JPH0617336Y2 - ボンディング・ツール - Google Patents

ボンディング・ツール

Info

Publication number
JPH0617336Y2
JPH0617336Y2 JP10831088U JP10831088U JPH0617336Y2 JP H0617336 Y2 JPH0617336 Y2 JP H0617336Y2 JP 10831088 U JP10831088 U JP 10831088U JP 10831088 U JP10831088 U JP 10831088U JP H0617336 Y2 JPH0617336 Y2 JP H0617336Y2
Authority
JP
Japan
Prior art keywords
pressing
power supply
pressing side
temperature
supply terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP10831088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0231183U (enrdf_load_stackoverflow
Inventor
浩幸 高崎
浩司 岡部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Avionics Co Ltd
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Priority to JP10831088U priority Critical patent/JPH0617336Y2/ja
Publication of JPH0231183U publication Critical patent/JPH0231183U/ja
Application granted granted Critical
Publication of JPH0617336Y2 publication Critical patent/JPH0617336Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP10831088U 1988-08-19 1988-08-19 ボンディング・ツール Expired - Lifetime JPH0617336Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10831088U JPH0617336Y2 (ja) 1988-08-19 1988-08-19 ボンディング・ツール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10831088U JPH0617336Y2 (ja) 1988-08-19 1988-08-19 ボンディング・ツール

Publications (2)

Publication Number Publication Date
JPH0231183U JPH0231183U (enrdf_load_stackoverflow) 1990-02-27
JPH0617336Y2 true JPH0617336Y2 (ja) 1994-05-02

Family

ID=31343518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10831088U Expired - Lifetime JPH0617336Y2 (ja) 1988-08-19 1988-08-19 ボンディング・ツール

Country Status (1)

Country Link
JP (1) JPH0617336Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0231183U (enrdf_load_stackoverflow) 1990-02-27

Similar Documents

Publication Publication Date Title
US4797726A (en) Lead frame including deformable plates
US5933327A (en) Wire bond attachment of a integrated circuit package to a heat sink
CA2209326C (en) Apparatus for heating and cooling an electronic device
US3786228A (en) Electric soldering iron tip
JP4903205B2 (ja) フリップチップ・パッケージングされた半導体デバイス及び半導体ダイをパッケージングする方法
JP2742454B2 (ja) ハンダ付け装置
JPH0617336Y2 (ja) ボンディング・ツール
JP2732823B2 (ja) はんだ付け方法
CN1187103A (zh) 用于加热和冷却电子器件的设备
JPH0970659A (ja) 熱圧着用ツール
JPS6333298B2 (enrdf_load_stackoverflow)
JPH0230144Y2 (enrdf_load_stackoverflow)
EP0250296B1 (en) Apparatus and method for tape bonding
JP2774941B2 (ja) サーマルプリントヘッドの組立て方法
JPH0465545B2 (enrdf_load_stackoverflow)
JPS5915386B2 (ja) 半導体装置用ヘッダの製造方法
JPH0410715Y2 (enrdf_load_stackoverflow)
JP3522434B2 (ja) パルスヒート方式溶接機のヒータツール構造
JPH04117481U (ja) 冷却フイン装置
JPH08236924A (ja) 半導体除去装置及び半導体除去方法
US4939341A (en) Heated tool with multiple heating surfaces
JP3017158B2 (ja) サーマルプリントヘッドの構造
JPH0513061U (ja) 電力半導体装置
CN2377704Y (zh) 电连接器
JP2868030B2 (ja) ボンディングツール