JPH061749B2 - Film capacitor manufacturing method - Google Patents
Film capacitor manufacturing methodInfo
- Publication number
- JPH061749B2 JPH061749B2 JP61034651A JP3465186A JPH061749B2 JP H061749 B2 JPH061749 B2 JP H061749B2 JP 61034651 A JP61034651 A JP 61034651A JP 3465186 A JP3465186 A JP 3465186A JP H061749 B2 JPH061749 B2 JP H061749B2
- Authority
- JP
- Japan
- Prior art keywords
- external electrode
- conductive layer
- film capacitor
- welding
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、金属化フィルムを誘電体とするフィルムコン
デンサの製造方法に関するもので、具体的には外部電極
引き出し方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a film capacitor having a metallized film as a dielectric, and more particularly to a method of drawing external electrodes.
従来の技術 近年、小型で信頼性の高い電子部品の開発は目ざましい
ものがある。とりわけ、精密溶接技術は電子部品開発に
おいて、重要な加工技術として位置づけられるようにな
ってきた。2. Description of the Related Art In recent years, the development of small and highly reliable electronic components has been remarkable. In particular, precision welding technology has come to be positioned as an important processing technology in the development of electronic parts.
フィルムコンデンサにおいて、金属化フィルムを巻回ま
たは積層した後、対向する内部電極(通常は金属蒸着
膜)が各々延びる両縁辺部に、金属溶射により導電層を
形成し、前記導電層に外部電極とするリード線またはリ
ードフレームを抵抗溶接し、必要により外装を施して得
るフィルムコンデンサの製造方法は公知である。In a film capacitor, after winding or laminating a metallized film, a conductive layer is formed by metal spraying on both edge portions where the opposing internal electrodes (usually a metal vapor deposition film) extend, and the conductive layer is provided with external electrodes. A method of manufacturing a film capacitor, which is obtained by resistance welding a lead wire or a lead frame to be formed and, if necessary, applying an outer package, is known.
以下、図面を参照しながら、従来のフィルムコンデンサ
の構成要素と外部電極の引き出し方法について、積層型
フィルムコンデンサで代表させて説明する。Hereinafter, with reference to the drawings, a conventional film capacitor and a method of drawing out external electrodes will be described by taking a laminated film capacitor as a representative.
ただし、内容は巻回型フィルムコンデンサについても同
様である。However, the same applies to the wound film capacitor.
第3図は、従来の積層フィルムコンデンサの切断面の一
部を拡大して、その構成を示した図である。第3図にお
いて、1は誘電体フィルム、2,3は誘電体フィルム1
に蒸着された内部電極、4は内部電極2と3を絶縁する
絶縁部、5は保護フィルム、6は金属溶射によって得ら
れた導電層である。FIG. 3 is an enlarged view of a part of a cut surface of a conventional laminated film capacitor, showing its configuration. In FIG. 3, 1 is a dielectric film, 2 and 3 are dielectric films 1.
The internal electrode 4 deposited on the insulating layer 4 is an insulating part for insulating the internal electrodes 2 and 3, 5 is a protective film, and 6 is a conductive layer obtained by metal spraying.
第4図は、従来の積層フィルムコンデンサにおける外部
電極引き出しの際の斜視図である。第4図において、6
は導電層で、第1図の構成と同じである。7は外部電
極、8は導電層6と外部電極7を溶接する、抵抗溶接電
極チップである。FIG. 4 is a perspective view at the time of drawing out external electrodes in the conventional laminated film capacitor. In FIG. 4, 6
Is a conductive layer and has the same structure as in FIG. Reference numeral 7 is an external electrode, and 8 is a resistance welding electrode tip for welding the conductive layer 6 and the external electrode 7.
従来のフィルムコンデンサの外部電極引き出し方法は、
第4図に示すように、導電層6と外部電極7を抵抗溶接
電極チップ8で、密着、加圧しながら通電し、導電層6
に外部電極7を溶接する方法(抵抗溶接法)がとられて
いる。The external electrode extraction method of the conventional film capacitor is
As shown in FIG. 4, the conductive layer 6 and the external electrode 7 are energized while being adhered and pressed by the resistance welding electrode tip 8 to make the conductive layer 6
A method (resistance welding method) of welding the external electrode 7 is adopted.
発明が解決しようとする問題点 しかしながら、前記のような方法では、第3図,第4図
からわかるように、内部電極2,3と導電層6間の接合
状態の安定性に関する最弱点は、通常、溶接時の加圧力
による力学的ダメージ、及び溶接時の発熱による熱的ダ
メージにあることは実験的に明らかであり、前記接合部
分に加わる溶接時の力学的、熱的ダメージが、フィルム
コンデンサの誘電正接特性を劣化させ、場合によって
は、コンデンサ容量の変動となることが知られていた。Problems to be Solved by the Invention However, in the method as described above, as can be seen from FIGS. 3 and 4, the weakest point regarding the stability of the bonding state between the internal electrodes 2, 3 and the conductive layer 6 is: Usually, it is experimentally clear that there is mechanical damage due to the pressure applied during welding and thermal damage due to the heat generated during welding. The mechanical and thermal damage during welding applied to the joint part is It has been known that the dielectric loss tangent characteristic of (3) is deteriorated and the capacitance of the capacitor fluctuates in some cases.
従来、前記溶接時のダメージを低減する手段として、厚
い誘電体フィルムを用いたり、保護フィルムの枚数を増
したりしているが、これらは、少容量フィルムコンデン
サの大型化、及び小型フィルムコンデンサ製作上の障害
となっている。また、溶接時の溶接バリも、小型フィル
ムコンデンサ製作上の障害となっている。Conventionally, as a means for reducing the damage at the time of welding, a thick dielectric film has been used and the number of protective films has been increased. Has become an obstacle. In addition, welding burrs during welding are also obstacles to the production of small film capacitors.
本発明は、前記問題点に鑑み、フィルムコンデンサ素子
に与える溶接時のダメージと、溶接バリの発生をともな
わないフィルムコンデンサの外部電極引き出し方法を提
供するものである。In view of the above problems, the present invention provides a method for drawing out an external electrode of a film capacitor, which does not cause damage to the film capacitor element during welding and generation of welding burrs.
問題点を解決するための手段 この目的を達成するために、本発明のフィルムコンデン
サ素子の製造方法は、抵抗溶接法でフィルムコンデンサ
素子の導電層と、外部電極を仮溶接した後、レーザー光
を用いて導電層と外部電極を溶融することにより、フィ
ルムコンデンサ素子の導電層に外部電極を溶接するもの
である。Means for Solving the Problems In order to achieve this object, the method for producing a film capacitor element of the present invention is a method of temporarily welding a conductive layer of a film capacitor element and an external electrode by resistance welding, and then applying a laser beam. The external electrode is welded to the conductive layer of the film capacitor element by melting the conductive layer and the external electrode.
作 用 フィルムコンデンサの導電層に外部電極を接触させ、抵
抗溶接電極チップで外部電極を加圧し通電を行なうと、
導電層と外部電極の接触部の抵抗発熱により、導電層と
外部電極は溶接される。この場合,加圧力,印加電流,
通電時間は、溶接強度,溶接品質に関係する。When the external electrode is brought into contact with the conductive layer of the working film capacitor and the resistance welding electrode tip pressurizes the external electrode to energize it,
The conductive layer and the external electrode are welded to each other due to resistance heating at the contact portion between the conductive layer and the external electrode. In this case, the applied pressure, applied current,
Energization time is related to welding strength and welding quality.
一方、導電層に外部電極を接触し、レーザー光線を照射
すると、レーザー光の吸収により発生した熱で、導電層
と外部電極は溶融される。この場合、導電層と外部電極
の接触状態は、レーザー溶接強度,レーザー溶接品質に
関係する。On the other hand, when the external electrode is brought into contact with the conductive layer and irradiated with a laser beam, the conductive layer and the external electrode are melted by the heat generated by the absorption of the laser beam. In this case, the contact state between the conductive layer and the external electrode is related to laser welding strength and laser welding quality.
本発明において、先ず、抵抗溶接電極チップは外部電極
が導電層に接触するに必要な(200g以下)程度で、
外部電極を加圧し通電される。この時、印加電流,印加
時間は、外部電極が導電層に僅かに溶接される(引張せ
ん断強さを500g以下)程度でよい。In the present invention, first, the resistance welding electrode tip is about (200 g or less) necessary for the external electrode to contact the conductive layer,
The external electrode is pressurized and energized. At this time, the applied current and the applied time may be such that the external electrode is slightly welded to the conductive layer (the tensile shear strength is 500 g or less).
次に、導電層と外部電極が仮溶接された部分へレーザー
光線を照射すると、レーザー光線の照射部分が局部的に
発熱し、導電層と外部電極は溶融される。その結果、フ
ィルムコンデンサ素子へのダメージと溶接バリがともな
わない外部電極の溶接が完了する。Next, when a laser beam is applied to the part where the conductive layer and the external electrode are temporarily welded, the part irradiated with the laser beam locally generates heat, and the conductive layer and the external electrode are melted. As a result, the welding of the external electrodes without damage to the film capacitor element and welding burrs is completed.
実施例 以下、本発明の一実施例について、図面を参照しながら
説明する。Embodiment One embodiment of the present invention will be described below with reference to the drawings.
第1図は、本発明の方法を実施する際の構成要素を示し
た図である。第1図において、6は導電層、7は外部電
極、8は抵抗溶接電極チップで、以上は第4図の構成と
同じものである。9はレーザー発生部、10は光学系、
11はレーザー光線である。以上のように構成された要
素について、以下その動作について説明する。FIG. 1 is a diagram showing components when carrying out the method of the present invention. In FIG. 1, 6 is a conductive layer, 7 is an external electrode, 8 is a resistance welding electrode tip, and the above is the same as the configuration of FIG. 9 is a laser generator, 10 is an optical system,
Reference numeral 11 is a laser beam. The operation of the elements configured as described above will be described below.
先ず、抵抗溶接電極チップ8は、外部電極7が導電層6
に接触する程度の小さい力で、外部電極7を加圧し通電
される。First, in the resistance welding electrode tip 8, the external electrode 7 is the conductive layer 6
The external electrode 7 is pressurized and energized with a small force such that it contacts the.
次に、抵抗溶接電極チップ8が後退した後、レーザー発
生部9で発生したレーザー光線11は、光学系10を通
り、外部電極7が導電層6に仮溶接された範囲を走査す
る。この時、レーザー光線11の集光径が、溶接範囲に
比べ大きい場合は走査しなくてもよい。Next, after the resistance welding electrode tip 8 is retracted, the laser beam 11 generated by the laser generator 9 passes through the optical system 10 and scans the range where the external electrode 7 is temporarily welded to the conductive layer 6. At this time, if the focused diameter of the laser beam 11 is larger than the welding range, scanning may not be performed.
また第2図は、抵抗溶接電極チップの一部が、導電層と
外部電極の接触範囲外で、外部電極と接触している図で
あって、構成要素はすべて第1図と同じであり、第1図
に示した場合よりも、小型のフィルムコンデンサに外部
電極を溶接できる方法であり、第1図で示した場合より
もさらに効果的である。Further, FIG. 2 is a diagram in which a part of the resistance welding electrode tip is in contact with the external electrode outside the contact range of the conductive layer and the external electrode, and all the constituent elements are the same as those in FIG. This is a method in which the external electrodes can be welded to a smaller film capacitor than the case shown in FIG. 1, which is more effective than the case shown in FIG.
以上のように本実施例によれば、抵抗溶接法により、導
電層と外部電極を仮溶接した後、レーザー光を用いて溶
接を行なうことで、フィルムコンデンサ素子に与える溶
接時のダメージと、溶融バリの発生をともなわない外部
電極の溶接ができる。As described above, according to the present embodiment, after the conductive layer and the external electrode are provisionally welded by the resistance welding method, the welding is performed by using the laser beam, so that the damage to the film capacitor element at the time of welding and the melting External electrodes can be welded without burr formation.
なお、本発明におけるレーザー光線は、YAGレーザ
ー、あるいはCo2レーザーの中から選択して使用するこ
とができる。また、レーザーの選択は、溶接対象となる
金属の組み合わせによるが、例えば、導電材料が亜鉛,
外部電極材料が銅系金属の場合は、マルチモードのYA
G、またはCo2レーザーを使用することができる。The laser beam in the present invention can be selected from YAG laser and Co 2 laser for use. The selection of the laser depends on the combination of metals to be welded. For example, if the conductive material is zinc,
If the external electrode material is copper-based metal, multi-mode YA
G or Co 2 lasers can be used.
この場合、レーザーの選択は、レーザー光線のエネルギ
ー密度が、溶接対象金属の蒸発エネルギー密度以下で、
分布状態がフラットであるという見地から行えばよい。In this case, the laser is selected so that the energy density of the laser beam is less than the evaporation energy density of the metal to be welded,
This can be done from the viewpoint that the distribution state is flat.
発明の効果 以上のように本発明は、抵抗溶接法で導電層に外部電極
を前溶接した後、レーザー溶接を行うことで、フィルム
コンデンサ素子に与える溶接時のダメージと、溶接バリ
の発生をともなわず、外部電極を溶接することができ、
その実用的効果は大なるものがある。As described above, according to the present invention, after pre-welding the external electrode to the conductive layer by the resistance welding method, laser welding is performed, thereby causing damage at the time of welding to the film capacitor element and occurrence of welding burrs. Without the need to weld external electrodes,
Its practical effect is enormous.
第1図は本発明の一実施例における製造方法の要部の構
成要素を示す構成図、第2図は本発明の他の実施例にお
いて、抵抗溶接電極チップの一部が導電層と外部電極の
接触範囲外で外部電極と接触している状態を示す構成
図、第3図は従来のフィルムコンデンサの切断面の一部
を拡大しその構成を示す断面図、第4図は従来のフィル
ムコンデンサにおいて、外部電極引き出しの際の状態を
示す斜視図である。 6……導電層、7……外部電極、8……抵抗溶接電極チ
ップ、9……レーザー発生部、10……光学系、11…
…レーザー光線。FIG. 1 is a block diagram showing the components of the essential part of the manufacturing method in one embodiment of the present invention, and FIG. 2 is another embodiment of the present invention in which a part of the resistance welding electrode tip is a conductive layer and an external electrode. Fig. 3 is a sectional view showing a state of being in contact with an external electrode outside the contact range of Fig. 3, Fig. 3 is a cross-sectional view showing the configuration by enlarging a part of a cut surface of a conventional film capacitor, and Fig. 4 is a conventional film capacitor. FIG. 7 is a perspective view showing a state when the external electrode is drawn out in FIG. 6 ... Conductive layer, 7 ... External electrode, 8 ... Resistance welding electrode tip, 9 ... Laser generator, 10 ... Optical system, 11 ...
… Laser light.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H01G 4/30 311 E 8019−5E (72)発明者 植杉 雄二 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 昭55−102221(JP,A) 特開 昭55−58517(JP,A) 特開 昭57−49217(JP,A) 特開 昭60−148691(JP,A)─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical indication location H01G 4/30 311 E 8019-5E (72) Inventor Yuji Uesugi 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-55-102221 (JP, A) JP-A-55-58517 (JP, A) JP-A-57-49217 (JP, A) JP-A-60-148691 (JP, A)
Claims (1)
ンサ素子の前記導電層に外部電極を接続する際に、抵抗
溶接法でフィルムコンデンサ素子の導電層と外部電極と
を仮溶接した後、レーザー光を用いて、前記導電層と外
部電極を溶融することを特徴とするフィルムコンデンサ
の製造方法。1. When connecting an external electrode to the conductive layer of a film capacitor element having conductive layers formed on both end surfaces, a laser is used after temporarily welding the conductive layer of the film capacitor element and the external electrode by resistance welding. A method of manufacturing a film capacitor, characterized in that the conductive layer and the external electrode are melted by using light.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61034651A JPH061749B2 (en) | 1986-02-18 | 1986-02-18 | Film capacitor manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61034651A JPH061749B2 (en) | 1986-02-18 | 1986-02-18 | Film capacitor manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62190829A JPS62190829A (en) | 1987-08-21 |
JPH061749B2 true JPH061749B2 (en) | 1994-01-05 |
Family
ID=12420340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61034651A Expired - Lifetime JPH061749B2 (en) | 1986-02-18 | 1986-02-18 | Film capacitor manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH061749B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0682596B2 (en) * | 1990-03-20 | 1994-10-19 | 株式会社ユニテック | Method and apparatus for welding lead wire of metallized plastic film capacitor |
-
1986
- 1986-02-18 JP JP61034651A patent/JPH061749B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62190829A (en) | 1987-08-21 |
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