JPH06229103A - Perforating method for floor material and panel body comprising floor material - Google Patents

Perforating method for floor material and panel body comprising floor material

Info

Publication number
JPH06229103A
JPH06229103A JP3951493A JP3951493A JPH06229103A JP H06229103 A JPH06229103 A JP H06229103A JP 3951493 A JP3951493 A JP 3951493A JP 3951493 A JP3951493 A JP 3951493A JP H06229103 A JPH06229103 A JP H06229103A
Authority
JP
Japan
Prior art keywords
panel body
floor material
hole
holes
floor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3951493A
Other languages
Japanese (ja)
Other versions
JP3263842B2 (en
Inventor
Yoshiki Konishi
芳樹 小西
Shigeru Kobayashi
茂 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Chuzo Kk
Fujitsu Ltd
Original Assignee
Furukawa Chuzo Kk
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Chuzo Kk, Fujitsu Ltd filed Critical Furukawa Chuzo Kk
Priority to JP03951493A priority Critical patent/JP3263842B2/en
Publication of JPH06229103A publication Critical patent/JPH06229103A/en
Application granted granted Critical
Publication of JP3263842B2 publication Critical patent/JP3263842B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Floor Finish (AREA)
  • Punching Or Piercing (AREA)

Abstract

PURPOSE:To easily and quickly perforate a floor material through an inexpensive production, by a method wherein the floor material is formed by casting a panel body and by sticking a board material thereon, and numbers of small holes are formed on the floor material. CONSTITUTION:A panel body 2, an aluminum alloy casting, is molded by die-casting and ribs are provided on the bottom surface thereof lengthwise and crosswise. When the panel body 2 is molded by die-casting, holes 3, each of which has a taper part 30 toward the bottom at a place to be perforated, are provided on the plane parts 23 between the ribs, and thin wall layers 31 each in casting fin form are formed on the bottoms thereof. A board material 4 is stuck on the upper plane of the panel body 2, using an adhesive, and the side of the board material 4 is placed on a die 5, following which a punch 6 is put at the side of the hole 3 on the bottom surface and perforation is wrought. By forming the taper part 30 on the hole 3, the punch 6 is prevented from deviating in position and the perforation is wrought. In this way, a plurality of punches 6 are arranged at the positions where the holes 3 are going to be formed and a plurality of through holes can be formed by punching at one try.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、クリーンルームや、コ
ンピュータ等の電子機器を配置したオフィスルーム、コ
ンピュータルームなどに敷設される床材の穿孔方法およ
び床材を構成するパネル本体に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for perforating a floor material laid in a clean room, an office room in which electronic equipment such as a computer is arranged, a computer room, etc., and a panel body constituting the floor material.

【0002】[0002]

【従来の技術】半導体工場等のクリーンルームおよび多
数の電子機器やコンピュータを設置したオフィスルーム
などでは、各機器の間をつなげる配線などを機能的に配
置するために、床を二重にしたフリーアクセスフロアー
が近年用いられている。
2. Description of the Related Art In a clean room such as a semiconductor factory and an office room in which a large number of electronic devices and computers are installed, free access with double floors is provided in order to functionally arrange wiring that connects the devices. Floors have been used in recent years.

【0003】また、このような部屋では、室内の空気の
清浄、機器自体が発する熱の排気、さらには電子機器の
性能維持のために、高い効率で空気の還流や換気を行う
必要か生ずる。このような還流や換気は、上記のように
二重にしたフリーアクセスフロアーの上側から下側へ、
あるいは下側から上側へ空気を通して行うことが最も効
率が良い。このため、フリーアクセスフロアーの床材に
通気用の孔を穿設し、この孔を通気孔として室内空気の
還流や換気が行われている。
In such a room, it is necessary to recirculate or ventilate the air with high efficiency in order to clean the air in the room, exhaust the heat generated by the equipment itself, and maintain the performance of the electronic equipment. Such circulation and ventilation is from the upper side to the lower side of the double free access floor as described above,
Alternatively, it is most efficient to pass air from the lower side to the upper side. For this reason, holes for ventilation are provided in the floor material of the free access floor, and the holes are used as ventilation holes for the circulation and ventilation of indoor air.

