JPH06249709A - Infrared detector - Google Patents
Infrared detectorInfo
- Publication number
- JPH06249709A JPH06249709A JP5341291A JP34129193A JPH06249709A JP H06249709 A JPH06249709 A JP H06249709A JP 5341291 A JP5341291 A JP 5341291A JP 34129193 A JP34129193 A JP 34129193A JP H06249709 A JPH06249709 A JP H06249709A
- Authority
- JP
- Japan
- Prior art keywords
- container
- joined
- solder
- infrared detector
- window member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、人体などから発せら
れる赤外線を検出する赤外線検出器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared detector for detecting infrared rays emitted from a human body or the like.
【０００２】[0002]
【従来の技術】上記赤外線検出器の一つに、例えば実開
平２−１１８８４２号公報に示される焦電型赤外線検出
器がある。これを図５および図６を用いて説明すると、
図５において、１は鉄やニッケルあるいはコバールなど
の金属よりなる下部開放型の筒状の容器で、その上面部
２のほぼ中央には開口部３が形成されている。４は開口
部３を容器１の上方から閉塞するように設けられた赤外
線透過窓材（以下、単に窓材という）で、図６に示すよ
うに、シリコン、ゲルマニウムなどの半導体を母材５と
し、この母材５の両面に波長選択性多層膜（以下、単に
多層膜という）６を形成してなるもので、その周側面の
ほぼ全体と開口部３の周辺部とを、絶縁性樹脂接着剤７
を用いて上面部２の上方から容器１に接合されている。
８は補助的に設けられる導電性樹脂接着剤である。2. Description of the Related Art One of the infrared detectors is, for example, a pyroelectric infrared detector disclosed in Japanese Utility Model Laid-Open No. 2-118842. This will be described with reference to FIGS. 5 and 6.
In FIG. 5, reference numeral 1 denotes a lower open-type tubular container made of a metal such as iron, nickel or kovar, and an opening 3 is formed in the upper surface portion 2 at substantially the center thereof. Reference numeral 4 denotes an infrared transparent window material (hereinafter simply referred to as a window material) provided so as to close the opening 3 from above the container 1. As shown in FIG. 6, a semiconductor such as silicon or germanium is used as a base material 5. A wavelength-selective multilayer film (hereinafter, simply referred to as a multilayer film) 6 is formed on both surfaces of the base material 5, and substantially the entire peripheral side surface and the peripheral portion of the opening 3 are bonded with an insulating resin. Agent 7
Is joined to the container 1 from above the upper surface portion 2.
Reference numeral 8 is a conductive resin adhesive which is additionally provided.
【０００３】９は窓材４に対して受光部電極１０，１１
を臨ませるようにして容器１内に収容された赤外線検出
素子で、例えばＰＺＴ（チタン酸ジルコン酸鉛系の酸化
物セラミックス）よりなる。この赤外線検出素子９は、
スペーサ１２を介してセラミックなどよりなる回路基板
１３上に設けられている。そして、回路基板１３の下面
側にはＦＥＴ（電界効果トランジスタ）１４や高抵抗１
５などからなる回路が設けられているとともに、複数の
リードピン１６が突設されている。これらのリードピン
１６は、容器１の下部開放部を閉塞するステム１７を貫
通して容器１の外部に延設されている。Reference numeral 9 denotes a light-receiving portion electrode 10, 11 with respect to the window member 4.
Is an infrared detection element housed in the container 1 so as to face the above, and is made of, for example, PZT (lead zirconate titanate-based oxide ceramics). This infrared detecting element 9
It is provided on a circuit board 13 made of ceramic or the like via a spacer 12. On the lower surface side of the circuit board 13, a FET (field effect transistor) 14 and a high resistance 1
5 is provided, and a plurality of lead pins 16 are provided in a protruding manner. These lead pins 16 extend to the outside of the container 1 through a stem 17 that closes the lower opening of the container 1.
【０００４】このように構成された焦電型赤外線検出器
においては、例えば人体から発せられた赤外線が窓材４
を通過して赤外線検出素子９の受光部電極１０，１１に
入射すると、リードピン１６からは所定の信号が出力さ
れる。そして、上記従来の赤外線検出器においては、窓
材４の母材５としてシリコン、ゲルマニウムなどの半導
体を用いるとともに、窓材４と容器１との接合に、銀、
銅などの金属フィラーを合成樹脂接着剤に分散混入させ
てなる導電性樹脂接着剤８を用いているので、窓材４と
容器１との間を導通させることができ、好都合である。In the pyroelectric infrared detector thus constructed, for example, infrared rays emitted from the human body are used as the window member 4
When it passes through and enters the light receiving portion electrodes 10 and 11 of the infrared detection element 9, a predetermined signal is output from the lead pin 16. In the above-mentioned conventional infrared detector, a semiconductor such as silicon or germanium is used as the base material 5 of the window member 4, and silver is used for joining the window member 4 and the container 1.
