JPH06232205A - Packaging semiconductor device and semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the strain of a semiconductor device due to the shrinkage stress of an adhesive and to improve the reliability of an electrical connection in packaging. CONSTITUTION:A metal bump 2 is formed on a semiconductor device 1, a conductive terminal 4 is formed on a substrate 3 which packages the semiconductor device 1, and, when the bump 2 is connected to the terminal 4, the periphery of a connection is buried. An adhesive 5-1 sufficient to fill a gap between the semiconductor device 1 and the packaging substrate 3 is applied to the semiconductor device 1 or the substrate 3. In a condition of the bump 2 pressed to the terminal 4, the adhesive 5-1 is hardened. Further, as a bump 2-1 to replace the bump 2, a groove 12 is formed on the surface, or as a bump 2-5 a recessed part 18-1 which retains the surface contour is formed and used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor device (chip), and more particularly to a mounting method for maintaining the connection between the semiconductor device and its mounting substrate with an adhesive. This is to prevent uneven electrical connection due to the use of bumps.

[0002]

2. Description of the Related Art For example, in a liquid crystal display panel, a main method of mounting a driving semiconductor chip on the display panel is as follows.
How to use COG (Chip on Glass) technology and TAB
There is a method to use (TapeAutomatid Bonding) technology,
In the method using the COG technique, the contraction stress of the adhesive is used to maintain the connection between the metal bump and the conductor terminal.

FIG. 17 is an explanatory view of a conventional semiconductor chip mounted by COG, and FIG. 18 is an explanatory view of a conventional semiconductor chip mounting method in a liquid crystal display panel. In FIG. 17, a large number of metal bumps 2 made of, for example, gold are provided on a semiconductor chip 1 for driving a liquid crystal display panel, and a glass substrate 3 for a liquid crystal display panel on which the semiconductor chip 1 is mounted is formed on the glass substrate 3. A conductor terminal 4 communicating with a transparent electrode (not shown),
The conductor terminal 41 for external connection is formed, and the conductor terminals 4 and 41 are
The predetermined bumps 2 of the semiconductor chip 1 are connected (abutted), and in order to maintain the connection and fix the semiconductor chip 1, a glass substrate 3 is coated and a space between the semiconductor chip 1 and the glass substrate 3 is filled. The shrinkage stress and adhesive force of the cured resin adhesive 5 are used.

In FIG. 18, (a), (b), (c), (d) and (e) are explanatory views of the semiconductor chip mounting process, and (f) is a description of the spread of the adhesive when the semiconductor chip is mounted. It is a figure. In FIG. 18 (a), a liquid crystal display panel 21 has a pair of glass substrates 3 and 22 on which transparent electrodes for display and the like are opposed to each other with a predetermined gap, and a liquid crystal is placed in the facing gap hermetically sealed with a sealing material 23. The conductor terminal 4 connected to the display electrode and the conductor terminal 41 for external connection are exposed in the exposed portion of the glass substrate 3 which is filled.

Therefore, as shown in FIG.
After dropping an appropriate amount of the semiconductor chip mounting adhesive 5 onto the glass substrate 3 using 24, the semiconductor chip 1 is
As shown in (c), it is adsorbed on the lower surface of the bonding tool 25, conveyed above the adhesive 5, and positioned with respect to the conductor terminals 4 and 41.

Next, the bonding tool 25 is lowered or the glass substrate 3 is raised so that the bumps 2 formed on the semiconductor chip 1 are brought into contact with the terminals 4 and 41 as shown in FIG. When the curing treatment of 5 is performed, the mounting of the semiconductor chip 1 is completed as shown in FIG.

In such a conventional method, the adhesive 5 which is dropped on the glass substrate 3 and spread by the semiconductor chip 1 and then cured is a generally rectangular semiconductor chip 1 as shown in FIG. And the glass substrate 3 is expanded into an elliptical shape.

[0008]

As described above,
In the conventional semiconductor chip mounting method using an adhesive, the bump 2 pushes the adhesive 5 away and connects to the conductor terminals 4 and 41, and the adhesive 5 filled between the semiconductor chip 1 and the glass substrate 3 is The structure for maintaining the electrical connection between the bump 2 and the conductor terminals 4 and 41 has the following problems in the mounting method of the semiconductor chip 1.

The shrinkage stress of the adhesive 5 filled between the semiconductor chip 1 and the glass substrate 3 and hardened causes the semiconductor chip 1 to be distorted into a concave shape. As a result, the electrical characteristics of the semiconductor chip 1 change.

The height of a large number (for example, several tens) of bumps 2 provided on the semiconductor chip 1 is generally about 2 μm, and due to variations in the height of the bumps 2 which are difficult to manage, a connection failure (contact resistance Excessive) may occur.

The adhesive 5 is likely to remain between the bump and the conductor terminal, which results in poor connection (excessive contact resistance).
May occur. It is necessary to consider the spread of the adhesive 5 in the dimension of the glass substrate 3, and thus the glass substrate 3 is upsized.

[0012]

FIG. 1 is an explanatory diagram of the basic configuration of the present invention. As shown in FIG. 1 (a), bumps 2 are provided on predetermined portions of a semiconductor chip (semiconductor device) 1, and as shown in FIG. 1 (b), a glass substrate 3 on which the semiconductor chip 1 is mounted is
The same conductor terminals 4 and 41 as the conventional one are arranged.

Then, as shown in FIG. 1C, the glass substrate 3
The semiconductor chip 1 is mounted on, but the adhesive 5 _-1 is the bump 2
And the connecting portions of the conductor terminals 4 and 41 are covered, and the gap between the semiconductor chip 1 and the glass substrate 3 is not filled.