【0004】そして、その効率をさらに向上させるに
は、床材の穿孔面積を増すことが必要であるが、1つ1
つの孔の面積を大きくすると、床材の強度が低下し、ま
た床面上をキャスター付の荷台等が通過すると、穿設さ
れた孔によって、振動や騒音が発生するといった問題が
あった。
In order to further improve the efficiency, it is necessary to increase the perforated area of the floor material.
When the area of the two holes is increased, the strength of the floor material is lowered, and when the cargo bed with casters passes over the floor surface, there is a problem that vibration and noise are generated due to the drilled holes.

【0005】このような問題を克服するには、孔の面積
を小さくし、孔の数を増やす必要がある。一方、一般に
床パネルなどに孔を形成するための穿孔方法としては、
ドリルによって孔を形成する方法と、ダイスとパンチに
よって穴あけ加工をして孔を形成する方法がある。
In order to overcome such problems, it is necessary to reduce the area of holes and increase the number of holes. On the other hand, generally, as a perforation method for forming holes in a floor panel,
There are a method of forming a hole with a drill and a method of forming a hole with a die and a punch.

【0006】ドリルによって孔を形成する方法では、コ
ストや時間がかかりすぎ、特に多数の孔を短時間で形成
する方法としては適さない。さらに、電子機器に対する
悪影響を少なくするため、上記フリーアクセスフロアー
に用いられる床材には、塵が発生せず、かつ帯電しにく
い表面仕上げ材が貼り合わされることが多いが、このよ
うな表面仕上げ材が貼り合わされると、ダイスとパンチ
による穴あけ加工は困難となる。特に、近接した位置に
複数の孔を形成しようとすると、材料自体が割れてしま
うといった欠点がある。以上述べたように、従来、床材
に多数の孔を低コストで形成することは困難であった。
The method of forming holes by a drill is too costly and time consuming, and is not suitable as a method of forming a large number of holes in a short time. Furthermore, in order to reduce adverse effects on electronic equipment, a surface finishing material that does not generate dust and is less likely to be charged is often attached to the floor material used for the above-mentioned free access floor. When the materials are pasted together, it becomes difficult to make holes with a die and a punch. In particular, when attempting to form a plurality of holes in close proximity to each other, the material itself is broken. As described above, conventionally, it has been difficult to form a large number of holes in a floor material at low cost.

【0007】[0007]

【発明が解決しようとする課題】本発明の目的は、フリ
ーアクセスフロアーなどに用いられる床材に、開口面積
の小さい孔を、安価にかつ短時間で多数形成することの
できる穿孔方法および、そのような穿孔を可能とする床
材を構成するパネル本体を提供することにある。
DISCLOSURE OF THE INVENTION An object of the present invention is to provide a perforation method capable of forming a large number of holes having a small opening area in a floor material used for a free access floor or the like at low cost in a short time, and a method therefor. An object of the present invention is to provide a panel body that constitutes a floor material that enables such perforation.

【0008】[0008]

【課題を解決するための手段】このような目的は、以下
の本発明(1)〜(7)により達成される。即ち、
This object is achieved by the present inventions (1) to (7) described below. That is,

【0009】(1) 穿孔予定箇所に薄肉部を形成した
パネル本体を鋳造により形成し、前記パネル本体の上面
に板材を貼り合わせて床材を構成し、前記薄肉部を前記
板材とともに穴あけ加工することによって床材に貫通孔
を形成することを特徴とする床材の穿孔方法。
(1) A panel main body having a thin portion formed at a portion to be perforated is formed by casting, a plate material is attached to an upper surface of the panel main body to form a floor material, and the thin portion is drilled together with the plate material. A method for punching a floor material, which comprises forming a through hole in the floor material.

【0010】(2) 前記パネル本体の穿孔箇所には、
穿孔方向に向かって径の小さくなるテーパーを有する孔
を形成し、前記薄肉部は前記孔のテーパー部分である上
記(1)に記載の床材の穿孔方法。
(2) At the perforated portion of the panel body,
The method for piercing a flooring material according to (1) above, wherein a hole having a taper whose diameter decreases in the piercing direction is formed, and the thin portion is a tapered portion of the hole.

【0011】(3) 前記パネル本体の鋳造時に形成さ
れた孔は、薄肉層によって閉塞されている上記(2)に
記載の床材の穿孔方法。
(3) The method for boring a floor material according to the above (2), wherein the holes formed during the casting of the panel body are closed by a thin layer.

【0012】(4) 上記穴あけ加工をするに際して、
複数のダイスとポンチを同時に使用して、同時に複数の
貫通孔を形成する上記(1)〜(3)のいずれかに記載
の床材の穿孔方法。
(4) When performing the above-mentioned drilling process,
The method for punching a floor material according to any one of (1) to (3) above, wherein a plurality of dies and punches are used simultaneously to form a plurality of through holes at the same time.

【0013】(5) 前記パネル本体の鋳造方法は、ダ
イカストである上記(1)〜(4)のいずれかに記載の
床材の穿孔方法。
(5) The method for casting the panel body is the method for perforating a flooring material according to any one of (1) to (4) above, which is die casting.

【0014】(6) 前記パネル本体はアルミニウム合
金からなる上記(1)〜(5)のいずれかに記載の床材
の穿孔方法。
(6) The method for boring a floor material according to any one of (1) to (5), wherein the panel body is made of an aluminum alloy.

【0015】(7) 床面構成面側に板材が貼り付けら
れるパネル本体であって、穴あけ加工による穿孔予定箇
所に、予め薄肉部が形成されていることを特徴とする床
材を構成するパネル本体。
(7) A panel body to which a plate material is attached on the side of the floor surface constituting the floor material, characterized in that a thin portion is formed in advance at a portion to be drilled by drilling. Body.

【0016】[0016]

【実施例】以下添付図面に基づいて、本発明の好適実施
例について説明する。図1は、床材1の薄肉部分の部分
拡大断面図、図2は床材1の全体底面図、図3は、床材
1の拡大断面側面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a partially enlarged sectional view of a thin portion of the flooring material 1, FIG. 2 is an overall bottom view of the flooring material 1, and FIG. 3 is an enlarged sectional side view of the flooring material 1.

【0017】図示されている床材1は、パネル本体2
と、該パネル本体2の上面に貼り付けられた板材4とを
有している。パネル本体2はアルミニウム合金鋳物であ
って、ダイカスト成型され、底面にリブ21、22が縦
横に設けられている。各リブ21の隙間に形成された平
面部23には、ダイカスト成型時に孔3が形成される。
この孔3は、後述する穴あけ加工によって、後に孔を形
成する箇所(穿孔予定箇所)に設けられ、各平面部23
に、この場合では4つづつ形成されいる。孔3の形状
は、図1中の孔の底部に向かって径が小さくなるテーパ
ー部分30を有し、底部には鋳造バリ状の薄肉層31が
形成されている。この鋳造バリ状の薄肉層31は、例え
ば、ダイカスト成型時に形成される鋳造バリである。テ
ーパー部分30のテーパー角θは、特に限定されない
が、17°程度以上であることが好ましい。
The floor material 1 shown is a panel body 2
And a plate member 4 attached to the upper surface of the panel body 2. The panel body 2 is an aluminum alloy casting, is die cast, and has ribs 21 and 22 provided on the bottom surface in the vertical and horizontal directions. The holes 3 are formed in the flat portion 23 formed in the gap between the ribs 21 during die casting.
The hole 3 is provided at a position where a hole is to be formed later (drilling planned position) by a drilling process described later, and each flat surface portion 23
In this case, four are formed. The hole 3 has a tapered portion 30 whose diameter decreases toward the bottom of the hole in FIG. 1, and a cast burr-shaped thin layer 31 is formed on the bottom. The cast burr-shaped thin layer 31 is, for example, a cast burr formed during die casting. The taper angle θ of the tapered portion 30 is not particularly limited, but is preferably about 17 ° or more.

【0018】上記パネル本体2の上平面は平らに形成さ
れ、ここに板材4が貼り付けられる。この板材4として
は、床面の帯電を防止するための処理が施された材料
や、塵埃の発生しない材料が用いられる。例えば、高圧
メラミン化粧板、帯電防止タイルなどが挙げられる。
The upper flat surface of the panel body 2 is formed flat and the plate member 4 is attached thereto. As the plate member 4, a material that has been treated to prevent the floor surface from being charged, or a material that does not generate dust is used. Examples include high-pressure melamine decorative boards and antistatic tiles.

【0019】この板材4は、接着剤によって前記パネル
本体2に貼り付けられる。この接着剤を塗布する時、パ
ネル本体2に形成されている孔3には、鋳造バリ状の薄
肉層31が残っているので、孔3から乾き切っていない
接着剤が流れ落ちることはなく、その後の加工作業やパ
ネル本体2の扱いが容易となる。また接着剤の無駄も少
なくなる。この板材4の厚さは、一時に穿孔する孔の数
により異なり、特に限定されないが、1.5〜3mm程度
とすることができる。板材4を上記のように貼着した
後、板材4側をダイス5に載せて、底面の孔3側からポ
ンチ6を挿入して穴あけ加工を行う。
The plate member 4 is attached to the panel body 2 with an adhesive. When this adhesive is applied, since the cast burr-shaped thin layer 31 remains in the hole 3 formed in the panel body 2, the adhesive that has not dried up does not flow down from the hole 3, and It becomes easy to perform the processing work and the handling of the panel body 2. Also, the waste of the adhesive agent is reduced. The thickness of the plate member 4 depends on the number of holes to be drilled at one time and is not particularly limited, but can be set to about 1.5 to 3 mm. After sticking the plate material 4 as described above, the plate material 4 side is placed on the die 5, and the punch 6 is inserted from the hole 3 side of the bottom surface to perform the drilling process.

【0020】この際、ポンチ6の径dに対する、孔3の
最小径Dの割合は、95〜98%程度で、孔3の径がポ
ンチ6の径dより若干小さく形成されている。このよう
に形成することによって、穴あけ加工を行う際に、ポン
チ6は孔3のテーパー部分30の底部近傍に最初に接触
し、この接触したテーパー部分30を含めて、鋳造バリ
状の薄肉層31とともに板材4を打ち抜き、穿設された
貫通孔7を形成する。このポンチ6が最初にパネル本体
2に接触した位置におけるパネル本体2の厚さtは、穴
あけ加工が可能な厚さであれば、特に限定されないが、
例えば0.7mm程度以下とすることができる。すなわ
ち、本実施例では、この接触した位置が薄肉部32とな
る。
At this time, the ratio of the minimum diameter D of the hole 3 to the diameter d of the punch 6 is about 95 to 98%, and the diameter of the hole 3 is formed slightly smaller than the diameter d of the punch 6. By forming in this way, when performing punching, the punch 6 first contacts the vicinity of the bottom of the tapered portion 30 of the hole 3 and, including the contacted tapered portion 30, the cast burr-shaped thin layer 31. At the same time, the plate member 4 is punched out to form a through hole 7 that is punched. The thickness t of the panel body 2 at the position where the punch 6 first comes into contact with the panel body 2 is not particularly limited as long as it is a thickness that allows punching.
For example, it can be about 0.7 mm or less. That is, in this embodiment, the contact position is the thin portion 32.

【0021】孔3にテーパー部分30を設けることによ
り、ポンチ6の位置が多少ずれても、テーパー部分30
によって穿孔位置との誤差が吸収されるので、高い精度
で穿孔することができる。また、図4に示されているよ
うに、複数のポンチ6を孔3が形成されている位置に配
設して、一回の打ち抜きで、複数の貫通孔7を形成する
ようにすれば、数回の打ち抜きによって、簡単に全面の
穿孔作業が完了できる。図4に示されている場合には、
4回の打ち抜き作業で、全面に貫通孔7を形成すること
ができる。ポンチ6は、基台上に複数配置され、その配
置位置は孔を形成する位置とし、基台を移動させること
によって、配置されたポンチ6によって同時に穴あけ加
工する。
By providing the tapered portion 30 in the hole 3, even if the position of the punch 6 is slightly displaced, the tapered portion 30 is formed.
Since the error with the drilling position is absorbed by the, it is possible to drill with high accuracy. Further, as shown in FIG. 4, if a plurality of punches 6 are arranged at the positions where the holes 3 are formed and a plurality of through holes 7 are formed by punching once, The punching work on the entire surface can be completed easily by punching several times. In the case shown in FIG.
The through hole 7 can be formed on the entire surface by four punching operations. A plurality of punches 6 are arranged on the base, and the positions of the punches 6 are positions where holes are formed. By moving the base 6, the punches 6 are simultaneously drilled.

【0022】このように、多数のポンチ6とダイス5を
用い、一度の打ち抜きで複数の貫通孔7を形成する場合
には、パネル本体2に予め形成されている孔3の位置
と、各ポンチ6が設けられている位置との間で誤差が生
じ易い。しかし、前述のように孔3に形成されたテーパ
ー部分30が、孔3の形成位置と、ポンチ6の位置との
間に生じた誤差を吸収するので、このようなテーパー部
分30を設けることは、多数の貫通孔7を同時に複数個
形成する場合には、特に好ましい。
In this way, when a plurality of punches 6 and dies 5 are used to form a plurality of through holes 7 by punching once, the positions of the holes 3 formed in the panel body 2 in advance and the punches. An error is likely to occur between the position where 6 is provided. However, since the tapered portion 30 formed in the hole 3 absorbs the error generated between the formation position of the hole 3 and the position of the punch 6 as described above, it is not possible to provide such a tapered portion 30. It is particularly preferable to form a plurality of through holes 7 at the same time.

【0023】上記のような方法で穴あけ加工をする際の
諸条件の一例を示すと、パネル本体2の材質はアルミニ
ウム合金ダイカスト製であり、孔3の径Dは、9mm、孔
3のテーパー部分30の角度は20度、板材4として高
圧メラミン化粧板を用い、板材4の厚さは1.6mm、ポ
ンチ6の径dに対して、孔3の最小径の割合は、97.
2%、ポンチ6が最初に孔3の内周面に接触した位置に
おけるパネル本体2の厚さtは、0.6mmとし、1つの
孔を打ち抜くために用いる圧力を、1400kg/cm2
することができる。
As an example of various conditions for drilling by the above method, the material of the panel body 2 is aluminum alloy die casting, the diameter D of the hole 3 is 9 mm, and the tapered portion of the hole 3 is formed. The angle of 30 is 20 degrees, a high-pressure melamine decorative plate is used as the plate 4, the thickness of the plate 4 is 1.6 mm, and the ratio of the minimum diameter of the hole 3 to the diameter d of the punch 6 is 97.
2%, the thickness t of the panel body 2 at the position where the punch 6 first contacts the inner peripheral surface of the hole 3 is 0.6 mm, and the pressure used to punch one hole is 1400 kg / cm 2 . be able to.

