JPH06209157A - Mounting of component - Google Patents

Abstract

PURPOSE:To make low the heights of mounted components by a method wherein when a flat package component of an LSI or the like is mounted is not conducted. CONSTITUTION:The length only of leads 2 of an electrical component 1 is made even leaving as the leads 2 are straight to cut the leads 2, the component 1 is inserted in a square hole conformed to the size of a package of the component 1 in such a way that it is buried in a mounting substrate 5 with the square hole bored therein and the leads 2 of the component 1 are fixed on lead pads 6 on the substrate 5 by soldering or the like. Thereby, a lead molding jig is dispensed with and at the same time, the heights of components on the substrate 5 can be made low.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounted on a substrate, which requires high-density mounting, a device in which dimensional tolerance of lead pitch is strictly required such as a narrow pitch, or a component mounted on a substrate. The present invention relates to the field of board mounting in which height restrictions are strictly required.

[0002]

2. Description of the Related Art FIG. 3 shows an example of the shape of parts applied to the present invention. In the figure, 1 is an electric component, 2 is a lead that is straight from four sides of the electric component 1, and 3 is a lead pad for electrically connecting the electric component 1 and the lead 2. The lead shape of the flat package component is basically shipped as a straight lead 2 parallel to the upper surface of the electric component 1 shown in FIG.

Next, a method of mounting components will be described. FIG. 4 shows a shape after the lead 2 is molded by the lead molding jig for mounting the electric component 1 on the substrate. Reference numeral 4 indicates a molding portion of the lead 2. FIG. 5 shows a board (hatched portion) on which an electric component is mounted from above, 5 is a mounting board, and 6 is a lead pad 6 on which the molded lead 2 of the electric component 1 shown in FIG. 4 is placed. The lead pad 6 has a conductive pattern and is used for electrical connection with other components mounted on the mounting substrate 5. FIG. 6 is a side view of the mounting substrate 5 on which the electrical component 1 after molding the leads 2 shown in FIG. 4 is mounted.

[0004]

In the component mounting method as described above, the distance between two adjacent leads 2 is very small,
That is, in the case of a narrow pitch, when molding the lead 2,
There is a problem that the flatness error of bending is very strict and a high-precision lead molding jig and tool are required.
There was also a problem that the height of parts would be higher.

The present invention has been made to solve the above problems, and an object thereof is to eliminate the need for a lead molding jig and to suppress the height of the electric component 1 on the mounting substrate 5.

[0006]

In the component mounting method according to the present invention, the lead 2 of the electrical component 1 is not molded, and only a cut for adjusting the length of the lead 2 is performed. After forming a square hole in the package shape of the electric component 1, arranging lead pads on the four sides of the square hole to which the straight lead 2 can be fixed by soldering, etc., and after inserting the electric component 1 into the square hole of the substrate, The lead 2 of the electric component 1 and the lead pad on the substrate side can be fixed by a method such as soldering.

[0007]

By adopting the mounting method as described above, the jig for molding the lead 2 of the electric component 1 is not necessary, and the height of the electric component 1 on the substrate can be kept low.

[0008]

【Example】

Example 1. FIG. 1 shows an embodiment of the present invention, and 5 and 6
Is the same as before. Reference numeral 7 denotes a square hole formed in the mounting board 5. The size of the square hole 7 is obtained by adding a tolerance to the package size of the electric component 1.

FIG. 2 is a side view of the mounting substrate 5, in which the electric component 1 is embedded in the square hole 7. In FIG. 2, 8 indicated by a dotted line is an electric component inserted from the opposite surface of the mounting substrate 5, 9 is a lead of the electric component 8, and 10 is a lead pad on the opposite surface of the mounting substrate. In this way, it is possible to mount the electric components 1 and 8 from both sides.

Next, the mounting procedure will be described. After inserting the electric component 1 into the square hole 7, the lead 2 that remains straight
Is aligned with the lead pad 6, and then fixed by soldering or the like. When mounting the electric component 8 having the same shape, after mounting the electric component 1, the lead 9 is fixed to the lead pad 10 by inserting the electric component 1 into the square hole 7 from the opposite side of the mounting substrate 5.

As described above, the lead 2 of the electric component 1 is not molded, and the mounting board 5 is formed by embedding a square hole matching the shape of the electric component 1 and embedding it.
The lead-molding jig is unnecessary, and since the component height can be kept low and the electric components 1 and 8 can be mounted on the mounting substrate 5 from both sides, high-density mounting design is possible.

In the above description, as the electric component 1, L
Although the rectangular package such as SI and the flat package have been described as examples, the present invention may be applied to a high component height such as a transistor and a capacitor.

[0013]

EFFECTS OF THE INVENTION Since the present invention is configured as described above, the lead molding jig of the high-precision electric component 11 is not necessary and the component height can be kept low.
This has the effect of enabling high-density mounting.

[Brief description of drawings]

FIG. 1 is a mounting board with square holes showing an embodiment of the present invention.

FIG. 2 is a diagram showing an electrical component mounting form showing an embodiment of the present invention.

FIG. 3 is a diagram showing a shape of an electric component.

FIG. 4 is a view showing a shape of an electric component after conventional lead molding.

FIG. 5 is a diagram showing a conventional mounting board.

FIG. 6 is a diagram showing a conventional electrical component mounting mode.

[Explanation of symbols]

 1 Electrical Component 2 Lead 3 Lead Pad 4 Lead Molding Part 5 Mounting Board 6 Lead Pad 7 Square Hole

Claims (1)

[Claims] 1. A flat package component, in which leads for outputting an electric signal are drawn out in parallel and straight to the upper surface of the package from two or four opposite sides of an electrical component such as lSI having a quadrilateral package mounted on a substrate. In this case, the lead is not bent and molded by the lead molding jig used for soldering to the board, only the lead length is cut and left in the straight shape, and the above parts are mounted on the mounting part on the board side. Square holes that match the shape of the package size are provided, and lead pads on which the straight leads of the above components can be directly mounted and soldered are placed on the two opposite sides or four sides of the square holes of the board. Then, the straight lead of the above-mentioned component and the lead pad on the side of the substrate that matches the lead are fixed by soldering. A component mounting method, which is characterized by: