JPH06186749A - Exposure device - Google Patents

Abstract

PURPOSE:To improve the quality of a substrate by always executing exposure work in an extremely clean atmosphere without being affected by an outside. CONSTITUTION:This exposure device is provided with an exposure means A simultaneously exposing patterns on original films 1 and 2 on both sides of the substrate 3 with the light of light sources for exposure 12 and 13 and a clean booth unit B covering the exposure means A to actually isolate it from the outside and holding the exposure means A in an atmosphere cleaner than the outside. The exposure means A includes an exposure part 4, substrate alignment part 5 for which an unexposed substrate is supplied and a substrate carrying means 6 carrying the unexposed substrate to the exposure part 4 from the substrate alignment part 5. A air in the clean booth unit flows from the top to the bottom in the exposure part 4 and the substrate alignment part 5 from an air supply fan 34 via an air supply filter 36 and from the bottom to the top in a flow path 38 through a mesh 37 and is discharged outside from a ventilation fan 35 via a ventilation filter.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure device that exposes a pattern on an original film onto the surface of a substrate.

[0002]

2. Description of the Related Art Conventionally, when a wiring pattern is formed on a printed board, a step of exposing a pattern provided on an original film onto the board is performed. In this exposure process, if dust or dust adheres to the substrate or the original film, the desired pattern cannot be exposed, and there are places with poor conduction in the wiring pattern, and high-quality substrates cannot be produced uniformly. There is a problem. Therefore, the working room where the exposure apparatus is installed has been made into a clean room.

[0003]

As described above, the work room has conventionally been made into a clean room. However, a user who operates a switch for setting work conditions brings in dust and dirt, which lowers the cleanliness of the work room. May cause Therefore, the user who enters the room must clean the clothes (clean room work clothes) sufficiently. For example,
If the environment for exposure requires a cleanliness class of about 1000, the clothes and human body must be cleaned so as to meet the requirement. If it is still insufficient, the frame for setting the original film and the substrate is regularly cleaned with a clean roller or the like, and the work of adjusting the exposure environment is extremely troublesome. In addition, the device for cleaning becomes very large in scale, resulting in high cost.

The present invention has been made by paying attention to such a conventional problem, and the actual exposure work can always be carried out in an extremely clean atmosphere without being affected by the outside. To improve the quality of. By this, 1
When a pattern of a pair of original films is simultaneously exposed on both sides of a substrate, a high quality substrate can be efficiently produced. Furthermore, it is an object of the present invention to eliminate the need for the user to consider cleaning as much as in the past, and to suppress an increase in cost.

[0005]

In order to achieve the above object, the present invention provides an exposing means for exposing a substrate surface to a pattern on an original film by light from an exposing light source, and an exposing means covering the exposing means from the outside. And a clean booth unit that substantially isolates and keeps the exposure means in an atmosphere cleaner than the outside.

The above-mentioned exposure unit is configured to include an exposure unit, a substrate alignment unit to which an unexposed substrate is supplied, and a substrate transfer unit for transferring the unexposed substrate from the substrate alignment unit to the exposure unit. May be. Further, it is effective for improving the production efficiency if the pattern of a pair of original films can be simultaneously exposed on the upper and lower surfaces of the substrate in the exposure section.

The operation unit operated by the user is
It is provided outside the clean booth unit.

[0008]

[Function] By arranging the exposure means in the clean booth unit and positioning it in a cleaner atmosphere than the outside,
Dust and dust are prevented from adhering to the substrate, and the quality is improved.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 to 3 show an exposure apparatus according to an embodiment of the present invention. As shown in the figure, this exposure apparatus uses the original films 1 and 2 by the light from the exposure light sources 12 and 13.
An exposure means A for exposing the surface of the substrate 3 with the upper pattern, and a clean booth unit B for covering the exposure means A and substantially isolating it from the outside and keeping the exposure means A in an atmosphere cleaner than the outside. Is equipped with.

The exposure unit A includes an exposure unit 4, a substrate alignment unit 5 to which an unexposed substrate is supplied, and a substrate transfer unit 6 which transfers the unexposed substrate from the substrate alignment unit to the exposure unit 4. I'm out.

First, the exposure section 4 will be described.
A box-shaped base 7, a lower frame 8 arranged on the base 7 for holding the lower original film 1, and an upper frame provided above the lower frame 8 so as to face the upper original film 2 and holding the upper original film 2. 9 and
Adjusting the position of the upper frame 9 with respect to the lower frame 8, both films 1,
A first alignment means (frame alignment means) 10 for aligning the two, a Z-axis cylinder 11, 11 for vertically moving the upper frame 9, and a pair of exposure light sources 12, 13 are provided.

A transparent plate 14 made of glass is provided in the lower frame 8.
Are held (see FIGS. 1 and 2). On the upper surface of the transparent plate 14, ITO is formed so as to cover almost the entire area.
A transparent electrode 15 made of (indium tin oxide) is formed. The transparent electrode 15 functions as a suction holding unit that holds the substrate 3 on the upper surface of the transparent plate 14 through the lower original film 1 by the static electricity generated by energization. The lower frame 8 is fixedly arranged on the base 7 so that the transparent plate 14 substantially matches the opening 7 a of the base 7. A transparent plate 9 a made of acrylic resin is held in the upper frame 9.

The first alignment means 10 holds the upper frame 9 and can adjust the position of the upper frame in the X, Y, and θ directions.
Yθ table 16 and a pair of CCD cameras 17, 17
And an alignment light source 18.
The CCD cameras 17 and 17 are arranged in the box-shaped base 7 so as to be movable between the alignment position shown in FIG. 1 and a retracted position retracted to the left and right from this position.
Then, the XYθ table 16 is based on the image signal obtained by receiving the illumination light from the alignment light source 18 by the CCD camera 17 so that the alignment mark of the upper original film 2 matches the alignment mark of the lower original film 1. The position of the upper frame 9 with respect to the lower frame 8 is adjusted.

The exposure light source 12 is arranged above the upper frame 9, and the exposure light source 13 is arranged below the lower frame 8.

Next, the substrate alignment section 5 will be described. The unexposed substrate 3 is at a reference position (a reference position corresponding to the lower original film 1, and a position at which the substrate is accurately positioned with respect to the lower original film 1 when the substrate is translated by a certain amount from this position. Second alignment means (substrate alignment means) 20 for aligning with the above).

The second alignment means 20 has an opening 2
XY arranged on a box-shaped base 21 having 1a
the θ table 22, a pair of CCD cameras 23, 23,
It is composed of an alignment light source 24. XYθ
The table 22 has the same structure as the XYθ table 16 and holds a transparent plate 22a on which the unexposed substrate 3 is placed. The second alignment means 20 uses the CC
C whose position coordinates are accurately adjusted corresponding to the D camera 17
The CD camera 23 receives the illumination light from the alignment light source 24 to detect an alignment mark (not shown) of the unexposed substrate 3, and the posture of the substrate 3 is determined based on the alignment mark (not shown). Substrate 3 by operation
Is adjusted so that it is located at the reference position.

Next, the substrate transfer means 6 will be described.
As shown in FIG. 1, it comprises a transport chuck 31 having a suction cup 30 for sucking the upper surface of the substrate 3, and a cylinder 32 for translating the transport chuck 31 between the substrate alignment unit 5 and the exposure unit 4. There is.

The clean booth unit B will be described below. An air supply fan 34 and an exhaust fan 35 are provided above the cabinet 33 having a size that covers all of the exposure unit A described above. The air taken in from the air supply fan 34 is sent into the exposure unit 4 and the substrate alignment unit 5 via the air supply filter 36. The air sent to the inside of the exposure means A through the air supply filter 36 is
The mesh 3 that moves from top to bottom and is installed at the bottom
7 through the exhaust passage 38 provided on the bottom surface and the back surface side of the cabinet 33, and moves upward through the exhaust filter 39 by the exhaust fan 35 (see FIG.
It is discharged to the right). In this embodiment, the clean booth unit B is used to clean the entire work chamber to a cleanliness class 100.
In a clean room of about 00, the inside of the exposure unit A has a cleanliness of about class 1000.

In front of the cabinet 33, an operation section 40 operated by the user is provided, and a display, a keyboard switch and other operation members necessary for setting working conditions are arranged.

On both sides of the cabinet 33, window holes 33a, 3 for supplying the substrate 3 into the exposing means A and carrying it out.
3b is opened. Normal clean booth unit B
Since the inside pressure is slightly higher than the outside pressure, and the air flow is downflow from top to bottom, the window holes 33a, 3
There is no concern that the cleanliness will be reduced due to the entry of dust and dirt from 3b. Window holes 33a, 3 are provided on both outsides of the cabinet.
A substrate supply device 41 and a substrate unloading device 42 are arranged so as to be continuous with 3b. Substrate feeding / unloading device 41, 42
A large number of rollers 41a ..., 42a.

A wiping device 43 on both upper and lower surfaces of the substrate 3 to which dust and dirt are attached in the external atmosphere is interposed between the substrate supply device 41 and the window 33a. Window holes 44a and 44b are provided on both side surfaces of the case 44 so as to communicate with the window hole 33a, and wiping rollers 45 and 46 are provided inside so as to be in contact with the upper and lower surfaces of the substrate 3, respectively. . Furthermore, the wiping rollers 45, 4
Clean rollers 47, 48 for removing dirt on No. 6
Are in contact with the respective rollers 45, 46. Although not shown, the clean rollers 47 and 48 are detachably pivotally supported so that they can be replaced when they become dirty.

Next, the operation of one embodiment having the above construction will be described. First, before attaching the upper and lower frames 8 and 9 to the exposure means A, the lower original film 1 is placed on the transparent plate 14 of the lower frame 8,
The upper original film 2 is attached to the transparent plate 9a of the upper frame 9 with an adhesive tape or the like.

Next, the lower frame 8 is attached and fixed on the base 7, and the upper frame 9 is attached to the XYθ table 16.

After this attachment, the alignment light source 18 is turned on with the CCD cameras 17, 17 positioned at the alignment position shown in FIG. 1, and the illumination light from the alignment light source 18 is received by the CCD camera 17 to obtain the light. The position of the upper frame 9 with respect to the lower frame 8 is adjusted by driving the XYθ table 16 so that the alignment mark of the upper original film 2 matches the alignment mark of the lower original film 1 based on the image signal received.

After this adjustment, the upper frame 9 is moved upward by the Z-axis cylinder 11 to secure a space in which the transport chuck 31 can move between the upper and lower original films 1 and 2. In this state, the transparent electrode 15 is energized to generate static electricity. The static electricity is also in a state of acting on the upper surface of the lower original film 1.

On the other hand, the unexposed substrate 3 is supplied to the substrate supply device 4
1, is conveyed by the rotation of the rollers 41a ... Exposure means A passing through 44b and 33a
Supplied within. The substrate 3 is transported to the substrate alignment section 5 by the substrate transport means 6 and is aligned with the reference position by the second alignment means 20.

Specifically, in the substrate alignment section 5, illumination light is projected from the alignment light source 24 toward the unexposed substrate 3 supplied on the transparent plate 22a. Then, this is received by the CCD camera 23 to detect an alignment mark (not shown) on the substrate 3, and XY is detected based on the detected alignment mark.
The θ table 22 is driven to position the substrate 3 at the reference position.

When the alignment of the substrate 3 is completed in this way, the substrate 3 is vacuum-sucked by the suction cup 30, and in that state, the cylinder 32 is driven to move the transfer chuck 31 in parallel by a predetermined amount to move it between the original films 1 and 2. Position it.

As described above, since static electricity is generated on the lower original film 1, the substrate 3 is adsorbed. In this way, the substrate 3 is fixedly adsorbed and held on the transparent plate 14 via the lower original film 1 by the static electricity generated by the energization of the transparent electrode 15. Therefore, there is no possibility that the substrate 3 is displaced.

Then, the cylinder 32 is driven to return the transfer chuck 31 to the substrate alignment section 5, and thereafter the upper frame 9 is lowered by the Z-axis cylinder 11 to set the upper original film 2 on the substrate 3 as shown in FIG. Adhere to the upper surface of. In this way, with the lower original film 1 and the upper original film 2 in close contact with the lower surface of the substrate 3 and the upper surface of the substrate 3, respectively, the CCD cameras 17, 17 of the exposure unit 4 are moved from the alignment position shown in FIG. Evacuate to.

In this state, the upper and lower exposure light sources 12, 13
By turning on, the patterns of both original films 1 and 2 are simultaneously exposed on both sides of the substrate 3.

When the exposure is completed, the upper original film 2 is raised, the cylinder 32 is driven to move the transport chuck 31 again to position it between the original films 1 and 2, and the substrate 3 after the exposure is sucked by the suction cup 30. Then, it is adsorbed and moved to a position where it projects from the window hole 33b. After that, the substrate unloading device 42 is driven to rotate the rollers 42a, and the substrate 3 may be unloaded.

The substrate transport means 6 transports the previously unexposed substrate 3 to the exposure unit 4 and retracts to the substrate alignment unit 5, and then, while the substrate is being exposed, the window hole 33a.
The next unexposed substrate 3 supplied from the substrate is supplied to the substrate alignment unit 5, and then the exposed previous substrate 3 is moved to a position protruding from the window hole 33b and retracted to the substrate alignment unit 5. At this time, by setting the next unexposed substrate 3 aligned to the reference position by the alignment means 20 to be conveyed to the exposure unit 4, a large number of substrates are efficiently exposed one after another.

Such a setting can be easily set by the user by arbitrarily operating the operating portion 40 provided outside the clean booth unit B without lowering the cleanliness of the exposure means A. Is possible.

In the above embodiment, in order to supply the unexposed substrate to the exposure means A in a clean state, the entire working chamber is made into a clean room with a cleanliness class of about 10,000, but the supplied substrate can be cleaned. In this case, extremely high quality substrate exposure can be performed by using the exposure apparatus of the present invention even in a normal working room which is not made a clean room.

[0036]

As described in detail above, according to the exposure apparatus of the present invention, since the exposure means is covered by the clean booth unit, the exposure work is always influenced by the outside in an extremely clean atmosphere. It is possible to significantly reduce the adhesion of dust and dust not only to the substrate, but also to the original plate film constituting the exposure means and the like, and the quality of the exposed substrate can be improved. Further, since only the exposure means is housed in the clean booth unit and the user is operating outside, there is no risk of deteriorating the cleanliness of the exposure work environment due to dust adhering to the user. .

Further, since the exposure means includes the substrate alignment portion, the substrate is aligned with the reference position, the substrate can be exposed with an accurate pattern, and the quality is improved.

As described above, since only the minimum necessary exposure environment is cleaned, the size of the apparatus is not so large and the cost can be kept low.

Even when a pair of original film patterns are simultaneously exposed on both sides of the substrate, a good quality substrate can be efficiently produced.

Further, since the operation section is provided outside the clean booth unit, the user can operate without impairing the cleanliness inside, and the operability of the user can be improved.

[Brief description of drawings]

FIG. 1 is a partially sectional front view showing an embodiment of an exposure apparatus according to the present invention.

2 is a partial cross-sectional plan view of the exposure apparatus shown in FIG.

FIG. 3 is a vertical sectional view of an exposure unit of the exposure apparatus shown in FIG.

[Explanation of symbols]

 A exposure means B clean booth unit 1, original plate film 3 substrate 4 exposure part 5 substrate alignment part 6 substrate transfer means 12, 13 exposure light source 40 operation part

Claims (4)

[Claims] 1. An exposure unit that exposes a pattern on an original film onto a substrate surface by light from an exposure light source; and an exposure unit that covers the exposure unit and is substantially isolated from the outside, and the exposure unit is cleaner than the outside. An exposure apparatus comprising: a clean booth unit for holding in an atmosphere. 2. The exposure unit according to claim 1, wherein the exposure unit, the substrate alignment unit to which the unexposed substrate is supplied, and the substrate that conveys the unexposed substrate from the substrate alignment unit to the exposure unit. An exposure apparatus comprising: a transport unit. 3. The exposure device according to claim 1, wherein the exposure unit is capable of simultaneously exposing a pair of patterns of the original film on the upper and lower surfaces of the substrate in the exposure unit. apparatus. 4. The exposure apparatus according to claim 1, further comprising an operation section operated by a user outside the clean booth unit.