A suitable amount of such an adhesive 5 _-1 is applied to the bumps 2 or the contact portions of the conductor terminals 4 and 41 with the bumps 2, or a sheet-like adhesive is applied along the bump row, for example. It is cut into strips and used by adhering it to the glass substrate 3 or the semiconductor chip 1, and the bumps 2 are cured by heating or irradiation with ultraviolet rays while being pressed against the conductor terminals 4 and 41.

Further, for example, as shown in FIGS.
Bump 2 of semiconductor device in invention _-1, 2_-FiveIs the connection partner
Crossing groove 12 or surface contour on the surface that abuts the conductor terminal of
Recessed part 18_-1To prevent plastic deformation of the bump tip.
And the adhesive sandwiched between the bump and the terminal can be easily pushed out.
Do not use for electrical connection bumps and electrical connection
Used together with dummy bumps, electrical connection bumps and conductor ends
I suggest not to put an adhesive between the children
Of.

[0016]

In the above means, the adhesive 5 _-1 for mounting the semiconductor chip 1 on the glass substrate 3 is applied only to the connecting portions between the bumps 2 and the terminals 4 and 41, and the contracting stress thereof causes the bumps 2 and the terminals 4 to be bonded. The semiconductor chip 1 is fixed to the glass substrate 3 by its adhesive force, while acting to maintain the connection with the terminals 41 and 41 as in the conventional case. However, since the adhesive 5 _-1 is not filled in a gap between the semiconductor chip 1 and the glass substrate 3, the shrinkage stress is limited to the peripheral connection portion between the bump 2 and the terminal 4 and 41, by conventional adhesive The distortion of the semiconductor chip 1 will not occur.

When the semiconductor chip 1 is mounted, if a sheet-like adhesive is used or dummy bumps are used, it is possible to prevent the adhesive from being applied between the bump 2 and the terminals 4 and 41. The electrical connection between the terminals 4 and 41 becomes more reliable.

Further, in the above means, providing the groove or recess on the bump surface facilitates plastic deformation of the tip of the bump.
In addition, the adhesive sandwiched between the bump 2 and the terminals 4 and 41 can be easily pushed out, and the contact resistance between the bump and the terminal can be reduced.

[0019]

FIG. 2 is an explanatory view of the first embodiment of the method of the present invention,
3 is an explanatory view of a second embodiment of the method of the present invention, FIG. 4 is an explanatory view of a third embodiment of the method of the present invention, FIG. 5 is an explanatory view of a fourth embodiment of the method of the present invention, and FIG. Is an explanatory view of a fifth embodiment of the method of the present invention, FIG. 7 is an explanatory view of a sixth embodiment of the method of the present invention,
8 is an explanatory view of a seventh embodiment of the present invention method, FIG. 9 is an explanatory view of an eighth embodiment of the present invention method, and FIG. 10 is a bump shaping tool used in the ninth embodiment of the present invention method. 11 is an explanatory view of a bump shaping and bump connecting method in the ninth embodiment of the present invention method, and FIG. 12 is a tenth embodiment of the present invention method.
13 is an explanatory view of an eleventh embodiment of the method of the present invention, FIG. 14 is an explanatory view of a twelfth embodiment of the method of the present invention, and FIG.
15 is an explanatory view of the 13th embodiment of the method of the present invention, and FIG. 16 is an explanatory view of bumps used in the 14th embodiment of the method of the present invention.

The semiconductor chip 1 shown in FIG.
As shown in (a), a large number of bumps 2 are arranged and the glass substrate 3
As shown in FIG. 2B, the same conductor terminals 4 and 41 as the conventional one are formed on the semiconductor chip 1, and further, on the semiconductor chip 1, as shown in FIG.
Adhesive 5 that covers the bumps 2 so that it does not leak out
Apply _-1 .

Next, the semiconductor chip 1 positioned so that the bumps 2 face the predetermined conductor terminals 4 and 41 is pressed against the glass substrate 3 and the adhesive 5 _-1 is cured by heating or ultraviolet irradiation. the adhesive 5 _-1 as shown in FIG. 2 (d), without filling the opposing gap between the semiconductor chip 1 and the glass substrate 3, so as to cover the connection portions between the bump 2 and the conductor terminal 4, 41 The shrinkage stress associated with the curing of the adhesive 5 _-1 maintains the electrical connection between the bump 2 and the conductor terminals 4 and 41 and fixes the semiconductor chip 1 on the glass substrate 3.

The adhesive _5-1 is the mounting method of the semiconductor chip 1, adhered only to the bump connection portion without filling the opposing gap between the semiconductor chip 1 and the glass substrate 3, the deformation of the semiconductor chip 1 due to the mounting (Distortion) hardly occurs,
The characteristics of the semiconductor chip 1 before mounting are not changed.

[0023] In FIG. 3, a large number of bumps 2 _-1 having a plurality of groove-like recess 12 in the surface as shown in FIG. 3 (b), is disposed on the external connection conductor pads 11 of the semiconductor chip 1 . The recess 12 is formed by, for example, embossing (stamping) after the bump 2 _-1 is bonded to the pad 11.

Next, as shown in FIG. 3B, the bump 2 _-1
After given coating an adhesive 5 _-1 to not protrude as much as possible over the, the semiconductor chip 1 is mounted on a glass substrate 3 that conductor terminal 4, 41 are formed, a glass substrate 3 of the semiconductor chip 1
When the adhesive _5-1 is cured while pressing it toward
As shown in (c), mounting of the semiconductor chip 1 is completed in which to connect the bump 2 _-1 in a predetermined conductor terminal 4 and 41.