Since the conductive resin adhesive 8 in which a metal filler such as copper is dispersed and mixed in the synthetic resin adhesive is used, the window member 4 and the container 1 can be electrically connected, which is convenient.
【０００５】[0005]
【発明が解決しようとする課題】ところで、一般に、焦
電型赤外線検出器においては、容器１内の回路のインピ
ーダンスが例えば１０11Ωというように極めて大きいと
ころから、温度や湿度などの環境の変化に対して、容器
１内の気密性を維持する必要がある。しかしながら、上
述のように、容器１の所定の箇所への窓材４の接着を樹
脂接着剤７，８によって行った従来の焦電型赤外線検出
器においては、過酷な環境の下における試験では、外気
や水分が透過するなどして容器１内に侵入するのを回避
することができず、このため、内部回路における絶縁性
が低下せざるを得ず、信頼性に限界があった。Generally, in a pyroelectric infrared detector, since the impedance of the circuit in the container 1 is extremely large, for example, 10 11 Ω, changes in the environment such as temperature and humidity. On the other hand, it is necessary to maintain the airtightness inside the container 1. However, as described above, in the conventional pyroelectric infrared detector in which the window material 4 is adhered to the predetermined portion of the container 1 with the resin adhesives 7 and 8, in the test under a harsh environment, It is unavoidable that the outside air or moisture penetrates into the container 1 due to permeation, etc. Therefore, the insulating property in the internal circuit is inevitably lowered, and the reliability is limited.
【０００６】なお、上述のような耐環境性は、焦電型赤
外線検出器のみならず、容器１内に熱電堆型赤外線検出
素子を収容した熱電堆型赤外線検出器やその他の赤外線
検出器においても同様である。The environment resistance described above is applicable not only to the pyroelectric infrared detector but also to the thermoelectric infrared detector in which the thermoelectric infrared detector is housed in the container 1 and other infrared detectors. Is also the same.
【０００７】この発明は、上述の事柄に留意してなされ
たもので、長期にわたって良好な気密性を維持すること
ができる赤外線検出器を提供することを目的としてい
る。The present invention has been made in view of the above matters, and an object thereof is to provide an infrared detector capable of maintaining good airtightness for a long period of time.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、この発明においては、赤外線透過材料よりなる母材
に波長選択性多層膜を形成した赤外線透過窓材を、赤外
線検出素子を収容した容器に形成された開口部に対して
接合した赤外線検出器において、前記窓材における少な
くとも母材断面部分にハンダ可能な金属層を形成すると
ともに、前記容器における窓材の接合予定部分をハンダ
可能な表面状態とし、窓材を前記接合予定部分にハンダ
を用いて接合している。In order to achieve the above object, according to the present invention, a container containing an infrared detecting element is provided with an infrared transmitting window material in which a wavelength selective multilayer film is formed on a base material made of an infrared transmitting material. In the infrared detector bonded to the opening formed in, a solderable metal layer is formed on at least a base material cross-section of the window material, and a surface of the container on which the window material is to be bonded is solderable. In this state, the window material is joined to the portion to be joined with solder.
【０００９】この場合、容器に対してハンダによって接
合されている窓材の周囲部分を樹脂接着剤によってモー
ルドしてあってもよい。In this case, the peripheral portion of the window member joined to the container by solder may be molded with a resin adhesive.
【００１０】[0010]
【作用】上記構成の赤外線検出器においては、容器に形
成された開口部を閉鎖するための窓材における母材の断
面部分にハンダ可能な金属層が形成されるとともに、容
器における窓材の接合予定部分をハンダ可能な表面状態
とし、ハンダを用いて窓材を接合予定部分に接合してい
るから、気密性が向上するとともに、窓材と容器との電
気的な結合が確実に行われるので、電磁気に対するシー
ルド性が向上する。In the infrared detector having the above structure, the solderable metal layer is formed on the cross section of the base material of the window material for closing the opening formed in the container, and the window material is joined in the container. Since the planned part has a surface condition that allows soldering, and the window material is bonded to the planned part using solder, the airtightness is improved and the electrical connection between the window material and the container is ensured. The electromagnetic shielding property is improved.
