JPH06195154A - Cooling mechanism for electronic device - Google Patents

Abstract

PURPOSE:To eliminate a dummy jucket not to be mounded as an option or the like by using a flexible hose previously having a pressure loss equal to a water cooling jucket in place of the jucket. CONSTITUTION:The water cooling jucket having the same flow passage as a water cooling jucket 5 is mounted as dummy at the position 3 of a multichip module not to be mounted essentially as an option part or the like so as to keep pressure loss balance. Therefore, nothing is connected to the position 3, and a flexible hose 14 having the same pressure loss as the water cooling jucket 5 is connected. Thus, another multichip module can be cooled without disturbing the balance of the pressure loss of whole coolant circulation system, and it is not necessary to use the water cooling jucket being the extremely expensive and precise working part for dummy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cooling an electronic device, and more particularly to a cooling mechanism of a type in which a plurality of circuit modules for liquid cooling are arranged side by side through a cooling plate to cool.

[0002]

2. Description of the Related Art A so-called multi-chip module, in which a large number of highly integrated LSIs are mounted on a ceramic substrate at a high density, has a large amount of heat generation per unit area, so a mechanism for liquid cooling via a cooling plate is used. Is often adopted.

An example of this type of cooling mechanism is described in Nikkei Electronics, September 1, 1983, pages 23 to 25.
Page and pages 209 to 241 of the December 10, 1990 issue of "Nikkei Electronics".

The cooling plate is called a cold head, a cold plate, or a water cooling jacket, and one of its heat transfer surfaces is in close contact with the multi-chip module in order to obtain high heat conduction. Attached to. The water cooling jacket has a flow passage for flowing the coolant inside, and the flow passage has a complicated design to optimize the heat transfer coefficient for the coolant in the flow passage, and the power characteristics of the coolant circulation system. Considering the above, the optimum pressure loss, that is, the optimum flow path resistance is designed. The water cooling jackets are connected in series by a flexible hose between the outward piping and the return piping of the coolant circulation system. Connected in parallel between the pipes. Similarly to the water cooling jacket, the forward piping, the return piping, and the flexible hose should be considered from the overall coolant circulation system in order to optimize the pressure loss of each path of the water cooling jacket group connected in parallel. Optimal design is made.

[0005]

PROBLEM TO BE SOLVED BY THE INVENTION Multi-chip module
Since the amount of heat generated per unit area is large, the flow rate of the coolant flowing inside the water cooling jacket may be slightly different
Since the junction temperature of I greatly changes, as described above, the optimum design of the water cooling jacket, the forward pipe, the return pipe, and the flexible hose flow path resistance is made. Therefore, in order to optimize the pressure loss of the entire system of the coolant circulation system, a water cooling jacket having the above-mentioned flow path is normally used as an option in a multi-chip module position that may not be mounted. -It was installed as.

By the way, the water cooling jacket is a precision machined component whose flow path is designed so as to optimize the heat transfer coefficient to the coolant in the flow path, and is very expensive.

The object of the present invention is to use the water cooling jacket, which was originally installed as a dummy at a multi-chip module position which may not be installed as an option.
It is to eliminate the pressure loss balance of the entire coolant circulation system without changing it.

[0008]

In order to achieve the above object, the present invention uses a flexible hose having a pressure loss equivalent to the flow resistance of the water cooling jacket in advance instead of the water cooling jacket. Characterize. In order to equalize the pressure loss of the water cooling jacket and the pressure loss of the flexible hose, change the inner diameter of the flexible hose according to the flow rate of the coolant flowing through the flexible hose, that is, increase the inner diameter. Or smaller,
This can be achieved by changing the pressure loss of the hose. Further, the inner diameter of the metal fitting for connecting the flexible hose and the water cooling jacket may be changed. Further, the present invention provides a simple straight pipe flow passage having a pressure loss equivalent to the flow passage resistance of the water cooling jacket in advance. It may be a simulated water cooling jacket.

[0009]

According to the cooling mechanism of the present invention, as an option,
In order to maintain the pressure loss balance of the entire coolant circulation system, the water cooling jacket, which is a very expensive precision machined component, was used at the multi-chip module position, which should not be mounted originally. You don't have to.

As a result, the cost of the cooling mechanism and the number of manufacturing steps can be reduced.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

In each of the following embodiments, the same components are designated by the same reference numerals, and the description thereof will be omitted or simplified.

FIG. 1 is a side view of a conventional cooling mechanism. A multi-chip module 3 having a large number of connecting pins is a mother board 1 having a plurality of connectors 2.
Connected to the multi-chip module 3
Are in thermal conductive contact with the water cooling jacket 5. The water cooling jacket 5 is connected in series between the outward branch pipe 7 and the return branch pipe 8 by a flexible hose 6. The outward branch pipe 7 and the return branch pipe 8 are connected to the heat exchanger 11, the pump 9, and the storage tank 10. Reference numeral 3 denotes a dummy water cooling jacket which is mounted at an optional module position and has the same flow passage as the water cooling jacket 5.
As described above, in the conventional cooling mechanism, the water cooling jacket 5 is optionally used as a dummy in order to keep the pressure loss balance of the entire coolant circulation system at the multi-chip module position which may not be mounted originally. It was equipped with a water cooling jacket with the same flow path as.

FIG. 2 shows a front view of FIG. 1, and reference numerals and components are the same as those shown in FIG.

FIG. 3 is a sectional view of the water cooling jacket 5 in FIGS. 2A and 2B, and shows a state in which the surface of the connection fitting side is partially peeled. The water cooling jacket 5 has a flow path 12
And a flexible hose connecting metal fitting 13,
As shown in the figure, it is a precision machined component that forms a complicated flow path.

FIG. 4 shows an embodiment of the present invention. In the conventional cooling mechanism of FIG. 1, the same flow path as that of the water cooling jacket 5 is provided as a dummy in order to keep the pressure loss balance at a multi-chip module position which may not be originally installed, as an option. It was equipped with a water cooling jacket. However, in FIG. 4, nothing is connected to the option module position 3, and instead of the water cooling jacket 5, a flexible hose 14 having the same pressure loss as the water cooling jacket 5 is connected.

FIG. 5 shows a cross section of the flexible hose 14 of FIG. 4, which has a fitting 16 for connecting the hose 15 and a water cooling jacket. Hose 15 or
By changing the inner diameter of the connection fitting 16, the pressure loss is the same as that of the water cooling jacket 5.

FIG. 6 shows another means for achieving the present invention, and shows a simulated water cooling jacket 17 having a pressure loss equivalent to that of the water cooling jacket 5. The simulated water cooling jacket 17 has a simple straight pipe flow path 18, and a pressure loss equivalent to the pressure loss of the water cooling jacket 5 can be obtained by changing the inner diameter of the straight pipe flow path 18. By connecting the simulated water cooling jacket 17 to the option module position 3 in FIG. 4, cooling can be performed without changing the pressure loss of the entire system of the coolant circulation system without using the water cooling jacket 5. it can.

[0019]

As described above, according to the present invention, as an option, a pressure loss equivalent to the original flow resistance of the water cooling jacket is applied to the multi-chip module position which may not be originally installed. By using the flexible hose that it has or a simulated water cooling jacket that has a simple straight pipe flow path, other multi-chip modules are cooled without disturbing the pressure loss balance of the entire coolant circulation system. Therefore, it is not necessary to use a water cooling jacket, which is a very expensive precision machined component.

As a result, the cost of the cooling mechanism and the number of manufacturing steps can be reduced.

[Brief description of drawings]

FIG. 1 is a side view schematically showing a conventional cooling mechanism.

2 is a front view of FIG.

3 is a partial cross-sectional view of the water cooling jacket 5 of FIG.

FIG. 4 is a diagram showing an embodiment using a flexible hose according to the present invention.

FIG. 5 is a sectional view of a flexible hose for carrying out FIG.

FIG. 6 is a diagram showing a simulated water cooling jacket having a simple straight pipe passage having a pressure loss equivalent to that of the water cooling jacket.

[Explanation of symbols]

1 ... Mother board, 2 ... Connector, 3 ... Optional module mounting position, 4 ... Multi-chip module,
5 ... Water cooling jacket, 6 ... Flexible hose, 7 ...
・ Forward branch pipe, 8 ・ ・ ・ Return branch pipe, 9 ・ ・ ・ Pump, 10 ・ ・ ・
Storage tank, 10 ... Storage tank heat exchanger, 11 ... Heat exchanger, 12 ... Flow path of water cooling jacket, 13 ... Connection fitting with flexible hose 14 ... Water cooling jacket 5 Flexible hose having the same pressure loss as that of 15 ... hose, 16 ... connection fitting, 17 ... simulated water cooling jacket, 18 ... straight pipe passage of simulated water cooling jacket

Front page continued (72) Inventor Mitsuo Miyamoto 1 Horiyamashita, Hadano City, Kanagawa Prefecture

Claims (1)

[Claims] 1. A group of flexible hoses for cooling a plurality of rows of circuit modules attached to an electronic device, wherein the pressure of each circuit module row is changed by changing the pressure loss of the flexible hoses. Cooling mechanism that can set loss arbitrarily.