【0024】以上説明した実施例では、テーパー部分3
0の穿孔方向端部が、薄肉部32となっている構成例で
あるが、この他、テーパー部分30を設けず、例えば孔
3の径Dをポンチ6の径dよりも十分大きくし、鋳造バ
リ状薄肉層を薄肉部として形成してもよい。そして、こ
のような薄肉部の厚さは、穴あけ加工が可能な厚さであ
れば、特に限定されない。
In the embodiment described above, the tapered portion 3
This is a configuration example in which the end portion in the direction 0 of the punching is the thin portion 32. However, in addition to this, the tapered portion 30 is not provided, and the diameter D of the hole 3 is made sufficiently larger than the diameter d of the punch 6, for example. The burr-like thin layer may be formed as a thin portion. Then, the thickness of such a thin portion is not particularly limited as long as it is a thickness that allows drilling.

【0025】さらに、上記パネル本体2は、板材4を貼
り付けただけの状態であれば、通常の床材としても利用
することができ、汎用性がある。また鋳造で成型するこ
とができるので、製造コストも安価ある。特に、本実施
例のパネル本体2は、アルミニウム合金鋳物であって、
ダイカスト成型されたものであり、製造コストが安価で
かつ十分な強度が得られ、穴あけ加工も容易であるとい
った利点がある。また、複数の上記孔3を、パネル本体
2に後から形成するには、加工コストや時間がかかり過
ぎてしまい適当でないが、鋳造によって、パネル本体2
の成型時に同時に形成することによって安価にかつ高精
度に形成することができる。
Further, the panel body 2 can be used as a normal flooring material as long as the plate material 4 is simply attached, and it has versatility. Further, since it can be molded by casting, the manufacturing cost is low. In particular, the panel body 2 of this embodiment is an aluminum alloy casting,
Since it is die-cast, it has the advantages of low manufacturing cost, sufficient strength, and easy drilling. Further, it is not suitable to form the plurality of the holes 3 in the panel body 2 afterwards because it requires processing cost and time too much. However, the panel body 2 is formed by casting.
It is possible to form at low cost and with high precision by simultaneously forming them during molding.

【0026】[0026]

【発明の効果】以上説明したように、本発明の穿孔方法
およびパネル本体を用いれば、安価にかつ迅速に床材に
複数の貫通孔を穿設することができる。
As described above, by using the punching method and the panel body of the present invention, it is possible to punch a plurality of through holes in the floor material inexpensively and quickly.

【図面の簡単な説明】[Brief description of drawings]

【図1】床材の薄肉部分の部分拡大断面図である。FIG. 1 is a partially enlarged sectional view of a thin portion of a flooring material.

【図2】床材の全体底面図である。FIG. 2 is an overall bottom view of the floor material.

【図3】床材の拡大側断面図である。FIG. 3 is an enlarged side sectional view of a floor material.

【図4】複数の孔を穿孔する際の、穿孔方法を示す床材
の全体斜視図である。
FIG. 4 is an overall perspective view of a floor material showing a drilling method when punching a plurality of holes.

【符号の説明】[Explanation of symbols]

1 床材 2 パネル本体 21 リブ 22 リブ 23 平面部 3 孔 30 テーパー部分 31 鋳造バリ状の薄肉層 32 薄肉部 4 板材 5 ダイス 6 ポンチ 7 貫通孔 1 Floor Material 2 Panel Main Body 21 Rib 22 Rib 23 Plane Part 3 Hole 30 Taper Part 31 Cast Burr Thin Layer 32 Thin Part 4 Plate Material 5 Die 6 Punch 7 Through Hole

