the tablet carrying jig 86 is inserted into the entrance / exit 88 by the pusher 87, and the jig 86 is inserted.
The tablet 40 held by the
Are thrown into each. After loading, tablet transportation jig 8
6 is retracted to the standby position, and the new tablet 40 is held at the standby position.

On the other hand, after the tablet 40 is loaded, the upper die 31
The lower die 32 is heated by the heater, and the tablet 40 is heated and melted by a resin (not shown) which is a liquid molding material. At the same time, each plunger 35 is inserted into each pot 34 by the plunger drive device 44. As the plunger 35 is inserted, the resin is
To the runner 37, and the cavities 33 are filled from the gate 38.

After the resin is filled in the cavities 33 and the resin is cured by a thermal crosslinking reaction, the resin sealing packages 14 are molded by the cavities 33.

After a predetermined time elapses after the plunger 35 starts descending, the plunger 35 is withdrawn from the pot 34.

Then, the vertical motor 51 is driven by the servomotor 52 with a transmission, and the lower die mounting plate 50 is lowered. The lower die 32 is lowered by the lowering of the lower die mounting plate 50, so that the upper die 31 and the lower die 32 are opened. Along with this mold opening, ejector pin (not shown)
Work that has been molded with a resin-sealed package (hereinafter,
It is called a shaped work. ) 1A is released from the upper mold 31 and the lower mold 32.

Next, the lower die 32 is moved forward along the guide rails 53 of the lower die mounting plate 50 by the front-back servomotor 54. By this movement, the lower mold 32 is located at the original front standby position which is separated from the position directly below the upper mold 31. A loading device 60 and an unloading device 70 are installed at the front standby position of the lower mold 32 so as to face each other.

When the lower die 32 is moved to the front standby position with the molded work 1A released, the work holding device 76 of the unloading device 70 holds the molded work 1A to form it. Completed work storage rack 26
Is transported to the position of and is stored in the rack 26.

When the lower mold 32 is moved from directly under the upper mold 31, the upper mold air cleaner 92 is fed directly under the upper mold, and the molding surface of the upper mold 31 is cleaned by the air cleaner 92. In addition, the work 1A that has been molded from the lower mold 32
Is unloaded, the lower mold air cleaner 94
Is fed right above the lower mold, and the air cleaner 94 cleans the molding surface of the lower mold 32.

Thereafter, by repeating the above operation, the resin-sealed package 14 is sequentially molded for each work 1.

According to the above embodiment, the following effects can be obtained. (1) By providing the lower die so as to move in the front-rear direction with respect to the upper die, when a lead frame as a work is supplied to the lower die, and a resin-sealed package is formed as a work after processing. When the lead frame is taken out from the lower mold, the lower mold can be moved from the mold clamping position in the direction perpendicular to the mold clamping direction, so that it is possible to avoid the interference between the work and its conveying device and the upper mold.

(2) According to the above (1), the upper mold and the lower mold do not have to be largely separated in the vertical direction, so that the height of the transfer molding apparatus as a whole can be designed low.

(3) When the operation of supplying the lead frame to the lower mold and the operation of taking out the lead frame from the lower mold are automated, the lead frame transport device advances and retracts into the space between the upper mold and the lower mold. Since it is not necessary to configure the transport device and its peripheral devices, the structure of the transport device and its peripheral devices can be easily configured.

(4) Further, since the work of exchanging the upper mold and the lower mold due to the change of the product type becomes the work outside the transfer molding apparatus, the work efficiency can be improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the lower die is not limited to be moved in the front-rear direction, but the lower die may be moved in the left-right direction or the diagonal direction. In short, the lower mold may be configured to be movable from the mold clamping position.

Further, although the lower mold side is moved in the above-mentioned embodiment, the upper mold side may be moved.

The lower die or upper die longitudinal movement device or vertical movement device is not limited to the structure of the above embodiment.

The work loading device and the work unloading device are not limited to those in the above-described embodiment, but it is desirable that they are optimally configured in accordance with the conditions such as the structure and arrangement of the molding die.

The work loading device, work unloading device, tablet feeding device, air cleaner and the like may be omitted.

In the above description, the case where the invention made by the present inventor is mainly applied to the multi-pot type transfer molding technique which is the field of application which is the background of the invention has been described, but the present invention is not limited to this. The present invention can be applied to general molding equipment for resin-sealed packages such as a general transfer molding die having a runner and a sub-runner.

[0075]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By configuring the upper die or the lower die so as to move in a direction intersecting with the die clamping direction, when the lead frame as a work is supplied to the lower die, and as a work after processing. When the molded lead frame of the resin-sealed package of is removed from the lower mold or the upper mold, the upper mold or the lower mold can be moved from the mold clamping position to a position away from the mold clamping position. It is possible to avoid interference between the device and the upper mold or the lower mold.

