JPH06246625A - Both side polishing device - Google Patents

Both side polishing device

Info

Publication number
JPH06246625A
JPH06246625A JP3767893A JP3767893A JPH06246625A JP H06246625 A JPH06246625 A JP H06246625A JP 3767893 A JP3767893 A JP 3767893A JP 3767893 A JP3767893 A JP 3767893A JP H06246625 A JPH06246625 A JP H06246625A
Authority
JP
Japan
Prior art keywords
polished
work
polishing
holding
rotary shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3767893A
Other languages
Japanese (ja)
Inventor
Mitsuhide Isobe
光英 磯辺
Toshiro Yamashiro
敏郎 山城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Zosen Corp
Original Assignee
Hitachi Zosen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Zosen Corp filed Critical Hitachi Zosen Corp
Priority to JP3767893A priority Critical patent/JPH06246625A/en
Publication of JPH06246625A publication Critical patent/JPH06246625A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

PURPOSE:To improve the smoothness by rotatably supporting the outer circumferential edge of a disk-shaped work which is placed vertically by three holding rollers, arranging polishing tools on both sides of the work, providing the holding rollers in an elevatable manner, and thereby providing a complicated working locus. CONSTITUTION:A portal supporting frame body 5 is vertically provided in the center of a horizontal supporting table 2, an elevating body 8 which is elevated/lowered by an elevating device 9 is provided, and two supporting shaft bodies are pivotably supported by this elevating body 8. Lower side holding rollers 13 to hold the outer circumferential edge of a work W are mounted on the tip part of the respective shaft bodies 12, and at the same time, an upper side holding roller 13 is mounted on the end part of a supporting arm 16 which is supported by the elevating body 8 and swayed by a cylinder 15, and the respective rollers 13, 17 are interlockingly rotated by the action of a motor 25. A polishing tool 44 which is supported by the respective holding bodies 42 arranged on both sides of the supporting frame body 5 through a rotary shaft body 43 is pressed against the work W by the action of a pushing cylinder 47, and the polishing work is executed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えばハードディスク
用基板などの薄い円板状のワークの両面を研磨する両面
研磨装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-side polishing apparatus for polishing both sides of a thin disk-shaped work such as a hard disk substrate.

【0002】[0002]

【従来の技術】従来、この種の円板状のワークの両面を
研磨する研磨装置としては、大きいキャリアに複数個の
ワークを保持するとともに、このキャリアの上下に大き
い径の研磨具を配置して、研磨具およびキャリアを所定
方向に回転させて、複数個のワークの表裏面を同時に研
磨するものであった。
2. Description of the Related Art Conventionally, as a polishing apparatus for polishing both surfaces of a disk-shaped work of this type, a plurality of works are held in a large carrier, and a large-diameter polishing tool is arranged above and below the carrier. Then, the polishing tool and the carrier are rotated in a predetermined direction to simultaneously polish the front and back surfaces of a plurality of works.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記のような
研磨装置によると、一度に複数個のワークを研磨するた
め、すなわちバッチ式処理であるため、バッチ毎に研磨
状態の管理をする必要が生じ、面倒であるという問題が
あった。
However, according to the polishing apparatus as described above, since a plurality of works are polished at one time, that is, the batch type processing, it is necessary to manage the polishing state for each batch. There was a problem that it occurred and was troublesome.

【0004】例えば、バッチ式研磨を行う場合には、粗
加工と、仕上げ加工など各工程に渡って常に同一のバツ
チ毎に処理を行う必要がある。すなわち、バッチ式では
同一バッチ内でのワークの厚みの差は小さく問題はない
が、異なるバッチ間では厚み差があるため、バッチ毎の
厚み管理を行わないと、ある工程において、加工される
ワークと加工されないワークとが発生し、加工面粗さや
加工面平坦度に影響を与え、不良品を増加させてしま
う。
For example, when performing batch type polishing, it is necessary to always perform processing for each same batch over each process such as roughing and finishing. That is, in the batch type, the difference in the thickness of the work within the same batch is small and there is no problem, but since there is a difference in the thickness between different batches, the work to be processed in a certain process unless the thickness is controlled for each batch. And a workpiece that is not machined is generated, which affects the machined surface roughness and the machined surface flatness, increasing the number of defective products.

【0005】また、上記のバッチ式研磨においては、ワ
ークの供給位置および加工終了後のワークの位置を検出
するのが困難であり、またワークと研磨具は加工液によ
りリンギング(密着)するが、リンギング状態のワーク
を研磨具から引き離すのも面倒であった。
Further, in the above-mentioned batch type polishing, it is difficult to detect the supply position of the work and the position of the work after finishing the work, and the work and the polishing tool ring (contact) with the working liquid. It was also troublesome to separate the ringing work from the polishing tool.

【0006】そこで、本発明は上記問題を解消し得る両
面研磨装置を提供することを目的とする。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a double-sided polishing apparatus which can solve the above problems.