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 穿孔予定箇所に薄肉部を形成したパネル
本体を鋳造により形成し、前記パネル本体の上面に板材
を貼り合わせて床材を構成し、 前記薄肉部を前記板材とともに穴あけ加工することによ
って床材に貫通孔を形成することを特徴とする床材の穿
孔方法。
1. A floor body is formed by casting a panel main body having a thin-walled portion formed at a predetermined hole to be punched, and a plate material is attached to an upper surface of the panel main body, and the thin-walled portion is punched together with the plate material. A method for punching a floor material, characterized in that a through hole is formed in the floor material by the method.
【請求項2】 前記パネル本体の穿孔予定箇所には、穿
孔方向に向かって径の小さくなるテーパーを有する孔を
形成し、前記薄肉部は前記孔のテーパー部分である請求
項1に記載の床材の穿孔方法。
2. The floor according to claim 1, wherein a hole having a taper whose diameter becomes smaller in a drilling direction is formed at a planned hole of the panel body, and the thin portion is a tapered portion of the hole. How to drill wood.
【請求項3】 前記パネル本体の鋳造時に形成された孔
は、薄肉層によって閉塞されている請求項2に記載の床
材の穿孔方法。
3. The method for boring a floor material according to claim 2, wherein the holes formed during casting of the panel body are closed by a thin layer.
【請求項4】 上記穴あけ加工をするに際して、複数の
ダイスとポンチを同時に使用して、同時に複数の貫通孔
を形成する請求項1〜3のいずれかに記載の床材の穿孔
方法。
4. The method for punching a floor material according to claim 1, wherein a plurality of dies and punches are simultaneously used to form a plurality of through holes at the same time when the boring process is performed.
【請求項5】 前記パネル本体の鋳造方法は、ダイカス
トである請求項1〜4のいずれかに記載の床材の穿孔方
法。
5. The method for piercing a floor material according to claim 1, wherein the method for casting the panel body is die casting.
【請求項6】 前記パネル本体はアルミニウム合金から
なる請求項1〜5のいずれかに記載の床材の穿孔方法。
6. The method of piercing a floor material according to claim 1, wherein the panel body is made of an aluminum alloy.
【請求項7】 床面構成面側に板材が貼り付けられるパ
ネル本体であって、穴あけ加工による穿孔予定箇所に、
予め薄肉部が形成されていることを特徴とする床材を構
成するパネル本体。
7. A panel body, to which a plate material is attached on the floor surface side, at a planned drilling location by drilling,
A panel body that constitutes a floor material, characterized in that a thin portion is formed in advance.
JP03951493A 1993-02-03 1993-02-03 Floor material perforation method and panel body constituting floor material Expired - Fee Related JP3263842B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03951493A JP3263842B2 (en) 1993-02-03 1993-02-03 Floor material perforation method and panel body constituting floor material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03951493A JP3263842B2 (en) 1993-02-03 1993-02-03 Floor material perforation method and panel body constituting floor material

Publications (2)

Publication Number Publication Date
JPH06229103A true JPH06229103A (en) 1994-08-16
JP3263842B2 JP3263842B2 (en) 2002-03-11

Family

ID=12555159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03951493A Expired - Fee Related JP3263842B2 (en) 1993-02-03 1993-02-03 Floor material perforation method and panel body constituting floor material

Country Status (1)

Country Link
JP (1) JP3263842B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999067979A1 (en) * 1998-06-22 1999-12-29 Kabushiki Kaisha Toshiba Electronic apparatus, method of manufacturing electronic apparatus case and blanking device
KR101368964B1 (en) * 2013-08-26 2014-03-03 주식회사 서경 Common casting mold system for multiple hole panel and general panel
WO2020040275A1 (en) * 2018-08-24 2020-02-27 ニプロ株式会社 Dust entry prevention mechanism and entrance preparation room

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023000340A (en) * 2021-06-17 2023-01-04 トヨタ自動車株式会社 Infection control vehicle

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999067979A1 (en) * 1998-06-22 1999-12-29 Kabushiki Kaisha Toshiba Electronic apparatus, method of manufacturing electronic apparatus case and blanking device
KR101368964B1 (en) * 2013-08-26 2014-03-03 주식회사 서경 Common casting mold system for multiple hole panel and general panel
WO2020040275A1 (en) * 2018-08-24 2020-02-27 ニプロ株式会社 Dust entry prevention mechanism and entrance preparation room
JPWO2020040275A1 (en) * 2018-08-24 2021-08-26 ニプロ株式会社 Dust carry-in prevention mechanism and entrance preparation room

Also Published As

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