【００１１】[0011]
【実施例】以下、この発明の実施例を、図面を参照しな
がら説明する。なお、以下の各図において、図５および
図６に示す符号と同一の符号は、同一物または相当物を
示す。Embodiments of the present invention will be described below with reference to the drawings. In each of the following drawings, the same reference numerals as those shown in FIGS. 5 and 6 indicate the same or equivalent components.
【００１２】まず、この発明の第１実施例を図１および
図２を参照しながら説明する。図１は、焦電型赤外線検
出器の一例を示し、この図において、１８は窓材４にお
ける母材５の多層膜６によって挟まれる断面部分５ａに
形成されたハンダ可能な金属層である。この金属層１８
は、母材５の側面部５ａの全周に形成される。また、１
９は容器１の上面部２における窓材４の接合予定部分
で、ハンダ可能な表面状態にされている。そして、２０
は母材５の側面部５ａに形成された金属層１８と容器１
における接合予定部分１９との間に施されるハンダ部分
である。このハンダ部分２０は、窓材４の全周に施され
ている。２１はハンダ部分２０を被覆するように窓材４
の全周にモールドされた樹脂接着剤である。First, a first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 shows an example of a pyroelectric infrared detector, in which reference numeral 18 denotes a solderable metal layer formed in a cross-section portion 5a sandwiched by a multilayer film 6 of a base material 5 in a window material 4. This metal layer 18
Are formed on the entire circumference of the side surface portion 5 a of the base material 5. Also, 1
Reference numeral 9 denotes a portion to be joined to the window member 4 on the upper surface portion 2 of the container 1, which is in a solderable surface state. And 20
Is the metal layer 18 formed on the side surface 5a of the base material 5 and the container 1
It is a solder part applied between the part to be joined 19 in FIG. The solder portion 20 is provided on the entire circumference of the window member 4. 21 is a window member 4 so as to cover the solder portion 20.
Is a resin adhesive that is molded around the entire circumference of.
【００１３】次に、窓材４の製作手順および窓材４の容
器１への接合手順の一例について説明する。Next, an example of a procedure for manufacturing the window member 4 and a procedure for joining the window member 4 to the container 1 will be described.
【００１４】窓材４の母材５は、シリコン（Ｓｉ）また
はゲルマニウム（Ｇｅ）のような半導体よりなり、例え
ば直径１０１．６ｍｍ（４インチ）、厚さ０．３８ｍｍ
のウェハ状に切り出す。The base material 5 of the window member 4 is made of a semiconductor such as silicon (Si) or germanium (Ge), and has a diameter of 101.6 mm (4 inches) and a thickness of 0.38 mm.
Cut out into a wafer.
【００１５】公知の蒸着法を用いて、前記ウェハの両面
に高屈折率物質としてのＧｅと低屈折率物質としての硫
化亜鉛（ＺｎＳ）とを数十層重畳する。これによって、
ウェハの表面に波長選択性を有する多層膜が形成され、
光学フィルタが得られる。この場合、多層膜における光
学膜厚や蒸着層数を適宜設定することにより、所望の波
長選択性を有する光学フィルタが得られることはいうま
でもない。Dozens of layers of Ge as a high-refractive index material and zinc sulfide (ZnS) as a low-refractive index material are superposed on both surfaces of the wafer by using a known vapor deposition method. by this,
A multilayer film having wavelength selectivity is formed on the surface of the wafer,
An optical filter is obtained. In this case, it goes without saying that an optical filter having a desired wavelength selectivity can be obtained by appropriately setting the optical film thickness and the number of vapor deposition layers in the multilayer film.
【００１６】多層膜が形成されたウェハ（光学フィル
タ）を、ダイヤモンドよりなる回転刃を高速回転させて
切断することにより、数ｍｍ角のペレット、すなわち、
窓材４に形成する。この小片形状に切断された窓材４
は、図２に示すように、母材５の上下両面が多層膜６に
挟まれた所謂サンドウィッチ形状を呈している。A wafer (optical filter) on which a multilayer film is formed is cut by rotating a rotary blade made of diamond at a high speed to form a pellet of several mm square, that is,
It is formed on the window member 4. This window material 4 cut into small pieces
2 has a so-called sandwich shape in which the upper and lower surfaces of the base material 5 are sandwiched by the multilayer films 6, as shown in FIG.
