JP2020063967A - Socket device for evaluation and measurement evaluation method of lsi - Google Patents

Abstract

To provide a socket device capable of being used in performing different measurement evaluations successively by laminating plural samples in a vertical direction.SOLUTION: A socket device performs measurement evaluation by placing an LSI 400 to be measured on a measurement object placement stand 102 provided in an internal space of cylindrical frame bodies 101. The device can laminate a desired number of frame bodies 101 in a vertical direction. Determination of a frame body for executing measurement evaluation by selecting the LSI 400 is controllable depending on with which frame body 101, and an edge contact piece 104 and a corresponding contact piece 131 of the measurement object placement stand 102 an edge opposing contact piece 251 and an outer opposing contact piece 252 in a lower tip part of an arm 222 are connected.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to an evaluation socket device and an LSI measurement / evaluation method using the evaluation socket device.

  Conventionally, when a sample LSI is evaluated, the sample is loaded into a socket mounted on a DUT (Device Under Test) board for evaluation, and measurement and evaluation are performed. In this case, one socket can be filled with only one sample, and it is necessary to remove and fill the next sample each time one sample is measured and evaluated, which is inefficient. It was

  Therefore, in order to perform efficient measurement and evaluation, it is necessary to prepare a plurality of DUT boards for evaluation, which causes a problem that a large amount of cost is required.

  On the other hand, Patent Document 1 includes two or more rubbers provided with electrical wiring, two or more guides provided with electrical wiring, and a socket frame for accommodating the rubber and the guide. There is disclosed a semiconductor package test socket in which the same number of rubbers and guides are alternately stacked so that one rubber is located at the bottom in the storage space of the socket frame.

  The semiconductor package test socket described in Patent Document 1 enables a test in a state in which a plurality of layers of single-layer chip semiconductor packages are stacked. Therefore, a test for the multi-chip semiconductor package can be performed without manufacturing the multi-chip semiconductor package. The result is obtained.

  Further, in Patent Document 2, an IC socket in which a plurality of measuring units for measuring the electrical characteristics of an IC to be tested are arranged in parallel, an IC carried in to each measuring unit, and an IC from each measuring unit There is disclosed an IC socket provided with a plurality of belt conveyor control devices that carry out a belt conveyor system and a tester main body that supplies a test signal to each of the measuring parts of the IC socket.

  According to the invention of Patent Document 2 described above, a large number of ICs can be simultaneously transported and inspected at the same time without increasing the mounting area of the IC socket on the inspection board.

  Further, Patent Document 3 discloses a semiconductor device in which a semiconductor chip is mounted on a TAB tape, in which electrically conductive test pads are provided on both surfaces of the TAB tape.

  When the semiconductor devices disclosed in Patent Document 3 are stacked in the vertical direction, the respective test pads are electrically connected to each other, and the efficient test can be collectively performed.

JP, 2008-20458, A JP, 2006-126063, A JP-A-5-82610

  In the evaluation socket device according to the above-mentioned conventional example, although a plurality of samples can be stacked vertically and the same measurement test can be efficiently performed at the same time, different measurement evaluations cannot be performed one after another. there were.

  This embodiment provides an evaluation socket device that can be used such that different measurement evaluations are performed one after another without taking up an area when measuring and evaluating a plurality of measurement target LSIs by stacking in the vertical direction. To do.

  The evaluation socket device according to the embodiment is provided with at least one in the inner space of the cylindrical frame body, and has an LSI connection contact piece that is connected to the terminal of the LSI when the LSI to be measured is placed, and A measuring object mounting table provided with an edge contact piece electrically connected to the LSI connecting contact piece and provided on an edge portion, and the edge portion of the measuring object mounting table provided on the frame body itself of the frame body. External including a corresponding contact piece corresponding to the contact piece through a gap, and an electrical connecting portion electrically connected to the corresponding contact piece and electrically connected to a measuring device provided connected to the frame body. It is possible to move a gap between the connection mechanism and the edge contact pieces of the plurality of measurement object mounting bases and the corresponding contact pieces, and between the edge contact pieces and the corresponding contact pieces in one measurement object mounting table. Equipped with electrical contact means for electrical contact Characterized by comprising a gap mobile.