Therefore, the upper die and the lower die do not have to be largely separated from each other in the vertical direction, so that the height of the transfer molding apparatus as a whole can be designed to be low. Also,
When the operation of supplying the lead frame to the lower mold or the upper mold and the operation of taking out the lead frame from the lower mold or the upper mold are automated, the lead frame transport device moves back and forth in the space between the upper mold and the lower mold. Since it is not necessary to configure the transport device and its peripheral devices, the structure of the transport device and its peripheral devices can be easily configured. Further, since the work of exchanging the upper mold and the lower mold accompanying the change of the product type is a work outside the transfer molding apparatus, the work efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a molding apparatus for a resin-sealed package that is an embodiment of the present invention.

FIG. 2 is a partially omitted plan view thereof.

FIG. 3 is a partially omitted front view thereof.

FIG. 4 is a partially omitted perspective view showing a main part of the same as seen from a side surface.

FIG. 5 is a partially omitted side view thereof.

FIG. 6 is a partially omitted plan view showing the molding die.

FIG. 7 is a partially omitted side sectional view thereof.

8A and 8B are a partially omitted plan view and a front sectional view showing a work.

FIG. 9 is a perspective view showing a work storage rack.

[Explanation of symbols]

1 ... Work (multiple lead frame), 1A ... Molded work, 2 ... Unit lead frame, 3 ... Outer frame, 4 ... Section frame, 5 ... Tab suspension lead, 6 ... Tab, 7 ... Dam member, 8 ... Outer leads, 9 ... Inner leads, 10 ... Molding device for resin-sealed package, 11 ... Bonding layer, 1
2 ... Pellet, 13 ... Bonding wire, 14 ... Resin sealing package, 20 ... Rack, 21 ... Main body, 22A,
22B ... Opening, 23 ... Long groove, 25 ... Machine stand, 26 ... Molded work storage rack, 30 ... Transfer molding die, 3
DESCRIPTION OF SYMBOLS 1 ... Upper mold, 32 ... Lower mold, 33a ... Upper mold cavity recess, 33b ... Lower mold cavity recess, 34 ... Pot, 3
5 ... Plunger, 36 ... Cull, 37 ... Runner, 38 ... Gate, 39 ... Escape recess, 40 ... Tablet, 41 ... Mold clamping device, 42 ... Stand, 43 ... Upper mold mounting plate, 44 ... Plunger drive device, 45 ... Plunger mounting plate, 46 ... Feed screw device, 47 ... Load cell, 48 ... Servo motor with transmission, 49 ... Guide rail, 50 ... Lower mounting plate, 51
... Vertical movement device, 52 ... Servo motor with transmission device, 53 ...
Guide rail, 54 ... Lower mold front / rear servo motor, 60 ...
Work loading device, 61 ... Elevator, 62 ...
Standby station, 63 ... Feed screw device, 64 ... Moving base, 65 ... Arm, 66 ... Work holding device, 70 ... Work unloading device, 71 ... Stock section, 73 ...
Feed screw device, 74 ... Moving base, 75 ... Arm, 76 ... Work holding device, 80 ... Tablet supply device, 81 ... Guide frame, 82 ... Moving base, 83 ... Feed screw device, 84 ... Tablet magazine, 85 ... Stand, 86 ... Tablet conveying jig, 87 ... Pusher, 88 ... Doorway, 91 ... Upper mold air cleaner moving device, 92 ... Upper mold air cleaner, 9
3 ... Lower mold air cleaner moving device, 94 ... Lower mold air cleaner.

Front Page Continuation (72) Inventor Yasuhiro Koyama 5-20-1 Kamimizuhoncho, Kodaira-shi, Tokyo Inside the Semiconductor Business Division, Hitachi, Ltd. (72) Inventor Kazuaki Okamoto 2-6, Otemachi, Chiyoda-ku, Tokyo No. 2 in Nitrate Electronics Engineering Co., Ltd. (72) Inventor Shingo Ibe 2-6-2 Otemachi 2-chome, Chiyoda-ku, Tokyo

Claims (3)

[Claims] 1. A resin-sealed package for molding a resin-sealed package for resin-sealing a pellet and a part of each lead on a lead frame on which a pellet is mounted and electrically connected to a lead group. A molding apparatus, comprising: a pair of upper and lower molds, each having a cavity formed on a mating surface thereof and clamped together by a cylinder device, wherein the lead is provided on a mating surface between the upper mold and the lower mold. In a molding apparatus for a resin-sealed package, the resin-sealed package is molded into a lead frame by filling the cavity with a molding material in a state where the pellet is aligned and sandwiched in the cavity. The resin-sealed package, wherein the upper mold and the lower mold are configured to be relatively moved in a direction intersecting with the mold clamping direction. Molding apparatus of di. 2. A lead frame loading device is provided at a position facing a moving position of the upper mold or the lower mold from the mold clamping position, and the loading device is provided with the lead frame for the upper mold or the lower mold. The molding device for a resin-sealed package according to claim 1, wherein the molding device is configured to supply the resin-sealed package. 3. A lead frame unloading device is provided at a position facing the moving position of the upper mold or the lower mold from the mold clamping position, and the unloading device is formed with the resin-sealed package. The molding apparatus for a resin-sealed package according to claim 1, wherein the lead frame is discharged from the upper mold or the lower mold.