JPH05102343A - Mounting structure of semiconductor device and mounting method of semiconductor device - Google Patents

Abstract

PURPOSE:To provide a method by which the reliability on the connection is high and which never causes electric conductivity trouble, in case of mounting a semiconductor element on a glass board, with the active face opposite to it. CONSTITUTION:A semiconductor element 1 is loaded on a wiring board 4 where a through hole 9 is opened, and the adhesive for fixing is hardened by heat. Moreover, in case of having used a photosetting adhesive, it can be made the hardening from the rear of the semiconductor device and the hardening from the rear of the glass board. This way, by having opened a through hole, the adhesive can be escaped to outside, so it does not give stress to the connection. Moreover, even if trouble should be found, the semiconductor device could be removed simply from the glass wiring board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure and a mounting method for a semiconductor device in which a semiconductor element is mounted on a glass wiring board.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for mounting a plurality of semiconductor elements at high density and thinly on a wiring substrate having a constant area such as a liquid crystal display or an IC memory card.

As a mounting method to meet these demands, as shown in FIG. 5, the active surface 2 of the semiconductor element 1 is connected to the connection portion 6 in which the conductive particles 15 are arranged on the wiring pattern 5 arranged on the glass wiring board 4. Then, the electrode 3 of the semiconductor element 1 is aligned with the connecting portion 6 and the fixing adhesive 8 is cured to connect the electrode 3 of the semiconductor element 1 to the wiring pattern 5 arranged on the glass wiring board 4. A method for electrically connecting the portion 6 is known. In order to fix the glass wiring board 4 and the semiconductor element 1 to each other as described above, the fixing adhesive 8 is applied by an arrangement means such as potting or transfer printing,
Connection part 6 between electrode 3 of semiconductor element 1 and glass wiring board 4
The semiconductor element 1 is placed on the glass wiring substrate 4 in alignment with each other, and the heating tool 11 having an up / down mechanism (not shown) is lowered to heat and press from the semiconductor element back surface 12 as shown in the sectional view of FIG. Then, the fixing adhesive 8 is hardened and then the heating tool 11 is raised again, whereby the electrode 3 of the semiconductor element 1 and the wiring pattern 5 on the glass wiring substrate 4
It was possible to make an electrical connection with the connection portion 6 of.

[0004]

However, in the above-mentioned prior art, in the case of connecting the electrode of the semiconductor element and the wiring pattern, the heat distribution of the heating tool is not uniform, the surface state of the back surface of the semiconductor element, and the bonding for fixing. There is a problem that the fixing adhesive is apt to be hardened due to the uneven curing rate of the agent, the difference in the heat radiation state of the substrate connecting portion, and the like, and the electrical connection is easily caused.

Further, in the reliability test after connection, when the thermal shock test is repeated, the semiconductor element, the wiring board, and the fixing adhesive, interface peeling on each connection surface, cracking of the fixing adhesive, and connection Problems such as poor electrical continuity due to floating parts occur.

Further, even if a defective connection or a defective function of the semiconductor element is found as a result of the inspection of the electric characteristics of the connected semiconductor element, it is difficult to remove the semiconductor element from the connection point.

Therefore, the present invention has been made to solve the above problems, and its purpose is to provide a highly reliable and electrically conductive connecting portion when connecting a semiconductor element on a substrate. Defect-free mounting structure of semiconductor device and highly reliable connection part does not cause electrical continuity failure, and even if a failure is found, removal of semiconductor element from glass wiring board There is provided a method of mounting a semiconductor device which can be easily manufactured.

[0008]

According to the mounting structure of a semiconductor device of the present invention, a semiconductor element and a glass wiring board having a connecting portion at a position facing an electrode of the semiconductor element are connected to an active surface of the semiconductor element or a glass wiring. After applying a fixing adhesive to the semiconductor element arrangement area of the substrate, the active surface of the semiconductor element and the glass wiring board are arranged to face each other, and the electrodes of the semiconductor element and the connection portion of the glass wiring board are electrically connected. In a semiconductor device for connection, a connection portion of a glass wiring board in which a through hole penetrating the front surface and the back surface of the glass wiring board is arranged within the semiconductor element arrangement range of the glass wiring board facing the active surface of the semiconductor element. And the electrodes of the semiconductor element are aligned and placed, and the fixing adhesive is cured by applying pressure and heat from the back surface of the semiconductor element to connect the semiconductor element and the glass wiring board. To.

According to the method of mounting a semiconductor device of the present invention, a semiconductor element and a glass wiring board having a connecting portion at a position facing an electrode of the semiconductor element are disposed on an active surface of the semiconductor element or a semiconductor element arrangement of the glass wiring board. The step of applying the photo-curable adhesive to the range including the semiconductor element arrangement range having the through holes penetrating the front surface and the back surface of the glass wiring board within the range, the connection part of the glass wiring board and the electrode of the semiconductor element are aligned. It comprises a step of placing, a step of exposing the glass wiring board from the back side of the semiconductor element, and a step of exposing the range including the semiconductor element placement range from the back side of the glass wiring board by pressurizing the connection part from the back side of the semiconductor element. It is characterized by

[0010]

According to the mounting structure of the semiconductor device of the present invention, first, the fixing adhesive is applied to the active surface of the semiconductor element or the semiconductor element arrangement area of the glass wiring board, and then the active surface of the semiconductor element and the glass wiring board. In a semiconductor device in which the electrodes of the semiconductor element are electrically connected to the connection portion of the glass wiring board by facing the After pressing and heating from the back surface of the semiconductor element after aligning and mounting the electrode of the semiconductor element with the connection portion of the glass wiring board in which the through holes penetrating the front surface and the back surface of the glass wiring substrate are arranged. When the fixing adhesive is hardened with, and the semiconductor element and the glass wiring board are connected, the excess amount of the fixing adhesive due to pressure and the expansion of the fixing adhesive due to heating are released through the through holes, and the semiconductor is removed. It is possible to alleviate the pressing spread strength of the adhesive layer between the active surface of the element and the glass wiring substrate.

Further, according to the semiconductor device mounting method of the present invention, the semiconductor element and the glass wiring board having the connecting portion at a position facing the electrode of the semiconductor element are connected to the active surface of the semiconductor element or the glass wiring board. In the semiconductor element arrangement range,
The step of applying the photo-curable adhesive to the range including the semiconductor element arrangement range having the through holes penetrating the front surface and the back surface of the glass wiring board, the connection portion of the glass wiring board, and the electrode of the semiconductor element are aligned. It comprises a step of placing, a step of exposing the glass wiring substrate from the back side of the semiconductor element, and a step of exposing the range including the semiconductor element placement range from the back side of the glass wiring board by pressurizing the connecting portion from the back side of the semiconductor element. When a defect is found by conducting an electrical characteristic test after exposure from the back side of the semiconductor element, the semiconductor element can be replaced by removing the photo-curable adhesive in the curing range around the semiconductor element, and During the exposure of the semiconductor element arrangement range from the back surface of the glass wiring board, it is possible to release the pressure portion of the photocurable adhesive due to the pressure due to the through hole.

[0012]

1 and 2 are cross-sectional views schematically showing an embodiment of a mounting structure of a semiconductor device according to the present invention, in which 1 is a semiconductor element, 2 is an active surface of the semiconductor element 1, and 3 is a semiconductor element. As the first electrode, an electrode called gold bump, which is obtained by plating the electrode of the semiconductor element 1 with gold and protruding on the active surface 2 of the semiconductor element 1, was used. Reference numeral 4 denotes a glass wiring board, and a glass liquid crystal display body is used in this description. Glass wiring board 4
A wiring pattern 5 formed of a transparent conductive film (ITO) was arranged on the surface of the. Reference numeral 6 is a connection portion of the wiring pattern 5 arranged so as to face the electrode 3 of the semiconductor element 1. Reference numeral 7 is a semiconductor element arrangement range of the glass wiring board 4, 8 is a fixing adhesive, and a thermosetting resin is used, and an epoxy adhesive is used this time. Further, 9 is a through hole of the glass wiring board 4, and this time, it is set to 0. by using an air breakable method in which fine abrasive grains are kneaded and blown into compressed air from the back surface 10 of the glass wiring board.
A through hole having a diameter of 5 mm was formed. The above will describe the embodiment in detail.

