JPH0622997Y2 - 絶縁物封止型半導体装置 - Google Patents

絶縁物封止型半導体装置

Info

Publication number
JPH0622997Y2
JPH0622997Y2 JP7847787U JP7847787U JPH0622997Y2 JP H0622997 Y2 JPH0622997 Y2 JP H0622997Y2 JP 7847787 U JP7847787 U JP 7847787U JP 7847787 U JP7847787 U JP 7847787U JP H0622997 Y2 JPH0622997 Y2 JP H0622997Y2
Authority
JP
Japan
Prior art keywords
chip
support plate
monolithic
leads
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7847787U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63187349U (enExample
Inventor
和美 高畠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP7847787U priority Critical patent/JPH0622997Y2/ja
Publication of JPS63187349U publication Critical patent/JPS63187349U/ja
Application granted granted Critical
Publication of JPH0622997Y2 publication Critical patent/JPH0622997Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/01515—
    • H10W72/075—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/5475—
    • H10W74/00—
    • H10W90/753—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7847787U 1987-05-25 1987-05-25 絶縁物封止型半導体装置 Expired - Lifetime JPH0622997Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7847787U JPH0622997Y2 (ja) 1987-05-25 1987-05-25 絶縁物封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7847787U JPH0622997Y2 (ja) 1987-05-25 1987-05-25 絶縁物封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS63187349U JPS63187349U (enExample) 1988-11-30
JPH0622997Y2 true JPH0622997Y2 (ja) 1994-06-15

Family

ID=30927459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7847787U Expired - Lifetime JPH0622997Y2 (ja) 1987-05-25 1987-05-25 絶縁物封止型半導体装置

Country Status (1)

Country Link
JP (1) JPH0622997Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5164533B2 (ja) * 2007-11-14 2013-03-21 オンセミコンダクター・トレーディング・リミテッド 半導体モジュールおよび撮像装置
JP5164532B2 (ja) * 2007-11-14 2013-03-21 オンセミコンダクター・トレーディング・リミテッド 半導体モジュールおよび撮像装置

Also Published As

Publication number Publication date
JPS63187349U (enExample) 1988-11-30

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