【００１７】そして、母材５の露出している断面部分５
ａは、そのままの状態ではハンダに対する濡れ性がな
い。そこで、この断面部分５ａにメッキまたはスパッタ
リングによって表面処理を行い、これを金属層１８とす
るのである。Then, the exposed cross-section portion 5 of the base material 5
In the state as it is, a has no wettability to solder. Therefore, the cross-section 5a is subjected to a surface treatment by plating or sputtering to form the metal layer 18.
【００１８】前記メッキによる表面処理としては、例え
ばニッケル−リン系、ニッケル−ホウ素系、パラジウム
−リン系のものが金属層１８の付着強度が強く安定して
いる。そして、ハンダに対する濡れ性を一層向上させる
には、前記いずれかによるメッキ後、金メッキで仕上げ
るのもよい。As the surface treatment by plating, for example, nickel-phosphorus-based, nickel-boron-based, and palladium-phosphorus-based ones have strong and stable adhesion strength of the metal layer 18. Then, in order to further improve the wettability with respect to solder, it is also preferable to finish with gold plating after plating with any of the above.
【００１９】また、前記スパッタリングによって表面処
理を行う場合、例えばニッケル、クローム、銅、金など
の金属をスパッリングによって単層または多層膜として
組み合わせることにより、ハンダに対して濡れ性の良好
なハンダ可能な金属層１８を得ることができる。Further, when the surface treatment is performed by the above-mentioned sputtering, by combining metals such as nickel, chrome, copper and gold as a single layer or a multi-layered film by sparring, solder having good wettability can be obtained. It is possible to obtain a transparent metal layer 18.
【００２０】なお、上記メッキまたはスパッリングによ
る表面処理で用いる素材またはその組合せは、上記した
ものに限られるものではなく、要するに前記母材５の露
出している断面部分５ａにハンダに対する濡れ性が優れ
た金属層１８が形成されておればよい。The material used for the surface treatment by plating or sparring or the combination thereof is not limited to the above-mentioned ones. In short, the exposed cross-section 5a of the base material 5 has a wettability to solder. It is sufficient that the excellent metal layer 18 is formed.
【００２１】一方、前記窓材４が接合される容器１は、
これをハンダに対する濡れ性の良好な金属素材（例えば
ニッケル、コバールなど）をプレス加工によって成形す
るのが好ましいが、ハンダに対する濡れ性が不十分な金
属素材（例えば鉄など）を用いてもよい。どちらの場
合、少なくとも窓材４の接合予定部分１９については、
ハンダ可能な表面状態に表面処理が施されてあればよ
い。この表面処理についても、上記母材５の露出してい
る断面部分５ａの表面処理に適用されるメッキまたはス
パッタリングを同様に採用すればよい。また、容器全体
にこれら表面処理を施してもよい。On the other hand, the container 1 to which the window member 4 is joined is
It is preferable that a metal material having good wettability with respect to solder (for example, nickel, Kovar, etc.) is formed by pressing, but a metal material with insufficient wettability with respect to solder (for example, iron) may be used. In either case, at least the portion 19 to be joined of the window member 4 is
It suffices if the surface treatment is applied to the solderable surface state. Also for this surface treatment, plating or sputtering applied to the surface treatment of the exposed cross-section portion 5a of the base material 5 may be similarly adopted. Moreover, you may perform these surface treatments to the whole container.
【００２２】上述のようにして形成された窓材４を容器
１の接合予定部分１９に、例えば錫−鉛系のハンダを熱
溶融させることによって、両者を接合するのである。そ
の場合、窓材４の側部に形成された金属層１８と容器１
の上面部２における接合予定部分１９との間にハンダ部
分２０が形成されるようにするのがよい。そして、この
とき、使用するハンダとしては、ペースト状のクリーム
ハンダ、糸状ハンダ、ペレット状の固形ハンダなどがあ
る。また、前記錫−鉛系のハンダの他、銀を適宜混入し
たハンダを用いてもよいことはいうまでもない。The window material 4 formed as described above is joined to the portion 19 to be joined of the container 1 by heat-melting tin-lead solder, for example, to join the two. In that case, the metal layer 18 formed on the side of the window member 4 and the container 1
It is preferable that the solder portion 20 is formed between the upper surface portion 2 and the portion 19 to be joined. At this time, as the solder to be used, there are paste-like cream solder, thread-like solder, pellet-like solid solder, and the like. Needless to say, other than the tin-lead solder, a solder in which silver is appropriately mixed may be used.