【0007】[0007]

【課題を解決するための手段】上記課題を解決するた
め、本発明の第1の手段は、ディスク状の被研磨材の外
周部において、このディスク状の被研磨材の外周縁を保
持する保持ローラを、支持体に昇降自在に設けられた昇
降部材に、少なくとも3箇所でかつ水平軸心回りで回転
自在に支持し、上記各保持ローラにより回転自在に保持
されたディスク状の被研磨材の両側位置に、保持体を介
して、被研磨材に対して接近離間自在な回転軸体を配置
し、この回転軸体の先端部に、被研磨材の表裏面を研磨
する研磨具を取り付け、上記回転軸体を回転させる回転
駆動装置を設けるとともに、回転軸体を介して上記両研
磨具を、被研磨材の表裏面に所定の付勢力で以て押し付
けるための押圧装置を設け、かつ上記昇降部材を昇降さ
せる昇降駆動装置を設けた両面研磨装置である。
In order to solve the above problems, the first means of the present invention is to hold the outer peripheral edge of a disk-shaped material to be polished at the outer peripheral portion of the disk-shaped material to be polished. The roller is supported by an elevating member provided on a support so as to be vertically movable at at least three locations and rotatably about a horizontal axis, and the disk-shaped material to be polished is rotatably held by the respective holding rollers. At both sides, a rotary shaft that is movable toward and away from the material to be polished is disposed via a holder, and a polishing tool for polishing the front and back surfaces of the material to be polished is attached to the tip of this rotary shaft. A rotary drive for rotating the rotary shaft is provided, and both polishing tools are provided via the rotary shaft with a pressing device for pressing the front and back surfaces of the material to be polished with a predetermined biasing force, and A lifting drive that lifts the lifting member Digits is a double-side polishing apparatus.

【0008】また、上記課題を解決するため、本発明の
第2の手段は、ディスク状の被研磨材の外周部におい
て、このディスク状の被研磨材の外周縁を保持する保持
ローラを、支持体に少なくとも3箇所でかつ水平軸心回
りで回転自在に支持し、上記各保持ローラにより回転自
在に保持されたディスク状の被研磨材の両側位置に、保
持体を介して、被研磨材に対して接近離間自在な回転軸
体を配置し、この回転軸体の先端部に、被研磨材の表裏
面を研磨する研磨具を取り付け、上記回転軸体を回転さ
せる回転駆動装置を設けるとともに、回転軸体を介して
上記両研磨具を、被研磨材の表裏面に所定の付勢力で以
て押し付けるための押圧装置を設け、かつ上記保持ロー
ラまたは研磨具をそれぞれの回転軸心に対して偏心させ
た位置に設けた両面研磨装置である。
In order to solve the above problems, the second means of the present invention is to support a holding roller for holding the outer peripheral edge of the disk-shaped material to be polished on the outer peripheral portion of the disk-shaped material to be polished. A disk-shaped material to be polished is rotatably supported on at least three locations around a horizontal axis and is rotatably held by each of the holding rollers. On the other hand, a rotary shaft body that can approach and separate is arranged, and at the tip of this rotary shaft body, a polishing tool for polishing the front and back surfaces of the material to be polished is attached, and a rotary drive device for rotating the rotary shaft body is provided, Both the polishing tools through the rotary shaft, a pressing device for pressing the front and back surfaces of the material to be polished with a predetermined biasing force, and the holding roller or polishing tool with respect to the respective rotation axis Both sides provided in an eccentric position A grinding apparatus.

【0009】[0009]

【作用】上記の各構成によると、保持ローラにより被研
磨材を一個だけ保持し、そして回転駆動装置により研磨
具を回転させるとともに押圧装置により被研磨材に押圧
することにより、被研磨材の両面を研磨具により同時に
研磨することができる。したがって、複数個の被研磨材
を一度にバッチ処理するものに比べて、バッチ毎に管理
をする必要がなく、また被研磨材の供給および取出し位
置の位置決めを行う必要がなく、また被研磨材は保持ロ
ーラにより保持されているので、研磨具とのリンギング
の心配がない。
According to each of the above constructions, only one piece of the material to be polished is held by the holding roller, and the polishing tool is rotated by the rotation driving device and pressed against the material to be polished by the pressing device. Can be simultaneously polished with a polishing tool. Therefore, compared to batch processing of a plurality of polishing materials at one time, it is not necessary to control each batch, and it is not necessary to position the supply and removal positions of the polishing material, and Is held by the holding roller, so there is no concern about ringing with the polishing tool.

【0010】さらには、被研磨材を保持する保持ローラ
が昇降させられるため、または保持ローラあるいは研磨
具がそれぞれの回転軸心に対して偏心させられているた
め、被研磨材の加工軌跡がランダムとなり、したがって
被研磨材の加工平面度が良好となる。
Further, since the holding roller for holding the material to be polished is moved up and down, or because the holding roller or the polishing tool is eccentric with respect to each rotational axis, the processing trajectory of the material to be polished is random. Therefore, the processing flatness of the material to be polished becomes good.

【0011】[0011]

【実施例】以下、本発明の第1の一実施例を図1〜図4
に基づき説明する。図1〜図4において、1は例えばハ
ードディスク用の薄い円形基板(以下、単にワークとい
う)Wの両面すなわち表裏面を研磨するための両面研磨
装置で、大きく分けて、水平支持台2と、この水平支持
台2の中央部に配置されたワークWの保持部3と、この
保持部3の両側位置の水平支持台2上に配置された研磨
部4とから構成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A first embodiment of the present invention will be described with reference to FIGS.
It will be explained based on. 1 to 4, reference numeral 1 denotes a double-side polishing apparatus for polishing both sides, that is, the front and back surfaces of a thin circular substrate (hereinafter, simply referred to as a work) W for a hard disk, which is roughly divided into a horizontal support table 2 and a horizontal support table 2. It is composed of a holding section 3 for the work W arranged in the central portion of the horizontal support base 2, and a polishing section 4 arranged on the horizontal support base 2 on both sides of the holding section 3.

【0012】上記保持部3は、水平支持台2上に立設さ
れた門形状の支持枠体(支持体)5と、この支持枠体5
に形成された両側のガイド溝5aに案内されるととも
に、その上面から突設された支持具6のフランジ部6a
と支持枠体5の水平部5bとの間に挿入された支持ばね
(圧縮ばね)7を介して昇降可能に支持された昇降板
(昇降部材)8と、この昇降板8を所定距離でもって昇
降させる昇降駆動装置9と、この昇降板8の左右位置か
らそれぞれ軸受11を介して回転自在に突出された2本
の支持軸体12と、これら各支持軸体12の先端部にそ
れぞれ取り付けられるとともにそれぞれ外周部にワーク
Wの外周縁を保持可能な溝部13aが形成された下側保
持ローラ13と、同じく昇降板8に、図1の矢印aにて
示すように、取付ピン(図示せず)を介して鉛直面内で
揺動自在に支持されるとともに支持ブラケット14を介
して取り付けられた揺動用シリンダー装置15により揺
動自在にされた支持アーム16と、この支持アーム16
の一端部に軸受(図示せず)を介して回転自在に取り付
けられるとともに外周部にワークWの外周縁を保持可能
な溝部17aが形成された上側保持ローラ17とから構
成されており、また上記各保持ローラ13,17は、図
4に示すように、同一鉛直面内で所定間隔でもってそれ
ぞれ配置されている。なお、支持具6の棒状取付部6b
は、図3に示すように、支持枠体5の水平部6bに形成
された貫通穴5c内を挿通されている。
The holding portion 3 is a gate-shaped support frame (support) 5 standing on the horizontal support base 2, and the support frame 5.
The flange portion 6a of the support tool 6 which is guided by the guide grooves 5a on both sides formed on the
And an elevating plate (elevating member) 8 which is elevatably supported by a supporting spring (compression spring) 7 inserted between the elevating plate 8 and a horizontal portion 5b of the supporting frame 5, and the elevating plate 8 is arranged at a predetermined distance. An elevating drive device 9 for elevating and lowering, two support shafts 12 rotatably projecting from the left and right positions of the elevating plate 8 via bearings 11, respectively, and attached to the tip ends of these support shafts 12, respectively. Along with the lower holding rollers 13 each having a groove portion 13a capable of holding the outer peripheral edge of the work W on the outer peripheral portion thereof, and also on the lift plate 8, as shown by an arrow a in FIG. ) And a supporting arm 16 which is oscillatably supported in the vertical plane by means of a oscillating cylinder device 15 mounted via a supporting bracket 14, and the supporting arm 16
An upper holding roller 17 which is rotatably attached to one end of the workpiece via a bearing (not shown) and has an outer peripheral portion formed with a groove 17a capable of holding the outer peripheral edge of the workpiece W. As shown in FIG. 4, the holding rollers 13 and 17 are arranged in the same vertical plane at predetermined intervals. The rod-shaped mounting portion 6b of the support 6 is
3 is inserted through a through hole 5c formed in the horizontal portion 6b of the support frame 5, as shown in FIG.

【0013】上記各保持ローラ13,17は合成樹脂に
より構成され、また2個の下側保持ローラ13について
は、回転駆動されるようにしている。すなわち、各下側
保持ローラ13を支持する支持軸体12の他端部には、
従動用プーリー21が取り付けられるとともに、これら
両従動用プーリー21同士が連結ベルト(図示せず)に
より互いに連動連結され、さらに一方の従動用プーリー
21に駆動ベルト23を介して連動連結された駆動用プ
ーリー24を回転させる第1電動機25が水平支持台2
上に配置されている。
Each of the holding rollers 13 and 17 is made of synthetic resin, and the two lower holding rollers 13 are rotationally driven. That is, at the other end of the support shaft 12 that supports each lower holding roller 13,
The driven pulley 21 is attached, the driven pulleys 21 are linked to each other by a coupling belt (not shown), and the driven pulley 21 is linked to the driven pulley 21 via a driving belt 23. The first electric motor 25 for rotating the pulley 24 is the horizontal support base 2
It is placed on top.

【0014】したがって、第1電動機25を駆動するこ
とにより、両下側保持ローラ13を所定速度でもって回
転させることができる。また、上記昇降駆動装置9は、
図3に示すように、支持枠体5の水平部5b上でかつ支
持具6のフランジ部6aの上方位置で駆動軸体31を介
して回転自在に設けられるとともにフランジ部6aを所
定距離でもって昇降させるカム体32と、このカム体3
2を駆動軸体31を介して回転させるカム用電動機(図
示せず)とから構成されている。なお、33は昇降駆動
装置9のケーシングであり、またカム用電動機によりカ
ム体32を直接回転させることもできる。
Therefore, by driving the first electric motor 25, both lower holding rollers 13 can be rotated at a predetermined speed. Further, the lifting drive device 9 is
As shown in FIG. 3, it is rotatably provided on the horizontal portion 5b of the support frame 5 and above the flange portion 6a of the support tool 6 via the drive shaft 31, and the flange portion 6a is provided at a predetermined distance. The cam body 32 for moving up and down, and this cam body 3
2 and a cam electric motor (not shown) for rotating the shaft 2 via the drive shaft 31. Reference numeral 33 is a casing of the lifting drive device 9, and the cam body 32 can be directly rotated by a cam motor.

【0015】したがって、カム用電動機により、支持ば
ね7の付勢力に抗してカム体32を回転させることによ
り、昇降板8が、すなわち各保持ローラ13,17が所
定距離でもって昇降することになる。
Therefore, by rotating the cam body 32 against the urging force of the support spring 7 by the cam motor, the lift plate 8, that is, the holding rollers 13 and 17 can be lifted and lowered by a predetermined distance. Become.

【0016】次に、左右の研磨部4について説明する
が、その主要構成については、左右とも同一構成であ
り、異なるのはその回転駆動源が一つであるということ
であり、したがって本実施例においては、左側の研磨部
4Aに着目して説明する。
Next, the left and right polishing parts 4 will be described. The main structure of the left and right polishing parts 4 is the same, and the difference is that there is only one rotary drive source. In the following, the description will focus on the polishing section 4A on the left side.

【0017】すなわち、この研磨部4Aは、支持枠体5
の左側の水平支持台2上に支持ブラケット41を介して
支持された保持体42と、この保持体42内に回転自在
に配置された回転筒体(図示せず)と、この回転筒体内
にセレーション部を介して挿通された、すなわち摺動可
能にかつ回転をも伝達可能に挿通された回転軸体43
と、この回転軸体43の先端部に取り付けられた研磨具
44と、上記水平支持台2に支持ブラケット45を介し
て支持されて上記回転軸体43の他端部を連結部材46
を介して押圧して研磨具44をワークWの表面に押圧す
るための押圧用シリンダー装置(押圧装置)47と、上
記回転筒体を回転させる回転駆動部とから構成されてい
る。
That is, the polishing section 4A is composed of the support frame 5
A holder 42 supported via a support bracket 41 on the left horizontal support base 2, a rotary cylinder (not shown) rotatably arranged in the holder 42, and a rotary cylinder (not shown) inside the rotary cylinder. The rotary shaft body 43 inserted through the serration portion, that is, slidably and also capable of transmitting rotation.
The polishing tool 44 attached to the tip of the rotary shaft 43, and the other end of the rotary shaft 43 supported by the horizontal support base 2 via the support bracket 45.
It is composed of a pressing cylinder device (pressing device) 47 for pressing the polishing tool 44 against the surface of the work W by pressing the rotary cylinder body and a rotary drive unit for rotating the rotary cylinder.

【0018】この回転駆動部は、上述したように、両側
研磨部4A,4Bの駆動を同時に行うようにしている。
すなわち、図2に示すように、水平支持台2上には、研
磨具44の回転軸心と平行に伝導軸体51が回転自在に
支持されるとともに、その両端部には、各回転筒体の端
部に取り付けられた従動用プーリー52に連結ベルト5
3を介して連動連結された従動用中間プーリー54が取
り付けられ、また上記伝導軸体51の一方の端部寄り途
中には、駆動用中間プーリー55が取り付けられるとと
もに、この駆動用中間プーリー55に駆動ベルト56を
介して連動連結された駆動用プーリー57を回転させる
第2電動機(回転駆動装置)58が水平支持台2上に配
置されている。
As described above, this rotary drive unit is designed to drive the both-side polishing units 4A and 4B at the same time.
That is, as shown in FIG. 2, the transmission shaft body 51 is rotatably supported on the horizontal support base 2 in parallel with the rotation axis center of the polishing tool 44, and the rotary cylinder bodies are provided at both ends thereof. Connected belt 5 to driven pulley 52 attached to the end of
A driven intermediate pulley 54, which is interlocked and connected via 3, is attached to the drive shaft 51, and a drive intermediate pulley 55 is attached to the drive intermediate pulley 55 midway near one end of the transmission shaft body 51. A second electric motor (rotational drive device) 58 that rotates a drive pulley 57 that is interlocked and coupled via a drive belt 56 is arranged on the horizontal support base 2.

【0019】また、この研磨部4には、回転軸体43の
移動量を制御するための制御装置61が設けられてい
る。この制御装置61は、図1に示すように、回転軸体
43と押圧用シリンダー装置47とを連結する連結部材
46に取り付けられた位置決め部材62と、保持体42
側に取り付けられて、上記位置決め部材62の先端に当
接可能にされた出退用ロッド部63aを有する位置決め
用シリンダー装置(ノックシリンダーともいう)63と
から構成されている。
Further, the polishing section 4 is provided with a control device 61 for controlling the movement amount of the rotary shaft body 43. As shown in FIG. 1, the control device 61 includes a positioning member 62 attached to a connecting member 46 that connects the rotating shaft body 43 and the pressing cylinder device 47, and a holding body 42.
A positioning cylinder device (also referred to as a knock cylinder) 63 that is attached to the side of the positioning member 62 and has a retractable rod portion 63a that can contact the tip of the positioning member 62.

【0020】なお、上記各シリンダー装置15,47,
63としては、例えばエアーシリンダーが使用されてい
る。次に、ワークWの研磨作業について説明する。
The cylinder devices 15, 47,
As 63, for example, an air cylinder is used. Next, the work of polishing the work W will be described.

【0021】まず、揺動用シリンダー装置15により、
上側保持ローラ17を上方に揺動させて、ワークWを下
側保持ローラ13により支持させた後、上側保持ローラ
17を下降させて、3個の保持ローラ13,17によ
り、正確には各ローラ13,17の溝部13a,17a
に案内させて保持させる(図4参照)。
First, with the swing cylinder device 15,
After swinging the upper holding roller 17 upward so that the work W is supported by the lower holding roller 13, the upper holding roller 17 is lowered, and by the three holding rollers 13 and 17, accurately each roller. Grooves 13a and 17a of 13 and 17
And hold it (see FIG. 4).

【0022】次に、押圧用シリンダー装置47により、
両側の回転軸体43をワークW側に移動させる。この移
動時においては、位置決め部材62が位置決め用シリン
ダー装置63の出退用ロッド部63aに当接するまで、
回転軸体43が前進する。
Next, by the pressing cylinder device 47,
The rotary shaft bodies 43 on both sides are moved to the work W side. During this movement, until the positioning member 62 abuts on the retractable rod portion 63a of the positioning cylinder device 63,
The rotating shaft body 43 advances.

【0023】そして、位置決め部材62が出退用ロッド
部63aに当接して、回転軸体43の前進が停止し、こ
の状態では、研磨具44がワークWの両面に対して所定
のクリアランスが保持されている。
Then, the positioning member 62 contacts the projecting / retracting rod portion 63a to stop the forward movement of the rotary shaft body 43. In this state, the polishing tool 44 maintains a predetermined clearance with respect to both surfaces of the work W. Has been done.

【0024】この状態で、各電動機25,58を駆動し
て、下側保持ローラ13および回転軸体43を介して両
側の研磨具44を同一方向に回転させながら、位置決め
用シリンダー装置63の出退用ロッド部63aを少しづ
つ引き込み、研磨具44をワークWの両面に等しい押圧
力でもって押圧することにより、ワークWの両面がソフ
トに研磨される。勿論、この時、ワークWには、図4に
示すように、加工液が吹付ノズル65により吹き付けら
れている。
In this state, the electric motors 25 and 58 are driven to rotate the polishing tools 44 on both sides in the same direction through the lower holding roller 13 and the rotary shaft body 43, and the positioning cylinder device 63 is projected. Both surfaces of the work W are softly polished by pulling the retracting rod portion 63a little by little and pressing the polishing tool 44 with the same pressing force to both surfaces of the work W. Of course, at this time, the working liquid is sprayed onto the work W by the spray nozzle 65 as shown in FIG.

【0025】そして、この時、ワークWの回転ととも
に、カム体32の回転により、昇降板8が昇降させら
れ、したがってワークWの表面がランダムに研磨される
ことになる。
At this time, as the work W rotates, the elevation plate 8 is moved up and down by the rotation of the cam body 32, so that the surface of the work W is randomly polished.

【0026】なお、この昇降板8が昇降する際に、第1
電動機25に対して下側保持ローラ13だけが昇降する
ことになり、したがってその駆動ベルト23には、昇降
を吸収し得るように、例えば移動可能に構成された中間
プーリーが設けられている。
When the elevating plate 8 moves up and down, the first
Only the lower holding roller 13 moves up and down with respect to the electric motor 25, so that the drive belt 23 thereof is provided with, for example, a movable intermediate pulley so as to absorb the up and down movement.

【0027】また、上記出退用ロッド部63aの引き込
み制御は、シリンダー本体内のエアーを抜くことにより
行われ、またこの抜くエアーの流量を緻密に制御すれ
は、ワークWの両面への研磨具44の押付力を常に等し
くすることができる。
Further, the pulling-in control of the withdrawal rod portion 63a is performed by bleeding the air in the cylinder body, and the precise control of the flow rate of the bleeding air is performed by the polishing tool on both sides of the work W. The pressing force of 44 can always be made equal.

【0028】このように、研磨するワークWを一枚づつ
保持して、その両面を研磨具により研磨するようにした
ので、従来のように、複数枚のワークを一度にバッチ処
理するものに比べて、バッチ毎のワークの管理をする必
要がなく、またワークの供給および取出し位置の位置決
めを行う必要がなく、さらにワークは保持ローラにより
保持されているので、研磨具とのリンギングの心配がな
い。
As described above, since the workpieces W to be polished are held one by one and both surfaces thereof are polished by the polishing tool, as compared with the conventional one that batch-processes a plurality of workpieces at a time. Therefore, there is no need to manage the work for each batch, there is no need to position the supply and take-out positions of the work, and since the work is held by the holding roller, there is no concern about ringing with the polishing tool. .

【0029】さらに、ワークWを保持する保持ローラが
所定距離でもって昇降させられるため、ワークWの加工
軌跡が単調でなくなり、したがって研磨具などの癖によ
る悪影響をうけることが防止されるので、ワークWの加
工平面度が良好となる。
Further, since the holding roller for holding the work W is moved up and down by a predetermined distance, the machining locus of the work W becomes non-monotonous, and therefore, the adverse effects of the habit of the polishing tool and the like are prevented. The processing flatness of W becomes good.

【0030】次に、本発明の第2の実施例を、図5およ
び図6に基づき説明する。すなわち、上記第1の実施例
においては、ワークWを保持する保持ローラを支持する
昇降板を昇降させるようにしたが、本第2の実施例にお
いては、昇降板を昇降させる替わりに、下側保持ローラ
を鉛直面内で移動し得るように構成したものである。
Next, a second embodiment of the present invention will be described with reference to FIGS. That is, in the first embodiment described above, the lifting plate that supports the holding roller that holds the work W is moved up and down, but in the second embodiment, instead of moving the lifting plate up and down, the lower side The holding roller is configured to be movable in the vertical plane.

【0031】すなわち、図5に示すように、各支持軸体
12の先端部に取り付けられる下側保持ローラ13の中
心位置を、支持軸体12の中心軸bに対して所定距離c
だけ偏心させており、また上側保持ローラ17を支持す
る支持アーム16は、支持枠体(この場合には、昇降板
は設けられない)5側の中央板体部71に形成されたガ
イド空間部72内に昇降可能に挿入された昇降体73上
に取り付けられるとともに、この昇降体73を下方に押
圧する押圧部材として圧縮ばね74が設けられている。
That is, as shown in FIG. 5, the center position of the lower holding roller 13 attached to the tip of each support shaft 12 is set to a predetermined distance c with respect to the center axis b of the support shaft 12.
The support arm 16 that is eccentric only and that supports the upper holding roller 17 has a guide space portion formed in the central plate portion 71 on the support frame body (in this case, the elevating plate is not provided) 5 side. A compression spring 74 is provided as a pressing member that is mounted on an elevating body 73 that is inserted in 72 so as to elevate and lower, and that presses the elevating body 73 downward.

【0032】したがって、この構成において、下側保持
ローラ13を回転させれば、図6の仮想線および実線に
て示すように、その偏心距離(cにほぼ等しい距離)で
もって、下側保持ローラ13すなわちワークWが上下に
移動し、上記と同様に、ワークWの研磨加工面の平面度
が良好となる。
Therefore, in this structure, when the lower holding roller 13 is rotated, the lower holding roller 13 has an eccentric distance (a distance substantially equal to c) as shown by the phantom line and the solid line in FIG. 13, that is, the work W moves up and down, and the flatness of the polished surface of the work W becomes good as in the above.

【0033】勿論、下側保持ローラ13が上下方向に揺
動した場合、上側保持ローラ17は昇降体73の移動に
より追従し得る。さらに、上記第2の実施例において
は、下側保持ローラ13を、その支持軸体12の回転軸
心bに対して偏心させることにより、ワークWの研磨加
工面をランダムに移動させるようにしたが、例えば左右
の研磨具44の回転中心を、その回転軸体43の回転軸
心に対して、所定距離でもって偏心させるようにして
も、上記と同様の効果が得られる。
Of course, when the lower holding roller 13 swings in the vertical direction, the upper holding roller 17 can follow the movement of the lifting body 73. Further, in the second embodiment, the lower holding roller 13 is eccentric with respect to the rotation axis b of the support shaft body 12 so that the polishing surface of the work W is randomly moved. However, even if the rotation center of the left and right polishing tools 44 is eccentric with respect to the rotation axis of the rotation shaft body 43 by a predetermined distance, the same effect as described above can be obtained.