It is a sectional view of the embodiment of the socket device concerning the present invention, and is a figure showing the state before performing measurement evaluation with respect to LSI provided in the uppermost socket of the laminated 3 steps of sockets. It is a sectional view of an embodiment of a socket device concerning the present invention, and is a figure showing the case where measurement and evaluation are performed to LSI provided in the uppermost socket of the laminated 3 steps of sockets. It is a sectional view of an embodiment of a socket device concerning the present invention, and is a figure showing the case where measurement and evaluation are performed to LSI provided in the socket of the 2nd step of the 3 steps of the laminated socket. It is a sectional view of an embodiment of a socket device concerning the present invention, and is a figure showing the case where measurement and evaluation are performed to LSI provided in the socket of the bottom of the laminated three steps of sockets. The top view of the socket which constitutes the embodiment of the socket device concerning the present invention. The bottom view of the socket which constitutes the embodiment of the socket device concerning the present invention. Sectional drawing of the socket which comprises embodiment of the socket apparatus which concerns on this invention. FIG. 3 is a plan view of an electric connecting means moving portion which constitutes an embodiment of the socket device according to the present invention. FIG. 4 is a bottom view of the electrical connecting means moving portion that constitutes the embodiment of the socket device according to the present invention. Sectional drawing of the electrical connection means moving part which comprises embodiment of the socket apparatus which concerns on this invention. FIG. 3 is a perspective view of an arm used for an electric connecting means moving unit that constitutes an embodiment of a socket device according to the present invention. Sectional drawing of the normal state in the principal part of the arm used for the electrical connection means moving part which comprises embodiment of the socket apparatus which concerns on this invention. Sectional drawing of the state which received the pressure in the principal part of the arm used for the electrical connection means moving part which comprises embodiment of the socket apparatus which concerns on this invention. It is sectional drawing in the principal part of the measuring object mounting base which comprises embodiment of the socket apparatus which concerns on this invention, (a) is sectional drawing of a normal state, (b) is sectional drawing of the state which received the pressure. Sectional drawing which shows the process from the electrical non-connection state to the electrical connection state by the principal part of the arm in the gap between the measuring object mounting base and frame which constitute the embodiment of the socket device which concerns on this invention. Sectional drawing which shows the process from the electrical connection state to the electrical non-connection state by the main part of the arm in the gap between the measuring object mounting base and the frame body which constitute the embodiment of the socket device according to the present invention.

  An embodiment of an evaluation socket device according to the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1A, the socket device for evaluation according to the present embodiment includes a socket part 100 and an electrical connecting means moving part 200, and the socket part is placed on a measuring device 300 placed on a table or the like (not shown). 100 is laminated, and further, the electrical connecting means moving portion 200 is laminated on the socket portion 100. In this embodiment, three sockets 100S are stacked.

  As shown in FIG. 2C, for example, the socket portion 100 includes a rectangular tubular frame body 101, and one measurement object mounting table 102 is horizontally provided in an inner space of the frame body 101. In the present embodiment, three sockets 100S are stacked, and one socket 102 for measurement is provided in each socket 100S. Therefore, it is also possible to make each frame body 101 into an integrated socket part 100, and in this case, at least one (three in the present embodiment) measurement object mounting bases are provided on the frame body 101. 102 is provided.

  As shown in FIG. 1A, which is a plan view when viewed from the top, the measurement object mounting table 102 has an LSI connection contact piece 103 that is connected to a terminal of the LSI 400 when the LSI 400 to be measured is mounted. In addition, an edge contact piece 104, which is a conductor electrically connected to the LSI connection contact piece 103 and provided at the edge, is provided.

  As shown in, for example, FIG. 1A, the measurement target mounting table 102 includes a plastic base 110 joined to the inner wall surface of the tubular frame 101, and the base 110 provided above the base 110. The contact plate 120 has an outer periphery inside the outer periphery. The LSI connection contact piece 103 can be formed as a bump at a position corresponding to a terminal of the LSI 400 on the upper surface of the contact plate 120 of the measurement target mounting table 102. The LSI connection contact piece 103 is arranged and provided at an appropriate position so that the LSI 400 to be measured is simply placed on the upper surface of the contact plate 120 in a predetermined direction to be connected to a required terminal of the LSI 400. ing. The edge contact piece 104 is also provided on the edge of the contact plate 120. As shown in FIG. 2A, a plurality of edge contact pieces 104 are provided at the ridges of the two opposite sides of the contact plate 120, which are necessary for the measurement test. Further, the measurement target mounting table 102 is provided with a fixture (not shown) for fixing the LSI 400 after it is mounted. The fixing tool is a band type in which the measurement target mounting base 102 and the LSI 400 are integrated and fixed around the upper surface, the side surface, the bottom surface, the side surface, and the upper surface for several revolutions. It can be realized by a suitable one such as a hook type provided at one or more places and engaged with each other.

