JPH06196743A - Solar battery module - Google Patents

Abstract

PURPOSE:To provide a solar battery module with a small number of operating steps and a high productivity instead of a series step using a bus bar. CONSTITUTION:A semiconductor layer, a transparent electrode layer and a collection electrode are formed on a conductive substrate, and they are cut in a desired size, and solar battery cells 101 are formed. Subsequently, a collection electrode layer 106, the transparent electrode layer and the semiconductor layer along one side of the solar battery cells 101 are respectively removed, and each solar battery cell 101 formed so as to expose a part 102 of the surface of the conductive substrate is arranged between electrode terminal tabs 104 on a flat plate in a transverse row, and members 103 for series connection are stuck between the adjacent solar battery cells 101. Thus, a solar battery module can be manufactured easily and speedily without performing troublesome operations such as a soldering and a coating of an insulating resin. Further, a bus bar for concentrating a current is eliminated and the whole shape of the solar battery module can be flattened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a solar cell module,
In particular, the present invention relates to improvement of the serialization process of solar cells.

[0002]

2. Description of the Related Art Amorphous silicon solar cells are shown in FIG.
As shown in FIG. 4, a conductive substrate 404, a photoelectric conversion layer 403 made of amorphous silicon, a transparent conductive layer 402 also serving as an antireflection layer, and a current collecting grid electrode 401 are formed in that order. Light incident from the grid electrode 401 side is converted into a current in the photoelectric conversion layer 403, and is extracted as an output from between the current collecting grid electrode 401 and the conductive substrate 404 via the transparent conductive layer 402.
When the photoelectric conversion layer 403 is composed of, for example, only one layer of amorphous silicon, its output voltage is a low value of about 0.7 V, so that several to several hundreds of photoelectric conversion layers are connected in series in practical use. , Various output increasing methods are adopted. Specifically, in the case of a solar battery cell in which a photoelectric conversion layer is provided on a conductive substrate, it is necessary to make a direct wiring through a wiring material and to manufacture a solar battery module in which the cells are connected in series. It was

Conventionally, a solar cell module has, for example, as shown in FIG. 6, a bus bar 6 on each solar cell 600.
01 one end of each of the connection copper tabs 603 is connected to one end of each of the connection copper tabs 603 via solder 602a, and the other end of the copper tab 603 removes the semiconductor layer of the solar cell adjacent to the solar cell. Exposed portion 60 of the conductive substrate formed by
4 was connected via solder 602b. In addition, since a part of the conductive substrate is exposed around the solar battery cells, in order to prevent a short circuit between the exposed portion and the bus bar 601, the vicinity of both ends of the bus bar 601 is insulated with an insulating material 605. In addition, the insulating material 606 is provided along one side of the solar battery cell 600 in order to prevent contact between the bases of the solar battery cell and adjacent solar battery cells.
Since the bus bar 601 is a member that is connected to a large number of current collecting electrodes 607 through a conductive adhesive 608 and concentrates current, a metal wire having high conductivity is used. In the figure, 609 is an electrode terminal tab, and 610 is a sealing resin.

FIG. 7 illustrates in more detail the serialization process of the conventional solar module. First, FIG.
As shown in (a), a resin 60 as an insulating material is formed on a part of the exposed portion of the conductive substrate formed around the solar cell 600.
5 and then a resin 606 as an insulating material is applied along one side end, and these are hardened. Next, as shown in FIG. 7B, the bus bar 601 is adhered to the collector electrode 607 via the conductive adhesive 608, and the adhesive is cured. next,
As shown in FIG. 7C, other solar cells are arranged adjacent to the solar cell, and one end of the series metal tab 603 and one end of the bus bar 601 of the solar cell are soldered 602a. Through the metal tab 603.
The other end is connected to the exposed conductive substrate 604 of another adjacent solar cell via the solder 602b, thus ending the serialization step.

FIG. 22 shows another structural example for forming the exposed portion of the conductive substrate, which is a stainless steel substrate 22.
01, a thin semiconductor layer is formed, a substrate exposed portion 2202 is provided in a part of the substrate 2201, and a bus bar 2204 of the first solar cell and a substrate exposed portion 2202 of the second solar cell are connected. ing. Note that in FIG. 22, 2
203 is a collector electrode.

[0006] As another example, there is a method of stacking adjacent solar cells on the light incident side.

[0007]

However, in the conventional method of serializing the solar cell module, it is necessary to apply an insulating material, fix the bus bar 601, and solder the wiring material for serialization, which is troublesome. Productivity is poor because it takes too much time. Further, since current concentrates on the bus bar 601, it is necessary to form the bus bar 601 with a conductive wire having a large cross-sectional area, which hinders reduction of the thickness of the solar battery cell. In this case, if the thickness of the bus bar 601 is unduly thin, the width must be increased in order to increase the current capacity.
There is a problem that the output of the solar battery cell is reduced according to the so-called shadowed portion covered with 01. Moreover, since the problem of current concentration also occurs in the series-connecting metal tab 603 connected to the bus bar 601, it is necessary to increase the cross-sectional area of the metal tab 603. Furthermore, since the solders 602a and 602b are frequently used, there is a possibility that the residue of the flux necessary for soldering may adversely affect the reliability of the cell.

Further, the conventional solar cell module described above is
After connecting the solar cells in series, it is necessary to coat them with a polymer resin such as EVA or a coating material such as fluorine resin in order to provide environmental resistance. There is also a problem that the amount of material covering the battery cells increases, which increases the cost of the solar cell module and increases the thickness and weight of the solar cell module.

Further, when the bus bar electrode is thick,
Even if the amount of the covering material is increased, the entire covering material on the bus bar electrode is still thin, so that there is a problem that the scratch resistance of the solar cell module is poor.

Further, in the case of the structure shown in FIG. 22, it is necessary to provide a substrate exposed portion 2202 in the substrate 2201 for performing serialization, so that the portion 2202 is a portion that does not contribute to the power generation of the solar cell and is effective. The area is so small that the solar cells cannot be effectively used, and the bus bar 2
Since it is necessary to provide 204, this portion also becomes a shadow and causes a loss in conversion efficiency, and there are manufacturing problems such as formation of the substrate exposed portion 2202 and fabrication of a complicated shape such as the substrate 220l. is there.

Furthermore, there are problems that the electrical connection is unstable and that the connection is easily failed when the solar cell is bent by an external force.

[0012]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art. It is an object of the present invention to provide a solar cell module with a small number of man-hours and high productivity instead of the serialization process using a bus bar. To aim.

Another object of the present invention is to provide a solar cell module having a high conversion efficiency, a thin and lightweight solar cell module, high quality, and high quality.

[0014]

The present invention is directed to a conductive substrate, a semiconductor layer provided on the substrate and having a photoelectric conversion function, a transparent conductive film provided on the semiconductor layer, and a transparent conductive film on the transparent conductive film. In a solar battery module in which a plurality of solar cells composed of a plurality of current collecting electrodes are connected in series, the current collecting electrode of one of the adjacent solar cells and the other solar cell A serial connection member is interposed between the conductive base, and the serial connection member includes a metal layer, a pair of conductive adhesive layers provided on one side of the metal layer at a predetermined interval, and both conductive layers. And an insulating adhesive layer sandwiched by a conductive adhesive layer, one conductive adhesive layer of the pair of conductive adhesive layers is brought into contact with the current collecting electrode of the one solar battery cell, The adhesive layer is the same as the adjacent solar cells. There is positioned so as to each other becomes an insulating condition, characterized in that the other of the conductive adhesive layer of the pair of the conductive adhesive layer so as to contact with the other conductive substrate of the solar cell.

In this case, it is preferable that the conductive adhesive and the insulating adhesive constituting the serial connection member are pressure sensitive adhesives.

The serial connection member is manufactured by the following procedure. First, a metal foil having a predetermined tape width or an insulating sheet having a metal film deposited thereon is prepared. Next, using a dispenser, a conductive adhesive, an insulating adhesive, and a conductive adhesive are placed in that order from the sheet end position of the tape width sheet, and squeegeeing is performed to obtain a uniform film thickness.

The conductive adhesive used for the series connection member is preferably a finely powdered gold, silver, copper, nickel, carbon or the like dispersed in a binder polymer. Examples of the binder polymer include resins such as polyester, epoxy, acryl, polyvinyl acetate, rubber, urethane and phenol. In particular, if an acrylic or rubber type pressure-sensitive adhesive is used, heating and curing are not required, which can contribute to reduction in the number of steps.

As the insulating adhesive, pressure sensitive adhesives such as acrylic, silicone and rubber adhesives are preferable.

As the metal layer, aluminum, copper,
Stainless steel or the like is suitable.

As the flat plate used in the manufacturing process of the solar cell module according to the present invention, a thin coated steel plate, a nylon resin sheet, a polyester resin sheet, or the like is suitable for sealing in the module, and when not sealed together. A PTFE sheet or the like to which no adhesive is attached is suitable.

As the sealing resin, ethylene-vinyl acetate copolymer (EVA resin), polyvinyl butyral, and silicone resin are preferable.

Examples of the conductive substrate include stainless steel, aluminum, copper, carbon sheets and the like.

Examples of the semiconductor layer having a photoelectric conversion function include pin-junction amorphous silicon, pn-junction polycrystalline silicon, CuIn ₂ Se ₂ / CdS and the like. The semiconductor layer is formed by plasma CVD of silane gas or the like in the case of amorphous silicon, formed into a sheet of molten silicon in the case of polycrystalline silicon, and formed by electron beam evaporation, sputtering or the like in the case of CuIn ₂ Se _2. .

As the transparent electrode, indium oxide,
Tin oxide, ITO, zinc oxide, titanium oxide, a crystalline semiconductor layer doped with a high concentration of impurities, and the like are preferable, and the formation method thereof is resistance heating vapor deposition, electron beam vapor deposition, sputtering method, spray method, CVD method, impurities. A diffusion method and the like can be mentioned.

[0025]

OPERATION One example of the manufacturing process of the solar battery module 100 in which a plurality of solar battery cells 101 as shown in FIG. 1 are serialized will be described.

First of all, as shown in FIG.
After the semiconductor layer 203 and the transparent electrode layer 202 are formed on the surface 4, the conductive electrode is screen-printed to form the collector electrode 201, which is cut into a desired size to manufacture the solar battery cell 200. Then, each solar cell 2
Collector electrode layer 201 and transparent electrode layer 20 along one side of
2. The semiconductor layer 203 is removed to expose a part of the surface of the conductive substrate 207. The solar cells 200 produced as described above are arranged side by side on the flat plate 208 between the electrode terminal tabs (104 shown in FIG. 1), and between the adjacent solar cells are members for series connection. Stick 203. Note that the flat plate 208 is the solar cell 2
It can be sealed together with 00. FIG. 5 shows a plan view state immediately after pasting the serial connection member 503.

When the serial connection member 203 is attached, as shown in FIG. 2, the insulating adhesive 203c covers one side (left side in FIG. 2) of the solar cell 200 on one side. In addition, it is important to set the position and pressing force. After the attachment, heat treatment is performed to complete the series connection.
Adhesive 203c used for serial connection member 203
When is a pressure sensitive adhesive, heat treatment is not required.

Thereafter, as shown in FIG. 1, if a lead wire is connected to the electrode terminal tab 104 for output extraction and sealed with a sealing resin 105, the solar module 100 as a final product.
Is obtained.

As described above, it can be seen that the solar cell module of the present invention can be manufactured simply and quickly without going through troublesome operations such as soldering and coating of insulating resin. Also,
A bus bar that concentrates the current is not required, and the overall shape of the solar cell module can be flattened.

In FIG. 1, 102 is an exposed portion of the conductive substrate, 103 is a tape-shaped serial connection member, and 106 is a collector electrode. In FIG. 2, reference numeral 207 denotes an exposed portion of the substrate, 203
Is a serial connection member, 203a is a metal layer, and 203b is a conductive adhesive.

FIG. 3 shows the connecting member 203 for series connection of FIG.
3 shows a state before being attached. In FIG. 3, reference numeral 303 is a connecting member for series connection, 303a is a metal layer, 303b is a conductive adhesive, and 303c is an insulating adhesive. Also, FIG.
Inside, 501 is a solar cell and 502 is an exposed portion of the substrate.

[0032]

EXAMPLES Examples of the present invention will be described in more detail below. Example 1 First, an amorphous silicon layer made of a pin junction having a film thickness of 400 nm is formed on a cleaned roll-shaped stainless steel substrate by plasma CVD of silane gas or the like by a roll-to-roll method, and then an IT film having a film thickness of 80 nm
O was formed by resistance heating vapor deposition. Next, a paste containing an ITO etching agent (ferric chloride, hydrochloric acid) was screen-printed and heat-treated to remove a part of the ITO layer to divide the solar cell. Next, the ITO / pin junction amorphous silicon layer located at the wiring connection portion of each separated solar cell was removed by a grinder to expose the surface of the stainless steel substrate, and the ITO removed portion was cut by irradiation with YAG laser light.

With respect to the above-mentioned cells, a collector electrode was formed by using a silver ink by a screen printing method to obtain a plurality of solar battery cells. As a serial connection member, an epoxy-based conductive adhesive (viscosity 2000 poise) containing silver particles as a filler in an aluminum foil having a width of 5 mm and a thickness of 0.1 mm, a width of 1 mm,
A pressure-sensitive acrylic insulating adhesive having a width of 3 mm and the same epoxy conductive adhesive as the above-mentioned epoxy conductive adhesive having a width of 1 mm were applied by a dispenser and squeezed to adjust the thickness to about 0.1 mm.

Next, three solar cells were arranged side by side between two terminal electrode copper tabs, a series connection member was attached between the solar cells, and heat treatment was carried out at 130 ° C. for 1 hour.

After the heat treatment, the PTFE sheet was removed, an element connected in series with two sheets of nylon sheet and EVA sheet was sandwiched, and laminated with a vacuum laminator to prepare a module according to the present invention. Since the series connection is performed by using the thin tape-shaped series connection member, the module can be flattened as a whole and the flexibility is high. This module is a standard light AM
l. It was placed under 5, 100 mW / cm ² , and the open circuit voltage was measured. As a result, it was 2.1 V, which indicated normal operation.

As described above, the conventional series connection process of solar cells requires the complicated work of covering the stainless substrate, fixing the bus bar, and soldering, but in the manufacture of the module of the present invention, As described above, the tape-shaped connecting member is attached and the heat treatment is all that is required, so the work is extremely simplified. (Example 2) In this example, first, as in Example 1,
Roll-to-roll method, plasma CV such as silane gas
By D, the film thickness 4 on the washed roll-shaped stainless steel substrate
After forming an amorphous silicon layer having a pin junction of 00 nm, ITO having a film thickness of 80 nm was formed by resistance heating vapor deposition. Further, a paste containing an ITO etching agent (ferric chloride, hydrochloric acid) was screen-printed and then heat-treated to remove a part of the ITO layer to divide the solar cell.

Subsequently, the surface of the stainless steel substrate in Example 1 was exposed by sandblasting, and the ITO removed portion was cut by shearing. With respect to the cells, a collecting electrode was formed by using a silver ink by a screen printing method to obtain a plurality of solar battery cells.

Next, the series connection member was constructed as follows. First, aluminum was vapor-deposited on a polyester tape having a width of 5 mm and a thickness of 0.1 mm. A pressure-sensitive acrylic conductive adhesive having a width of 1 mm, a pressure-sensitive acrylic conductive adhesive having a width of 3 mm, and a pressure-sensitive acrylic conductive adhesive having a width of 1 mm were applied to the vapor-deposited aluminum surface. The conductive filler of the conductive adhesive is silver particles. Next, a copper tab for extraction electrodes and three solar cells were placed side by side on a PTFE sheet, and the above-mentioned members for series connection were attached to make series connection.

As described above, in this embodiment, since the conductive adhesive and the insulating adhesive are both pressure-sensitive, even heat treatment is unnecessary, and the work is further simplified as compared with the conventional connection method. it can. (Example 3) A plurality of solar cells were manufactured in the same procedure as in Example 2. Next, a copper foil having a thickness of 0.2 mm and a width of 6 mm is used as a pressure-sensitive acrylic conductive adhesive having aluminum particles as a filler in a width of 2 mm, a pressure-sensitive rubber-based adhesive is in a width of 2 mm, and the above-mentioned acrylic conductive adhesive is used. With the same width as 2mm,
It was applied by a coater to obtain a member for series connection. As described above, in the present invention, the electric current is not concentrated and does not flow in the series connection portion, so that the conductivity of the conductive filler can be reduced. Therefore, aluminum, carbon or the like may be used instead of expensive silver.

Next, the copper tab for the terminal electrode and the solar battery cell 3
The sheets were arranged on a coated steel plate having a thickness of 0.2 mm and connected by a series member. Also in this embodiment, the series connection can be completed only by laminating the series members, which is remarkably simple. Furthermore, polyvinylidene fluoride (PVD
F, Tedlar (manufactured by Dupont) sheet and EVA sheet were stacked and laminated with a coated steel sheet by a vacuum laminator to obtain a module. Since the module of this embodiment is equipped with the back plate, the module has high strength, and the number of steps does not increase even if the back plate is mounted. (Embodiment 4) FIGS. 8 and 9 show a schematic structure of a solar battery module according to a fourth embodiment of the present invention, in which three solar battery cells 800a, 800b, 800c are arranged side by side. In each solar cell, as shown in FIG. 9, a lower electrode layer 802, a semiconductor layer 803, an upper electrode layer 804, and a comb-shaped electrode 805 which is a collector electrode are formed in that order on a conductive substrate 801. .

Then, between adjacent solar cells, the solar cells are arranged below the conductive substrate 801 so as to straddle the bus bar electrode 807, and the solar cells are connected in series, and the bus bar electrode 801 and the solar cells are connected. The comb-shaped electrode 805 is electrically connected via a conductor 806 such as a conductive paste.

Each solar cell 800a, 800b, 80
In 0c, the end face portion along the length direction of the bus bar of each cell was covered with the insulator 808 in order to prevent an electrical short circuit between the conductive substrate 801 and the bus bar electrode 807. Further, as shown in the figure, the solar cell 800a, 800c on both sides has a terminal connector 80 connected to each conductive substrate 801.
9 and 810 are provided respectively.

As described above, in the solar cell module according to this embodiment, the bus bar electrode 807 is located below the conductive substrate 801 and is located between the adjacent solar cells, so that the bus bar Shadow loss due to the bus bar electrode 807 can be reduced as compared with the conventional solar cell module in which the electrode 807 is located above the solar cell.

Further, the bus bar electrode 807 is connected to the conductive substrate 8
Since it is located below 01, the area of the bus bar electrode 801 can be increased, and as a result, the thickness of the bus bar electrode 801 can be reduced.

Examples of the conductive substrate 801 include stainless steel, aluminum, copper, carbon sheet and the like, but a stainless substrate is preferably used.

As the lower electrode 802, Ti, Cr, M
O, W, Al, Ag, Ni or the like is used, and as a forming method, there are resistance heating vapor deposition, electron beam vapor deposition, sputtering method and the like.

For the photovoltaic layer, a semiconductor material known as a thin film solar cell can be used.

As the semiconductor layer 803, for example, a pin junction amorphous silicon layer, a pn junction polycrystalline silicon layer, Cu
A compound semiconductor layer such as InSe ₂ / CdS may be used.

As a method of forming the semiconductor layer 803,
The amorphous silicon layer can be formed by plasma CVD or the like in which plasma discharge is generated in a raw material gas such as silane gas that forms a film.

Further, the pn junction polycrystalline silicon layer is
For example, it is formed by a film forming method of forming a film from molten silicon. In addition, the above CuInSe ₂ /
CdS is formed by a method such as an electron beam vapor deposition method, a sputtering method, and an electrodeposition method (deposition by electrolytic decomposition of an electrolytic solution).

As a material used for the upper electrode layer 804,
_{In 2 0 3, SnO 2,} In 2 O 3 over SnO _2, ZnO, Ti
There are O ₂ , Cd ₂ SnO ₄ , and crystalline semiconductor materials doped with impurities in a high concentration, and the like. The forming methods are resistance heating evaporation, electron beam evaporation, sputtering method, spray method,
There are a CVD method, an impurity diffusion method and the like.

A material having a higher conductivity than that of the upper electrode 804 can be used for the comb-shaped electrode 805. Examples thereof include a metal electrode and a conductive electrode in which a metal and a polymer binder are dispersed. Generally, a metal paste in which a metal powder and a polymer resin binder are in a paste form is used. These metal pastes are usually formed on the transparent electrode by a screen printing method. Among these metal pastes, silver paste is preferable in consideration of conductivity and cost, but the metal paste is not limited to this.

The bus bar electrode 807 is not particularly limited, but a metal electrode, a conductive paste or the like is usually used, and the shape thereof is linear or tape-like.

The conductor 806 is not particularly limited, but a conductor such as a conductive metal paste, solder, or metal wire is usually used.

The insulator 808 may be, for example, an insulating tape such as a polyester tape or an insulating resin such as an epoxy resin or an acrylic resin which is heat-cured or photo-cured. (Embodiment 5) This embodiment is shown in FIGS. 10 and 11, and uses a stainless steel substrate as a conductive substrate.

First, as a conductive substrate (the same as the conductive substrate 801 of Example 5 shown in FIG. 9), a 0.2 mm thick stainless steel foil whose surface was cleaned was prepared.
Next, on the stainless steel foil, as a lower electrode (similar to the conductive substrate 802 shown in FIG. 9), 5000 Å
And an aluminum film of 700 Å were formed by a sputtering method at a substrate temperature of 350 ° C. Then Zn
On the O film, 150 Å n-type a-Si layer, 4000 Å i
Type a-Si layer, 100 Å p-type a-Si layer, three photoelectric conversion layers as pin junction semiconductor layers (similar to conductive substrate 803 shown in FIG. 9) are continuously formed in that order. did. The gases used at this time are SiH ₄ gas / PH ₃ gas / H ₂ gas, SiH ₄ gas / H ₂ gas, SiH ₄ gas / BF
_{It was 3} gas / H ₂ gas, and the substrate temperature was maintained at 250 ° C.

Then, a 700 Å In ₂ O ₃ —SnO ₂ film (ITO film) was formed on the semiconductor layer as a transparent electrode (similar to the conductive substrate 804 of Example 5 shown in FIG. 9).
It was formed by resistance heating vapor deposition of In and Sn at 200 ° C. in an oxygen atmosphere.

Then, the formed roll-shaped stainless steel substrate was cut into a pattern as shown in FIG. 10 to obtain three solar battery cells 1001 to 1003. Next, an ITO etching material (FeCl ₃ , HCl) containing paste is screen-printed and then heated and washed to remove the ITO layer on the paste-printed portion (removed portion 10
11), ensured electrical separation between the upper electrode and the lower electrode.

Next, a 0.3 mm wide current collecting comb-shaped electrode 1012 on the ITO layer was formed by screen-printing a silver paste.

Subsequently, each solar cell 1001-100
In order to insulate each other from each other, each of the adjacent end portions is connected to 0.
It was covered with 1 mm thick polyester tape 1013. In this case, the polyester tape 1013 was attached to the inside of the removed portion 1011 of the ITO in order to electrically separate the upper electrode and the lower electrode.

Next, below the conductive substrate of each solar cell and across the adjacent solar cells, the copper foil 10 serving as a bus bar electrode having a thickness of 0.1 mm and a width of 5 mm.
I placed 14.

Here, the distance between the solar cells is 1.
The thickness was set to 0 mm, and the solar cell and the bus bar electrode were temporarily fixed with an adhesive tape 1018.

Next, the bus bar electrodes 1014 located over the solar cells 1001 and 1002, and over the solar cells 1002 and 1003, respectively, are projected onto the substrates of the solar cells 1002, 1003. They were electrically connected by spot welding. Thereby, the solar cells 1001 to 1003 were connected in series.

Further, a copper tab 1016 for taking out a terminal from the negative electrode side is connected to the convex portion of the solar battery cell 1001 by welding, and a copper tab 1017 for taking out a terminal from the positive electrode side is connected to the solar cell. The bus bar 1014 connected to the comb-shaped electrode of the cell 1003 was connected by soldering.

Next, the above-prepared solar cell module was placed on a PET film 1020 having a thickness of 0.3 mm, and then resin-sealed with a fluorine resin and EVA (ethylene vinyl acetate copolymer). .

In the above solar cell module, the bus bar electrode is located under the conductive substrate and is located between the adjacent solar cells, so that the bus bar electrode is located above the solar cell. It is possible to reduce the shadow loss due to the bus bar electrode as compared with the solar cell module described above. (Embodiment 6) This embodiment has the structure shown in FIG. 12, but in the structure of the above-mentioned embodiment 5, the comb-shaped electrode 1012 on the solar battery cell and the bus bar electrode 1014 are electrically connected. A copper wire 1201 having a diameter of 0.2 mm was used as the connection body of No. Other configurations were the same as those in the fifth embodiment.

That is, in FIG. 12, the copper wire 1201
Is for electrically connecting the comb-shaped electrode 1012 and the bus bar electrode 1014, and is arranged in an arc shape between the ends of the adjacent solar cells. The copper wire 1201 and the comb-shaped electrode 10
12 and the copper wire 1201 and the bus bar electrode 101
For connection with No. 4, adhesive silver ink 1002 was used.

As in the sixth embodiment, a copper wire 100 as a connection body is used.
When the solar cell module was constructed using No. 1, the bending resistance of the solar cell module could be improved in addition to the effect of Example 4 described above. (Embodiment 7) In this embodiment, in the structure of Embodiment 5, a polyester tape 1 which is an insulating material at an end portion of a solar battery cell.
Instead of 013, a photocurable resin was used. The other structure was the same as that of the fifth embodiment. As the photocurable resin, TB3042C (registered trademark) manufactured by ThreeBond Co., Ltd. is used.
After forming a resin thin film by dipping to the inside of the portion 1011 where the TO has been removed by etching, l500 mj / c
It was cured by irradiation with UV radiation in an amount of m ² . The thickness of the photocurable resin was about 30 μm.

By manufacturing the thin film insulating material by photo-curing as in the present embodiment, it becomes possible to make the distance between the solar cells 0.5 mm, which is excellent in flatness and also causes shadow loss. A small number of solar cell modules could be manufactured. (Embodiment 8) The present embodiment 8 has a configuration shown in FIGS. 13 and 14, and has solar battery cells 1320 to 1322.
Are the lower electrode layer 1302, the semiconductor layer 1303, the upper electrode layer 1304, and the upper electrode layer 13 on the conductive substrate 1301.
A comb-shaped electrode 1305, which is a collector electrode of No. 04, was formed. Three solar cells were arranged in parallel, and a plate-shaped bus bar electrode 1307 was arranged at the end of each solar cell.

In order to connect the three solar cells in series, the bus bar electrode 1307 and the comb-shaped electrode 1305 were electrically connected via a conductor 1306 such as a conductive paste.

Here, each end of each solar cell is covered with an insulator 1308 so that the conductive base 1301 and the bus bar electrode 1307 are not electrically short-circuited. In addition, in the figure, 1309 and 1310 are the solar battery cells 1.
This is a connection body for taking out terminals from the conductive substrates 320 and 1322.

As can be understood from FIG. 13, in the solar cell module of the present invention, the bus bar electrodes 1307 are located between the solar cells, so that the total thickness of the conventional solar cell module is at least equivalent to the thickness of the bus bar electrode. I could make it thinner.

The conductive substrate 1301 of this embodiment may be made of stainless steel, aluminum, copper, carbon sheet or the like, but a stainless substrate is preferably used.
As the lower electrode provided on the base, Ti, Cr,
Mo, W, Al, Ag, Ni or the like is used, and examples of the forming method include resistance heating vapor deposition, electron beam vapor deposition, and sputtering method.

As the photovoltaic layer of the solar cell, a known semiconductor material generally used as a thin film solar cell was used. As the semiconductor layer 1303 of the solar cell,
Examples thereof include a pin junction amorphous silicon layer, a pn junction polycrystalline silicon layer, and a compound semiconductor layer such as CuInSe ₂ / CdS. As the method for forming the semiconductor layer, in the case of an amorphous silicon layer, plasma C for generating plasma discharge in a raw material gas for forming a film such as silane gas is used.
It can be formed by VD or the like. The pn junction polycrystalline silicon layer is formed by, for example, a film forming method of forming a film from molten silicon.

The CuInSe ₂ / CdS was formed by a method such as an electron beam evaporation method, a sputtering method, an electrodeposition method (deposition by electrolytic decomposition of an electrolytic solution) or the like.

As the material used for the transparent electrode 1304 of the solar battery cell, In ₂ O ₃ , SnO ₂ , In ₂ O ₃ --Sn
_{O 2, ZnO, TiO 2,} Cd 2 SnO 4, there is a crystalline semiconductor material such as doped with impurity at a high concentration, as a method for forming the resistance heating evaporation, electron beam evaporation, sputtering, spraying, CVD, There is an impurity diffusion method or the like.

As the comb-shaped electrode 1305, the upper electrode 13 is used.
A material having a higher conductivity than that of 04 can be used, and examples thereof include a metal electrode and a conductive electrode in which a metal and a polymer binder are dispersed. Generally, a metal powder and a polymer resin binder are in a paste form. The used metal paste is used. These metal pastes are usually formed on the transparent electrode 1304 by a screen printing method. Of these metal pastes, silver paste is preferable in view of conductivity and cost, but the metal paste is not limited to this.

The bus bar electrode 1307 is not particularly limited, but a metal electrode, a conductive paste or the like is usually used, and its shape is linear or tape-like.

The conductor 1306 is not particularly limited, but a conductive metal paste or a conductor such as solder or metal wire is usually used.

As the insulating material 1308, for example, an insulating tape such as a polyester tape or an insulating resin such as an epoxy resin or an acrylic resin obtained by thermosetting or photocuring can be used.
It is not particularly limited to these. (Embodiment 9) This embodiment relates to an amorphous silicon solar battery cell using a stainless steel substrate as a conductive base and has a structure shown in FIGS.

First, a 0.2 mm-thick stainless steel foil with a cleaned surface was prepared as a conductive substrate for solar cells.

Next, on a stainless steel foil, as a lower electrode, an aluminum film having a thickness of 5000Å and 700Å
ZnO film was formed by sputtering at a substrate temperature of 350 ° C. Then, the substrate temperature was maintained at 250 ° C.
A 150 Å n-type a-Si layer, a 4000 Å i-type a-Si layer, and a 100 Å p-type a-Si layer are respectively formed on the O film by SiH ₄ gas / PH ₃ gas / H ₂ gas and SiH ₄ gas. /
H ₂ gas and SiH ₄ / BF ₃ gas / H ₂ gas were continuously used to form three photoelectric conversion layers as pin junction semiconductor layers.

Thereafter, in order to form a 700 Å In ₂ O ₃ —SnO ₂ film (ITO film) as a transparent electrode on the semiconductor layer, resistance overheating vapor deposition of In and Sn was performed at 200 ° C. in an oxygen atmosphere. .

Next, the formed roll-shaped stainless steel substrate was cut into a pattern as shown in FIG. 15 to obtain three solar battery cells 1501 to 1503. Next, an ITO etching material (FeCl ₃ , HCl) -containing paste is screen-printed in a predetermined pattern, and then heated and washed to remove the ITO layer in the portion where the paste is printed (removed portion 1511). This ensured electrical separation between the upper electrode and the lower electrode.

Next, a 0.3 mm wide current collecting comb electrode 1512 having a width of 0.3 mm was formed on the ITO by screen printing of a silver paste.

After that, in order to insulate the end faces of these solar cells which are adjacent to the adjacent solar cells, 0.1
It was covered with millimeter-thick polyester tape 1513. At this time, the polyester tape 1513 is provided with the ITO removal portion 15l in order to electrically separate the upper electrode and the lower electrode.
It was attached so that it was located inside with respect to l.

Subsequently, the three solar cells arranged side by side were separated from each other by a distance of 0.6 mm, and a tin-plated copper wire 1514 having a diameter of 0.4 mm was placed in each gap.

Next, the comb-shaped electrode 151 of the solar battery cell is formed.
2 and one end of the bus bar electrode 1514 with the adhesive silver ink 15
It was electrically connected using 15.

Further, the bus bar electrode 12l located between the solar cell 1501 and the solar cell 1502 and between the solar cell 1202 and the solar cell 1203.
4 were electrically connected to each other by spot welding to the convex portions of the substrate, so that the respective solar cells were connected in series.

Further, a copper tab 1516 is connected to the convex portion of the solar cell 1501 for taking out the terminal from the negative electrode side, and a copper tab 1517 for taking out the terminal from the positive side is connected to the comb-shaped electrode of the solar cell 1503. Busbar electrode 1
To 514 by soldering.

Next, these solar cell modules are connected to each other.
After being placed on a PET film 1520 having a thickness of 3 mm, it was resin-sealed with a fluorine resin and EVA (ethylene-vinyl acetate copolymer) to prepare a solar cell module.

Therefore, in the produced solar cell module, since the bus bar electrodes were located between the solar cells,
It has become possible to reduce the total thickness by at least the thickness of the bus bar electrode. (Embodiment 10) In this embodiment, the bus bar electrode in Embodiment 9 is composed of a tin-plated copper tape having a width of 0.6 mm and a height of 0.2 mm. The distance was 0.8 mm. The other structure and manufacturing method are the same as those in the ninth embodiment.

In the solar cell module according to this example, since the thickness of the conductive substrate is the same as the thickness of the bus bar electrode, the bus bar electrode never projects from the solar cell surface. As a result, a solar cell module having high flatness and excellent scratch resistance could be manufactured. (Example 11) In this example, a photo-curable resin was used in place of the polyester tape which is the insulating material on the end face of the solar cell, and a zinc plated steel sheet whose surface was treated with insulation was used in place of the PET resin. . Other configurations and manufacturing methods are the same as those in the tenth embodiment.

The photo-curable resin is T manufactured by ThreeBond Co., Ltd.
B3042C (registered trademark) is used to dip the end surface of the solar cell to the inside of the portion 1511 where the ITO is removed by etching to form a resin thin film, and then 1500 mj
It was cured by irradiation with ultraviolet rays in an amount of / cm ² to obtain an insulating material.

The thickness of the photocurable resin was about 30 μm. In this example, the distance between the solar cells was set to 0.7 by manufacturing the thin film insulating material by photo-curing.
It has become possible to manufacture a solar cell module having excellent flatness, little shadow loss, and high bending resistance. (Embodiment 12) FIG. 17 shows a state after completion of a serialized solar cell module according to this embodiment, FIG. 18 shows a manufacturing process of the solar cell module, and FIG. 19 shows 1 shows a cross-sectional structure of a solar battery cell according to this example.

The solar cell 1700 shown in FIG. 17 was manufactured by the following procedure. First, the substrate 1701 is SUS430 that has been mirror-polished and sufficiently degreased and washed.
BA substrate (width 10 cm, length 5 cm, thickness 0.1 lm
m) is put into a DC sputtering device (not shown), and Cr is added to 200
Å Deposited to form a lower electrode 1702.

Then, the substrate 1701 is taken out and inserted into an RF plasma CVD film forming apparatus (not shown), and as shown in FIG. 19, an n layer 1703, an i layer 1704, and a p layer 1705.
Was deposited in this order. After that, the upper electrode 170 is placed in a resistance heating vapor deposition device (not shown), and an alloy of In and Sn is vapor-deposited by resistance heating to have an antireflection effect.
6 was deposited to a thickness of 700Å.

Next, the substrate 1701 was placed in a screen printer (HK-4060 manufactured by Tokai Seiki) not shown, and a current collecting electrode 1707 having a width of 200 μm and a length of 4 cm was arranged at an interval of 1 cm.
Printed in. At this time, a silver paste was used as the conductive paste. After printing the silver paste, the substrate 1701 was placed in a heating furnace and held at 150 ° C. for 5 minutes to cure the conductive paste.

Next, as shown in FIG. 18 (a), a through hole (through hole) having a diameter of 1 mm is formed at the center of the solar cell protruding from the end of the collector electrode 1707 as shown in FIG. 18 (b). Hole) 1708 was opened. Further, in order to avoid a short circuit in the through hole portion, etching was performed by the following procedure.

First, the solar cell 1700 is set to AlCl ₃
It was immersed in an aqueous solution of (6H ₂ O), a counter electrode was used as a stainless substrate, and a voltage of −3 V was applied for 5 seconds. Then, the insulating layer 17 is formed by using an acrylic anion electrodeposition paint.
09 was deposited (FIG. 18 (c)). In this case, the electrolytic cell having the structure shown in FIG. 22 was used.

Then, a solder paste was placed so as to connect the through hole 1708 and the collector electrode 1707, and reflow was performed in a heating furnace to form a connecting member 1710 (FIG. 18 (d)). Further, a serializing member 1711 made of a copper foil with an adhesive and having a width of 10 mm was adhered to the back surface of the solar cell 1700 (FIG. 18 (e)).

10 solar cells were produced by the same method.
FIG. 18 (f) shows two serialized solar cells.

Next, encapsulation of this serialized solar cell was performed as follows. Solar cell 170
After stacking EVA (ethylene vinyl acetate) above and below 0, and further stacking the fluororesin film ETFE (ethylene tetrafluoroethylene), put it in a vacuum laminator and hold it at 150 ° C for 60 minutes to perform vacuum lamination A battery module was produced. Ten solar cell modules were manufactured as described above.

The initial characteristics of the obtained solar cell module were measured by the following procedure.

First, a solar power spectrum of AM1.5 was irradiated with an intensity of 100 mW / cm ² using a pseudo solar light source (hereinafter referred to as a simulator) using a xenon lamp, and the current-voltage characteristics of the solar cell were measured. This characteristic was normalized by the open area of the solar cell to obtain the conversion efficiency of the open area. The average value of this conversion efficiency was 6.5%. From this result, it is understood that the serialized solar cell of the present invention has a high conversion efficiency in the open portion.

The substrate is a conductive material and also serves as a lower electrode. Specifically, Fe, Ni, Cr,
Al, Mo, Au, Nb, Ta, V, Ti, Pt, Pb
And the like, or alloys thereof, such as thin plates of brass and stainless steel, and composites thereof.

Further, in order to smooth or texture the surface of the substrate, a thin film lower electrode may be manufactured by using the same material and means as described above.

The p-layer, i-layer and n-layer are produced by a normal thin-film production process, and include vapor deposition, sputtering, high frequency plasma CVD and microwave plasma CV.
It can be produced by using a known method such as D method, ECR method, thermal CVD method, LPCVD method as desired. As a method industrially adopted, a plasma CVD method in which a source gas is decomposed by plasma and deposited on a substrate is preferably used.

As the reaction device, a batch type empty device or a continuous film forming device can be used as desired.

The structure of this embodiment can be applied to a so-called tandem type solar battery cell in which two or more pin junctions are stacked in order to improve the spectral sensitivity and the voltage.

The upper electrode needs to be a so-called transparent electrode for efficiently absorbing light from the sun, white fluorescent lamp, or the like into the semiconductor layer, and a desired physical property value is a light transmittance of 85. % Or more, and the sheet resistance value is 100 Ω / in order to electrically allow a current generated by light to flow laterally to the semiconductor layer.
It is desirable that it be less than or equal to b.

Examples of the material of the transparent electrode having such characteristics are SnO ₂ , In ₂ O ₃ , ZnO, CdO, CdSn.
Examples thereof include metal oxides such as O ₄ and ITO (In ₂ O ₃ + SnO ₂ ).

As a method for producing these, a resistance heating vapor deposition method, an electron beam heating vapor deposition method, a sputtering method, a spray method and the like can be used, and they are appropriately selected according to need. Since the collector electrode is opaque, the effective area is lost. Effective means are to reduce the area of the collecting electrode, reduce the specific resistance of the collecting electrode, and increase the cross-sectional area of the electrode in order to effectively extract the current. Therefore,
As an electrode material, a material having a low specific resistance such as silver or copper is suitable.

For example, the specific resistance of silver is 1.62 × 10 ^-6 Ω
Cm, and the specific resistance of copper is 1.72 × 10 ⁻⁶ Ωcm, whereas that of aluminum is 2.75 × 10 ^−6.
Ωcm, for zinc, it is 5.9 × 10 ⁻⁶ Ωcm. As a method for forming these electrodes, a sputtering method, a vacuum evaporation method, an evaporation method such as an electron beam evaporation method, a plating method,
There is a screen printing method. The vapor deposition method can deposit good-quality metal and has good ohmic contact with semiconductors, but it has the problems that the deposition rate is slow, the throughput is long because a vacuum process is used, and masking is required. is there.

In the plating method, electroless plating of Ni is generally carried out, but there is a problem that it is easily peeled off and a mask is required. The screen printing method is characterized by being most easily automated and having high mass productivity.

The conductive paste to be printed is Ag, P
This is a paste prepared by mixing a powder of a metal such as t, Cu or C or an alloy thereof with a binder made of a polymer and a solvent of the binder in an appropriate ratio. The desired specific resistance depends on the design of the width, length, thickness, etc. of the collector electrode, but it is necessary that it does not become a resistance when the current generated by the solar cell flows, and it is necessary to have about 10 ^-5 Ωcm. Is.

The screen printing method uses a conductive paste as a printing ink by using a screen having a desired pattern on a mesh made of nylon or stainless steel, and the minimum electrode width is about 50 μm. be able to. A commercially available printer is preferably used. The screen printed conductive paste is heated in a drying oven to crosslink the binder and to volatilize the solvent.

The through hole formed in a part of the solar cell is a through hole for drawing out the collector electrode to the back surface of the substrate.

The size of the through hole is required to be large enough to be filled with a conductive material in a later step, and to be as small as possible in order to minimize the loss of the power generation area. A size of 100 μm to 2 mm is suitable. In order to form such through-holes, a method using a drill is generally used as in the case of forming a through-hole in a printed circuit board, or a method using a laser when the holes are small.

When the electrode near the through hole is removed by etching, for example, when ITO is used as the upper electrode, Al, Cl, (6H ₂ O) is used.
By immersing the solar cells in the aqueous solution and applying a negative voltage to the solar cells,
O can be selectively removed.

Also, the vicinity of the through hole is insulated, but this eliminates the need to provide an unnecessary gap between adjacent solar cells, and therefore both cells can be brought into contact with each other and the opening of the solar cell can be made. The effective area in the area will increase.

The insulating layer provided in the through hole is preferably a light-transmissive material because it does not interfere with the incidence of sunlight and does not affect the conversion efficiency. Also, considering the environment when used outdoors as a solar cell, it has good weather resistance, heat,
Stability to humidity and light is required.

In some cases, the solar cell may be bent or impacted, so it is necessary to have mechanical strength as well. As the material having high bending resistance, a polymer resin is suitable, and specifically, polyester, ethylene vinyl acetate copolymer, acrylic resin, epoxy resin, urethane or the like is used. A number average molecular weight of the polymer resin is preferably about 1 to 20,000.

The thickness of the insulating layer is preferably selected according to the type of polymer resin, since it is preferable that the electrical insulating property is maintained and the light transmittance is not impaired. The suitable range is from several μm to several 10 μm. A usual method is used for laminating such a polymer resin, for example, a method of dissolving in a solvent and performing spin coating or dipping, a method of melting with heat and coating with a roller,
A method of depositing by electric field polymerization, a method of depositing by electrodeposition, a method by plasma polymerization, etc. are used and are appropriately determined from various conditions such as physical properties of the polymer resin and desired film thickness. A dipping method, an electrodeposition method, or the like is suitable for performing the insulating treatment.

In particular, in the electrodeposition method, since it is possible to use a water-soluble solvent, the waste liquid can be easily treated and the film thickness can be easily controlled by controlling the electric current.
It is used as a suitable method having features such as suitability for coating the through hole portion. As such a device for electrodeposition, for example, the device shown in FIG. 23 can be used.

In FIG. 23, 2301 is an electrodeposition layer, and 230
2 is an electrodeposition liquid, 2303 is a counter electrode, 2304 is a substrate, 2
305 is all layers up to the upper electrode 2306, 2306 is a power source, and 2307 is a conducting wire.

As the material of the connecting member provided in the through hole portion, the same material as that of the collector electrode can be used, but solder is preferably used. For example, a method of filling the through hole with solder by reflow is a method. Used.

The serializing member is a member for connecting in series so that the current between the adjacent solar cells flows to the back surface side of the substrate. Materials are Ag, Pt, C
A material made of a metal such as u or C, or an alloy thereof may be used, and a wire-shaped or foil-shaped material may be attached, or the same conductive paste as that for the current collecting electrode may be used. As the foil-like material, for example, a copper foil, or a copper foil plated with tin, and in some cases, an adhesive-attached material is used. (Comparative Example) This comparative example relates to a conventional serialized solar cell module as shown in FIG. 22, and was manufactured as follows. First, as in the case of Example 12, a substrate made of SUS430BA (width 10 cm, length 5 cm, thickness 0.1 mm) 2201 to manufacture a solar cell 2200
A lower electrode, an n layer, an i layer, and a p layer were deposited in this order on the semiconductor layer to deposit an upper electrode. After that, the substrate 2201 was cut by press cutting and the semiconductor layer was scraped off by a grinder to form a substrate exposed portion 2202.

Next, as in the case of Example 12, using a screen printer (not shown), the width was 200 μm and the length was 4 cm.
The current collecting electrodes 2203 were printed at intervals of 1 cm and cured in a heating furnace.

Next, the tin plated copper foil bus bar 220 is used.
Sticked 4 10 solar cells were prepared by the same method. Ten of these were connected in series to produce a serialized solar cell. Note that FIG. 22 shows two solar cells connected in series.

Then, encapsulation of this serialized solar cell was performed in the same manner as in Example 12 to produce 10 solar cell modules.

The initial characteristics of the obtained solar cell module were measured in the same manner as in Example 12, and as a result, the average value of the open-loop conversion efficiency was 5.3%. Therefore, from this result, it can be understood that in Example 12, the open-loop conversion efficiency is good, but this is because there are few portions that do not contribute to power generation as compared with the comparative example. (Example 13) Figs. 20 and 21 show the structure of Example 13, and a solar battery cell 1600 according to this example was produced by the following procedure.

The steps up to formation of the upper electrode were performed in the same manner as in Example 12. Next, using a screen printing machine (not shown),
Current collecting electrodes 2007 having a length of 00 μm and a length of 4 cm were printed at intervals of 1 cm and cured. Next, a tin-plated copper foil bus bar 2012 was attached, and a through hole 2008 having a diameter of 1 mm was opened at the center position of the end portion of the bus bar 2012 where the solar cell 2000 was extended.
Furthermore, in order to avoid a short circuit in the through hole, the first embodiment
Etching was performed in the same manner as in 2. Furthermore, an insulating layer 2009 was deposited using an acrylic anion electrodeposition coating material.

Thereafter, a solder paste was placed so that the through hole 2008 and the bus bar 2012 were connected to each other to form a connecting member 2010. Furthermore, with adhesive, width 10
A serialization member 2011 made of a copper foil of mm was adhered to the back surface of the solar cell 2000. In the same manner, 10 solar cells were produced and these were serialized.

Next, encapsulation of this series solar cell was carried out in the same manner as in Example 12 to produce 10 solar cell modules. The initial characteristics of the obtained solar cell module were measured in the same manner as in Example 12. The average value of the conversion efficiency of the openings was 6.1%, which was higher than that of the comparative example.

[0136]

As described above, according to the present invention, the thin series connection is flat and flexible as a whole, and the whole connection is made. Therefore, current concentration can be prevented and power loss can be reduced. The series connection is maintained even if a part is detached, so it is highly reliable, and steps such as insulating resin application, soldering, and bus bar attachment are not required, and connections can be made only on the surface, facilitating process automation. As described above, the solar cell module according to the present invention is excellent in productivity, reliability, and appearance, and has high industrial utility value.

[Brief description of drawings]

FIG. 1 is a plan view showing a solar cell module according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a series connection portion of the solar battery cells in FIG.

FIG. 3 is a sectional view of the serial connection member shown in FIG.

FIG. 4 is a side view showing a configuration example of an amorphous solar battery cell.

FIG. 5 is a plan view showing a part of a serialization process of the solar cell module according to the present invention.

FIG. 6 is a plan view of a conventional solar cell module.

FIG. 7 is a plan view showing a serialization process of the conventional solar cell module shown in FIG.

FIG. 8 is a plan view showing a solar cell module according to a fourth embodiment of the present invention.

9 is a sectional view taken along the line PP of FIG.

FIG. 10 is a plan view showing a solar cell module according to a fifth embodiment of the present invention.

11 is a cross-sectional view taken along the line QQ of FIG.

FIG. 12 is a diagram of a solar cell module according to a sixth embodiment of the present invention.

FIG. 13 is a diagram of a solar cell module according to a seventh embodiment of the present invention.

14 is a cross-sectional view taken along the line RR of FIG.

FIG. 15 is a diagram of a solar cell module according to a ninth embodiment of the present invention.

16 is a cross-sectional view taken along the line SS of FIG.

FIG. 17 is a plan view of a solar cell module according to a twelfth embodiment of the present invention.

FIG. 18 is a diagram showing a manufacturing process of the solar cell module shown in FIG. 17.

FIG. 19 is a sectional view of a solar cell according to a twelfth embodiment.

FIG. 20 is a plan view of a solar cell module according to a thirteenth embodiment.

21 is a cross-sectional view taken along the line TT of FIG.

FIG. 22 is a plan view showing a configuration of a conventional serialized solar cell module.

FIG. 23 is a cross-sectional view showing a configuration example of an electrodeposition tank.

[Explanation of symbols]

 100 solar battery module, 101 solar battery cell, 102 exposed portion of conductive substrate, 103 tape-shaped serial connection member, 104 terminal electrode tab, 105 sealing resin, 106 current collecting electrode, 200 solar battery cell, 201 collector Electrode, 202 transparent conductive film, 203 serial connection member, 203a metal layer, 203b conductive adhesive, 203c insulating adhesive, 204 conductive substrate, 207 substrate exposed portion, 303 serial connection member, 303a metal layer 303b conductive adhesive, 303c insulating adhesive, 80l conductive substrate, 802 lower electrode layer, 803 semiconductor layer, 804 upper electrode layer, 805 comb electrode, 806 connection conductor, 807 bus bar electrode, 800a, 800b, 800c solar cell.

Claims (8)

[Claims] 1. A conductive substrate, a semiconductor layer provided on the substrate and having a photoelectric conversion function, a transparent conductive film provided on the semiconductor layer, and a plurality of collector electrodes provided on the transparent conductive film. In a solar cell module in which a plurality of solar cells are connected in series, a solar cell module is connected in series between the current collecting electrode of one of the adjacent solar cells and the conductive base of the other solar cell. The connection member for series connection includes a metal layer, a pair of conductive adhesive layers provided at a predetermined interval on one surface side of the metal layer, and an insulation sandwiched between the conductive adhesive layers with a connection member interposed. Composed of a conductive adhesive layer, one of the conductive adhesive layer of one of the conductive adhesive layer is brought into contact with the current collecting electrode of the one solar cell,
The insulating adhesive layer is positioned so that the adjacent solar cells are in an insulated state from each other, and the other conductive adhesive layer of the pair of conductive adhesive layers is the conductive base of the other solar cell. A solar cell module characterized by being brought into contact with. 2. The solar cell module according to claim 1, wherein the conductive adhesive and the insulating adhesive constituting the serial connection member are pressure-sensitive adhesives. 3. Each of the solar cells is provided with a plurality of through holes, the through holes are filled with a conductive connecting member, and one end side of the connecting member is connected to a collecting electrode of the solar battery cell, The solar cell module according to claim 1, wherein the other end of the connection member is connected to the conductive base of the solar cell. 4. The upper electrode in the vicinity of the through hole is removed by etching.
The solar cell module described in 1. 5. The solar cell module according to claim 3, wherein the through hole is subjected to an insulation treatment so as to insulate at least the upper electrode and the substrate. 6. The serialized solar cell according to claim 5, wherein the insulating treatment is performed by using an electrodeposition method. 7. A lower electrode layer, a semiconductor layer, an upper electrode layer, a comb-shaped electrode that is a collecting electrode of the upper electrode layer is sequentially provided on a conductive substrate, and a bus bar electrode that is a collecting electrode of the comb-shaped electrode is further provided. In a solar cell module having a plurality of solar cells connected in series, the bus bar electrode is located below the conductive substrate, and is located between the ends of adjacent solar cells. Solar cell module. 8. The solar cell module according to claim 7, wherein the bus bar electrode is located between respective ends of adjacent solar cells.