In the method of mounting the semiconductor chip 1, the adhesive 5 _-1 partially fills the concave portion 12 of the bump 2 _-1 , and adheres only to the bump connecting portion, so that the semiconductor chip 1 and the glass substrate 3 are bonded together.
Since the gaps facing each other are not filled, the semiconductor chip 1 is hardly deformed (distorted) due to mounting, and the bump 2 _-1 and the adhesive 5 _-1 are formed more than when the bump 2 having a flat surface is used. Since the bonding area of is increased, the fixing force for fixing the semiconductor chip 1 to the glass substrate 3 is increased.

[0026] In FIG. 4, on the number of external connection conductor pads 11 formed on the semiconductor chip 1 is provided with a bump 2 _-1 composed by gold or the like. As shown in FIG. 4 (a), a plurality of recesses 12 are formed on the surface of the bump 2 _-1 , for example, by embossing, and then the bump 2 _-1 is covered as shown in FIG. 4 (b), and
Adhesive 5 to prevent it from protruding from bump 2 _{-1 as} much as possible
Apply _-1 .

In FIG. 4C, a transparent electrode (not shown)
A conductor terminal 4 _-1 communicating with the transparent electrode and a conductor terminal 41 _-1 for external connection are formed on the glass substrate 3 on which the bumps 2 are formed on the conductor terminals 4 _-1 , 41 _-1. A plurality of protrusions (irregularities) 13 facing _-1 are formed by, for example, an etching method.

Therefore, the semiconductor chip 1 is positioned so that the convex portion of the bump 2 _-1 formed by forming the concave portion 12 and the protrusion 13 of the terminals 4 _-1 , 41 _-1 are brought into contact with each other, and then the semiconductor chip 1 is attached to the glass substrate. It is pressed toward 3, and the adhesive _5-1 is cured by heating, irradiation of ultraviolet rays, or the like.

Then, as shown in FIG. 4D, the adhesive 5
_-1 indicates the bump 2 _-1 , the terminal 4 _-1, and the bump 2 without filling the facing gap between the semiconductor chip 1 and the glass substrate 3.
_-1 and the terminal 41 _-1.
-1 and the terminals 4 _-1 , 41 _-1 are electrically connected by the contracting stress of the adhesive 5 _-1 , and the semiconductor chip 1 is fixed on the glass substrate 3.

In the method of mounting the semiconductor chip 1 as described above, the adhesive 5 _-1 has a part of the recess 12 of the bump 2 _-1 and the terminal 4.
₋₁ , 41 ₋₁ fills the recesses due to the formation of the protrusions 13 and adheres only to the bump connection portions, and does not fill the facing gap between the semiconductor chip 1 and the glass substrate 3, so that the semiconductor chip 1 is deformed during mounting ( The fixing force of the semiconductor chip 1 is increased as compared with the case where the bump 2 and the conductor 4 in which the distortion is hardly generated and the surface is not provided with unevenness are used.

In FIG. 5A, the semiconductor chip 1 has
The bumps 2 located on the conductor pads 11 communicating with the in-chip elements and the dummy bumps 14 not communicating with the in-chip elements are provided.

The dummy bumps 14 correspond to the bumps 2 in a one-to-one manner and are located outside the bumps 2. The surface of the dummy bumps 14 is made uneven by forming depressions 13 by embossing or the like.

Then, as shown in FIG. 5B, dummy bumps are formed.
An adhesive 5 _-1 is applied so as to cover the bumps 14 and prevent the bumps 14 from protruding as much as possible, and in particular not to adhere to the bumps 2.

In FIG. 5C, a transparent electrode (not shown)
The glass substrate 3 on which is formed is provided with conductor terminals 4 and 41 which communicate with the transparent electrode and face predetermined bumps 2 and 14. However, the conductor terminal 4 communicates with the transparent electrode of the glass substrate 3, and the conductor terminal 41 is for external connection.

[0035] Therefore, given the bumps 2, 14 of the semiconductor chip 1 in which the adhesive 5 _-1 and downward so as to face the predetermined conductor terminals 4 and 41 of the glass substrate 3, after positioning the semiconductor chip 1 , The semiconductor chip 1 is pressed toward the glass substrate 3, and the adhesive 5 _-1 is cured by heating or ultraviolet irradiation while the bumps 2 are in contact with the conductor terminals 4 and 41.

Then, as shown in FIG. 5D, the adhesive 5
_-1 is cured so as to cover the connecting portion between the bump 14 and the conductor terminals 4 and 41 without filling the facing gap between the semiconductor chip 1 and the glass substrate 3, and the electrical conductivity of the bump 2 and the conductor terminals 4 and 41 is increased. The physical connection and the bonding between the semiconductor chip 1 and the glass substrate 3 are maintained by the shrinkage stress and the adhesive force of the cured adhesive 5 _-1 .

In the method of mounting the semiconductor chip 1, the tip of the dummy bump 14 is easily plastically deformed by forming the recess 13, and the height of the bump 2 including the pad 11 is h and the height of the bump 14 is h. ₋₁ , h <h ₋₁ , and if the difference between the bump heights h and h ₋₁ is within the plastic deformation easy width of the tip of the bump 14, the bump 2 and the conductor terminal
Connection with the 4 and 41 are readily eliminate fear of film of adhesive 5 _-1 is formed between the connection, it becomes ensured, an adhesive 5 _-1 opposing gap between the semiconductor chip 1 and the glass substrate 3 Since the filling is not performed, the deformation (distortion) of the semiconductor chip 1 due to the mounting hardly occurs.

In FIG. 6 (a), the semiconductor chip 1 has
When a plurality of small metal bumps _2-2 over each contact pad 11, for example, bumps 2,2 _-1 surface of supra is 100 [mu] m × 100 [mu] m, for example surface 100 [mu] m × 30 [mu] m or 30 [mu] m
A plurality of bumps 2 _-2 having a size of 30 μm are provided.

Therefore, the adhesive 5 is provided so as to cover the plurality of bumps 2 _-2 provided on the same pad 11 and to prevent the bumps 2 _-2 from protruding as much as possible, and in particular not to adhere to the inside of the pad 11. _{-1 is applied} to the semiconductor chip 1 of the above embodiment
Similarly, the semiconductor chip 1 is mounted on the glass substrate 3 on which the conductor terminals 4 and 41 are formed.

[0040] Then, when the adhesive is cured 5 _-1 by heating or ultraviolet irradiation, or the like as shown in FIG. 6 (b), without being filled in the opposing gap between the semiconductor chip 1 and the glass substrate 3, the bump 2 _{- 2} and the conductor terminals 4 and 41 are electrically connected,
The semiconductor chip 1 is fixed to the glass substrate 3, fixed and their electrical connection will be maintained by the adhesive force and contraction stress of adhesive _5-1.

The mounting method of the semiconductor chip 1, that is, the mounting method of the semiconductor chip 1 using a plurality of small bumps 2 _-2 is the same chip because the bump 2 _-2 is more easily plastically deformed than that of the bump 2. Even if there are variations in the height of the large number of bumps 2 provided on the semiconductor device 1, it is possible to eliminate the electrical connection failure when mounting the semiconductor chip.

In FIG. 7A, the semiconductor chip 1 has
A metal bump 2 _-1 is provided on the conductor pad 11, and a dummy bump 14 that is not connected to an in-chip element is provided inside each bump 2 _-1 . The dummy bump 14 has the same shape as the recess 13 of the bump 2 _-1. A recess 15 is provided.

[0043] Therefore, so as not possible protrude inside and outside of the bump 14 covering the bumps 14 are denoted by coating an adhesive 5 _-1 bump 14, as in the semiconductor chip 1 of the embodiment, the conductor The semiconductor chip 1 is mounted on the glass substrate 3 on which the terminals 4 and 41 are formed.

[0044] Then, when the adhesive is cured 5 _-1 by heating or ultraviolet irradiation, or the like as shown in FIG. 7 (b), without being filled in the opposing gap between the semiconductor chip 1 and the glass substrate 3, the bump 2 _{- 1} and the conductor terminals 4 and 41 are electrically connected,
The semiconductor chip 1 is fixed to the glass substrate 3.

In the mounting method of the semiconductor chip 1, when the height of the bump 2 _-1 including the pad 11 is h and the height of the bump 14 is h _-1 , h <h _-1 and the bump height is Assuming that the difference between h and h ₋₁ is within the plastic deformation easy width of the tip of the bump 14, the bump 2 ₋₁ and the terminal 4,
The connection with 41 is easy and reliable without the concern that a film of the adhesive 5 _-1 is formed between the connections, and the adhesive 5 _-1 is not filled in the facing gap between the semiconductor chip 1 and the glass substrate 3. Therefore, the deformation (distortion) of the semiconductor chip 1 due to the mounting hardly occurs.

In FIG. 8A, on the conductor pad 11 of the semiconductor chip 1, a metal base 18, a resin body 16 formed on the metal base 18 and cured, an exposed surface of the metal base 18, and a resin body A bump 2 _-3 made of a solder layer 17 covering 16 is formed.

[0047] Therefore, to cover the bump 2 _-3, and so as not possible protrude from the bump 2 _-3, denoted coating the adhesive 5 _-1 the bump 2 _-3, and the semiconductor chip 1 of the embodiment Similarly, the glass substrate 3 on which the conductor terminals 4 (and 41) are formed
The semiconductor chip 1 is mounted on.

Then, the semiconductor chip 1 is pressed against the glass substrate 3 with a pressing force that the resin body 16 is appropriately crushed and spread, and the adhesive _5-1 is cured by heating or ultraviolet irradiation, as shown in FIG. ), The bump 2-3 is not filled in the facing gap between the semiconductor chip 1 and the glass substrate _3.
And the conductor terminal 4 (and 41) and the semiconductor chip 1 and the glass substrate 3 are mechanically connected by the adhesive 5
It will be maintained by _-1 .

In FIG. 9A, the conductor of the semiconductor chip 1
On the pad 11, a pair of resin bodies 16 _-1, Resin body 16_-1Cover
Bump 2 consisting of solder layer 17_-FourTo form. Therefore,
Bump 2_-FourAnd bump 2_-FourEat as much as possible
Bump 2 so that it does not come out_-FourTo the adhesive 5_-1And apply
Like the semiconductor chip 1 of the above-described embodiment, the conductor terminals 4 (and
The semiconductor chip 1 is mounted on the glass substrate 3 on which
List.

Next, when the semiconductor chip 1 is pressed against the glass substrate 3 with a pressing force that the resin body 16 _-1 is appropriately crushed and spreads, and the adhesive 5 _-1 is cured by heating or ultraviolet irradiation, the result is shown in FIG. as shown in (b), without being filled in the opposing gap between the semiconductor chip 1 and the glass substrate 3, the bump 2 _-4
And the conductor terminal 4 (and 41) and the semiconductor chip 1 and the glass substrate 3 are mechanically connected by the adhesive 5
It will be maintained by _-1 .

In FIG. 10, (a), (b), (c) and (d) are perspective views of the metal bump according to the present invention, and (e) is a tool for shaping the concave portion of the metal bump surface shown in (a). A side view, (f) is a plan view of the tip surface of the tool shown in (e).