【００２３】前記ハンダによる窓材４と容器１との接合
が完了した後、窓材４の周囲部分を樹脂接着剤２１によ
ってモールドする。After the joining of the window member 4 and the container 1 by the solder is completed, the peripheral portion of the window member 4 is molded with the resin adhesive 21.
【００２４】上記実施例においては、ハンダ部分２０に
よって窓材４と容器１とが接合されるので、従来の焦電
型赤外線検出器に比べて、その気密性が大幅に向上する
とともに、ハンダ部分２０を介して窓材４の母材５と容
器１とが電気的に結合されるので、電磁気に対するシー
ルド性が向上する。また、窓材４の周囲部分を樹脂接着
剤２１によってモールドしているので、取扱い時におけ
る外的な衝撃に対する窓材４の角部の欠けを防止でき
る。そして、腐食性ガス雰囲気で使用しても、ハンダ部
分２０の表面層が腐蝕されることがない。In the above embodiment, since the window member 4 and the container 1 are joined by the solder portion 20, the airtightness thereof is significantly improved as compared with the conventional pyroelectric infrared detector, and the solder portion is also improved. Since the base material 5 of the window material 4 and the container 1 are electrically coupled via 20, the electromagnetic shielding property is improved. Further, since the peripheral portion of the window member 4 is molded with the resin adhesive 21, it is possible to prevent the corner portion of the window member 4 from being chipped due to an external impact during handling. Even when used in a corrosive gas atmosphere, the surface layer of the solder part 20 is not corroded.
【００２５】次に、この発明の第２実施例を図３および
図４を参照しながら説明する。この実施例においては、
窓材４は、その上面が容器１の上面に開設された開口部
３を囲む上面部２と同じ高さ（面一）となるように設け
られているとともに、窓材４における母材５の上下両面
に形成された多層膜６Ａ，６Ｂによって挟まれる断面部
分５ａおよび下側の多層膜６Ｂにおける視野角に寄与し
ない部分６ｂに、ハンダ可能な金属層２２が形成されて
いる。この場合、視野角に寄与しない部分６ｂとは、赤
外線検出素子９の受光部電極１０，１１の外縁と母材５
の上側の多層膜６Ａとを結ぶ視野角規定ライン２３より
も外縁側の部分のことをいう。Next, a second embodiment of the present invention will be described with reference to FIGS. 3 and 4. In this example,
The window member 4 is provided such that its upper surface is at the same height (flush) as the upper surface portion 2 surrounding the opening 3 formed on the upper surface of the container 1, and the base material 5 of the window member 4 is A solderable metal layer 22 is formed on a cross-sectional portion 5a sandwiched by the multilayer films 6A and 6B formed on the upper and lower surfaces and a portion 6b of the lower multilayer film 6B that does not contribute to the viewing angle. In this case, the portion 6b that does not contribute to the viewing angle means the outer edges of the light receiving electrodes 10 and 11 of the infrared detection element 9 and the base material 5.
The outer peripheral side of the viewing angle defining line 23 connecting the upper multilayer film 6A.
【００２６】つまり、この第２実施例においては、母材
５の側断面部分５ａのみならず、下側の多層膜６Ｂの視
野角に寄与しない部分６ｂにも、ハンダ可能な金属層２
２を形成している。That is, in the second embodiment, the metal layer 2 which can be soldered is applied not only to the side cross-section portion 5a of the base material 5 but also to the portion 6b which does not contribute to the viewing angle of the lower multilayer film 6B.
Forming 2.
【００２７】そして、２４は容器１の接合予定部分で、
第１実施例における符号１９で示される部分と同様にハ
ンダ可能な表面状態に表面処理が施されている。また、
２５は窓材４を容器１に接合するためのハンダ部分であ
る。なお、接合予定部分２４の表面処理は、ハンダ部分
２５に対応する部分のみを部分的に行ってもよいが、容
器全体を一括して表面処理するようにしてもよい。Reference numeral 24 is a portion of the container 1 to be joined,
Similar to the portion indicated by reference numeral 19 in the first embodiment, surface treatment is applied to the solderable surface state. Also,
Reference numeral 25 is a solder portion for joining the window member 4 to the container 1. The surface treatment of the portion 24 to be joined may be carried out only on the portion corresponding to the solder portion 25, but the entire container may be subjected to the surface treatment at once.
