JPH0617331Y2 - 金属基板を用いたプリント配線板 - Google Patents
金属基板を用いたプリント配線板Info
- Publication number
- JPH0617331Y2 JPH0617331Y2 JP514888U JP514888U JPH0617331Y2 JP H0617331 Y2 JPH0617331 Y2 JP H0617331Y2 JP 514888 U JP514888 U JP 514888U JP 514888 U JP514888 U JP 514888U JP H0617331 Y2 JPH0617331 Y2 JP H0617331Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductor pattern
- wiring board
- printed wiring
- protruding portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 29
- 239000002184 metal Substances 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 title claims description 26
- 239000004020 conductor Substances 0.000 claims description 30
- 238000005476 soldering Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP514888U JPH0617331Y2 (ja) | 1988-01-19 | 1988-01-19 | 金属基板を用いたプリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP514888U JPH0617331Y2 (ja) | 1988-01-19 | 1988-01-19 | 金属基板を用いたプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01110495U JPH01110495U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-07-26 |
| JPH0617331Y2 true JPH0617331Y2 (ja) | 1994-05-02 |
Family
ID=31208269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP514888U Expired - Lifetime JPH0617331Y2 (ja) | 1988-01-19 | 1988-01-19 | 金属基板を用いたプリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617331Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2640780B2 (ja) * | 1989-12-28 | 1997-08-13 | 松下電器産業株式会社 | 金属基板の層間接続方法 |
-
1988
- 1988-01-19 JP JP514888U patent/JPH0617331Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01110495U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-07-26 |