JPH06251843A - Aging method and aging base board - Google Patents

Abstract

PURPOSE:To enhance aging work efficiency of an LSI package, and prevent bending of a lead in aging work. CONSTITUTION:Sockets 3 each provided with an inside wiring 4 connected at one end thereof to a lead 5 of an LSI package 2 and at the other end thereof to a lead 5 of another LSI package 2 are laminated at multiple stages on an aging base board 1. The leads 5 of the LSI packages 2 disposed in the sockets 3 are aged while being held between the sockets 3 at the upper stage and the sockets 3 at the lower stage in a sandwiched manner.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique effectively applied to the aging of an LSI package which is performed in the inspection process of a semiconductor integrated circuit device.

[0002]

2. Description of the Related Art In a semiconductor integrated circuit device inspection process, an aging test is performed by mounting an LSI package on a dedicated socket of an aging board and connecting the aging board to a tester.

[0003]

In recent years, with the high integration of semiconductor integrated circuit devices, the external dimensions of LSI packages have become larger, and the number of LSI packages that can be mounted on one aging substrate is decreasing. There is a problem that the work efficiency of aging is gradually decreasing.

Further, since the width and pitch of the leads are becoming finer due to the increase in the number of pins of the LSI package accompanying the higher speed and higher functionality of the semiconductor integrated circuit device, when the LSI package is mounted in the dedicated socket of the aging board, Lead bending is likely to occur when the LSI package is taken out from the dedicated socket.

An object of the present invention is to provide a technique capable of improving the aging work efficiency of an LSI package.

Another object of the present invention is to provide a technique capable of preventing lead bending of an LSI package during aging work.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

According to the present invention, when a plurality of LSI packages are mounted on an aging board for aging, one end is LS.
Sockets with internal wiring connected to the leads of the I package and the other ends of which are connected to the leads of other LSI packages are stacked on the aging board in multiple stages, and the leads of the LSI packages mounted in the respective sockets are placed in the upper stage. The socket and the lower socket are sandwiched and held to perform aging.

[0010]

According to the above means, by laminating the sockets on which the LSI packages are mounted on the aging board in multiple stages, a larger number of LSI packages can be mounted on the aging board having the same size as the conventional one and the aging can be performed simultaneously. Therefore, the aging work efficiency of the LSI package can be improved.

According to the above-mentioned means, the leads of the LSI package mounted in the socket are sandwiched between the upper socket and the lower socket, and the aging is performed while holding the leads, so that the LSI package is placed in this socket. It is possible to prevent lead bending that occurs when mounting the IC chip or when taking out the LSI package from the socket.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partial cross-sectional view of a socket in which multiple layers are stacked on an aging board, which is an embodiment of the present invention, and FIG.
FIG. 3 is a partial perspective view of the aging board, and FIG. 3 is an overall side view of the aging board.

As shown in FIG. 2, on the main surface of the aging board 1, a plurality of sockets 3 each having an LSI package 2 mounted therein are stacked. In the figure, an example is shown in which the sockets 3 are stacked in four stages, but it is also possible to stack five stages or more.

The lowermost socket 3 is fixed on the aging board 1 via a pin or the like (not shown). Similarly,
The upper and lower sockets 3, 3 are fixed to each other via a pin or the like (not shown).

As shown in FIG. 1, each socket 3
, A plurality of internal signal wirings 4 penetrating the upper and lower surfaces thereof are provided along the outer peripheral portion thereof. This internal signal wiring 4
One end (lower end) of the LSI is attached to this socket 3
It comes into contact with the lead 5 of the package 2, and the other end (upper end) is
The LSI mounted in the upper socket 3 of this socket 3
The leads 5 of the package 2 are brought into contact with each other. Further, the leads 5 of the LSI package 2 are sandwiched and held between the lower surface of the upper socket 3 and the upper surface of the lower socket 3.

The leads 5 of the LSI package 2 mounted in the lowermost socket 3 are wired 5 on the aging board 1 via the internal signal wiring 4 of the socket 3 or directly.
Connected to. That is, the leads 5 of the LSI package 2 mounted in the respective sockets 3 on the aging board 1 are connected to each other through the internal signal wirings 4 of the respective sockets 3 and are connected to the wirings 5 on the aging board 1. .

According to the aging board 1 of the present embodiment configured as described above, it is possible to mount a larger number of LSI packages 2 on the aging board 1 having the same size as the conventional one and simultaneously perform the aging. Therefore, the LSI
The aging work efficiency of the package 2 can be improved.

Further, the leads 5 of the LSI package 2 mounted in the socket 3 are sandwiched between the lower surface of the upper socket and the upper surface of the lower socket 3 and held to perform aging, whereby the LSI is mounted on the socket 3. It is possible to prevent lead bending when mounting the package 2 or when taking out the LSI package 2 from the socket 3 after aging.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

[0020]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

According to the present invention, it is possible to mount a large number of LSI packages on an aging substrate and simultaneously perform aging, so that it is possible to improve the aging work efficiency of the LSI packages.

Further, according to the present invention, the leads of the LSI package are sandwiched between the upper socket and the lower socket and held to perform aging, thereby preventing lead bending in the aging process. it can.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view of a socket in which multiple layers are stacked on an aging board that is an embodiment of the present invention.

FIG. 2 is a partial perspective view of this aging board.

FIG. 3 is an overall side view of an aging board.

[Explanation of symbols]

 1 Aging board 2 LSI package 3 Socket 4 Internal signal wiring 5 Lead 6 Wiring

Claims (2)

[Claims] 1. A socket provided with internal wiring, one end of which is connected to a lead of an LSI package and the other end of which is connected to a lead of another LSI package when a plurality of LSI packages are mounted on an aging board for aging. Is laminated on the aging substrate in multiple stages, and the leads of the LSI package mounted in the respective sockets are sandwiched and held by the upper and lower sockets. 2. A lead of an LSI package attached to each socket, in which a socket having internal wiring, one end of which is connected to a lead of an LSI package and the other end of which is connected to a lead of another LSI package, is stacked. An aging board characterized by being configured so that it can be sandwiched between the upper socket and the lower socket.