  A corresponding contact piece 131 is provided inside the projecting portion 130 that slightly projects from the frame body 101 to the measurement target mounting table 102 on the frame body itself (column portion) of the frame body 101. A plurality of the corresponding contact pieces 131 are provided so as to be in a corresponding relationship with the plurality of edge contact pieces 104 of the measurement target mounting table 102 via the gap 112. The corresponding contact piece 131 is shown exposed inside the protrusion 130, but it is not visible from the outside of the protrusion 130, so it is shown by a broken line in FIGS. 2A and 2B, but it is indicated by X- in FIG. 2A. In FIG. 2C, which is an X sectional view, etc., a solid line is drawn.

  The void 112 is formed in the base portion 110 of the measurement target mounting table 102. The length of the long side of the gap 112 is set to be substantially equal to the length of one side of the contact plate 120. The contact plate 120 is formed so as to protrude into the void 112. The edge of the contact plate 120 can be seen in the void 112 as shown in FIG. 2B, which is a view of the socket 100S looking from the lower side to the upper side. There is. The long side of the void 112 on the side of the frame 101 extends to the entrance of the recess of the protrusion 130 that holds the corresponding contact piece 131 therein, in which the corresponding contact piece 131 is provided.

  A cross-sectional view of a portion of the contact plate 120 near the edge contact piece 104 is configured as shown in FIGS. 5 (a) and 5 (b). That is, in order to electrically connect the LSI connection contact piece 103 and the edge contact piece 104, the conductor 106 is provided so as to be connected to the LSI connection contact piece 103, and the edge contact piece 104 is straight in the lateral direction. A conductor 108 extending in the direction is connected and provided. The conductor 106 has a conductor 106A that is bent and extends toward the edge contact piece 104, and a contact piece 107 is provided at the tip thereof. A contact piece 108A is provided at the tip of the conductor. The contact piece 108A and the contact piece 107 are in contact with each other in a normal state and are in an electrically conductive state.

  The contact plate 120 has elasticity, and when the contact plate 120 is pressed in the lateral arrow F direction from the state shown in FIG. 5A by the plastic arm 222 as shown in FIG. Is moved in the direction. The conductor 106A also moves in the F direction, but the strain is greater on the side closer to the position where the pressing force is applied, and the contact piece 108A provided at the tip of the conductor 108 and the contact piece 107 provided at the tip of the conductor 106A are different from each other. The LSI connecting contact piece 103 and the edge contact piece 104 are not electrically connected to each other.

  When the pressing force in the direction of the arrow F in the lateral direction disappears from the above state, the state returns from the state of FIG. 5B to the state shown in FIG. 5A, and the contact piece provided at the tip of the conductor 108. 108A contacts the contact piece 107 provided at the tip of the conductor 106A, and the LSI connection contact piece 103 and the edge contact piece 104 are in a conductive state.

  Here, the contact plate 120 has elasticity and the arm 222 is plastic, but this relationship may be reversed. Therefore, the elastic portion provided on at least one of the edge contact piece 104 and the edge opposed contact piece 251 is an electrical structure formed by the edge opposed contact piece 251, the external opposed contact piece 252, and the conductor 255, which will be described later. It may be made of a material that is compressed and contracted when the connecting means is moved.

  The frame itself of the frame 101 (inside the pillar portion) is connected to each of the corresponding contact pieces 131, and an electrical connection is obtained with the terminals of the LSI 400 and the measuring device 300 provided in contact with the frame 101. The electrical connection unit 109 is provided. At a position on the upper surface of the measuring device 300 corresponding to the electrical connection portion 109, a terminal (not shown) connected to a required circuit or the like of the measuring device 300 is provided. Further, the electrical connection portion 109 is configured by two conductors 109A extending in the vertical direction corresponding to one corresponding contact piece 131 in the frame body 101, as shown in FIG. 2C. A horizontal bar conductor 109B extending in the lateral direction is provided between the two conductors 109A so as to connect them.