After applying the fixing adhesive 8 to the active surface 2 of the semiconductor element 1 or the semiconductor element arrangement area 7 of the glass wiring board 4, the active surface 2 of the semiconductor element 1 and the glass wiring board 4 are coated.
Are arranged so as to face each other, the electrode 3 of the semiconductor element 1 and the connection portion 6 provided on the wiring pattern 5 formed on the glass wiring board 4 are aligned (positioned), and the semiconductor element 1 is placed on the glass wiring board 4 Place on top.

Next, the heating tool 11 having a vertical mechanism (not shown) as shown in FIG.
The fixing adhesive 8 is hardened by being brought into contact with and being heated and pressed by the heating tool 11. At this time, the fixing adhesive 8 spreads over the active surface 2 of the semiconductor element 1 and the semiconductor element arrangement area 7 of the glass wiring board 4 by being pressed by the heating tool 11, and between the active surface 2 of the semiconductor element 1 and the glass wiring board 4. The surplus amount of the fixing adhesive 8 filled in can be discharged around the semiconductor element 1 and through the through holes 9.

Further, since the hardening of the fixing adhesive 8 by the heat transfer from the heating tool 11 is started from the vicinity of the electrode 3 of the semiconductor element 1, the uncured fixing adhesive 8 inside the connecting portion 6 is a through hole. By discharging the adhesive from the sheet 9, it is possible to remove the stress of the adhesive in the uncured portion that was trying to push open the cured adhesive 8 in the cured portion that stays inside during heating, and thus the adhesive is fixed. The agent 8 can be cured without applying stress to the semiconductor element 1 and the glass wiring board 4. After the heating and curing of the fixing adhesive 8 is completed, the heating tool 11 is lifted again to electrically connect the electrode 3 of the semiconductor element 1 and the connecting portion 6 of the wiring pattern 5 on the glass wiring board 4. ..

In the present embodiment, the through-hole 9 is formed by using the air blush method. However, the same effect can be obtained by ultrasonic drilling, laser drilling, etching of a glass wiring board, or the like. It is obvious that the hole size (hole diameter) of the through hole 9 must be changed depending on the viscosity and the curing temperature of the fixing adhesive 8 used, and the opening direction of the through hole 9 must be changed. , And even if the opening diameter is changed, it is included in the present invention.

Although the connection using the epoxy adhesive as the fixing adhesive 9 has been described, metal particles or solder or resin sphere surface is plated with metal for electrical connection between the electrode and the connecting portion. The conductive adhesive, the anisotropic conductive adhesive, or the anisotropic conductive film containing conductive particles such as metal particles in the fixing adhesive is used. The effect of using the through-holes is the same even if different kinds of adhesives are used as the fixing adhesives, and therefore, they are included in the present invention.

Further, even if a ceramic substrate such as an alumina substrate is used, the same effect can be obtained and is included in the present invention.

Next, a method of mounting the semiconductor device according to the present invention will be described. 3 and 4 are cross-sectional views for explaining an embodiment of a method for mounting a semiconductor device according to the present invention.

In FIG. 3, reference numeral 1 is a semiconductor element, 2 is an active surface of the semiconductor element 1, and 3 is an electrode of the semiconductor element 1. The electrode of the semiconductor element 1 is gold-plated to form an active surface 2 of the semiconductor element 1. An electrode called a protruding gold bump was used. Reference numeral 4 denotes a glass wiring board. In this description, a glass liquid crystal display is used, and a wiring pattern 5 formed of a transparent conductive film (ITO) is arranged on the surface of the glass wiring board 4. Reference numeral 6 is a connection portion of the wiring pattern 5 arranged so as to face the electrode 3 of the semiconductor element 1. 7 is a semiconductor element arrangement range provided on the glass wiring board 3, and 8a is a photocurable adhesive used as a fixing adhesive. 9 is the glass wiring board 4
It is a through hole. The embodiment will be described in detail above.

