JPH06209566A - Protection method and protective circuit for mos type semiconductor element - Google Patents

Protection method and protective circuit for mos type semiconductor element

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Publication number
JPH06209566A
JPH06209566A JP218893A JP218893A JPH06209566A JP H06209566 A JPH06209566 A JP H06209566A JP 218893 A JP218893 A JP 218893A JP 218893 A JP218893 A JP 218893A JP H06209566 A JPH06209566 A JP H06209566A
Authority
JP
Japan
Prior art keywords
semiconductor element
circuit
main
detection
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP218893A
Other languages
Japanese (ja)
Inventor
Masaru Karasawa
大 唐澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP218893A priority Critical patent/JPH06209566A/en
Publication of JPH06209566A publication Critical patent/JPH06209566A/en
Pending legal-status Critical Current

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  • Protection Of Static Devices (AREA)
  • Power Conversion In General (AREA)

Abstract

PURPOSE:To surely detect the abnormal state of a main MOS type semiconductor element and prevent the breakdown of when connecting, in series, a switching circuit comprising the main MOS type semiconductor element and a semiconductor element for detection connected in parallel with this, and using it as the component of a power converter. CONSTITUTION:This is a protective circuit for a MOS type semiconductor element being characterized by having connected the gate of a semiconductor element 12 for detection with a gate drive circuit 6-1 through an OFF-DELAY circuit 13, and the gate of a main MOS semiconductor element 10 with the gate drive circuit 6-1 through an ON-DELAY circuit 14.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、MOS形半導体素子の
保護方法及び保護回路に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a protection method and a protection circuit for a MOS type semiconductor device.

【0002】[0002]

【従来の技術】従来技術を図4、図5及び図6を参照し
て説明する。図4において、1―1,1―2は主MOS
形半導体素子で、ここでは一例としてIGBTを用い
た。2―1,2―2は直流電源、3はリアクトルで、図
4の回路は一般的にハ―フブリッジ回路と呼ばれる回路
である。
2. Description of the Related Art A conventional technique will be described with reference to FIGS. In FIG. 4, 1-1 and 1-2 are main MOSs
In this case, an IGBT is used here as an example. 2-1 and 2-2 are DC power supplies, 3 is a reactor, and the circuit of FIG. 4 is a circuit generally called a half bridge circuit.

【0003】図4に示すような回路で、主IGBT1―
1と主IGBT1―2が同時にONしてしまうと、電流
が負荷であるリアクトル3を通らず主IGBT1―1と
1―2を通過して電源が短絡してしまうために、それを
防止する目的で図6に示すように主IGBT1―1のO
N区間と主IGBT1―2のON区間の間にデッドタイ
ムという主IGBT1―1と主IGBT1―2の両方と
もONしていない区間を設けている。
In the circuit as shown in FIG. 4, the main IGBT 1-
If 1 and the main IGBT 1-2 are turned on at the same time, the current will pass through the main IGBTs 1-1 and 1-2 without passing through the reactor 3, which is a load, and the power supply will be short-circuited. As shown in FIG. 6, O of the main IGBT 1-1
Between the N section and the ON section of the main IGBT1-2, a dead time section is provided in which neither the main IGBT1-1 nor the main IGBT1-2 is ON.

【0004】しかし、それにも拘らず主IGBT1―
1,1―2がノイズ等で誤って同時にONして主IGB
T1―1,1―2に過電流が流れると言う故障モ―ドが
ある。この過電流により素子破壊を防ぐための従来の保
護回路について説明する。図5は、図4の主IGBT1
―1のコレクタ端子7―1、エミッタ端子8―1に囲ま
れた(A)部の拡大図である。
However, in spite of that, the main IGBT 1-
1, 1-2 are mistakenly turned on at the same time due to noise, etc.
There is a failure mode in which an overcurrent flows in T1-1 and 1-2. A conventional protection circuit for preventing element destruction due to this overcurrent will be described. FIG. 5 shows the main IGBT 1 of FIG.
It is an enlarged view of the (A) part surrounded by the collector terminal 7-1 of -1, and the emitter terminal 8-1.