  As described above, in the frame body 101 itself (inside) of the frame body 101, the corresponding contact piece 131 corresponding to the edge contact piece 104 of the measurement target mounting table 102 via the gap 112, and the corresponding contact piece. An electrical connection portion 109 that is electrically connected to the piece 131 and that is electrically connected to the measuring device 300 provided in contact with the frame body 101 is provided. The corresponding contact piece 131 and the electrical connection portion 109 form an external connection mechanism.

  The electrical communication means moving unit 200 is configured as shown in FIGS. 3A, 3B and 3C. A box 210 having a rectangular parallelepiped shape is used as a main body. Inside the box 210, a space 223 is provided in which an internal top plate 221 and two plate-shaped arms 222 connected to the internal top plate 221 can move in the vertical direction. The electrical communication means moving unit 200 has a function of moving the electrical communication means, which will be described later, including an edge facing contact piece 251, an external facing contact piece 252, and a conductor 255 to stop in the gap 112. The leg portion 260, which is a portion of the bottom portion of the box 210 that overlaps the upper portion of the frame body 101, is formed into a sleeve shape that fits into the frame body 101 of the socket 100S. Needless to say, the frame body 101 side of the socket 100S may be in a sleeve shape, and the leg portion 260 may be inserted and removed.

  The arm 222 has an inclined portion formed by narrowing the inside toward the tip surface 224 at the lower tip portion, and the inclined portion is provided with the edge contact piece 104 of the contact plate 120 of the measurement target mounting table 102. It has the same inclination angle as the inclined surface. As shown in FIG. 4A, an edge facing contact piece 251 that comes into contact with the edge contact piece 104 of the contact plate 120 of the measurement target mounting table 102 is provided on the inclined portion at the lower end of the arm 222. On the surface of the arm 222 on the back side of the surface on which the edge facing contact piece 251 is provided, an external facing contact piece 252 bent in a V shape is provided so as to project to the outside. The external facing contact piece 252 is provided at a position shorter than the distance from the tip end surface 224 to the edge facing contact piece 251. The external facing contact piece 252 constitutes an external facing contact piece that contacts the corresponding contact piece 131 while facing the corresponding contact piece 131 of the external connection mechanism.

  The external facing contact piece 252 comes into contact with the corresponding contact piece 131 provided on the frame body 101 of the socket 100S to obtain an electrical connection. That is, as shown in FIG. 6C, when the edge facing contact piece 251 comes into contact with the edge contact piece 104 of the contact plate 120 of the measurement object mounting base 102 in the socket 100S, the frame body 101 is touched. An edge facing contact piece 251 and an external facing contact piece 252 are provided on the arm 222 so that the external facing contact piece 252 contacts the corresponding contact piece 131 provided.

  As shown in FIGS. 4B and 4C, which are cross-sectional views of the portion of the arm 222 where the edge facing contact piece 251 and the external facing contact piece 252 are provided, the edge facing contact piece 251 and the outside A conductor 255 that electrically connects the facing contact pieces 252 is provided in a layered laminated structure. Further, an elastic body 256 is formed in the rear portion of the portion where the external facing contact piece 252 is provided. When the external facing contact piece 252 is pressed toward the arm 222 side, the elastic body 256 is compressed and the external facing contact piece 252 is compressed. 252 is stored in the arm 222.

  At this time, a part of the layered conductor 255 adjacent to the external facing contact piece 252 moved to the inside of the arm 222 together with the external facing contact piece 252, and a part of the conductor 255 was divided, as shown in FIG. 4C. It becomes a state. That is, the edge facing contact piece 251 and the external facing contact piece 252 are not electrically connected.

  From this state, when the force for pressing the outer facing contact piece 252 to the arm 222 side is eliminated, the elastic body 256 expands and returns to the original size, the outer facing contact piece 252 returns to the original position, and the conductor 255 Part of returns to its original position. As a result, the edge facing contact piece 251 and the external facing contact piece 252 are electrically connected.

  Therefore, one of the corresponding contact piece 131 and the external facing contact piece 252 is formed with a concave portion and the other is formed with a convex portion, and the side formed with the convex portion is compressed and contracted when the electrical connecting means moves. It may be made of a material.

  As shown in FIGS. 3A and 3C, a rotatable lever 230 is provided on the upper portion of the box 210 and stops at a position where an arrow mark 231 indicates one of socket position marks 232 to 235 indicating the position of the socket. Is being done. The character "open" is written on the upper surface of the socket position mark 232, the character "1" is written on the upper surface of the socket position mark 233, and the character "1" is written on the upper surface of the socket position mark 234. The character “2” is described, and the character “3” is described on the upper surface of the socket position mark 235.

  A screw is formed on the lower side of the central portion of the lever 230, and a vertically long rotating shaft 241 is formed to extend to the bottom plate 242 of the box 210. A female screw is formed in the central portion of the inner top plate 221 corresponding to the screw of the rotating shaft 241, and the inner top plate 221 is moved downward by the rotation of the rotating shaft 241 in the first direction. The two arms 222 also move downward together with the top plate 221. When the rotation shaft 241 rotates in the second direction opposite to the first direction, the inner top plate 221 moves upward, and the two arms 222 move together with the inner top plate 221.

  When the operator rotates the lever 230 and stops the arrow mark 231 toward the socket position mark 232, the rotation of the rotation shaft 241 is controlled, and the inner top plate 221 and the arm 222 are positioned at the top. . In this state, when the upper side (lever 230 side) is viewed from the bottom surface of the box 210, the arm 222, the edge facing contact piece 251, and the external facing contact piece 252 are lined up as shown in FIG. 3B. You can The rotation control of the rotary shaft 241 can be realized by a controller that receives the operation information of the lever 230 and a motor that rotates the rotary shaft 241 under the control of the controller.

  When the operator rotates the lever 230 and stops the arrow mark 231 toward the socket position mark 233, the rotation control of the rotation shaft 241 is performed, whereby the inner top plate 221 and the arm 222 are provided near the tip thereof. The edge facing contact piece 251 is in contact with the edge contact piece 104 of the contact plate 120 of the measurement target mounting table 102 of the socket 100S stacked on the top, and the external facing contact piece 252 is also stacked on the top. The corresponding contact piece 131 provided on the frame 101 of the socket 100S is brought into contact with the corresponding contact piece 131. A sectional view of the socket device in this embodiment at this time is as shown in FIG. 1B.

  When the operator rotates the lever 230 and stops the arrow mark 231 toward the socket position mark 234, the rotation control of the rotation shaft 241 is performed, whereby the inner top plate 221 and the arm 222 are provided near the tip thereof. The edge facing contact piece 251 contacted with the edge contacting piece 104 of the contact plate 120 of the measuring object mounting base 102 of the socket 100S stacked second from the upper side, and the external facing contacting piece 252 also from the upper side. The second stacked socket 100S is positioned at a position in contact with the corresponding contact piece 131 provided on the frame body 101. A sectional view of the socket device in this embodiment at this time is as shown in FIG. 1C.

  When the operator rotates the lever 230 and stops the arrow mark 231 toward the socket position mark 235, the rotation control of the rotation shaft 241 is performed, whereby the inner top plate 221 and the arm 222 are provided near the tip thereof. The edge facing contact piece 251 contacted with the edge contacting piece 104 of the contact plate 120 of the measuring object mounting base 102 of the socket 100S stacked at the bottom, and the external facing contacting piece 252 is also stacked at the bottom. The corresponding contact piece 131 provided on the frame 101 of the socket 100S is brought into contact with the corresponding contact piece 131. A sectional view of the socket device in this embodiment at this time is as shown in FIG. 1D.

  As described above, the two arms 222 including the edge facing contact piece 251, the external facing contact piece 252, and the conductor 255 correspond to the edge contact piece 104 of the contact plate 120 of the plurality of measurement object mounting bases 102 and the above. A gap moving body that can move in the gap 112 between the contact piece 131 is configured. This air gap moving body is formed between the edge contact piece 104 and the corresponding contact piece 131 in the contact plate 120 of one measurement object mounting base 102, which is constituted by the edge opposed contact piece 251, the external opposed contact piece 252 and the conductor 255. It is provided with an electrical communication means for electrically communicating with.

  The socket device of the embodiment described above is used as follows. An LSI 400 to be measured is prepared for each of the three sockets 100S, mounted on the contact plate 120 of the measurement target mounting base 102, and fixed by a fixture. This state is the state shown in FIG. 2C and the like.