First, a photo-curable adhesive 8a is applied to the active surface 2 of the semiconductor element 1, the semiconductor device arrangement area 7 including the through hole 9 of the glass wiring board 4, or both.

Next, the active surface 2 of the semiconductor element 1 and the glass wiring board 4 are arranged so as to face each other, and the electrode 3 of the semiconductor element 1 and
Connection part 6 provided on the wiring pattern 5 on the glass wiring board 4
Are aligned (aligned) with each other, and the semiconductor element 1 is mounted on the glass wiring board 4.

In the state where the semiconductor element 1 is pressed from the rear surface 12 of the semiconductor element and pressed against the glass wiring board 4, a photo-curing type adhesive spread over the active surface 2 of the semiconductor element 1 and the semiconductor element arrangement area 7 of the glass wiring board 4. The agent 8a is the semiconductor element 1
Is filled between the active surface 2 and the glass wiring board 4, and the surplus amount of the photo-curable adhesive 8a surrounds the semiconductor element 1 and the through hole 9.
Let it drain more.

In this state, the back surface 12 of the semiconductor element is exposed by using curing light 13 from a light source having a wavelength effective for curing the photo-curable adhesive 8a to expose the photo-curable adhesive around the semiconductor element 1. 8a is cured and the semiconductor element 1 and the glass wiring board 4 are temporarily connected. At this time, the photo-curable adhesive 8a is cured only around the periphery of the semiconductor element 1, and the internal photo-curable adhesive 8a shielded from light by the semiconductor element 1 is still in an uncured state. After the temporary connection by exposure from the back surface 12 of the semiconductor element is completed, an electrical characteristic test is performed to check the connection between the glass wiring board 4 and the semiconductor element 1 and the electrical characteristic of the semiconductor element 1. The semiconductor element 1 determined to be defective as a result of the electrical characteristic test can be stripped of the photo-curable adhesive 8a around the semiconductor element 1 and re-connected.

After the completion of the electrical characteristic inspection, as shown in FIG. 4, a pressing force necessary for connection is applied from the back surface 12 of the semiconductor element by using a pressing tool 14, and the surplus amount of the photo-curable adhesive 8a is passed through the through hole 9. After being discharged, the glass wiring board back surface 10 side is exposed by using curing light 13a from a light source having a wavelength effective for curing the photocurable adhesive 8a, and the connection between the semiconductor element 1 and the glass wiring board 4 is completed. To do. When pressure is applied from the semiconductor element back surface 10 and connection pressure is applied, the photo-curable adhesive 8a in the uncured portion is discharged only from the through hole 9 because the vicinity of the semiconductor element 1 is cured. It is possible to perform photo-curing while reducing the stress of the photo-curable adhesive 8a remaining inside.

Although the present invention has been described with reference to a glass wiring board, a substrate capable of transmitting curing light, such as a light transmissive ceramic, is included in the present invention.

[0027]

As described above, according to the mounting structure of the semiconductor device of the present invention, the front surface and the back surface of the glass wiring board are penetrated into the active surface of the semiconductor element or within the semiconductor element disposition range of the glass wiring board. After applying a fixing adhesive in the semiconductor element arrangement area of the glass wiring board with the through holes, the connection part of the glass wiring board facing the active surface of the semiconductor element and the electrode of the semiconductor element are aligned and placed. After that, the semiconductor element and the glass wiring board are connected to each other by applying pressure and heat from the back surface of the semiconductor element, so that the heating tool has a non-uniform heat distribution, the surface state of the back surface of the semiconductor element, and an adhesive for fixing. When the fixing adhesive is liable to be hardened due to uneven curing speed and difference in heat dissipation at the substrate connection, electrical connection failure may occur. By releasing the surplus amount of the fixing adhesive and the expansion of the fixing adhesive due to heating, the spreading force of the adhesive layer between the active surface of the semiconductor element and the glass wiring board is relaxed, and the connection part and the semiconductor It is possible to increase the adhesiveness of the connection with the electrode of the element and reduce the connection failure due to floating.

Further, according to the present invention, a glass wiring having a semiconductor element and a connecting portion at a position facing an electrode of the semiconductor element, and having a through hole penetrating the front surface and the back surface of the glass wiring board in the semiconductor element arrangement range. The substrate and the active surface of the semiconductor element or the range including the semiconductor element arrangement range of the glass wiring board, the step of applying the photo-curable adhesive, the connection portion of the glass wiring board, and the electrode of the semiconductor element are aligned. From the step of placing, the step of exposing the glass wiring substrate from the back side of the semiconductor element, and the step of pressurizing the connection portion from the back side of the semiconductor element and exposing the range including the semiconductor element placement range from the back side of the glass wiring board According to the mounting method, if a connection failure is found by conducting an electrical characteristic inspection after exposure from the back side of the semiconductor element, the cured photo-curable type around the semiconductor element will be used. The semiconductor element can be easily replaced by removing the adhesive, and the exposed portion of the semiconductor element arrangement area from the back surface of the glass wiring board can escape the pressure of the photocurable adhesive due to the pressure due to the through hole. It is possible to reduce the spreading force of the adhesive layer between the active surface of the semiconductor element and the glass wiring board, strengthen the adhesion between the connection part and the electrode of the semiconductor element, and reduce the connection failure due to floating. There is an advantage that it can be done, and the effect of implementation is great

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing an embodiment of a mounting structure of a semiconductor device of the present invention.

FIG. 2 is a cross-sectional view for explaining the connection of the embodiment of the mounting structure of the semiconductor device of the present invention.

FIG. 3 is a sectional view for explaining an embodiment of a method for mounting a semiconductor device of the present invention.

FIG. 4 is a cross-sectional view for explaining a connection method of the embodiment of the mounting method of the semiconductor device of the present invention.

FIG. 5 is a cross-sectional view showing the structure of a conventional semiconductor device.

FIG. 6 is a sectional view for explaining a conventional method for connecting semiconductor devices.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Active surface 3 Electrode 4 Glass wiring board 5 Wiring pattern 6 Connection part 7 Semiconductor element arrangement range 8 Fixing adhesive 8a Photocurable adhesive 9 Through hole 10 Glass wiring board back surface 11 Heating tool 12 Semiconductor element back surface 13 , 13a Curing light 14 Pressure tool 15 Conductive particles

Claims (2)

[Claims] 1. A semiconductor element, a glass wiring board having a connecting portion at a position facing an electrode of the semiconductor element, and a fixing adhesive. The active surface of the semiconductor element and the glass wiring board are formed by the semiconductor. A fixing adhesive is sandwiched between the active surface of the element and the glass wiring board, and the elements are arranged to face each other.
In a semiconductor device for electrically connecting an electrode of the semiconductor element and a connecting portion of the glass wiring board, a glass wiring board is provided within a semiconductor element disposition range of the glass wiring board facing the active surface of the semiconductor element. A mounting structure for a semiconductor device, wherein a through hole penetrating the front surface and the back surface of the semiconductor device is arranged. 2. A semiconductor element and a glass wiring board having a connecting portion at a position facing an electrode of the semiconductor element are arranged such that an active surface of the semiconductor element and the glass wiring board face each other. In the semiconductor device for electrically connecting the electrode of the element and the connection portion of the glass wiring board, the active surface of the semiconductor element or the surface of the glass wiring board within the semiconductor element arrangement range of the glass wiring board. A step of applying a photo-curable adhesive to a range including a semiconductor element arrangement range having a through hole penetrating the back surface, aligning the connection portion of the glass wiring board and the electrode of the semiconductor element, and forming a semiconductor on the glass wiring board. A step of placing the element, a step of exposing the glass wiring board from the back side of the semiconductor element, a pressure of the connecting portion from the back side of the semiconductor element, and a range including the semiconductor element placement range from the back side of the glass wiring board. Mounting method of a semiconductor device characterized by comprising a step of exposing.