【0034】ところで、上記各実施例においては、ワー
クを保持する保持ローラを3個設けたが、3個に限定さ
れるものではなく、例えば4個設けてもよい。また、上
記各実施例においては、下側保持ローラを第1電動機に
より回転させるようにしたが、例えばこの下側保持ロー
ラも上側保持ローラと同様に、単に軸受を介して回転自
在に支持させるようにしてもよい。なお、この場合に
は、図4に示すように、ワークWの回転中心に対して研
磨具44が偏心した位置に設けられているため、ワーク
Wにおける接触面での内周側と外周側との相対速度差に
より、ワークW自身が自然に回転される。
By the way, in each of the above embodiments, three holding rollers for holding the work are provided, but the number of holding rollers is not limited to three and may be four, for example. Further, in each of the above-described embodiments, the lower holding roller is rotated by the first electric motor. However, like the upper holding roller, for example, the lower holding roller may be rotatably supported via the bearing. You may In this case, as shown in FIG. 4, since the polishing tool 44 is provided at a position eccentric with respect to the rotation center of the work W, the inner peripheral side and the outer peripheral side of the contact surface of the work W are Due to the relative speed difference of the work W, the work W itself is naturally rotated.

【0035】さらに、上記実施例においては、吹付ノズ
ル65によりワークに加工液を吹き付けるようにした
が、例えば回転軸体43の内部に加工液の供給穴を形成
し、回転軸体43から研磨具44側に加工液を供給する
ようにしてもよい。
Further, in the above-mentioned embodiment, the working liquid is sprayed onto the work by the spray nozzle 65. However, for example, a working liquid supply hole is formed inside the rotary shaft body 43, and the rotary shaft body 43 is used to polish the work liquid. The working fluid may be supplied to the 44 side.

【0036】[0036]

【発明の効果】以上のように本発明の構成によると、被
研磨材を一個づつ保持して、その両面を研磨具により研
磨するようにしたので、従来のように、複数個の被研磨
材を一度にバッチ処理するものに比べて、バッチ毎に管
理をする必要がなく、また被研磨材の供給および取出し
位置の位置決めを行う必要がなく、また被研磨材は保持
ローラにより保持されているので、研磨具とのリンギン
グの心配がない。
As described above, according to the structure of the present invention, since the materials to be polished are held one by one and both surfaces thereof are polished by the polishing tool, a plurality of materials to be polished can be conventionally used. It is not necessary to manage each batch, and it is not necessary to position the supply and removal positions of the material to be polished, compared with the case where batch processing is performed at once, and the material to be polished is held by a holding roller. Therefore, you do not have to worry about ringing with the polishing tool.

【0037】そして、さらに被研磨材を保持する保持ロ
ーラが所定距離でもって昇降させられるため、または保
持ローラあるいは研磨具をそれぞれの回転軸心に対して
偏心させたので、被研磨材の加工軌跡が単調でなくな
り、したがって研磨具などの癖による悪影響をうけるこ
とが防止されるので、加工平面度が良好となる。
Further, since the holding roller for holding the material to be polished can be moved up and down by a predetermined distance, or because the holding roller or the polishing tool is eccentric with respect to each rotation axis, the processing locus of the material to be polished is obtained. Is not monotonous, and therefore is prevented from being adversely affected by the habit of the polishing tool or the like, so that the processing flatness is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例における研磨装置の全体
側面図である。
FIG. 1 is an overall side view of a polishing apparatus according to a first embodiment of the present invention.

【図2】図1のA−A矢視図である。FIG. 2 is a view on arrow AA of FIG.

【図3】同実施例の研磨装置の昇降駆動装置の要部正面
図である。
FIG. 3 is a front view of a main part of a lifting drive device of the polishing apparatus of the embodiment.

【図4】同実施例における研磨作業を説明する要部正面
図である。
FIG. 4 is a front view of relevant parts for explaining a polishing operation in the embodiment.

【図5】本発明の第2の実施例における研磨装置の要部
断面図である。
FIG. 5 is a cross-sectional view of essential parts of a polishing apparatus in a second embodiment of the present invention.

【図6】同第2の実施例における研磨作業を説明する要
部正面図である。
FIG. 6 is a front view of relevant parts for explaining a polishing operation in the second embodiment.