  Next, the socket 100S (already set with the LSI 400) to be stacked at the lowest position is placed on the upper surface of the measuring device 300. As a result, the electrical connection section 109 in the frame 101 is connected to a required circuit or the like of the measuring device 300. The lowest socket 100S and the measuring device 300 are fixed by a fixture such as a hook type not shown.

  Next, the second-stage socket 100S is stacked, and further the uppermost socket 100S is stacked. In this state, the electrical connection portion 109 of the lowest socket 100S, the electrical connection portion 109 of the second-stage socket 100S, and the electrical connection portion 109 of the highest socket 100S are electrically connected to each other. . Further, the three sockets 100S are also fixed by a fixture such as a hook type not shown.

  Further, the box 210 is stacked on the uppermost socket 100S stacked in three stages. The leg portion 260, which is a portion of the bottom portion of the box 210 that overlaps the upper portion of the frame body 101, is formed into a sleeve shape as described above, and the leg portion 260 of the bottom portion of the box 210 is fitted to the frame body 101 of the socket 100S. To do. Further, the lower end portion of the arm 222 is in a state of being positioned in the upper space of the void 112 of the measurement target mounting table 102 (FIG. 1A). At this time, the arrow mark 231 on the upper part of the box 210 is in a state of stopping toward the socket position mark 232.

  Next, the LSI 400 can be measured and evaluated. When the operator rotates the lever 230 and stops the arrow mark 231 toward the socket position mark 233, the rotation of the rotary shaft 241 is controlled, whereby the inner top plate 221 and the arm 222 start descending.

  Then, as shown in FIG. 6A, the lower end portion of the arm 222 enters the gap 112 of the measurement target mounting table 102. Further, the inner top plate 221 and the arm 222 continue to descend, the outer facing contact piece 252 touches the projecting portion 130 of the frame body 101, the outer facing contact piece 252 receives pressure, the elastic body 256 is compressed, and the outer facing contact piece 252 is compressed. The piece 252 is stored in the arm 222 (FIG. 6B).

  When the inner top plate 221 and the arm 222 are further lowered from the state of FIG. 6B, the outer facing contact piece 252 expands toward the corresponding contact piece 131 provided on the projecting portion 130 of the frame 101, and the shape is restored. Then, the external facing contact piece 252 and the corresponding contact piece 131 are brought into a state of being in good contact with each other. Further, the edge facing contact piece 251 provided in the vicinity of the tip of the arm 222 also comes into a state of being in good contact with the edge contact piece 104 of the contact plate 120 of the measurement target mounting base 102 of the socket 100S. The state at this time is shown in FIG. 6C and FIG. 1B.

  In the above state, as shown by S1 in FIG. 1B, a signal or current can flow. That is, the required circuit of the measuring device 300 → the electrical connection portion 109 in the stacked three-stage socket S → the corresponding contact piece 131 in the uppermost socket 100S → the outer facing contact piece 252 of the arm 222 and the conductor 255 and the edge facing each other. The contact piece 251 → the edge contact piece 104 of the contact plate 120 of the measurement target mounting table 102 and the internal conduction path and the LSI connecting contact piece 103 → the signal or current can be passed to the terminal of the LSI400 and the circuit of the LSI400, and Signals and currents can also flow in the direction of "←" in which the above "→" is reversed.

  After performing the measurement and evaluation of the LSI 400 in the above state, the operator rotates the lever 230 in order to perform the measurement and evaluation of the LSI 400 set in the second-stage socket 100S. When the arrow mark 231 is stopped in the direction of the socket position mark 234 by this rotation, the rotation of the rotary shaft 241 is controlled, whereby the inner top plate 221 and the arm 222 start descending (FIG. 7A).

  By the lowering of the inner top plate 221 and the arm 222, the outer facing contact piece 252 and the corresponding contact piece 131 are separated from each other, and the outer facing contact piece 252 is pressed by the inclined portion of the corresponding contact piece 131, and the elastic body 256 is compressed to the outside. The facing contact piece 252 is stored in the arm 222 (FIG. 7B). Further, the inclination of the edge facing contact piece 251 provided near the tip of the arm 222 advances to the upper side, so that the edge contact piece 104 provided on the contact plate 120 of the measuring object mounting base 102 in the socket 100S contacts the contact plate. It is pressed toward the center of 120. As a result, as described with reference to FIG. 5B, the state of continuity between the LSI connection contact piece 103 and the edge contact piece 104 remains only slightly (FIG. 7B). As a result, it is possible to avoid an unnecessary operation such as an inappropriate signal or current flowing during the movement of the arm 222 and adversely affecting the LSI 400.

  When the internal top plate 221 and the arm 222 are further lowered from the state of FIG. 7B, the LSI connection contact piece 103 and the edge contact piece 104 are brought into a non-conductive state (FIG. 7C). The external facing contact piece 252 expands toward the corresponding contact piece 131 provided on the projecting portion 130 of the frame 101 to restore the shape (FIG. 7C).

  Since the arrow mark 231 is directed toward the socket position mark 234, the rotation control of the rotary shaft 241 is continued, whereby the inner top plate 221 and the arm 222 continue to descend. As a result, the lower end of the arm 222 enters the space 112 of the second stage measurement target mounting table 102 as shown in FIG. 6A. Further, the relationship between the second-stage measurement target mounting table 102 and the arm 222 ton advances as shown in FIGS. 6B and 6C, and the measurement of the LSI 400 set on the second-stage measurement target mounting table 102 is performed. It is ready for evaluation. In the above state, as shown by S1 in FIG. 1C, a signal or current can flow. That is, the LSI 400 set on the uppermost measurement target mounting table 102 has no electrical connection to the required circuit of the measuring device 300, so the LSI 400 set on the uppermost measurement target mounting table 102 is performed. It is possible to perform measurement evaluation. That is, it is possible to perform measurement by sending a current or signal different from that for the LSI 400 set on the uppermost measurement target mounting table 102 to a required circuit and receiving a response.

  After performing the measurement and evaluation of the LSI 400 set on the second-stage measurement target mounting table 102, the operator rotates the lever 230 in order to perform the measurement and evaluation of the LSI 400 set in the lowermost socket 100S. When the arrow mark 231 is stopped toward the socket position mark 235 by this rotation, the rotation of the rotary shaft 241 is controlled, whereby the inner top plate 221 and the arm 222 start descending.

  From the above, the relationship between the second-stage measurement-object mounting table 102 and the arm 222 is as shown in FIG. 7 (a) → FIG. 7 (b) → FIG. 7 (c). The relationship between 102 and the arm 222 is as shown in FIG. 6 (a) → FIG. 6 (b) → FIG. 6 (c). As a result, as shown in FIG. 1D, measurement and evaluation of the LSI 400 set on the measurement target mounting table 102 at the lowermost stage can be performed.

  In the above state, as shown by S1 in FIG. 1D, a signal or current can flow. At this time, the LSI 400 set on the uppermost and second-stage measurement object mounting tables 102 has no electrical connection to a required circuit or the like of the measuring device 300, so that the uppermost and second-stage measurement is performed. The measurement and evaluation performed on the LSI 400 set on the target mounting table 102 can be performed.

  When all the measurements and evaluations are completed, the operator rotates the lever 230 and stops the arrow mark 231 toward the socket position mark 232, and then the rotation control of the rotation shaft 241 is performed, whereby the inner top plate 221 and the arm are controlled. 222 is located at the top. At this time, it is possible to separate the three sockets 100S and remove the LSIs 400 set in the respective sockets S by the procedure reverse to the case of the above-described assembly, and proceed to the next measurement and evaluation.

  In this embodiment, it is possible to incorporate up to 3 sockets and perform measurement and evaluation of up to 3 LSIs. By using the embodiment in which the arms 222 have different lengths, it is possible in principle to configure a socket device in which the required number of sockets and LSIs are provided.

100 socket part 100S socket 101 frame body 102 measurement object mounting base 103 LSI connection contact piece 104 LSI edge contact piece 106 conductor 107 contact piece 108 conductor 109 electrical connection portion 110 base 112 void 120 contact plate 130 protruding portion 131 corresponding contact piece 200 Electrical Connecting Means Moving Unit 210 Box 221 Inner Top Plate 222 Arm 223 Space 224 Tip Surface 230 Lever 231 Arrow Mark 232, 233, 234, 235 Socket Position Mark 241 Rotating Shaft 242 Bottom Plate 251 Edge Opposing Contact Piece 252 External Opposing Contact One piece 255 Conductor 256 Elastic body 260 Leg 300 Measuring instrument 400 LSI

Claims (8)