[0052] In FIG. 10 (b), the metal bumps 2 _-5 consisting by gold or the like, in contact with the surface conductor terminal is connected are made to form an annular recess 18 _-1 leaving a surface profile, Recess 18 _-1
Is the tip surface 32 of the shaping tool 31 shown in FIGS.
Tip surface 32 having an annular recess 33 corresponding to the recess 18 _-1
Are formed by pressing on the surface of the bump 2 _-5 .

[0053] In FIG. 10 (b), the metal bumps 2 _-6 made by gold and the like, in contact with the surface conductor terminal is connected are obtained by forming a rectangular recess 18 _-2 leaving a surface profile. The recess 18 _-2 is formed by a pressing tool similar to the tool 31, that is, a tool in which a recess corresponding to the recess 18 _-2 is formed on the tip surface.

[0054] In FIG. 10 (c), the metal bumps 2 _-7 made by gold and the like, in contact with the surface conductor terminal is connected are obtained by forming a cross-shaped recess 18 _-3 leaving a surface profile. Recess 18 _-3
Is formed by a pressing tool similar to the tool 31, that is, a tool in which a concave portion corresponding to the concave portion 18 _-3 is formed on the tip surface.

In FIG. 10 (d), a metal bump _2-8 made of gold or the like has a V-shaped recess _18-4 having a surface contour left on the surface which contacts the conductor terminal of the connection partner. Recess 18 _-4
Is formed by a pressing tool similar to the tool 31, that is, a tool in which a concave portion corresponding to the concave portion 18 _-4 is formed on the tip surface.

[0056] In the following, the shaping method and the metal bumps 2 _-5 metal bumps 2 _-5 explaining how to connect to a conductor terminal 4 (or 41) with reference to FIG. 11. In FIG. 11 (a), after the metal bumps 2 are formed on the predetermined portions of the semiconductor chip 1, FIG.
When the tip surface 32 of the tool 31 is pressed against the surface of the metal bump 2 as shown in Fig. 11, the bump _2-5 having the annular recess 18 _-1 formed on the surface is completed as shown in the plan view of Fig. 11C. .

Therefore, as shown in FIG. 11D, the glass substrate 3
After given coating an adhesive 5 _-1 over the conductor terminal 4 (and 41), then positioning the semiconductor chip 1 to the conductor terminal 4 as shown in FIG. 11 (e), 11 (f) As shown, the bumps 2 _-5 are brought into contact with the conductor terminals 4, and the adhesive 5 _-1 is cured to complete the mounting of the semiconductor chip 1.

In the method of mounting the semiconductor chip 1, the tip surface of the bump 2 _-5 pushes the adhesive 5 _-1 to contact the conductor terminal 4, and the adhesive sandwiched between the tip surface and the conductor terminal 4 is applied. A part of the agent 5 _-1 is extruded to the outside of the tip end surface of the bump and the other part is extruded into the recess 18 _-1 , so that the electrical connection between the bump 2 _-5 and the conductor terminal 4 is ensured.

The recesses 18 _-2 or 18 _-3 or 18 _-4 formed in the bumps 2 _-6 , 2 _-7 , 2 _-8 play the same role as the recesses 18 _-1 and the bumps 2 _-6 , 2 _-7, contributes to the reliability of electrical connection 2 _-8.

The embodiment shown in FIG. 12 relates to another method of applying an adhesive which connects the bumps _2-5 to the conductor terminals 4 (and 41). In FIG. 12 (a), the adhesive 37 is evenly applied to the surface of the adhesive transfer plate 36, for example, by screen printing,
Apply by a leveling method using a squeegee.

Next, as shown in FIG. 12B, an adhesive transfer tool is prepared.
38, that is, bump 2_-FiveThe recess of 18 _-1The protrusion corresponding to
Abut the tip surface of the formed tool 38 with the adhesive 37,
As shown in Fig. 12 (c), part of the adhesive 37_-1The tool 38 tip
Apply to the end face.

Next, as shown in FIG. 12D, after the adhesive 37 _-1 of the tool 38 is transferred to the recesses 18 _-1 of the bumps 2 _-5 ,
As shown in Fig. 12 (e), _attach the tip of the bump 2 _-5 to the conductor terminal 4
(And 41), the adhesive 37 _-1 is cured, and then the adhesive 39 is applied to the periphery of the bump 2 _-5 and the curing is performed. As shown, the mounting of the semiconductor chip 1 is completed.

The mounting method of the semiconductor chip 1 is such that the adhesive 37 _-1 and the adhesive 37 _-1 are provided between the tip surface of the bump 2 _-5 and the conductor terminal 4.
39 does not wear. Therefore, the reliability of the electrical connection between the bump _2-5 and the conductor terminal 4 is increased.

In FIG. 13, (a) is a perspective view of the semiconductor chip mounting adhesive sheet 51, (b) is a side view of the adhesive sheet 51 bonded to the glass substrate 3, and (c) is a semiconductor substrate on the glass substrate 3. FIG. 3 is a side view of the chip 1 mounted, and (d) is a plan view in which a part of the mounted semiconductor chip 1 is broken and removed.

In FIG. 13 (a), the adhesive sheet 51 has a square shape that faces a large number of bumps 2 provided on the four sides of the semiconductor chip 1, and the adhesive film 51 _-1 and the protective films _51-2 and 51-2.
_-3 is sandwiched between.

Therefore, first, the protective film _51-2 is peeled off, and the structure shown in FIG.
As shown in (b), the adhesive film 51 _-1 is adhered to the glass substrate 3. The adhesive 51 _-1 covers the bump connecting portions of the conductor terminals 4 and 41 formed on the glass substrate 3.

[0067] Then, the protective film 51 _-3 After peeled, the semiconductor chip 1 is positioned and pressed against the glass substrate 3, contact bumps 2 to the conductor terminal 4, 41 (connection) allowed the adhesive film 51 _{- When} the hardening process ₁ is performed, the mounting of the semiconductor chip 1 is completed as shown in FIG.