【符号の説明】[Explanation of symbols]

W ワーク 1 両面研磨装置 2 水平支持台 3 保持部 4 研磨部 5 支持枠体 6 支持具 8 昇降板 9 昇降駆動装置 13 下側保持ローラ 17 上側保持ローラ 25 第1電動機 32 カム体 42 保持体 43 回転軸体 44 研磨具 47 押圧用シリンダー装置 58 第2電動機 W work 1 double-sided polishing device 2 horizontal support 3 holding part 4 polishing part 5 support frame 6 support 8 lift plate 9 lifting drive device 13 lower holding roller 17 upper holding roller 25 first electric motor 32 cam body 42 holding body 43 Rotating shaft 44 Polishing tool 47 Cylinder device for pressing 58 Second electric motor

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】ディスク状の被研磨材の外周部において、
このディスク状の被研磨材の外周縁を保持する保持ロー
ラを、支持体に昇降自在に設けられた昇降部材に、少な
くとも3箇所でかつ水平軸心回りで回転自在に支持し、
上記各保持ローラにより回転自在に保持されたディスク
状の被研磨材の両側位置に、保持体を介して、被研磨材
に対して接近離間自在な回転軸体を配置し、この回転軸
体の先端部に、被研磨材の表裏面を研磨する研磨具を取
り付け、上記回転軸体を回転させる回転駆動装置を設け
るとともに、回転軸体を介して上記両研磨具を、被研磨
材の表裏面に所定の付勢力で以て押し付けるための押圧
装置を設け、かつ上記昇降部材を昇降させる昇降駆動装
置を設けたことを特徴とする両面研磨装置。
1. An outer peripheral portion of a disk-shaped material to be polished,
A holding roller for holding the outer peripheral edge of the disk-shaped material to be polished is supported by an elevating member provided on a support so as to be vertically movable at at least three locations and rotatably around a horizontal axis,
Rotating shafts that are movable toward and away from the material to be polished are disposed at both sides of the disk-shaped material to be polished rotatably held by each of the holding rollers via a holder. A polishing tool for polishing the front and back surfaces of the material to be polished is attached to the tip portion, and a rotary drive device for rotating the rotary shaft body is provided. A double-sided polishing apparatus, comprising: a pressing device for pressing with a predetermined biasing force, and an elevating drive device for elevating the elevating member.
【請求項2】ディスク状の被研磨材の外周部において、
このディスク状の被研磨材の外周縁を保持する保持ロー
ラを、支持体に少なくとも3箇所でかつ水平軸心回りで
回転自在に支持し、上記各保持ローラにより回転自在に
保持されたディスク状の被研磨材の両側位置に、保持体
を介して、被研磨材に対して接近離間自在な回転軸体を
配置し、この回転軸体の先端部に、被研磨材の表裏面を
研磨する研磨具を取り付け、上記回転軸体を回転させる
回転駆動装置を設けるとともに、回転軸体を介して上記
両研磨具を、被研磨材の表裏面に所定の付勢力で以て押
し付けるための押圧装置を設け、かつ上記保持ローラま
たは研磨具をそれぞれの回転軸心に対して偏心させた位
置に設けたことを特徴とする両面研磨装置。
2. An outer peripheral portion of a disk-shaped material to be polished,
A holding roller that holds the outer peripheral edge of the disk-shaped material to be polished is rotatably supported by at least three locations around a horizontal axis on a support, and is held rotatably by the holding rollers. A rotary shaft that is movable toward and away from the material to be polished is placed on both sides of the material to be polished via a holder, and the front and back surfaces of the material to be polished are polished at the tip of this rotary shaft. A tool is attached and a rotation drive device for rotating the rotary shaft is provided, and a pressing device for pressing both the polishing tools via the rotary shaft to the front and back surfaces of the material to be polished with a predetermined biasing force. A double-sided polishing apparatus, characterized in that the holding roller or the polishing tool is provided at a position eccentric with respect to each rotation axis.
JP3767893A 1993-02-26 1993-02-26 Both side polishing device Pending JPH06246625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3767893A JPH06246625A (en) 1993-02-26 1993-02-26 Both side polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3767893A JPH06246625A (en) 1993-02-26 1993-02-26 Both side polishing device

Publications (1)

Publication Number Publication Date
JPH06246625A true JPH06246625A (en) 1994-09-06

Family

ID=12504279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3767893A Pending JPH06246625A (en) 1993-02-26 1993-02-26 Both side polishing device

Country Status (1)

Country Link
JP (1) JPH06246625A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003001560A (en) * 2001-06-22 2003-01-08 Semiconductor Leading Edge Technologies Inc Substrate lapping apparatus, substrate lapping method and semiconductor device
CN105538071A (en) * 2015-11-30 2016-05-04 合保电气(芜湖)有限公司 Grinding device for two end surfaces of lightning arrester valve block

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57144654A (en) * 1981-03-03 1982-09-07 Nec Corp Polishing method for high density magnetic disk substrate
JPH0475869A (en) * 1990-07-17 1992-03-10 Sano Fuji Koki Kk Both side polishing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57144654A (en) * 1981-03-03 1982-09-07 Nec Corp Polishing method for high density magnetic disk substrate
JPH0475869A (en) * 1990-07-17 1992-03-10 Sano Fuji Koki Kk Both side polishing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003001560A (en) * 2001-06-22 2003-01-08 Semiconductor Leading Edge Technologies Inc Substrate lapping apparatus, substrate lapping method and semiconductor device
CN105538071A (en) * 2015-11-30 2016-05-04 合保电气(芜湖)有限公司 Grinding device for two end surfaces of lightning arrester valve block

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