At least one sheet is provided in the inner space of the cylindrical frame, and has an LSI connecting contact piece that is connected to the terminal of the LSI when the LSI to be measured is placed, and is electrically connected to the LSI connecting contact piece. A measurement target mounting table having an edge contact piece provided at the edge,
A corresponding contact piece provided on the frame body itself of the frame body and corresponding to the edge contact piece of the measurement object mounting table via a gap, and electrically connected to the corresponding contact piece, and contacting the frame body. An external connection mechanism that includes an electrical connection unit that obtains an electrical connection to a measurement device provided as
The gaps between the edge contact pieces of the plurality of measurement object mounting bases and the corresponding contact pieces are movable, and the edge contact pieces and the corresponding contact pieces of one measurement object mounting base are electrically connected. And an air gap moving body provided with an electrical communication means.   The electrical contact means includes an edge facing contact piece that contacts the edge contact piece in a state of facing the edge contact piece, and the corresponding contact piece in a state of facing the corresponding contact piece of the external connection mechanism. The evaluation socket device according to claim 1, further comprising: an external facing contact piece that contacts with the outer facing contact piece; and a conductor that electrically connects the edge facing contact piece and the external facing contact piece. The measurement target mounting table has a plastic base portion coupled to the inner wall surface of the cylindrical frame body, and a contact plate provided on the upper portion of the base portion and having an outer periphery inside the outer periphery of the base portion. ,
The edge contact piece and the edge facing contact piece are configured by a conductor provided on an inclined surface, and an elastic portion provided on at least one of the edge contact piece and the edge facing contact piece is the electric portion. The evaluation socket device according to claim 2, wherein the evaluation socket device is made of a material that is compressed and contracts when the mechanical communication means moves.   One of the corresponding contact piece and the external facing contact piece is formed of a material in which one is formed into a concave portion and the other is formed into a convex portion, and the side formed in the convex portion is compressed and contracted when the electrical connecting means moves. The evaluation socket device according to claim 2 or 3, wherein   Electric contact means movement for stopping the electric contact means by moving a gap between the edge contact pieces of the plurality of measurement object mounting tables and the corresponding contact pieces corresponding to each of the edge contact pieces The evaluation socket device according to any one of claims 1 to 4, further comprising a portion.   It is characterized in that the socket for stacking a plurality of sockets, in which one piece of the measuring object mounting table is provided in the inner space of the cylindrical frame, is joined to the lower part of the electrical connecting means moving part. The evaluation socket device according to claim 5. At least one piece is provided in the inner space of the cylindrical frame, and has an LSI connecting contact piece that is connected to the terminal of the LSI when the LSI to be measured is placed, and is electrically connected to the LSI connecting contact piece. A measurement target mounting table having an edge contact piece provided at the edge,
A corresponding contact piece provided on the frame itself of the frame body and corresponding to the edge contact piece of the measurement object mounting table via a gap, and electrically connected to the corresponding contact piece, and contacting the frame body. An external connection mechanism that includes an electrical connection unit that obtains an electrical connection to a measurement device provided as
The gap between the edge contact pieces of the plurality of measurement object mounting bases and the corresponding contact pieces can be moved, and the edge contact pieces and the corresponding contact pieces of one measurement object mounting base are electrically connected. And an air gap moving body provided with an electrical communication means for using the socket device for evaluation,
With respect to the electrical communication means, the space is moved to electrically connect between the edge contact piece and the corresponding contact piece in one measurement target mounting table, and the LSI mounted on the measurement target mounting table is connected. Signals are sent and received between the two to perform measurement and evaluation of the LSI,
Furthermore, the space is moved with respect to the electrical connection means, and the edge contact piece and the corresponding contact piece in another one measurement target mounting table are electrically connected to each other and placed on the measurement target mounting table. Signal is sent to and received from the LSI, and the LSI is measured and evaluated,
Hereinafter, similar to the above, the electric communication means is moved in the space, signals are transmitted to and received from an LSI mounted on a corresponding target mounting table, and measurement and evaluation of the LSI are performed. And a method for measuring and evaluating LSI.   At least one of the plurality of measurement object mounting tables is different from the LSI mounted on another measurement object mounting table by differentiating a signal transmitted / received from / to an LSI mounted on at least one measurement object mounting table. 8. The LSI measurement / evaluation method according to claim 7, wherein the measurement / evaluation of the seed is performed.