In mounting the semiconductor chip 1 as described above,
Bump 2 instead of bump 2_-1Or 2 _-2Or 2_-3Or
Two_-FourOr 2_-FiveIt is possible to mount semiconductor chip 1 with
In addition, between the semiconductor chip 1 and the glass substrate 3 is shown in FIG.
As shown in (c) and (d), a cavity 52 is formed, which
Therefore, the semiconductor chip 1 is distorted due to mounting (variation of characteristics).
Will not occur.

In FIG. 14, (a) is a perspective view of the semiconductor chip mounting adhesive sheet 56, (b) is a plan view in which the adhesive film 56 _-1 of the adhesive sheet 56 is bonded to the glass substrate 3, (c) )
FIG. 6 is a plan view of the adhesive sheet 56 with the protective film 56 _-3 removed.

In FIG. 14 (a), the adhesive sheet 56 has a square shape facing the many bumps 2 of the semiconductor chip 1 and
It has a notch 57 on one side, that is, a shape in which a groove 57 is formed in an adhesive sheet 56, and has a sandwich structure in which an adhesive film 56 _-1 is sandwiched between protective films 56 _-2 and 56 _-3 .

The adhesive sheet 56 is the adhesive sheet 51.
It is used in the same manner as described above and used for mounting the semiconductor chip 1. Immediately
Then, as shown in FIG._-2Peel off the adhesive
Rum 56 _-1After bonding to the glass substrate 3, it is shown in Fig. 14 (c).
As protective film 56_-3Peel off the adhesive film 56_-1On top of the
Place the semiconductor chip 1 indicated by the one-dot chain line, and
Adhesive 56 with the tape 1 pressed against the glass substrate 3_-1
The semiconductor chip 1 is completely mounted by carrying out the hardening process of
It

When mounting the semiconductor chip 1 as described above,
Bump 2 instead of bump 2_-1Or 2 _-2Or 2_-3Or
Two_-FourOr 2_-FiveIt is possible to mount semiconductor chip 1 with
Therefore, there is no contact between the semiconductor chip 1 and the glass substrate 3.
A cavity similar to that when using the adhesive sheet 51 is formed.
It

Such a cavity prevents distortion (variation in characteristics) of the semiconductor chip 1 due to mounting, and the notch 57 allows air inside the cavity in mounting the semiconductor chip to escape to the outside (air pressure inside the cavity is the same as atmospheric air). To). Therefore, the mounting distortion of the semiconductor chip 1 according to this embodiment is further reduced as compared with the embodiment described with reference to FIG.

In FIG. 15, (a) is an explanatory view of a strip-shaped adhesive film 58 for mounting a semiconductor chip, (b) is an explanatory view of a U-shaped adhesive film 59 for mounting a semiconductor chip, and (c) is a semiconductor chip mounting. FIG. 6 is an explanatory view of a window opening U-shaped adhesive film 60 for use in a computer.

In FIG. 15 (a), a pair of strip-shaped adhesive films 58 indicated by alternate long and short dash lines are formed by removing a protective film (not shown) attached to the lower surface of the adhesive film 58 so that the conductor terminals 4 and 41 are arranged in two rows. After being adhered to the glass substrate 3 formed in step 1, the protective film (not shown) adhered to the upper surface is peeled off, and the bump contact portions at the tips of the conductor terminals 4 and 41 are as shown in FIG. The pair of strip-shaped adhesive films 58 shown by the one-dot chain line peels off the protective film stuck on the lower surface and sticks it on the glass substrate 3, and then peels off the protective film stuck on the upper surface, Cover the bump contact part at the tip of 41.

[0076] The adhesive film 58, the available adhesive film 56 _-1 similarly to the mounting semiconductor chip 1, i.e., a semiconductor chip 1 placed on the adhesive film 58 toward the glass substrate 3 presses Then, the curing process is performed in that state.

In FIG. 15B, the U-shaped adhesive film 59 indicated by the alternate long and short dash line is the protective film adhered on the upper surface after the protective film adhered on the lower surface is peeled off and adhered on the glass substrate 3. Is peeled off to cover the bump contact portions at the tips of the conductor terminals 4, 41.

The adhesive film 59 is used for mounting the semiconductor chip 1 similarly to the adhesive films _56-1 and 58, that is, the semiconductor chip 1 placed on the adhesive film 59 is directed to the glass substrate 3. And press, and the curing process is performed in that state.

In FIG. 15C, a U-shaped adhesive film
The 60 is formed by forming through holes 60 _-1 , 60 _-2 and 60 _-3 on three sides of the U-shape. After peeling off the protective film attached to the lower surface and attaching it to the glass substrate 3, it is attached to the upper surface. The conductor terminal 4 is placed in the through holes 60 _-1 , 60 _-2 , 60 _{-3 of} the adhesive film 60 from which the attached protective film has been peeled off.
And the bump contact portions at the tips of 41 are exposed.

The adhesive film 60 is used for mounting the semiconductor chip 1 similarly to the adhesive films _56-1, 58 and 59, that is, the semiconductor chip 1 placed on the adhesive film 60 is attached to the glass substrate 3. It is pressed toward, and the curing process is performed in that state. And through holes 60 _-1 , 60 _-2 , 60
_-3 is provided and does not overlap the tip bump contact portion of the conductor terminal 4 or 41, the reliability of the electrical connection of the bump is
Higher than with adhesive film 56 _-1 or 58 or 59.

[0081] In FIG. 15 (d), the adhesive film 61 is made by forming a through hole 61 _-1 and 61 _-2, then peeling the protective film adhered to the lower surface, protection adhered to the upper surface The bump contact portions at the tips of the conductor terminals 4 and 41 are exposed in the through holes 61 _-1 , 61 _-2 of the adhesive film 61 from which the film has been peeled off.