【００２８】この第２実施例の他の部分の構成は、第１
実施例のものと同様であるので、その詳細な説明は省略
する。The structure of the other parts of this second embodiment is the same as that of the first embodiment.
Since it is similar to that of the embodiment, its detailed description is omitted.
【００２９】この第２実施例においては、窓材４は、容
器１の上面に開設された開口部３を囲む上面部２と同じ
高さ（面一）となるように設けられる。容器１の接合予
定部分２４に、例えば錫−鉛系のハンダを熱溶融させる
ことによって、窓材４と容器１とを接合するのである。
その場合、窓材４の側部断面部分５ａおよび多層膜６Ｂ
における視野角に寄与しない部分６ｂにわたって形成さ
れた金属層２２と容器１の接合予定部分２４とにわたっ
てハンダ部分２５が形成されるようにするのがよい。そ
して、このとき使用するハンダとしては、第１実施例に
おいて使用したものと同じである。In the second embodiment, the window member 4 is provided so as to have the same height (flush) as the upper surface 2 surrounding the opening 3 formed on the upper surface of the container 1. The window material 4 and the container 1 are joined to the portion 24 to be joined of the container 1 by thermally melting tin-lead based solder, for example.
In that case, the side section 5a of the window member 4 and the multilayer film 6B
It is preferable that the solder portion 25 is formed over the metal layer 22 formed over the portion 6b that does not contribute to the viewing angle and the planned joining portion 24 of the container 1. The solder used at this time is the same as that used in the first embodiment.
【００３０】上述のように構成された赤外線検出器にお
いては、窓材４と容器１とが接合され、しかも、窓材４
側に、ハンダの濡れ性のよい金属層２２が窓材４の側部
断面部分５ａおよび多層膜６Ｂにおける視野角に寄与し
ない部分６ｂにわたって形成されているので、ハンダ部
分２５と窓材４との接合面積が第１実施例のものより大
きい。したがって、窓材４と容器１とがより強固かつ確
実に接合され、容器１の気密性が向上するとともに、窓
材４と容器１との電気的な結合が確実に行われるので、
電磁気に対するシールドが良好に行われる。In the infrared detector constructed as described above, the window member 4 and the container 1 are joined together, and moreover, the window member 4
Since the metal layer 22 having good wettability of solder is formed on the side over the side cross-section portion 5a of the window material 4 and the portion 6b which does not contribute to the viewing angle in the multilayer film 6B, the solder portion 25 and the window material 4 are The bonding area is larger than that of the first embodiment. Therefore, the window member 4 and the container 1 are more firmly and surely joined, the airtightness of the container 1 is improved, and the window member 4 and the container 1 are securely electrically connected.
Good shielding against electromagnetic fields.
【００３１】なお、上記第２実施例においても、第１実
施例と同様に、窓材４の外面の周囲部分（容器１と接合
部分）を樹脂接着剤によってモールドしてもよい。Also in the second embodiment, the peripheral portion of the outer surface of the window member 4 (joint portion with the container 1) may be molded with a resin adhesive, as in the first embodiment.
【００３２】また、図示しないが、窓材４を容器１の内
側から開口部３を閉塞するように容器１に接合してもよ
い。Although not shown, the window member 4 may be joined to the container 1 from the inside of the container 1 so as to close the opening 3.
【００３３】この発明は、母材５の片面にのみ多層膜が
形成された窓材４にも適用できることはいうまでもな
い。また、この発明は、容器１内に熱電堆型赤外線検出
素子を収容した熱電堆型赤外線検出器やその他の赤外線
検出器にも適用できることはいうまでもない。Needless to say, the present invention can be applied to the window member 4 in which the multilayer film is formed only on one surface of the base material 5. Further, it goes without saying that the present invention can also be applied to a thermoelectric stack type infrared detector in which the thermoelectric stack type infrared detecting element is housed in the container 1 and other infrared detectors.
【００３４】[0034]
【発明の効果】以上説明したように、請求項１の発明に
よれば、窓材と容器との接合が緊密に行われるので、従
来の合成樹脂接着剤による窓材と容器との接着に比べ、
気密性が大幅に向上するとともに、窓材の母材と容器と
が電気的に結合されるので、電磁気に対するシールド性
が向上する。したがって、長期間にわたって安定に動作
する赤外線検出器を得ることができる。As described above, according to the first aspect of the present invention, since the window material and the container are tightly bonded to each other, compared with the conventional bonding of the window material and the container with the synthetic resin adhesive. ,
The airtightness is significantly improved, and since the base material of the window material and the container are electrically coupled, the electromagnetic shielding property is improved. Therefore, it is possible to obtain an infrared detector that operates stably over a long period of time.
