JPH06181367A - Semiconductor laser device and assembling method thereof - Google Patents

Abstract

PURPOSE:To obtain a method of assembling a semiconductor laser device wherein the light emitting point of a semiconductor laser element mounted in a package is improved in position accuracy. CONSTITUTION:A soldering region 3 whose width W1 is larger than the width of the emission surface of a semiconductor laser array element 5 to solder by tens of mum is formed at a predetermined position on a sub-mount main body 1, and the semiconductor laser array element 5 is soldered to the soldering region 3 making its center coincident with the center of the soldering region 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser device in which a semiconductor laser device or a semiconductor laser array device is mounted in a package and a method for assembling the same, and more particularly, the positional accuracy of a light emitting point of the semiconductor laser device or the semiconductor laser array device. Is related to the improvement of.

[0002]

2. Description of the Related Art FIG. 7 is a perspective view showing a submount used when a conventional semiconductor laser device is mounted at a predetermined position in a package.
The submount body 10a, 10b, 10c is made of metal, 12 is a groove for electrical isolation, and 13 is a solder region having a width W0 formed on the upper surface of the metal 10b.

Semiconductor laser devices for optical communication, optical disks,
When used in a system such as a laser beam printer, packaging suitable for the application is performed. In this packaging, there is a direct connection method in which the element is directly connected to a predetermined component in the package, such as a metal block or a circular stem, but this method has a simple structure to be produced, but the element is attached. It is necessary to process the surface with high accuracy, and in order to avoid thermal stress due to the difference in thermal expansion coefficient between the mounting surface and the element, only soft In solder can be used as a solder material. On the other hand, in order to eliminate such a difficulty, the thermal expansion coefficient of thermal expansion is close to that of the element, and S which has excellent thermal conductivity and workability is used.
There is a method of mounting a device on a package via a submount made of i or SiC. The submount shown in FIG. 7 is used in this mounting method (assembly method).

The assembly method will be described below. A solder region 13 is formed on the upper surface of the metal 10b laid on the submount body 11. This solder region 13 has a width W so that the entire bottom surface of the chip to be mounted is soldered.
0 is formed to be considerably wider than the lateral width of the semiconductor laser device. Then, after that, a semiconductor laser device (not shown) is adsorbed by a collet or the like and conveyed onto the submount, and the device is placed on the solder region 13 of the submount and soldered. At the same time or after this, the metal 10a side of the submount body 11 is die-bonded to a predetermined component such as a metal block or a circular stem in a package (not shown).

[0005]

The submount used for mounting the conventional semiconductor laser device in the package is constructed as described above, and the formation position of the solder region is particularly specified on the submount body. In addition, the lateral width W0 of the semiconductor laser device is simply formed to be larger than the lateral width of the device so that the entire bottom surface of the semiconductor laser device is soldered. Therefore, when a semiconductor laser device is mounted on a package using such a submount, the device can be reliably soldered to the solder region, but the mounting position of the chip on the submount is not fixed, and Even if the submount to which the element is soldered is die-bonded to a predetermined position in the package with high positional accuracy, the position of the light emitting point of the semiconductor laser element may deviate from the predetermined range in the package. There was a problem that reliability was lowered.

The present invention has been made to solve the above problems, and provides a semiconductor laser device capable of improving the positional accuracy of the emission point of a semiconductor laser element mounted in a package, and an assembling method thereof. The purpose is to do.

[0007]

A semiconductor laser device and a method of assembling the same according to the present invention have a lateral width which is larger than a lateral width of a light emitting surface of a semiconductor laser element by several tens of μm at a predetermined position on a submount. A solder region is formed so that the semiconductor laser element is soldered so that its center position overlaps with the center position of the solder region.

Further, in the semiconductor laser device and the method of assembling the same according to the present invention, the area where the solder area is formed on the submount is soldered more than other areas on the submount before the solder is formed. Is treated so that the wettability is improved.

[0009]

According to the present invention, the solder region for soldering the semiconductor laser device is provided at a predetermined position on the submount, the width of which is several tens of μm larger than the width of the semiconductor laser device.
Since the semiconductor laser element is formed to be larger by about m and the center position of the semiconductor laser element is overlapped with the center position of the solder area, the semiconductor laser element is soldered to the center of the solder area positioned on the submount. Then, the submount is accurately positioned and placed, and by die-bonding the submount to a predetermined position in the package, the position of the light emitting point of the semiconductor laser element in the package can be positioned with high accuracy. Be positioned at.

According to the present invention, the region where the solder region is formed on the submount is wetted more easily than the other regions. Therefore, the semiconductor laser element is placed in the solder region to melt the solder. At this time, the semiconductor laser element moves to the center of the molten solder due to surface tension, and even if the semiconductor laser element is erroneously placed at a biased position of the solder region, that is, at a position away from the center, The semiconductor laser element can be soldered to the center position with high accuracy.

[0011]

【Example】

Example 1. FIG. 1 is a perspective view showing a submount used for mounting the semiconductor laser array element according to the first embodiment of the present invention at a predetermined position in a package. In the figure, 1 is formed of, for example, Si or SiC. Further, the submount main body, 2 is a groove for electrical isolation, 3 is a solder region, and 4a, 4b and 4c are metal. Also, FIG.
FIG. 3 is a perspective view showing a semiconductor laser array element mounted on the submount, in which 5 is a semiconductor laser array element, and 6 is a separating element for separating each element constituting the semiconductor laser array element. The groove 7 is an active layer (light emitting point) for each element. The solder region 3 is the semiconductor laser array element 5 to be soldered.
Has a lateral width W1 on the side corresponding to the light emitting surface side which is several tens of μm longer than the lateral width W4 of the light emitting surface of the semiconductor laser array element, and corresponds to the light emitting surface of the semiconductor laser array element 5 on which the submount body 1 is mounted. It is formed with a dimensional accuracy within several tens of μm so that the distances W2 and W3 from both ends to the both ends on the side surface are the same.

Here, the lateral width W1 of the solder region 3 is calculated from the lateral width W4 of the semiconductor laser array element 5 on the light emitting surface side by the formula 1
The reason why the length is increased by 0 μm will be described. The size of the semiconductor laser array element 5, that is, the thickness of its substrate is generally 90.
It is about 100 μm. At the time of assembling a semiconductor laser device, which will be described later, an operator observes both the semiconductor laser array element 5 and the solder area 3 with a microscope, and the solder area 3 has the same length from both side end portions of the semiconductor laser array element 5. By mounting the semiconductor laser array element 5 so as to protrude so much, the semiconductor laser array element 5 is mounted and soldered so that the center position of the semiconductor region 3 overlaps the center position of the solder region 3. Width W1 of the solder area 3
Is longer than the lateral width W4 of the light emitting surface of the semiconductor laser array element 5 by several tens of μm.
This is because the size can be determined most accurately by the operator whether or not the lengths of the solder protruding from both ends of the semiconductor laser array element 5 are equal. That is, if the lateral width W1 is made longer than the lateral width W4 of the light emitting surface of the semiconductor laser array element 5 by about several μm, the operator can accurately see the positional relationship between the semiconductor laser array element 5 and the solder region 3 during the above work. If the length of the semiconductor laser array element 5 is increased by several hundred μm, it is difficult to compare whether or not the lengths of the solder protruding from both end portions of the semiconductor laser array element 5 are equal, and the semiconductor is accurately positioned at the center position of the solder region 3. It becomes impossible to overlap the central positions of the laser array elements 5.

Further, the solder region 3 is positioned with a dimensional accuracy within several tens of μm so that the distances W2 and W3 from both ends of the submount body 1 to both ends of the solder region 3 are the same. This is the solder area 3
If the deviation of the formation position of the sub-mount is larger than several tens of μm, the position of the light emitting point is several tens of μm from the desired position even if the submount body 1 is die-bonded to a predetermined position in the package.
This is because they will be located farther apart and the light emitting point cannot be positioned accurately.

Next, the assembling method will be described. A solder region 3 is formed at a predetermined position on the submount body 1. Here, the solder region 3 is formed so that its lateral width W1 is longer than the lateral width W4 of the light emitting surface of the semiconductor laser array element 5 by several tens of μm. Further, the formation position is formed at the both ends of the solder region 3 with dimensional accuracy within several tens of μm so that the intervals W2 and W3 between the end and the end of the submount body 1 become equal. After that, the semiconductor laser array element 5 is sucked by a collet or the like and the submount body 1
While being conveyed up and observed with a microscope, the center of the semiconductor laser array element 5 overlaps with the center of the submount body 1, that is, as shown in FIG. The solder region 3 is placed on the solder region 3 and soldered so that the protruding lengths L1 and L2 of the solder region 3 are the same. Simultaneously with or after this, the submount body 1 is die-bonded to a predetermined position on a plane such as a metal block or a circular stem in a package (not shown).

In the method of assembling the semiconductor laser device of this embodiment, the semiconductor laser array element 5 is soldered on the submount body 1 at a predetermined position such as the center position with a positional accuracy within several tens of μm. Since it is soldered in the center of the region 3 and positioned at a predetermined position on the submount body 1 with high accuracy, it is possible to empirically die-bond to a predetermined position within the package without positioning this submount with high accuracy. Then, the semiconductor laser array element 5
The light emitting points of are arranged within a predetermined standard range, and a highly reliable semiconductor laser device can be efficiently obtained.

Further, when the submount to which the semiconductor laser array element 5 is soldered is accurately positioned and die-bonded to a predetermined position in the package, the position of the light emitting point is accurately positioned in the package. It is possible to manufacture a highly reliable semiconductor laser device with a high yield.

Example 2. FIG. 4 is a perspective view showing a submount used for mounting the semiconductor laser device according to the second embodiment of the present invention at a predetermined position in a package.
In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts, and 8 is a paste made of pine or the like for improving the wetting of solder.

In this submount, the solder region 3 is formed on the upper surface of the metal 4b on the submount body 1 with the paste 8 interposed therebetween. FIG. 5 is a side view showing a state in which a semiconductor laser array element is die-bonded to this submount.

Here, in the paste 8, the lateral width W1 'on the side corresponding to the light emitting surface side of the semiconductor laser array element 5 to be soldered is several tens of μm longer than the lateral width W4 of the light emitting surface of the semiconductor laser element 5, and The solder regions 3 are formed with a dimensional accuracy within a few tens of μm so that the distances W2 ′ and W3 ′ between the ends of the both ends and the end of the submount body 1 are equal. It is formed to be slightly smaller than the area.

In the submount of this embodiment,
When the semiconductor laser array element is soldered to the solder region 3 on the submount body 1, when the solder region 3 is heated and melted, the solder spreads over the entire upper surface of the paste 8 and is placed on the melted solder. The semiconductor laser array element 5 has a metal 4 without the molten solder paste 8.
It moves to the center of the paste 8, that is, the center of the solder melted on the entire surface of the paste 8 due to the surface tension generated between the surface b and the surface b. Therefore, even if the semiconductor laser array element 5 is erroneously placed at a position away from the centers of the paste 8 and the solder area 3, the semiconductor laser array element 5 is finally placed in the center of the solder area 3 (paste 8). It is possible to attach the semiconductor laser array element to the submount main body 1 without requiring severe accuracy in the work for mounting the semiconductor laser array element 5 as compared with the first embodiment. It can be accurately positioned and soldered.

Example 3. FIG. 6 is a perspective view showing a submount used for mounting the semiconductor laser device according to the third embodiment of the present invention at a predetermined position in a package.
In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions.

In the first embodiment, the solder area 3 is formed by positioning it in the center of the submount body 1. However, in this embodiment, as shown in the figure, one end of the solder area 3 and the submount are mounted. Distance W2 from one end of body 1
And the distance W3 between the other end of the solder region 3 and the other end of the submount body 1 are set to different sizes so that each size becomes a predetermined size with a dimensional accuracy within several tens of μm. The solder region 3 is formed on the.

As shown in this embodiment, in the present invention, the solder region 3 may be formed at a desired position on the submount body with high precision. The semiconductor laser array element is positioned with high accuracy on the submount simply by soldering the laser array element so that its center overlaps with the center of the solder region 3.

In each of the above-mentioned embodiments, the semiconductor laser element is an active layer, that is, a semiconductor laser array element in which a light emitting point is formed for each element, but one light emitting point is used. It goes without saying that the same effect can be obtained by using the semiconductor laser device of.

[0025]

As described above, according to the present invention, the solder region for soldering the semiconductor laser device is provided at a predetermined position on the submount, and its width is larger than the width of the semiconductor laser device by about several tens of μm. Since the semiconductor laser element is formed so as to be soldered so that its center position overlaps with the center position of the solder region, the semiconductor laser element should be positioned and mounted on the submount with high accuracy. The position of the light emitting point of the semiconductor laser element in the package can be positioned with high accuracy by simply die-bonding the submount to a predetermined position in the package, and as a result, the semiconductor laser array element 5 in the package can be positioned. There is an effect that it is possible to obtain a highly reliable semiconductor laser device in which a light emitting point is positioned within a predetermined standard with high yield.

Further, according to the present invention, since the solder region is formed on the submount through the paste that makes the solder easy to wet the submount, the semiconductor laser device is mounted on the solder region. Then, when the solder is melted, the semiconductor laser element moves to the center of the melted solder due to the surface tension generated between the solder forming area on the submount and the area where the solder is not formed. Even if the semiconductor laser element is placed at a different position, the semiconductor laser element can be accurately soldered at the center position of the solder region.
There is an effect that a highly reliable semiconductor laser device in which the light emitting point of the semiconductor laser array element 5 in the package is positioned within the standard can be obtained with high yield.

[Brief description of drawings]

FIG. 1 is a perspective view showing a submount used when mounting a semiconductor laser array device according to a first embodiment of the present invention at a predetermined position in a package.

FIG. 2 is a perspective view showing a semiconductor laser device.

FIG. 3 is a side view showing a state in which a semiconductor laser device is soldered onto the submount shown in FIG.

FIG. 4 is a perspective view showing a submount used when the semiconductor laser array device according to the second embodiment of the present invention is mounted at a predetermined position in a package.

5 is a side view showing a state in which a semiconductor laser device is soldered on the submount shown in FIG.

FIG. 6 is a perspective view showing a submount used for mounting a semiconductor laser array device according to a third embodiment of the present invention at a predetermined position in a package.

FIG. 7 is a perspective view showing a submount used when a conventional semiconductor laser device is mounted at a predetermined position in a package.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1,11 Submount main body 2,12 Electric isolation groove 3,13 Solder area 4a-4c, 10a-10c Metal 5 Semiconductor laser array element 6 Groove for separating each element of a semiconductor laser array element 7 Active layer (Light emitting point) 8 paste

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[Procedure amendment]

[Submission date] July 15, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

[0011]

EXAMPLES Example 1. FIG. 1 is a perspective view showing a submount used for mounting the semiconductor laser array element according to the first embodiment of the present invention at a predetermined position in a package. In the figure, 1 is formed of, for example, Si or SiC. Further, the submount main body, 2 is a groove for electrical isolation, 3 is a solder region, and 4a, 4b and 4c are metal. Also, FIG.
Is a perspective view showing a semiconductor laser array element mounted on the submount. In the figure, 5 is a semiconductor laser array element, and 6 is an active layer (light emission) for each element.
Points) and 7 are each element that constitutes the semiconductor laser array element.
It is a separation groove for separating the components . In the solder area 3, the lateral width W1 on the side corresponding to the light emitting surface side of the semiconductor laser array element 5 to be soldered is several tens of μm longer than the lateral width W4 of the light emitting surface of the semiconductor laser array element.
In addition, the distances W2 and W3 from both ends of the surface of the submount body 1 on the side corresponding to the light emitting surface of the mounted semiconductor laser array element 5 to each other have the same length within several tens of μm. It is formed with positioning with dimensional accuracy of.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction content]

In this submount, the solder region 3 is formed on the upper surface of the metal 4b on the submount body 1 with the paste 8 interposed therebetween. FIG. 5 is a front view showing a state in which a semiconductor laser array element is die-bonded to this submount.

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] Brief description of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a perspective view showing a submount used when mounting a semiconductor laser array device according to a first embodiment of the present invention at a predetermined position in a package.

FIG. 2 is a perspective view showing a semiconductor laser device.

FIG. 3 is a front view showing a state in which a semiconductor laser element is soldered on the submount shown in FIG.

FIG. 4 is a perspective view showing a submount used when the semiconductor laser array device according to the second embodiment of the present invention is mounted at a predetermined position in a package.

5 is a front view showing a state in which a semiconductor laser device is soldered on the submount shown in FIG.

FIG. 6 is a perspective view showing a submount used for mounting a semiconductor laser array device according to a third embodiment of the present invention at a predetermined position in a package.

FIG. 7 is a perspective view showing a submount used when a conventional semiconductor laser device is mounted at a predetermined position in a package.

[Description of Reference Signs] 1,11 Submount body 2,12 Electrical isolation groove 3,13 Solder region 4a to 4c, 10a to 10c Metal 5 Semiconductor laser array element 6 Active layer (light emitting point) for each element 7 Separate each element of the semiconductor laser array element
Groove 8 paste for

[Procedure amendment 4]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 2

[Correction method] Change

[Correction content]

[Fig. 2]

Claims (5)

[Claims] 1. A semiconductor laser device in which a semiconductor laser element is soldered onto a submount, and the submount is die-bonded to a predetermined position in a package, wherein the submount has the semiconductor laser at a predetermined position on an upper surface thereof. The width of the light emitting surface of the device is several tens of μm
A semiconductor laser device having a solder region for soldering the large semiconductor laser device, wherein the semiconductor laser device is soldered so that its center position overlaps with the center position of the solder region. . 2. The semiconductor laser device according to claim 1, wherein the formation position of the solder region on the submount is several tens.
A semiconductor laser device, wherein the semiconductor laser device is formed at the predetermined position with a dimensional accuracy within μm. 3. A method for assembling a semiconductor laser device, comprising soldering a semiconductor laser element onto a submount and die-bonding the submount to a predetermined position in a package, wherein the lateral width is set at a predetermined position on the submount. An assembly of a semiconductor laser device, characterized in that a solder region larger than the lateral width of the semiconductor laser device by several tens of μm is formed, and the semiconductor laser device is soldered so that its center position overlaps with the center position of the solder region. Method. 4. The method for assembling a semiconductor laser device according to claim 3, wherein a region on the sub-mout where the solder is formed is positioned with respect to the solder more than other regions on the sub-mout before the solder is formed. A method for assembling a semiconductor laser device, which comprises treating the semiconductor laser device to improve wettability. 5. The method for assembling a semiconductor laser device according to claim 3, wherein the solder region is formed at the predetermined position with a dimensional accuracy within a few tens of μm. .