The adhesive film 61 is made of the adhesive film described above.
Film 56_-1And semiconductor chips as well as 58 and 59 and 60.
It is used for mounting the chip, that is, mounted on the adhesive film 61.
The semiconductor chip 1 is pressed toward the glass substrate 3,
In this state, the curing process is started. And the adhesive fi
Rum 60 through hole 60_-1, 60_-2, 60_-3Through hole similar to 61_-1And 61 _-2
By providing the
Reliability is improved.

However, the cured adhesive film 61
Adheres to the entire lower surface of the mounted semiconductor chip 1.
Therefore, the semiconductor chip 1 mounted by using the adhesive film 61 is suitable for those whose characteristics do not change due to the shrinkage stress of the adhesive film 61 due to, for example, the element configuration in the chip or the small size.

Although the adhesive film 60 is first placed on the glass substrate 3 in the above embodiment, the adhesive film 60
It is also possible to first attach 60 to the semiconductor chip 1 and then mount the semiconductor chip 1 on the glass substrate 3. At that time, the adhesive film 60 is naturally smaller than the semiconductor chip 1.

16 (a), (b), (c) and (d) are the conductor terminals described above.
Bump 2 that ensures electrical connection when connected to 4,41
_-9, 2 _-10, 2 _-11 2 _-12 is a perspective view of a bump 2 _-9 upper surface (the connection terminal connecting surface) frustoconical projection 19 _-1 protrudes,
Truncated pyramid projections 19 _-2 on the upper surface of the bump 2 _-10 protrudes, cross projection 19 _-3 on the upper surface of the bump 2 _-11 protrudes is V-shaped projection 19 _-4 on the upper surface of the bump 2 _-12 Project.

The projections 19 _-1 , 19 _-2 , 19 _-3 , 19 _-4 are, for example, tools similar to the recesses 18 _-1 , 18 _-2 , 18 _-3 , 18 _-4 , that is, projections on the tip surface. It is formed by a pressing tool (not shown) in which concave portions corresponding to 19 _-1 , 19 _-2 , 19 _-3 , 19 _-4 are formed.

The bumps 2 _-9 , 2 _-10 , 2 _-11 , 2 _-12 are
The same effect as the above-mentioned bump 2 _{-1 in} which the groove 12 is formed, that is,
By providing the protrusions 19 _-1 , 19 _-2 , 19 _-3 , 19 _-4 which are easily plastically deformed, when they are brought into contact with the conductor terminal of the connection partner,
This has the effect of increasing the reliability of the electrical connection.

[0088]

As described above, according to the method of the present invention, the mounting distortion of the semiconductor chip does not occur in the mounting method of the semiconductor chip which utilizes the shrinkage stress obtained by curing the adhesive. This has the effect of ensuring the characteristics before mounting the semiconductor chip.

Further, providing bumps on the bump surface,
By providing grooves or recesses on the bump surface, the plastic deformation of the tip of the bump can be facilitated, the contact resistance between the bump and the terminal can be reduced, and the fixing force of the semiconductor chip can be increased. The use of the dummy bumps or the use of an adhesive film that does not adhere between the bumps and the conductor terminals has the effect of reducing and stabilizing the contact resistance between the electrical connection bumps and the terminals.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a basic configuration of a semiconductor device mounting method according to the present invention.

FIG. 2 is an explanatory view of the first embodiment of the method of the present invention.

FIG. 3 is an explanatory diagram of a second embodiment of the method of the present invention.

FIG. 4 is an explanatory diagram of a third embodiment of the method of the present invention.

FIG. 5 is an explanatory view of a fourth embodiment of the method of the present invention.

FIG. 6 is an explanatory view of a fifth embodiment of the method of the present invention.

FIG. 7 is an explanatory view of a sixth embodiment of the method of the present invention.

FIG. 8 is an explanatory diagram of a seventh embodiment of the method of the present invention.

FIG. 9 is an explanatory diagram of an eighth embodiment of the method of the present invention.

FIG. 10 is an explanatory diagram of a configuration example of a bump shaping tool used in a ninth embodiment of the method of the present invention.

FIG. 11 is an explanatory diagram of a ninth embodiment of the method of the present invention.

FIG. 12 is an explanatory diagram of a tenth embodiment of the method of the present invention.

FIG. 13 is an explanatory diagram of an eleventh embodiment of the method of the present invention.

FIG. 14 is an explanatory diagram of a twelfth embodiment of the method of the present invention.

FIG. 15 is an explanatory diagram of a thirteenth embodiment of the method of the present invention.

FIG. 16 is an explanatory view of a bump used in a fourteenth embodiment of the method of the present invention.

FIG. 17 is an explanatory diagram of a conventional semiconductor chip mounted with COG.

FIG. 18 is an explanatory diagram of a conventional semiconductor chip mounting method for a liquid crystal display panel.

[Explanation of symbols]

1 semiconductor chip (semiconductor device) 2,2 _-1 , 2,2 _-2 , 2 _-3 , 2 _-4 , 2 _-5 , 2 _-6 , 2 _-7 , 2 _-8 , 2 _-9 , 2 _-10 , 2 _-11 ,
2 _-12 metallic bumps 3 glass substrate (mounting substrate) 4, 41 conductive terminal _25-1 adhesive 14 dummy bumps 16, 16 ₁ resin member 17 solder layer 51 _-1, 56 _-1, 58, 59, 60, 61 bonded Adhesive film 57 Notch of adhesive film 60 _-1 , 60 _-2 , 60 _-3 , 61 _-1 , 61 _{-2 Cutout of} adhesive film

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiaki Sukeda 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor Toshio Sakata 1015, Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited ( 72) Inventor Shinichi Kasahara, 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa, within Fujitsu Limited (72) Inventor Akira Matsunaga 1015, Uedota, Nakahara-ku, Kawasaki, Kanagawa within Fujitsu Limited

Claims (13)

[Claims] 1. The semiconductor device (1) and its mounting substrate (3) are provided on one side with metal bumps (2,2 _-1 , 2, _-2 , 2 _-3 , 2 _-4 , 2 _-5 , 2 _-6 , 2 _-7 ,
2 _-8 , 2 _-9 , 2 _-10 , 2 _-11 , 2 _-12 ), and a conductor terminal (4,41) for electrically connecting the bump is formed on the other side of the bump and the conductor terminal. When you connect, fill the area around the connection,
An amount of adhesive (5 _-1 ) that forms a gap between the semiconductor device (1) and the mounting substrate (3) is applied to the bump or the conductor terminal, and the bump is applied to the conductor terminal. A method for mounting a semiconductor device, comprising contacting and curing the adhesive. 2. The method for mounting a semiconductor device according to claim 1, wherein the metal bumps (2 _-1 , 2 _-5 , 2 _-6 , 2 _-7 , 2 _-8 , 2 _-9 , 2
_-10 , 2 _-11 , 2 _-12 ). A method of mounting a semiconductor device, characterized in that unevenness is provided on the surface. 3. The method for mounting a semiconductor device according to claim 2, wherein the metal bumps (2 _-1 , 2 _-5 , 2 _-6 , 2 _-7 , 2 _-8 , 2 _-9 , 2
_-10 , 2 _-11 , 2 _-12 ). Surface unevenness is formed by pressing the metal bumps. 4. The method for mounting a semiconductor device according to claim 3, wherein the concave and convex portions on the surface of the metal bumps (2 ₋₅ , 2 ₋₆ , 2 ₋₇ , 2 ₋₈ ) are formed on the contour of the surface. A method for mounting a semiconductor device, which is characterized by being formed without hanging. 5. The method for mounting a semiconductor device according to claim 2, wherein the concave and convex portions provided on the surface of the metal bumps (2 _-1 , 2 _-5 , 2 _-6 , 2 _-7 , 2 _-8 ) are provided. The adhesive (5 _-1 ) before connecting the metal bump to the conductor terminal (4, 41) according to claim ₁ .
A method for mounting a semiconductor device, characterized in that a part of the above is adhered. 6. The method for mounting a semiconductor device according to claim 1, wherein the metal bumps (2 ₋₃ , 2 ₋₄ ) are cured.
(16,16 _-1 ) with a solder layer (17) coated, the bump is pressed against the conductor terminal (4,41) so that the resin body is deformed, and the solder layer and the conductor terminal A method for mounting a semiconductor device, comprising: 7. The semiconductor device (1) and its mounting substrate (3) are provided with metal bumps (2) on one side and conductor terminals (4, 41) on the other side for electrically connecting the bumps, An adhesive film (51 _-1 , 56 _-1 , 58) having a shape that fills the periphery of the connection portion when the bump and the terminal are connected and forms a gap between the semiconductor device and the mounting substrate (3) facing each other. , 59, 60, 61) is adhered to the mounting substrate or the semiconductor device, and the bumps are pressed against the conductor terminals to cure the adhesive film. 8. The method of mounting a semiconductor device according to claim 7, wherein the adhesive film (51 ₋₁ , 56 ₋₁ ) has a substantially square shape corresponding to the arrangement of the conductor terminals (4, 41). What is claimed is: 1. A semiconductor device mounting method, comprising: 9. The method for mounting a semiconductor device according to claim 8, wherein the bump (2) and the terminals (4, 41) are provided at least at one location of the square-shaped adhesive film (56 ₋₁ ). A method for mounting a semiconductor device, comprising: providing a notch (57) that is closed by a curing process of the adhesive film in a state where the above are connected. 10. The method of mounting a semiconductor device according to claim 7, wherein the adhesive film (60, 61) exposes the metal bump (2) at a connection portion with the conductor terminal (4, 41). A method for mounting a semiconductor device, wherein cutouts (60 _-1 , 60 _-2 , 60 _-3 , 61 _-1 , 61 _-2 ) are provided. 11. A semiconductor device (1) and one of its mounting substrate (3) are provided with metal bumps (2,2 ₋₁ ) electrically connected in an electric circuit and dummy bumps (14) not electrically connected in a circuit. , On the other side, a conductor terminal (4, 41) for connecting the metal bump and the dummy bump is formed, and when the metal bump and the dummy bump are connected to the conductor terminal, the periphery of the connection portion between the dummy bump and the conductor terminal is formed. The dummy bump is coated with an adhesive (5 _-1 ) in an amount such that there is a gap between the semiconductor device and the mounting substrate, and the metal bump and the dummy bump are pressed against the conductor terminals to remove the adhesive. A method for mounting a semiconductor device, which comprises curing. 12. The method of mounting a semiconductor device according to claim 11, wherein the dummy bump (14) is replaced with the metal bump.
(2,2 _-1 ) A method of mounting a semiconductor device, which is characterized by being formed to be harder and have a lower height. 13. A conductor terminal of a semiconductor device mounting board (3)
In a semiconductor device in which metal bumps (2 _-5 , 2 _-6 , 2 _-7 , 2 _-8 ) connected to (4, 41) are formed, the bumps whose surface abuts the conductor terminal The semiconductor device is characterized in that concave portions (18 _-1 , 18 _-2 , 18 _-3 , 18 _-4 ) having the contours of the above are formed.