【００３５】また、請求項２の発明によれば、取扱い時
における外的な衝撃に対する窓材の角部の欠けを防止で
きるとともに、腐食性ガス雰囲気で使用しても、ハンダ
部分の表面層が腐蝕されることがなく、より安定に動作
する赤外線検出器を得ることができる。Further, according to the second aspect of the present invention, it is possible to prevent the corner portion of the window member from being chipped due to an external impact during handling, and even when it is used in a corrosive gas atmosphere, the surface layer of the solder portion is An infrared detector that does not corrode and operates more stably can be obtained.
【図１】この発明の第１実施例に係る焦電型赤外線検出
器の一例を示す断面図である。FIG. 1 is a sectional view showing an example of a pyroelectric infrared detector according to a first embodiment of the present invention.
【図２】図１に示す焦電型赤外線検出器の要部を示す拡
大断面図である。FIG. 2 is an enlarged sectional view showing a main part of the pyroelectric infrared detector shown in FIG.
【図３】この発明の第２実施例に係る焦電型赤外線検出
器の一例を示す断面図である。FIG. 3 is a sectional view showing an example of a pyroelectric infrared detector according to a second embodiment of the present invention.
【図４】図２に示す焦電型赤外線検出器の要部を示す拡
大断面図である。FIG. 4 is an enlarged cross-sectional view showing a main part of the pyroelectric infrared detector shown in FIG.
【図５】従来例の焦電型赤外線検出器を示す断面図であ
る。FIG. 5 is a sectional view showing a conventional pyroelectric infrared detector.
【図６】図５に示す焦電型赤外線検出器の要部を示す拡
大断面図である。6 is an enlarged cross-sectional view showing a main part of the pyroelectric infrared detector shown in FIG.
１…容器、３…開口部、４…赤外線透過窓材、５…母
材、５ａ…母材の断面部分、６，６Ａ，６Ｂ…波長選択
性多層膜、９…赤外線検出素子、１８，２２…金属層、
１９，２４…接合予定部分、２０，２５…ハンダ部分、
２１…樹脂接着剤。DESCRIPTION OF SYMBOLS 1 ... Container, 3 ... Opening part, 4 ... Infrared transmitting window material, 5 ... Base material, 5a ... Cross section of base material, 6,6A, 6B ... Wavelength selective multilayer film, 9 ... Infrared detecting element, 18, 22 … Metal layers,
19, 24 ... Joined portion, 20, 25 ... Solder portion,
21 ... Resin adhesive.
Claims (2)
性多層膜を形成した赤外線透過窓材を、赤外線検出素子
を収容した容器に形成された開口部に対して接合した赤
外線検出器において、前記窓材における少なくとも母材
の断面部分にハンダ可能な金属層を形成するとともに、
前記容器における窓材の接合予定部分をハンダ可能な表
面状態とし、窓材を前記接合予定部分にハンダを用いて
接合したことを特徴とする赤外線検出器。1. An infrared detector in which an infrared transmitting window material having a wavelength-selective multilayer film formed on a base material made of an infrared transmitting material is joined to an opening formed in a container accommodating an infrared detecting element, While forming a solderable metal layer on at least a cross-sectional portion of the base material in the window material,
An infrared detector characterized in that a portion of a window material to be joined in the container is in a solderable surface state, and the window material is joined to the portion to be joined by soldering.
いる窓材の周囲部分を樹脂接着剤によってモールドして
なる請求項１に記載の赤外線検出器。2. The infrared detector according to claim 1, wherein the peripheral portion of the window member joined to the container by solder is molded with a resin adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5341291A JP3047379B2 (en) | 1992-12-30 | 1993-12-11 | Infrared detector |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4-361070 | 1992-12-30 | ||
| JP36107092 | 1992-12-30 | ||
| JP5341291A JP3047379B2 (en) | 1992-12-30 | 1993-12-11 | Infrared detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06249709A true JPH06249709A (en) | 1994-09-09 |
| JP3047379B2 JP3047379B2 (en) | 2000-05-29 |
Family
ID=26576939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5341291A Expired - Fee Related JP3047379B2 (en) | 1992-12-30 | 1993-12-11 | Infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3047379B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08178746A (en) * | 1994-12-21 | 1996-07-12 | Ngk Insulators Ltd | Far infrared detector |
| EP0779503A3 (en) * | 1995-12-12 | 1998-11-11 | Murata Manufacturing Co., Ltd. | Infrared sensor |
| JP2010177298A (en) * | 2009-01-27 | 2010-08-12 | Panasonic Electric Works Co Ltd | Semiconductor device, and manufacturing method thereof |
| JP2020106542A (en) * | 2020-03-04 | 2020-07-09 | 浜松ホトニクス株式会社 | Light detection device |
| US11118972B2 (en) | 2015-04-28 | 2021-09-14 | Hamamatsu Photonics K.K. | Optical detection device having adhesive member |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57164430U (en) * | 1981-04-08 | 1982-10-16 | ||
| JPS6135317A (en) * | 1984-07-27 | 1986-02-19 | Matsushita Electric Ind Co Ltd | Sealing method of infrared transmission window |
| JPS6439528A (en) * | 1987-08-06 | 1989-02-09 | Matsushita Electric Ind Co Ltd | Sealing method for infrared-ray transmission window |
-
1993
- 1993-12-11 JP JP5341291A patent/JP3047379B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57164430U (en) * | 1981-04-08 | 1982-10-16 | ||
| JPS6135317A (en) * | 1984-07-27 | 1986-02-19 | Matsushita Electric Ind Co Ltd | Sealing method of infrared transmission window |
| JPS6439528A (en) * | 1987-08-06 | 1989-02-09 | Matsushita Electric Ind Co Ltd | Sealing method for infrared-ray transmission window |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08178746A (en) * | 1994-12-21 | 1996-07-12 | Ngk Insulators Ltd | Far infrared detector |
| EP0779503A3 (en) * | 1995-12-12 | 1998-11-11 | Murata Manufacturing Co., Ltd. | Infrared sensor |
| CN1072357C (en) * | 1995-12-12 | 2001-10-03 | 株式会社村田制作所 | Infrared sensor |
| JP2010177298A (en) * | 2009-01-27 | 2010-08-12 | Panasonic Electric Works Co Ltd | Semiconductor device, and manufacturing method thereof |
| US11118972B2 (en) | 2015-04-28 | 2021-09-14 | Hamamatsu Photonics K.K. | Optical detection device having adhesive member |
| US11555741B2 (en) | 2015-04-28 | 2023-01-17 | Hamamatsu Photonics K.K. | Optical detection device having adhesive member |
| JP2020106542A (en) * | 2020-03-04 | 2020-07-09 | 浜松ホトニクス株式会社 | Light detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3047379B2 (en) | 2000-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103988062B (en) | Infrared sensor | |
| WO2006120862A1 (en) | Infrared sensor and its manufacturing process | |
| US20020056897A1 (en) | Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same | |
| US5545849A (en) | Electronic component device and its manufacturing method | |
| JPH09311072A (en) | Infrared detector | |
| WO1993006444A1 (en) | Pyroelectric element | |
| JPH06249709A (en) | Infrared detector | |
| JP3210795B2 (en) | Infrared detector | |
| JP3304193B2 (en) | Window material for infrared detector and joining method thereof | |
| JPH09178549A (en) | Infrared detector | |
| JP3223461B2 (en) | Pyroelectric element | |
| JPH11211555A (en) | Infrared detector | |
| WO2013099799A1 (en) | Infrared detector | |
| JPS58127474A (en) | Silid state image pickup device | |
| JPH06201454A (en) | Infrared detector | |
| JPH11351959A (en) | Can with window material, method for fixing and temperature sensor | |
| JPS60235026A (en) | Manufacture of infrared detector | |
| JPH10178330A (en) | Surface acoustic wave element | |
| JPH10170337A (en) | Germanium infrared-ray transmissive window, its manufacture, and airtightly sealed package for infrared sensor | |
| JP2003032071A (en) | Surface acoustic wave device | |
| JP3285766B2 (en) | Package for storing optical semiconductor elements | |
| JPH0727615A (en) | Manufacture of pyroelectric infrared detector and structure thereof | |
| JPH0884042A (en) | Package member | |
| JP2000171294A (en) | Silicon infrared ray transmitting window, manufacture thereof, and airtight package for infrared ray sensing element | |
| JP2004022955A (en) | Package for containing infrared sensor element and infrared sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |