JPH05327173A - Manufacture of printed-wiring board having through hole - Google Patents

Abstract

PURPOSE:To perform a work of the external shape end surface of a printed- wiring board and the end surface of a through hole in the interior of the board by punching without generating a break of through holes and a peeling of a plating on the wall surfaces of the through holes in the vicinities of the through holes formed in the board and to contrive a miniaturization of the board and a reduction in a working time for the board. CONSTITUTION:When an external shape end surface 3 of a printed-wiring board 1 and an end surface 6 of a through hole 5 in the interior of the board 1 are processed in the vicinities of through holes 2 and 2a formed in the board 1, a perforation is performed in the milling lines of the end surfaces 3 and 6 and thereafter, these holes 4, 4a, 4b and 4c are subjected to punching work leaving a small number of the holes in the board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board having through holes used for mounting electric parts, electronic parts and the like.

[0002]

2. Description of the Related Art Conventionally, when punching an end face in the vicinity of a through hole so as not to affect the through hole of the printed wiring board, the end face is worked away from the through hole by a distance twice the thickness of the printed wiring board. . If the end face is processed by punching without securing this distance, there are problems such as damage to the through hole and peeling of the plating on the wall surface of the through hole. Therefore, when the above distance cannot be secured, a means of processing the end face with a router or a drill has been adopted. However, in the former case, since the end face must be processed at a distance from the through hole of the printed wiring board, it is not possible to reduce the size of the printed wiring board, and in the latter case, there is a problem that it takes a lot of processing time.

[0003]

SUMMARY OF THE INVENTION Therefore, in order to cope with the miniaturization of the printed wiring board and the shortening of the processing time, the present invention is directed to
Provided is a method of punching an end face in the vicinity of a through hole formed on a printed wiring board without damaging the through hole or causing plating peeling on the wall surface of the through hole.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and is characterized in that when end face processing is performed in the vicinity of a through hole formed in a printed wiring board, end face processing is performed. After making a hole in the line, a part of the hole is left in the printed wiring board for punching.

[0005]

When the punching is performed on the end surface processing line of the printed wiring board, the stress is relieved in this hole when punching with a part of the pre-drilled hole left in the printed wiring board. It does not affect the formed through holes. Therefore, the through hole is not damaged and the plating on the wall surface of the through hole is not peeled off. As a result, the printed wiring board can be downsized and the processing time can be shortened without lowering the reliability of the through hole. In addition,
This effect is larger and more preferable as there are more portions of the pre-drilled holes left on the printed wiring board.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings of the embodiments. The present invention is not limited to the examples below.

FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention. Through holes 2, 2, 2, 2 formed on a quadrangular printed wiring board 1 having a thickness of 1.2 mm are drilled or router-processed from the through holes 2 to the outer shape processing line at a position not more than twice the board thickness of the printed wiring board 1. Make a hole,
The outer shape is punched to form the outer end surface 3 so as to partially include the hole 4. The shape of the hole 4 is not limited to the circular shape, but may be an elliptical shape 4a, a square shape 4b, or the like.

The present invention can be applied not only to the outer shape processing of the printed wiring board 1 but also to the processing of the end surface 6 of the through hole 5 inside the printed wiring board 1. That is, when the through hole 5 is formed inside the printed wiring board 1 in the vicinity of the through hole 2a, a hole is first drilled on the periphery of the through hole 5 so as to partially include the hole 4c. The end face 6 is formed by punching 5 out with a die.

In order to form the outer end face 3 of the printed wiring board 1 and the end face 6 of the through hole in the printed wiring board 1 by punching, a die made of a punch die and a receiving die formed in a predetermined shape or It can be performed by a combination of a punch type and a contact plate.

The printed wiring board 1 of the present invention has through holes 2 and 2a, and the insulating substrate of the printed wiring board 1 is obtained by curing a resin of a prepreg obtained by impregnating a base material with a resin and drying. The resin of this insulating substrate is excellent in heat resistance, moisture resistance and resin purity,
Particularly, those having a small amount of ionic impurities are preferable. Specifically, epoxy resin, polyimide resin, fluororesin, PPO
Unsaturated polyester resin, phenol resin, etc.
Resins modified or mixed and combined are suitable. The base material of the insulating substrate is not particularly limited, but an inorganic material such as glass fiber is preferable because it has excellent heat resistance and moisture resistance. In addition, an organic fiber cloth base material having excellent heat resistance, and a mixture thereof can be used.

[0011]

According to the present invention, in the vicinity of the through hole formed in the printed wiring board, the printed wiring board can be punched and end-face-processed without damaging the through hole or removing the plating on the wall surface of the through hole. . Therefore, the printed wiring board can be downsized and the processing time can be shortened.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

[Explanation of symbols]

 1 Printed wiring board 2, 2a Through hole 3 External end face 4, 4a, 4b, 4c Hole 5 Through hole 6 End face

Claims (1)

[Claims] 1. In the vicinity of a through hole formed in a printed wiring board, when end face processing is performed, after punching a hole on the end face processing line, a part of the hole is left in the printed wiring board for punching. A method for manufacturing a printed wiring board having a characteristic through hole.