JPH062264Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH062264Y2
JPH062264Y2 JP1988014821U JP1482188U JPH062264Y2 JP H062264 Y2 JPH062264 Y2 JP H062264Y2 JP 1988014821 U JP1988014821 U JP 1988014821U JP 1482188 U JP1482188 U JP 1482188U JP H062264 Y2 JPH062264 Y2 JP H062264Y2
Authority
JP
Japan
Prior art keywords
pellet
semiconductor device
wire
mount portion
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988014821U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01120331U (US20050192411A1-20050901-C00001.png
Inventor
晴夫 山田
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1988014821U priority Critical patent/JPH062264Y2/ja
Publication of JPH01120331U publication Critical patent/JPH01120331U/ja
Application granted granted Critical
Publication of JPH062264Y2 publication Critical patent/JPH062264Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1988014821U 1988-02-05 1988-02-05 半導体装置 Expired - Lifetime JPH062264Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988014821U JPH062264Y2 (ja) 1988-02-05 1988-02-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988014821U JPH062264Y2 (ja) 1988-02-05 1988-02-05 半導体装置

Publications (2)

Publication Number Publication Date
JPH01120331U JPH01120331U (US20050192411A1-20050901-C00001.png) 1989-08-15
JPH062264Y2 true JPH062264Y2 (ja) 1994-01-19

Family

ID=31226352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988014821U Expired - Lifetime JPH062264Y2 (ja) 1988-02-05 1988-02-05 半導体装置

Country Status (1)

Country Link
JP (1) JPH062264Y2 (US20050192411A1-20050901-C00001.png)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583038U (ja) * 1981-06-29 1983-01-10 富士通株式会社 リ−ドフレ−ム

Also Published As

Publication number Publication date
JPH01120331U (US20050192411A1-20050901-C00001.png) 1989-08-15

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