【0005】従来の保護回路の構成は、検出用半導体素
子4―1(ここでは一例としてIGBTを用いた)と検
出用半導体素子4―1の通電電流検出用電流検出の一例
として検出用抵抗5―1を直列に接続したものを、主I
GBT1―1に並列に接続した構成となっている。又、
主IGBT1―1と検出用IGBT4―1は、ゲ―ト駆
動回路6―1からの同一のゲ―トによって動作させてい
る。主IGBT1―1に過電流が流れると、検出用IG
BT4―1にも比例した過電流が流れる。
The structure of the conventional protection circuit is such that the detection semiconductor element 4-1 (here, an IGBT is used as an example) and the detection resistor 5 as an example of the current detection for the energization current of the detection semiconductor element 4-1. -Connect one in series with the main I
It is configured to be connected in parallel to the GBT1-1. or,
The main IGBT 1-1 and the detection IGBT 4-1 are operated by the same gate from the gate drive circuit 6-1. When an overcurrent flows through the main IGBT1-1, the detection IG
An overcurrent proportional to BT4-1 also flows.

【0006】検出用抵抗5―1の電圧より過電流を読み
取り、主IGBT1―1の短絡過電流を検知し、ゲ―ト
信号を絞って短絡過電流を減少させ、最終的にはゲ―ト
信号を停止して短絡電流を遮断するという保護を行って
いる。
The overcurrent is read from the voltage of the detection resistor 5-1 to detect the short circuit overcurrent of the main IGBT 1-1, the gate signal is narrowed down to reduce the short circuit overcurrent, and finally the gate is detected. Protection is provided by stopping the signal and interrupting the short-circuit current.

【0007】[0007]

【発明が解決しようとする課題】図5に示すような従来
のMOS形半導体素子の保護回路では、主IGBT1―
1がONしていて検出用のIGBT4―1が点弧してい
ない時、つまり保護回路が動作していない場合に、主I
GBT1―1が点弧するために過電流から主IGBT1
―1を保護できない。あるいは主IGBT1―1がON
する前に検出用のIGBT4―1が、主IGBT1―1
の短絡破壊等の異常状態を検出して主IGBT1―1を
過電流破壊から未然に防止することが出来ないという安
全面の問題がある。
In a conventional protection circuit for a MOS type semiconductor device as shown in FIG. 5, the main IGBT 1-
1 is ON and the detection IGBT 4-1 is not firing, that is, when the protection circuit is not operating, the main I
The main IGBT1 from the overcurrent due to the ignition of GB1-1
-1 cannot be protected. Or main IGBT1-1 is ON
Before the detection, the IGBT 4-1 for detection is connected to the main IGBT1-1.
There is a safety problem in that it is impossible to prevent the main IGBT 1-1 from being damaged by overcurrent by detecting an abnormal state such as a short circuit breakdown.

【0008】本発明の目的は、図3に示すような主MO
S形半導体素子と検出用半導体素子の動作タイミングを
主MOS形半導体素子がONする場合は検出用半導体素
子を早くONさせ、主MOS形半導体素子がOFFする
場合は検出用半導体素子を遅くOFFさせることによ
り、主MOS形半導体素子が動作している場合は、必ず
検出用半導体素子が動作しているような、あるいは主M
OS形半導体素子が動作する前に前もって異常事態を検
出することができるMOS形半導体素子の保護方法及び
保護回路を提供することにある。
The object of the present invention is to provide a main MO as shown in FIG.
Regarding the operation timing of the S-type semiconductor element and the detection semiconductor element, when the main MOS type semiconductor element is turned on, the detection semiconductor element is turned on early, and when the main MOS type semiconductor element is turned off, the detection semiconductor element is turned off late. Therefore, when the main MOS type semiconductor element is operating, the detection semiconductor element is always operating, or the main M type semiconductor element is operating.
An object of the present invention is to provide a protection method and a protection circuit for a MOS type semiconductor device, which can detect an abnormal situation in advance before the OS type semiconductor device operates.

【0009】[0009]

【課題を解決するための手段】本発明は、上記目的を達
成するために、図1に示すように、検出用半導体素子1
2のゲ―トとゲ―ト駆動回路6―1とをOFF―DDE
LAY回路13を介して接続し、主MOS形半導体素子
10のゲ―トとゲ―ト駆動回路6―1とをON―DEL
AY回路14を介して接続したことを特徴とするもので
ある。
In order to achieve the above object, the present invention is directed to a semiconductor device 1 for detection as shown in FIG.
OFF-DDE the 2nd gate and the gate drive circuit 6-1.
The gate of the main MOS type semiconductor device 10 and the gate drive circuit 6-1 are connected to each other via the LAY circuit 13 and the ON-DEL is performed.
It is characterized by being connected via the AY circuit 14.

【0010】[0010]

【作用】主MOS形半導体素子10をONさせる場合
は、主MOS形半導体素子10のゲ―トにON―DEL
AYがかかり、検出用半導体素子12の方が主MOS形
半導体素子10より早くONする。
When the main MOS type semiconductor device 10 is turned on, the main MOS type semiconductor device 10 has an ON-DEL
AY is applied, and the detection semiconductor element 12 turns on earlier than the main MOS type semiconductor element 10.

【0011】主MOS形半導体素子10がOFFする場
合は、検出用半導体素子12のゲ―トにOFF―DEL
AYがかかり、検出用半導体素子12の方が主MOS形
半導体素子10より遅くOFFする。上記のような作用
によって、従来のような検出遅れを防ぐことができる。
When the main MOS type semiconductor element 10 is turned off, an OFF-DEL is connected to the gate of the detection semiconductor element 12.
AY is applied, and the detection semiconductor element 12 is turned off later than the main MOS type semiconductor element 10. With the above-described operation, it is possible to prevent the conventional detection delay.

【0012】[0012]

【実施例】以下本発明の一実施例を図1及び図2を参照
して説明する。図2は、図1に示す本発明の一実施例を
具体化した回路構成図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 2 is a circuit configuration diagram embodying the embodiment of the present invention shown in FIG.

【0013】この実施例では、OFF―DELAY回路
13を抵抗15とダイオ―ド16の並列回路によって構
成している。次に、ON―DELAY回路14をダイオ
―ド17と抵抗18の並列回路によって構成している。
尚、本実施例に於ては、主MOS形半導体素子10の一
例としてIGBT1―1、検出用半導体素子12の一例
としてIGBT4―1を用いて構成した。
In this embodiment, the OFF-DELAY circuit 13 is composed of a parallel circuit of a resistor 15 and a diode 16. Next, the ON-DELAY circuit 14 is composed of a parallel circuit of a diode 17 and a resistor 18.
In this embodiment, the main MOS type semiconductor device 10 is composed of the IGBT 1-1 and the detection semiconductor device 12 is composed of the IGBT 4-1.

【0014】ゲ―ト駆動回路6―1と検出用IGBT4
―1のゲ―トとをOFF―DELAY回路13を介して
接続し、ゲ―ト駆動回路6―1と主IGBT1―1のゲ
―トをON―DELAY回路14を接続する。
Gate drive circuit 6-1 and detection IGBT 4
The -1 gate is connected via the OFF-DELAY circuit 13, and the gate drive circuit 6-1 and the main IGBT1-1 gate are connected to the ON-DELAY circuit 14.

【0015】図2の主IGBT1―1をONさせる場
合、ゲ―ト駆動回路6―1とエミッタ端子7―1に正の
ゲ―ト電圧をかけると、検出用IGBT4―1のゲ―ト
・エミッタ間にかかるゲ―ト電圧は、OFF―DELA
Y回路13のダイオ―ド16によって通常の遅れの無い
ON動作を行い、主IGBT1―1のゲ―ト・エミッタ
間にかかるゲ―ト電圧は、ON―DELAY回路14の
抵抗18によって主IGBT1―1のON動作を遅らせ
る。これによって、主IGBT1―1がONする場合O
N―DELAY回路14によって、検出用IGBT4―
1が主IGBT1―1より先にONする。
When the main IGBT 1-1 of FIG. 2 is turned on, if a positive gate voltage is applied to the gate drive circuit 6-1 and the emitter terminal 7-1, the gate of the detection IGBT 4-1 is detected. The gate voltage applied between the emitters is OFF-DELA
The diode 16 of the Y circuit 13 performs a normal ON operation without delay, and the gate voltage applied between the gate and the emitter of the main IGBT 1-1 is changed by the resistor 18 of the ON-DELAY circuit 14 to the main IGBT 1-. Delay the ON operation of 1. As a result, when the main IGBT1-1 turns on, O
With the N-DELAY circuit 14, the detection IGBT 4
1 is turned on before the main IGBT 1-1.

【0016】次に、主IGBT1―1をOFFさせる場
合、ゲ―ト駆動回路6―1とエミッタ端子8―1に負の
ゲ―ト電圧をかけると、主IGBT1―1は、ON―D
ELAY回路14のダイオ―ド17によって通常の遅れ
の無いOFF動作を行い、検出用IGBT4―1は、O
FF―DELAY回路13の抵抗15によってOFF動
作を遅らせる。
Next, when the main IGBT 1-1 is turned off, a negative gate voltage is applied to the gate drive circuit 6-1 and the emitter terminal 8-1, and the main IGBT 1-1 turns on-D.
The diode 17 of the ELAY circuit 14 performs a normal OFF operation without delay, and the detection IGBT 4-1 is turned off.
The OFF operation is delayed by the resistor 15 of the FF-DELAY circuit 13.

【0017】これによって、主IGBT1―1がOFF
動作する場合、OFF―DELAY回路13によって、
主IGBT1―1が検出用IGBT4―1より先にOF
Fする。
As a result, the main IGBT 1-1 is turned off.
When operating, the OFF-DELAY circuit 13
The main IGBT1-1 is OF before the detection IGBT4-1
F

【0018】上記の動作特性により、主IGBT1―1
が動作中は必ず検出用IGBT4―1が動作しているの
で検出遅れが無く、主IGBT1―1に流れる過電流を
確実に検出でき、ゲ―ト絞り等の保護動作により主IG
BT1―1を確実に保護できるという効果が得られる。
Due to the above operation characteristics, the main IGBT 1-1
Since the detection IGBT 4-1 is always operating during operation, there is no detection delay and the overcurrent flowing in the main IGBT 1-1 can be detected reliably, and the main IGBT is protected by the protection operation such as the gate diaphragm.
The effect that the BT1-1 can be reliably protected is obtained.

【0019】以上の説明では、主IGBT1―1,1―
2を素子単体として説明したが、主IGBT1―1,1
―2が複数直列または並列接続した場合も同一の効果が
得られる。
In the above description, the main IGBTs 1-1, 1-
2 has been described as a single element, but the main IGBTs 1-1, 1
The same effect can be obtained when a plurality of -2 are connected in series or in parallel.

【0020】又、ON―DELAYやOFF―DELA
Y回路を主IGBT1―1や検出用IGBT4―1と物
理的に別回路として製作しても良いし、主IGBT1―
1や検出用IGBT4―1を同一半導体ペレット上、ま
たは、同一半導体パッケ―ジ内に製作しても同一の効果
を得ることができる。
In addition, ON-DELAY and OFF-DELA
The Y circuit may be physically formed as a separate circuit from the main IGBT1-1 or the detection IGBT4-1, or the main IGBT1-1-
The same effect can be obtained by manufacturing 1 or the detection IGBT 4-1 on the same semiconductor pellet or in the same semiconductor package.

【0021】[0021]

【発明の効果】以上説明のように、本発明によれば、主
MOS形半導体素子が動作中に検出用半導体素子が必ず
ON状態であり、検出遅れによって発生する過電流から
の主MOS形半導体素子を確実に保護でき、又、主MO
S形半導体素子の動作前に前もって、検出用半導体素子
により異常事態を検出して主MOS形半導体素子を過電
流破壊等から未然に防止することができるという著しい
効果が得られる。
As described above, according to the present invention, the detection semiconductor element is always in the ON state during the operation of the main MOS semiconductor element, and the main MOS semiconductor from the overcurrent generated by the detection delay is generated. The element can be protected surely and the main MO
Before the operation of the S-type semiconductor element, the remarkable effect that the abnormal state can be detected by the detecting semiconductor element in advance and the main MOS type semiconductor element can be prevented from being destroyed by overcurrent or the like is obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示すブロック図。FIG. 1 is a block diagram showing an embodiment of the present invention.

【図2】図1の具体的一例を示した回路構成図。FIG. 2 is a circuit configuration diagram showing a specific example of FIG.

【図3】本発明の動作を説明するための動作タイミング
図。
FIG. 3 is an operation timing chart for explaining the operation of the present invention.

【図4】MOS形半導体素子の適用例を示すハ―フブリ
ッジ回路。
FIG. 4 is a half bridge circuit showing an application example of a MOS semiconductor device.

【図5】図4の一部詳細図。FIG. 5 is a partial detailed view of FIG.

【図6】MOS形半導体素子を保護する原理を説明する
ためのタイミング図。
FIG. 6 is a timing diagram for explaining the principle of protecting a MOS semiconductor device.

【符号の説明】[Explanation of symbols]

1―1,1―2 …主IGBT 2―1,2―
2 …直流電源 3 …リアクトル 4―1
…検出用IGBT 5―1 …検出用抵抗 6―1
…ゲ―ト駆動回路 7―1 …コレクタ端子 8―1
…エミッタ端子 10 …主MOS形半導体素子 12 …検出用半導体素子 13 …OFF―DELAY回路 14 …ON―DELAY回路 15,18 …抵抗 16,17 …ダイオ―ド
1-1, 1-2 ... Main IGBT 2-1, 2-
2 ... DC power supply 3 ... Reactor 4-1
… Detecting IGBT 5-1… Detecting resistor 6-1
... Gate drive circuit 7-1 ... Collector terminal 8-1
... Emitter terminal 10 ... Main MOS type semiconductor element 12 ... Detection semiconductor element 13 ... OFF-DELAY circuit 14 ... ON-DELAY circuit 15, 18 ... Resistor 16, 17 ... Diode

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 検出用半導体素子と、この検出用半
導体素子の通電電流を検出する電流検出器との直列回路
を、主MOS形半導体素子に並列に接続したスイッチン
グ回路を少なくとも2組直流電源間に接続して成る回路
において、前記検出用半導体素子を前記主MOS形半導
体素子より早くオンさせ遅くオフさせることを特徴とす
るMOS形半導体素子の保護方法。
1. A switching circuit in which a series circuit of a detection semiconductor element and a current detector for detecting a current flowing through the detection semiconductor element is connected in parallel to a main MOS semiconductor element between at least two sets of DC power supplies. A method for protecting a MOS type semiconductor element, characterized in that the detection semiconductor element is turned on earlier than the main MOS type semiconductor element and turned off later than the main MOS type semiconductor element.
【請求項2】 検出用半導体素子と、この検出用半
導体素子の通電電流を検出する電流検出器との直列回路
を、主MOS形半導体素子に並列に接続し、前記電流検
出用半導体素子及び主MOS形半導体素子に同一のタイ
ミングでゲ―ト信号を供給するゲ―ト駆動回路を備えた
スイッチング回路を少なくとも2組直流電源間に接続し
て成る回路において、各スイッチング回路はゲ―ト駆動
回路と検出用半導体素子のゲ―トの間にOFF−DEL
AY回路を、ゲ―ト駆動回路と主MOS形半導体素子の
ゲ―トの間にON―DELAY回路を設けたことを特徴
とするMOS形半導体素子の保護回路。
2. A series circuit of a detection semiconductor element and a current detector for detecting a current flowing through the detection semiconductor element is connected in parallel to the main MOS semiconductor element, and the current detection semiconductor element and the main semiconductor element are connected. In a circuit in which at least two sets of switching circuits each having a gate driving circuit for supplying a gate signal to the MOS type semiconductor device at the same timing are connected between DC power supplies, each switching circuit is a gate driving circuit. OFF-DEL between the gate and the gate of the semiconductor device for detection
A protection circuit for a MOS type semiconductor device, characterized in that an ON-DELAY circuit is provided between the gate drive circuit and the gate of the main MOS type semiconductor device.
JP218893A 1993-01-11 1993-01-11 Protection method and protective circuit for mos type semiconductor element Pending JPH06209566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP218893A JPH06209566A (en) 1993-01-11 1993-01-11 Protection method and protective circuit for mos type semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP218893A JPH06209566A (en) 1993-01-11 1993-01-11 Protection method and protective circuit for mos type semiconductor element

Publications (1)

Publication Number Publication Date
JPH06209566A true JPH06209566A (en) 1994-07-26

Family

ID=11522392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP218893A Pending JPH06209566A (en) 1993-01-11 1993-01-11 Protection method and protective circuit for mos type semiconductor element

Country Status (1)

Country Link
JP (1) JPH06209566A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012207222A1 (en) 2011-05-02 2012-11-08 Mitsubishi Electric Corporation Power semiconductor device with a plurality of parallel switching elements

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012207222A1 (en) 2011-05-02 2012-11-08 Mitsubishi Electric Corporation Power semiconductor device with a plurality of parallel switching elements
US8766702B2 (en) 2011-05-02 2014-07-01 Mitsubishi Electric Corporation Power semiconductor device having plurality of switching elements connected in parallel
DE102012207222B4 (en) * 2011-05-02 2016-05-25 Mitsubishi Electric Corporation Power semiconductor device with a plurality of parallel switching elements
DE102012025769B3 (en) * 2011-05-02 2016-07-14 Mitsubishi Electric Corporation Power semiconductor device with a plurality of parallel switching elements

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